LED curing and pressing mechanism and equipment

Abstract

The utility model discloses a light-emitting diode (LED) curing and pressing mechanism and equipment, a first horizontal driving assembly and a second horizontal driving assembly are used for adjusting a pressing head to move along the horizontal direction, and the moving direction of a lifting driving assembly is perpendicular to the moving direction of a pitching adjusting assembly. The first horizontal driving assembly and the second horizontal driving assembly can control the position of the pressing head in the x-axis direction and the y-axis direction respectively, meanwhile, the lifting driving assembly can control the position of the pressing head in the z-axis direction, and the pressing head can be controlled to be pressed downwards or lifted through the pitching adjusting assembly, so that in the using process, the pressing head is adjusted in the x-axis direction, the y-axis direction and the z-axis direction, and therefore the pressing head can be adjusted in the x-axis direction, the y-axis direction and the z-axis direction. And the colloid is aligned with the wafer to be cured and is pressed downwards, so that the wafer is fixed on the colloid, and the wafer is convenient to fix.

Description

Technical Field

[0001] The utility model relates to the field of LED repair, and particularly relates to an LED curing and pressing mechanism and equipment. Background Art

[0002] On the one hand, the accuracy of traditional die bonding equipment for LED chips makes it difficult to improve the die bonding effect (unless the speed is greatly reduced). On the other hand, the traditional reflow oven method also exacerbates the defects in the production process, and it is difficult to achieve a 100% yield of LED panels. Therefore, it is necessary to perform secondary repair on the completed LED panels. Lasers are used to remove defective wafers, and then die bonding is performed again at the removed positions. During the die bonding process, the wafer needs to be fixed to the colloid. Otherwise, the wafer is likely to fall off. However, in the existing die bonding equipment, there is no setting for fixing the wafer. Content of the Utility Model

[0003] In order to overcome the deficiencies of the prior art, the utility model provides an LED curing and pressing mechanism and equipment, which can facilitate the fixing of wafers.

[0004] The technical solution adopted by the utility model to solve its technical problems is as follows: On the one hand, the utility model provides an LED single-point curing and pressing mechanism, including:

[0005] A first connecting piece, on which a pressing head is arranged, and the pressing head is used for pressing a wafer to be cured;

[0006] A pitching adjustment component, which is used to control the pitching movement of the first connecting piece;

[0007] A first horizontal driving component, the pitching adjustment component is installed on the first horizontal driving component, and the first horizontal driving component is used to drive the pitching adjustment component to move in the horizontal direction;

[0008] A lifting driving component, the first horizontal driving component is installed on the lifting driving component, and the lifting driving component is used to drive the first horizontal driving component to lift;

[0009] A second horizontal driving component, the lifting driving component is installed on the second horizontal driving component, and the second horizontal driving component is used to drive the lifting driving component to move in the horizontal direction, and the moving direction of the lifting driving component is perpendicular to the moving direction of the pitching adjustment component.

[0010] As a further improvement of the above technical solution, the pitching adjustment component is fixedly connected with a second connecting piece, and the first horizontal driving component includes a linear manual displacement table, and the output end of the linear manual displacement table is connected with the second connecting piece.

[0011] As a further improvement of the above technical solution, the pitch adjustment assembly includes an adjustment member and a rotating member. The adjustment member is disposed between the first connecting member and the second connecting member. One end of the rotating member is rotatably connected to the second connecting member, and the other end is fixedly connected to the first connecting member. The adjustment member is used to adjust the rotation of the rotating member.

[0012] As a further improvement of the above technical solution, the lifting drive assembly includes a lifting electric cylinder and a lifting guide rail. The lifting electric cylinder is fixedly connected with a lifting plate. The lifting guide rail is vertically fixed on the lifting plate. The first horizontal drive assembly is fixedly connected with a third connecting member. The third connecting member is slidably connected to the lifting guide rail. The guide rod of the lifting electric cylinder is fixedly connected to the third connecting member.

[0013] As a further improvement of the above technical solution, there are two lifting guide rails. The opposite sides of the third connecting member are respectively connected to the two lifting guide rails through two sliders.

[0014] As a further improvement of the above technical solution, the second horizontal drive assembly includes a horizontal electric cylinder. The guide rod of the horizontal electric cylinder is connected with a horizontal slider. The lifting plate is fixedly connected to the horizontal slider.

[0015] As a further improvement of the above technical solution, the first connecting member includes a connecting portion, an extending portion, and a mounting portion, which are connected in sequence to form a Z shape.

[0016] As a further improvement of the above technical solution, a connecting hole is provided on the mounting portion. The pressing head is detachably mounted in the connecting hole.

[0017] As a further improvement of the above technical solution, a thimble is provided at the lower end of the pressing head.

[0018] On the other hand, the present invention also provides an LED single-point curing and pressing device, including a dispensing mechanism and the aforementioned LED single-point curing and pressing mechanism. The dispensing mechanism is used for dispensing at the position where the wafer needs to be bonded.

[0019] The beneficial effects of the present invention are as follows: The first horizontal drive assembly and the second horizontal drive assembly are used to adjust the movement of the pressing head in the horizontal direction. Since the movement direction of the lifting drive assembly is perpendicular to the movement direction of the pitch adjustment assembly, the first horizontal drive assembly and the second horizontal drive assembly can control the position of the pressing head in the x-axis and y-axis directions respectively. At the same time, the lifting drive assembly can control the position of the pressing head in the z-axis direction, and the pitch adjustment assembly can control the pressing down or lifting of the pressing head. Therefore, during use, the pressing head is adjusted in the x-axis, y-axis, and z-axis directions to align it with the wafer to be cured and press down, so that the wafer is fixed on the colloid, which is convenient for fixing the wafer. Description of the Drawings

[0020] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 It is a schematic structural diagram of an LED single-point curing and pressing mechanism provided by a preferred embodiment of the present utility model;

[0022] Figure 2 It is a schematic structural diagram of another angle of the LED single-point curing and pressing mechanism provided by a preferred embodiment of the present utility model;

[0023] Figure 3 It is a front view of the LED single-point curing and pressing mechanism provided by a preferred embodiment of the present utility model;

[0024] Figure 4 is Figure 3 an enlarged view of part A in

[0025] Figure 5 It is a top view of the LED single-point curing and pressing mechanism provided by a preferred embodiment of the present utility model.

[0026] Reference numerals: 1, first connecting member; 2, pitching adjustment assembly; 3, first horizontal driving assembly; 4, lifting driving assembly; 5, second horizontal driving assembly;

[0027] 11, pressing head; 12, connecting portion; 13, extending portion; 14, mounting portion; 21, second connecting member; 22, adjusting member; 23, rotating member; 31, linear manual displacement table; 32, third connecting member; 41, lifting electric cylinder; 42, lifting guide rail; 43, lifting plate; 51, horizontal electric cylinder; 52, horizontal slider;

[0028] 111, ejector pin; 141, connecting hole; 421, slider. Specific embodiments

[0029] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts all fall within the scope of protection of the present utility model. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but refer to the more optimal connection structure that can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can select screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods as needed. For example, detachable connection can select screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, magic tape connection and other methods as needed. Each technical feature in the creation of the present utility model can be combined interactively on the premise of not conflicting with each other.

[0030] Please refer to Figures 1-4 , the present utility model provides an LED single-point curing and pressing mechanism, which includes a first connecting member 1, a pitching adjustment assembly 2, a first horizontal driving assembly 3, a lifting driving assembly 4, and a second horizontal driving assembly 5. A pressing head 11 is provided on the first connecting member 1, and the pressing head 11 is used to press the wafer to be cured; the pitching adjustment assembly 2 is used to control the pitching movement of the first connecting member 1; the pitching adjustment assembly 2 is installed on the first horizontal driving assembly 3, and the first horizontal driving assembly 3 is used to drive the pitching adjustment assembly 2 to move in the horizontal direction; the first horizontal driving assembly 3 is installed on the lifting driving assembly 4, and the lifting driving assembly 4 is used to drive the first horizontal driving assembly 3 to lift; the lifting driving assembly 4 is installed on the second horizontal driving assembly 5, and the second horizontal driving assembly 5 is used to drive the lifting driving assembly 4 to move in the horizontal direction. The moving direction of the lifting driving assembly 4 is perpendicular to the moving direction of the pitching adjustment assembly 2. The first horizontal driving assembly 3 and the second horizontal driving assembly 5 are used to adjust the horizontal movement of the pressing head 11. Since the moving direction of the lifting driving assembly 4 is perpendicular to the moving direction of the pitching adjustment assembly 2, the first horizontal driving assembly 3 and the second horizontal driving assembly 5 can control the position of the pressing head 11 in the x-axis and y-axis directions respectively. At the same time, the lifting driving assembly 4 can control the position of the pressing head 11 in the z-axis direction, and the pitching adjustment assembly 2 can control the pressing down or lifting of the pressing head 11. Therefore, during use, the pressing head 11 is adjusted in the x-axis, y-axis, and z-axis directions to align it with the wafer to be cured and press down, so that the wafer is fixed on the colloid, which is convenient for fixing the wafer.

[0031] The pitching adjustment assembly 2 is fixedly connected with a second connecting member 21. The first horizontal driving assembly 3 includes a linear manual displacement stage 31. The output end of the linear manual displacement stage 31 is connected with the second connecting member 21. The linear manual displacement stage 31 can precisely adjust the position of the pressing head 11 in the x-axis direction manually.

[0032] The pitching adjustment assembly 2 includes an adjusting member 22 and a rotating member 23. The adjusting member 22 is arranged between the first connecting member 1 and the second connecting member 21. One end of the rotating member 23 is rotatably connected with the second connecting member 21, and the other end is fixedly connected with the first connecting member 1. The adjusting member 22 is used to adjust the rotation of the rotating member 23, so that the included angle between the rotating member 23 and the second connecting member 21 changes, thereby changing the pitching angle, so that the pressing head 11 presses down or lifts up.

[0033] The lifting driving assembly 4 includes a lifting electric cylinder 41 and a lifting guide rail 42. The lifting electric cylinder 41 is fixedly connected with a lifting plate 43. The lifting guide rail 42 is vertically fixed on the lifting plate 43. The first horizontal driving assembly 3 is fixedly connected with a third connecting member 32. The third connecting member 32 is slidably connected with the lifting guide rail 42. The guide rod of the lifting electric cylinder 41 is fixedly connected with the third connecting member 32. When the lifting electric cylinder 41 is started, its guide rod can stretch, so as to drive the third connecting member 32 to lift along the lifting guide rail 42.

[0034] There are two lifting guide rails 42. The opposite sides of the third connecting member 32 are respectively connected with the two lifting guide rails 42 through two sliders 421. Specifically, two sliders 421 are connected to the two sides of the third connecting member 32 in the y-axis direction and close to the edge. The two lifting guide rails 42 provide more stable support for the third connecting member 32, which is beneficial to ensuring the stability of the third connecting member 32 during the lifting process; the setting of the sliders 421 is used to reduce friction, and the lifting of the third connecting member 32 is smoother.

[0035] The second horizontal driving assembly 5 includes a horizontal electric cylinder 51. The guide rod of the horizontal electric cylinder 51 is connected with a horizontal slider 52. The lifting plate 43 is fixedly connected with the horizontal slider 52. When the horizontal electric cylinder 51 is started, its guide rod drives the horizontal slider 52 to move along the y-axis, and the lifting plate 43 moves along the y-axis with the horizontal slider 52.

[0036] In this embodiment, the horizontal slider 52 is slidably connected with the cylinder body of the horizontal electric cylinder 5, which is beneficial to saving space.

[0037] The first connecting member 1 includes a connecting portion 12, an extending portion 13 and a mounting portion 14, which are connected in sequence to form a Z shape, which is convenient for connecting with the pitching adjustment assembly 2. Specifically, it is convenient for the connecting portion 12 to be connected with the rotating member 23.

[0038] The mounting part 14 is provided with a connection hole 141, and the pressing head 11 is detachably mounted in the connection hole 141. When the pressing head 11 is damaged, the damaged pressing head 11 can be taken out from the connection hole 141, and a new pressing head 11 can be installed in the connection hole 141, which is convenient to use.

[0039] A thimble 111 is provided at the lower end of the pressing head 11. In this embodiment, the LED curing and pressing mechanism is used to press a single wafer. The volume of a single wafer is very small, and the setting of the thimble 111 is beneficial to ensuring the accuracy of wafer pressing.

[0040] In other embodiments, by changing the cross-sectional area or shape of the bottom end of the pressing head 11 or the thimble 111, the LED curing and pressing mechanism can also be used to press two or more wafers simultaneously.

[0041] The preferred embodiment of the present utility model further provides an LED single-point curing and pressing device, which includes a dispensing mechanism and the LED single-point curing and pressing mechanism of the above embodiment. The dispensing mechanism is used to dispense glue at the position where the wafer needs to be bonded. After the dispensing mechanism finishes dispensing glue, the LED single-point curing and pressing mechanism fixes the wafer on the glue, which is convenient for fixing the wafer.

[0042] The above is a specific description of the preferred embodiment of the present utility model, but the present utility model is not limited to the described embodiment. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. An LED curing pressing mechanism, characterized in that: include: A first connecting member, wherein a pressing head is provided on the first connecting member, and the pressing head is used to press the wafer to be cured; A pitch adjustment assembly, the pitch adjustment assembly is used to control the pitch movement of the first connecting member; A first horizontal driving assembly, on which the pitch adjustment assembly is mounted, and the first horizontal driving assembly is used to drive the pitch adjustment assembly to move in a horizontal direction; A lifting drive assembly, wherein the first horizontal drive assembly is mounted on the lifting drive assembly, and the lifting drive assembly is used to drive the first horizontal drive assembly to lift; A second horizontal driving assembly, the lifting driving assembly is installed on the second horizontal driving assembly, the second horizontal driving assembly is used to drive the lifting driving assembly to move in a horizontal direction, and the moving direction of the lifting driving assembly is perpendicular to the moving direction of the pitch adjustment assembly.

2. The LED curing pressing mechanism according to claim 1, characterized in that: The pitch adjustment assembly is fixedly connected to a second connecting member, the first horizontal driving assembly includes a linear manual translation stage, and an output end of the linear manual translation stage is connected to the second connecting member.

3. The LED curing pressing mechanism according to claim 2, characterized in that: The pitch adjustment assembly includes an adjustment member and a rotating member. The adjustment member is arranged between the first connecting member and the second connecting member. One end of the rotating member is rotatably connected to the second connecting member, and the other end is fixedly connected to the first connecting member. The adjustment member is used to adjust the rotation of the rotating member.

4. The LED curing pressing mechanism according to claim 1, characterized in that: The lifting drive assembly includes a lifting electric cylinder and a lifting guide rail, the lifting electric cylinder is fixedly connected to a lifting plate, the lifting guide rail is vertically fixed to the lifting plate, the first horizontal drive assembly is fixedly connected to a third connecting member, the third connecting member is slidably connected to the lifting guide rail, and the guide rod of the lifting electric cylinder is fixedly connected to the third connecting member.

5. The LED curing pressing mechanism according to claim 4, characterized in that: Two lifting guide rails are provided, and two opposite sides of the third connecting member are respectively connected to the two lifting guide rails through two sliding blocks.

6. The LED curing pressing mechanism according to claim 4, characterized in that: The second horizontal driving assembly comprises a horizontal electric cylinder, a guide rod of the horizontal electric cylinder is connected to a horizontal slider, and the lifting plate is fixedly connected to the horizontal slider.

7. The LED curing pressing mechanism according to claim 1, characterized in that: The first connecting member includes a connecting portion, an extending portion and a mounting portion, which are connected in sequence to form a Z shape.

8. The LED curing pressing mechanism according to claim 7, characterized in that: The mounting portion is provided with a connecting hole, and the pressure head is detachably mounted in the connecting hole.

9. The LED curing pressing mechanism according to claim 1, characterized in that: The lower end of the pressure head is provided with an ejector pin.

10. An LED curing and pressing device, characterized in that: It comprises a glue dispensing mechanism and the LED curing and pressing mechanism according to any one of claims 1 to 9, wherein the glue dispensing mechanism is used for dispensing glue at the position where the wafer needs to be bonded.

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