Plasma etching cavity electrode cooling disc structure

Abstract

The utility model discloses a plasma etching cavity electrode cooling disc structure, which relates to the field of semiconductor manufacturing, and comprises a cast aluminum base, a cooling liquid flow channel used for circulating cooling liquid and a cavity upper cover used for installing the cast aluminum base, an upper electrode is arranged in the cavity upper cover, the upper electrode is positioned at the bottom of the cast aluminum base, and the cooling liquid flow channel is communicated with the cavity upper cover. The cooling liquid flow channel is composed of an inner flow guide pipe cast into the cast aluminum base and an outer flow guide pipe arranged outside the cast aluminum base. The cooling disc structure composed of the cast aluminum base and the cooling liquid flow channel is used as a core component for electrode temperature control, the electrode temperature can be effectively controlled within a certain area, the temperature difference is not too large, and the phenomenon that plasma distribution is not uniform due to the too large local temperature difference can be effectively avoided; therefore, the consistency of plasmas and the uniformity of etching can be improved, heat generated by ionization of special gas is reduced, electrodes and electronic components around the electrodes are protected, and the service life and the stability of the electrodes are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field related to semiconductor manufacturing, and particularly relates to a plasma etching cavity electrode cooling disk structure. Background Art

[0002] With the continuous progress of semiconductor technology, the diameter of wafers has gradually increased, but the size of transistors has been continuously decreasing, which has led to an increasing demand for higher precision and repeatability in the wafer processing process. To process semiconductor substrate materials, such as silicon wafers, a series of technologies have been adopted, including plasma technologies, such as electron evaporation, and ion technologies, such as sputtering deposition, plasma enhanced chemical vapor deposition, resist stripping, and plasma etching, etc.

[0003] During plasma etching, in order to generate high-energy plasma, the method of using electrodes to ionize high-energy gases is usually adopted, and a large amount of heat will be released during this process. Since the etching process accuracy is highly related to the uniformity and consistency of the plasma, it is necessary to maintain the temperature consistency of each region of the electrode at all times. In addition, during the ionization process, the electrode also withstands a large amount of thermal radiation, which affects the service life of the electrode and surrounding electronic components. Therefore, controlling the temperature of the electrode has become a problem that must be overcome. Summary of the Utility Model

[0004] To solve the defects existing in the prior art, the utility model provides a plasma etching cavity electrode cooling disk structure.

[0005] To solve the above technical problems, the utility model provides the following technical solutions:

[0006] A plasma etching cavity electrode cooling disk structure of the utility model includes a cast aluminum base, a coolant flow channel for circulating coolant, and a cavity upper cover for installing the cast aluminum base. An upper electrode is arranged inside the cavity upper cover, and the upper electrode is located at the bottom of the cast aluminum base. The coolant flow channel is composed of an inner diversion pipe cast into the cast aluminum base and an outer diversion pipe arranged outside the cast aluminum base. The inner diversion pipe is uniformly distributed inside the cast aluminum base in a spiral up-and-down manner, and a plurality of ventilation holes are opened on the cast aluminum base.

[0007] As a preferred technical solution of the utility model, one end of the outer diversion pipe is provided with a threaded interface, and the other end is provided with a transfer interface for connecting with the inner diversion pipe.

[0008] As a preferred technical solution of the utility model, a central hole with a convex-shaped cross-section is opened at the center of the cast aluminum base, and four U-shaped grooves are communicated and arranged at the bottom of the central hole around the central hole.

[0009] As a preferred technical solution of the present utility model, a plurality of groups of mounting holes are provided on the cast aluminum base and are arranged around the central hole. Each group of the mounting holes is annularly distributed, and a plurality of through holes are further provided on the cast aluminum base.

[0010] As a preferred technical solution of the present utility model, four assembly grooves are further provided on the cast aluminum base and are arranged around the central hole. The four assembly grooves are annularly distributed.

[0011] As a preferred technical solution of the present utility model, a mounting groove for mounting the cast aluminum base is provided on the cavity upper cover. The cross-sectional shape of the mounting groove is T-shaped, and a fitting part matching the assembly groove is provided in the mounting groove.

[0012] The beneficial effects of the present utility model are as follows:

[0013] Using the cooling disk structure composed of the cast aluminum base and the coolant flow channel as the core component for electrode temperature control, the electrode temperature can be effectively controlled within a certain range, preventing excessive temperature difference. It can effectively avoid uneven plasma distribution caused by excessive local temperature difference, thereby improving the uniformity of plasma and etching, and reducing the heat generated by the ionization of special gases, protecting the electrode and its surrounding electronic components, and ensuring their service life and stability. At the same time, the coolant flow channel is made of stainless steel to ensure corrosion resistance when the coolant flows through. Description of the Drawings

[0014] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0015] Figure 1 is a schematic connection structure diagram of the cast aluminum base and the coolant flow channel of a plasma etching cavity electrode cooling disk structure of the present utility model;

[0016] Figure 2 is a three-dimensional sectional view of the cast aluminum base of a plasma etching cavity electrode cooling disk structure of the present utility model;

[0017] Figure 3 is a schematic structure diagram of the coolant flow channel of a plasma etching cavity electrode cooling disk structure of the present utility model;

[0018] Figure 4 is a schematic structure diagram of the cast aluminum base of a plasma etching cavity electrode cooling disk structure of the present utility model;

[0019] Figure 5 is a schematic installation structure diagram of the cast aluminum base and the cavity upper cover of a plasma etching cavity electrode cooling disk structure of the present utility model.

[0020] In the figure: 1. cast aluminum base; 11. mounting hole; 12. through hole; 13. vent hole; 14. center hole; 15. assembly groove; 2. coolant flow channel; 21. inner guide tube; 22. threaded interface; 23. outer guide tube; 24. adapter; 3. upper electrode; 4. cavity cover. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0022] Example: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the utility model is a plasma etching cavity electrode cooling disk structure, including a cast aluminum base 1, a coolant flow channel 2 for circulating coolant and a cavity upper cover 4 for installing the cast aluminum base 1, an upper electrode 3 is arranged inside the cavity upper cover 4, and the upper electrode 3 is located at the bottom of the cast aluminum base 1, the coolant flow channel 2 is composed of an inner guide tube 21 cast into the cast aluminum base 1 and an outer guide tube 23 arranged outside the cast aluminum base 1, the inner guide tube 21 is evenly distributed inside the cast aluminum base 1 in a spiral up and down manner, and a plurality of vents 13 are opened on the cast aluminum base 1 for ventilation, the coolant flow channel 2 is made of stainless steel with good corrosion resistance, and the excellent thermal conductivity of the cast aluminum material is utilized to cast the coolant flow channel 2 into the part, and the coolant circulating in the coolant flow channel 2 takes away the heat generated by the upper electrode 3 and the ionization of the special gas, so that the temperature thereof is kept consistent.

[0023] Among them, one end of the outer flow guide tube 23 is provided with a threaded interface 22, and the other end is provided with a conversion interface 24 for connecting with the inner flow guide tube 21. The threaded interface 22 can facilitate the connection of the outer flow guide tube 23 with the cooling equipment end. The conversion interface 24 is used to connect the inner flow guide tube 21 and the outer flow guide tube 23, and can change the installation direction of the outer flow guide tube 23, which is beneficial to the connection of the outer flow guide tube 23 with the cooling equipment end.

[0024] A central hole 14 with a convex cross-section is provided at the center of the cast aluminum base 1, and four U-shaped grooves arranged around the central hole 14 are connected at the bottom of the central hole 14. The central hole 14 and the U-shaped grooves play a ventilation role.

[0025] Among them, a plurality of groups of mounting holes 11 are formed in the cast aluminum base 1 and are arranged around the central hole 14. Each group of the mounting holes 11 is annularly distributed. Moreover, a plurality of through holes 12 are also formed in the cast aluminum base 1. The mounting holes 11 are used for mounting bolts, and the bolts are used to connect the cast aluminum base 1 and the cavity upper cover 4.

[0026] Among them, four assembly grooves 15 are further formed in the cast aluminum base 1 and are arranged around the central hole 14. The four assembly grooves 15 are annularly distributed and are used for positioning the cast aluminum base 1.

[0027] Among them, a mounting groove for mounting the cast aluminum base 1 is formed in the cavity upper cover 4. The cross-sectional shape of the mounting groove is T-shaped. A fitting matched with the assembly groove 15 is arranged in the mounting groove. Through the cooperation of the fitting and the assembly groove 15, the cast aluminum base 1 is quickly positioned to save the installation time.

[0028] During operation, when manufacturing parts, the coolant flow channel 2 is cast into the cast aluminum base 1 to form a cooling plate. Then, the whole cooling plate is installed on the cavity upper cover 4 and placed above the upper electrode 3. After the coolant flow channel 2 is connected to the cooling end equipment, a cooling system is formed. The coolant circulating in the coolant flow channel 2 takes out the heat generated by the upper electrode 3 and the ionization reaction from the system, so that the overall temperature of the upper electrode 3 is maintained within a certain range, and at the same time, the radio frequency power supply electrode and the electronic components nearby are protected.

[0029] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plasma etching chamber electrode cooling plate structure, comprising a cast aluminum base (1), a coolant flow channel (2) for circulating coolant, and a chamber upper cover (4) for mounting the cast aluminum base (1), characterized in that: An upper electrode (3) is arranged inside the cavity upper cover (4), and the upper electrode (3) is located at the bottom of the cast aluminum base (1). The coolant flow channel (2) is composed of an inner flow guide tube (21) cast into the cast aluminum base (1) and an outer flow guide tube (23) arranged outside the cast aluminum base (1). The inner flow guide tube (21) is evenly distributed inside the cast aluminum base (1) in a spiral manner, and a plurality of ventilation holes (13) are opened on the cast aluminum base (1).

2. The plasma etching chamber electrode cooling plate structure according to claim 1, characterized in that: One end of the outer flow guiding tube (23) is provided with a threaded interface (22), and the other end is provided with a transfer interface (24) for connecting with the inner flow guiding tube (21).

3. The plasma etching chamber electrode cooling plate structure according to claim 1, characterized in that: A central hole (14) having a convex cross-sectional shape is provided at the center of the cast aluminum base (1), and four U-shaped grooves arranged around the central hole (14) are connected at the bottom of the central hole (14).

4. The plasma etching chamber electrode cooling plate structure according to claim 3, characterized in that: The cast aluminum base (1) is provided with a plurality of groups of mounting holes (11) arranged around a central hole (14), each group of the mounting holes (11) is distributed in a ring shape, and the cast aluminum base (1) is also provided with a plurality of through holes (12).

5. The plasma etching chamber electrode cooling plate structure according to claim 3, characterized in that: The cast aluminum base (1) is also provided with four assembly grooves (15) arranged around the central hole (14), and the four assembly grooves (15) are distributed in a ring shape.

6. The plasma etching chamber electrode cooling plate structure according to claim 5, characterized in that: The cavity upper cover (4) is provided with a mounting groove for mounting the cast aluminum base (1), the cross-sectional shape of the mounting groove is T-shaped, and an assembly part matching the assembly groove (15) is provided in the mounting groove.

Images