Swing arm equipment suitable for wafer cleaning equipment

Abstract

The utility model relates to swing arm equipment suitable for wafer cleaning equipment, which comprises an equipment base, a plurality of vertical guide plates are arranged on the equipment base, accommodating spaces are formed among the vertical guide plates, spacing plates are arranged at the upper ends of the vertical guide plates, one vertical guide plate is arranged as a driving bearing plate, and the driving bearing plate is arranged on the upper end of the vertical guide plate. A Z-direction driving device is arranged on the inner side of the containing space, another adjacent vertical guide plate is arranged as a displacement guide plate, a Z-direction guide device is arranged on the displacement guide plate and located on the inner side of the containing space, a steering driving device is installed on the Z-direction guide device, and the steering driving device is in conduction connection with a vertical adjusting assembly. A swing arm device is arranged on the vertical adjusting assembly. Therefore, through mutual cooperation of the Z-direction driving device and the Z-direction guiding device, the swing arm device can be driven to stably move up and down, different operation heights are met, and adaptability is high. Through the steering driving equipment, the swing arm device is controlled to have a large coverage angle, and the operation range can be widened.

Description

Technical Field

[0001] The utility model relates to a swing arm device, in particular to a swing arm device applicable to a wafer cleaning device. Background Art

[0002] For the existing wafer cleaning process, the surface of the wafer is often cleaned in a contact manner through a cleaning component, and a spraying component is also used to wash the surface of the wafer.

[0003] Taking the contact cleaning as an example, currently, a cleaning brush installed in a fixed manner is mainly used to contact and clean the wafer. However, due to different models of wafers and different shapes, the fixed manner is likely to cause cleaning dead corners.

[0004] Therefore, currently, an adjustable tray is adopted to rotate and adjust the wafer to make it fit the working range of the cleaning brush. However, during the implementation of this method, the position of the wafer may need to be adjusted in real time, and it is easy to cause misalignment or dropping of the wafer due to improper displacement, affecting the cleaning effect. At the same time, the cleaning brush cannot adjust its own working radius, and there may still be cleaning dead corners.

[0005] For spraying, currently, a fixed single spray head is also adopted to perform covering spraying from top to bottom. However, if the wafer model is switched, since the working radius cannot be adjusted, it is easy to cause cleaning dead corners at the outer edge of the wafer.

[0006] In view of the above defects, the designer actively conducts research and innovation in order to create a swing arm device applicable to a wafer cleaning device, making it more valuable in industry. Summary of the Utility Model

[0007] To solve the above technical problems, the purpose of the utility model is to provide a swing arm device applicable to a wafer cleaning device.

[0008] The swing arm device applicable to a wafer cleaning device of the present utility model includes a device base, wherein: a plurality of vertical guide plates are arranged on the device base, an accommodation space is formed between the vertical guide plates, a spacer is arranged at the upper ends of the vertical guide plates, one vertical guide plate is set as a driving and bearing plate, a Z-direction driving device is arranged inside the accommodation space of the driving and bearing plate, another adjacent vertical guide plate is set as a displacement guiding plate, a Z-direction guiding device is arranged inside the accommodation space of the displacement guiding plate, the Z-direction driving device is provided with a mounting plate, the mounting plate is connected with the Z-direction guiding device, a steering driving device is mounted on the Z-direction guiding device, the steering driving device is conductively connected with a vertical adjusting component, the upper end of the vertical adjusting component passes through the spacer, the lower end of the vertical adjusting component is movably connected with the mounting plate, a swing arm device is arranged on the vertical adjusting component, a reserved space is arranged inside the swing arm device, and a mounting hole communicated with the reserved space is arranged at the front end of the swing arm device.

[0009] Further, for the above swing arm device applicable to a wafer cleaning device, wherein the Z-direction driving device is a Z-direction linear motor, the driving end of the Z-direction linear motor is provided with a mounting plate, the mounting plate is movably connected with the Z-direction guiding device, and a steering driving device is arranged on the mounting plate.

[0010] Still further, for the above swing arm device applicable to a wafer cleaning device, wherein the Z-direction guiding device includes a guide rail connected with the vertical guide plate, a slider is movably arranged on the guide rail, a contact plate is arranged on the slider, and the contact plate is connected with the Z-direction driving device.

[0011] Still further, for the above swing arm device applicable to a wafer cleaning device, wherein the guide rails are I-shaped slide rails distributed in parallel, both sides of the slider are embedded into the corresponding I-shaped slide rails; a lower-end guide plate is further arranged on the contact plate, a guide hole is formed in the lower-end guide plate, and one end of the vertical adjusting component passes through the guide hole.

[0012] Still further, for the above swing arm device applicable to a wafer cleaning device, wherein the steering driving device is a servo motor, a main transmission wheel is arranged on the driving end of the servo motor, the vertical adjusting component includes a secondary transmission wheel movably connected with the mounting plate, a belt is sleeved between the main transmission wheel and the secondary transmission wheel, a vertical guide rod is arranged on the secondary transmission wheel, and the vertical guide rod is connected with the swing arm device.

[0013] Still further, for the above swing arm device applicable to a wafer cleaning device, wherein the vertical guide rod is of a hollow structure, a wiring / liquid supply space is formed inside, a guide through hole is arranged on one side of the vertical guide rod, a connecting valve head is arranged on the guide through hole, and an electric wire or a water pipe is arranged in the vertical guide rod.

[0014] Furthermore, in the above-mentioned swing arm device suitable for wafer cleaning equipment, a driving component is arranged in the reserved space, a cleaning brush is arranged on the mounting hole, the driving component is connected to the cleaning brush, and the driving component is a servo motor.

[0015] Furthermore, in the above-mentioned swing arm device suitable for wafer cleaning equipment, a water pipe is arranged in the reserved space, a spray head is arranged on the mounting hole, and the spray head is connected to the water pipe.

[0016] Furthermore, in the above-mentioned swing arm device suitable for wafer cleaning equipment, a clearance hole is provided on the vertical guide plate.

[0017] Furthermore, in the above-mentioned swing arm device suitable for wafer cleaning equipment, a through hole is provided on the partition plate, a waterproof ring is provided on the through hole, and the upper end of the vertical adjustment component passes through the waterproof ring.

[0018] By means of the above solution, the utility model has at least the following advantages:

[0019] 1. Through the cooperation of the Z-axis drive device and the Z-axis guide device, the swing arm device can be driven to achieve stable up and down displacement to meet different working heights with high adaptability.

[0020] 2. Through the steering drive equipment, the swing arm device is controlled to have a larger coverage angle, which can increase the operating range and meet the needs of different wafer models.

[0021] 3. Adopt the configuration of accommodating space to realize the centralized layout of each equipment as much as possible, reduce the occupation of the internal space of the cleaning equipment, and have better waterproof effect.

[0022] 4. The swing arm device can be used as a carrier for the cleaning brush or the spray head as needed to meet the needs of different cleaning processes, and has good versatility.

[0023] 5. According to the layout of the cleaning equipment, two of the utility models can be used to form a double swing arm coverage, which has a better working range. The height misalignment of the swing arm device will prevent movement interference.

[0024] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of a swing arm device suitable for wafer cleaning equipment (the vertical guide plates are not fully installed).

[0026] Figure 2 It is a schematic diagram of the back structure of a swing arm device applicable to a wafer cleaning device.

[0027] The meanings of the reference numerals in the figure are as follows.

[0028] 1 Equipment base 2 Vertical guide plate

[0029] 3 Spacer 4 Z-direction driving device

[0030] 5 Z-direction guiding device 6 Mounting plate

[0031] 7 Steering driving device 8 Vertical adjustment component

[0032] 9 Swing arm device 10 Guide rail

[0033] 11 Slide block 12 Contact plate

[0034] 13 Lower end guide plate 14 Main transmission wheel

[0035] 15 Auxiliary transmission wheel 16 Belt

[0036] 17 Vertical guide rod 18 Connecting valve head

[0037] 19 Waterproof ring 20 Relief hole

[0038] 21 Guide through hole 22 Connector pipeline Specific embodiments

[0039] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0040] Such as Figures 1 to 2The swing arm device applicable to a wafer cleaning device includes a device base 1. What makes it different is that several vertical guide plates 2 are arranged on the device base 1. An accommodation space is formed between the vertical guide plates 2, and a spacer 3 is arranged at the upper ends of the vertical guide plates 2. In this way, effective internal storage of subsequent various devices and components can be achieved, centralized layout can be realized, and subsequent waterproof planning can be facilitated. At the same time, one of the vertical guide plates 2 is set as a driving and bearing plate, and a Z-direction driving device 4 is arranged inside the accommodation space of this driving and bearing plate. Another adjacent vertical guide plate 2 is set as a displacement guiding plate, and a Z-direction guiding device 5 is arranged inside the accommodation space of this displacement guiding plate. Moreover, the Z-direction driving device 4 is provided with a mounting plate 6, and the mounting plate 6 is connected to the Z-direction guiding device 5 to realize the free up and down movement of the subsequent mounting plate 6, which can meet the adjustment of the horizontal position of the subsequent swing arm device 9. During implementation, a steering driving device 7 is installed on the Z-direction guiding device 5 of the present invention. The steering driving device 7 is conductively connected to a vertical adjustment component 8. The upper end of the vertical adjustment component 8 passes through the spacer 3, and the lower end of the vertical adjustment component 8 is movably connected to the mounting plate 6. In this way, the vertical adjustment component 8 can be controlled to achieve circumferential rotation. In order to cooperate with the position distribution of the brush head or the coverage of the spraying area during cleaning, a swing arm device 9 is arranged on the vertical adjustment component 8 of the present invention. Specifically, a reserved space is arranged inside the swing arm device 9, and a mounting hole communicating with the reserved space is arranged at the front end of the swing arm device 9. In this way, various brush head matching components for cleaning or spraying components can be selected and installed according to actual needs.

[0041] Combined with a preferred embodiment of the present invention, the Z-direction driving device 4 is a Z-direction linear motor, and the driving end of the Z-direction linear motor is provided with a mounting plate 6. At the same time, the mounting plate 6 is movably connected to the Z-direction guiding device 5, and a steering driving device 7 is arranged on the mounting plate 6. In this way, effective "driving bridging" can be achieved through the mounting plate 6, the accommodation space can be effectively utilized, and the control of the Z-direction driving can be realized. Moreover, through the participation of the Z-direction guiding device 5, stable Z-direction displacement can be achieved.

[0042] During implementation, the Z-direction guiding device 5 adopted by the present utility model includes a guide rail 10 connected to the vertical guiding plate 2. A slider 11 is movably arranged on the guide rail 10, and a contact plate 12 is arranged on the slider 11. The contact plate 12 is connected to the mounting plate 6 of the Z-direction driving device 4. In this way, the mounting plate 6 is driven to displace smoothly. Specifically, the guide rail 10 is an I-shaped slide rail distributed in parallel, and both sides of the slider 11 are embedded into the corresponding I-shaped slide rails. In this way, appropriate limiting can be satisfied, ensuring smooth up and down operation without abnormal separation. At the same time, the present utility model also arranges a lower-end guiding plate 13 on the contact plate 12. A guiding hole is opened on the lower-end guiding plate 13, and one end of the vertical adjustment component 8 passes through the guiding hole. In this way, better bottom limiting can be achieved, and abnormal skewing will not occur due to unbalanced load when the vertical adjustment component 8 rotates.

[0043] Furthermore, the steering driving device 7 adopted is a servo motor. A main transmission wheel 14 is arranged on the driving end of the servo motor. The vertical adjustment component 8 includes a secondary transmission wheel 15 movably connected to the mounting plate 6. A belt 16 is sleeved between the main transmission wheel 14 and the secondary transmission wheel 15. In this way, stable transmission can be achieved through the belt 16. Compared with direct drive of the servo motor, the speed ratio control can be achieved through the sizes of each transmission wheel. And a vertical guide rod 17 is arranged on the secondary transmission wheel 15. The vertical guide rod 17 is connected to the swing arm device 9. In order to enable the vertical guide rod 17 to concurrently realize "supply wire routing" inside, the adopted vertical guide rod 17 is of a hollow structure, and a wire routing / liquid supply space is formed inside. Thus, wires or water pipes can be arranged in the vertical guide rod 17. At the same time, a guide through hole 21 is arranged on one side of the vertical guide rod 17, and a connection valve head 18 is arranged on the guide through hole 21. In this way, external pipelines can be introduced through the connection valve head 18, and positioning at the interface can be realized, avoiding excessive pulling displacement of the pipelines caused by the rotation of the vertical guide rod 17.

[0044] Combined with actual implementation, if surface contact type cleaning assistance needs to be realized, a driving component can be arranged in the reserved space, a cleaning brush is arranged on the mounting hole, and the driving component is connected to the cleaning brush. The driving component is a servo motor. In this way, with the operation of the driving component, the cleaning brush can be driven to rotate to perform appropriate contact cleaning on the surface of the wafer.

[0045] If cleaning liquid or water needs to be assisted for spraying. Then the present utility model can arrange a water pipe in the reserved space. At the same time, a spray head is arranged on the mounting hole, and the spray head is connected to the water pipe. In this way, through the connected spraying device and using the actually rotatable range of the swing arm device 9, coverage spraying within a certain area can be realized to spray the cleaning liquid or water on the surface of the wafer. Of course, other components can also be arranged and selected according to needs, which will not be elaborated here.

[0046] Furthermore, in order to meet the subsequent layout of the introduction of various wires such as electric wires and water pipes, a clearance hole 20 is provided on the vertical guide plate 2. During implementation, the clearance hole 20 can be adapted to the waterproof ring 19 or a plug cover. Figure 2 As shown, for some pipelines that need to be laid out independently, a number of joint pipelines 22 are independently arranged on the corresponding vertical guide plates 2.

[0047] At the same time, in order to improve the waterproof effect of the upper partition plate 3, a through hole is provided on the partition plate 3, and a waterproof ring 19 is provided on the through hole, and the vertical guide rod 17 at the upper end of the vertical adjustment component 8 passes through the waterproof ring 19. In this way, the infiltration of external water stains can be avoided to the greatest extent.

[0048] The working principle of the utility model is as follows:

[0049] The Z-direction guide device 5 and the Z-direction drive device 4 cooperate with each other to drive the swing arm device 9 to reach a suitable horizontal height, thereby ensuring that the subsequent range of movement of the swing arm device 9 can cover the current wafer surface.

[0050] Take contact cleaning as an example.

[0051] The actual height of the vertical adjustment assembly 8 is adjusted by using the Z-axis driving device 4, so that the swing arm device 9 drives the cleaning brush to contact the wafer.

[0052] Afterwards, the steering drive device 7 controls the vertical guide rod 17 to rotate, so that the swing arm device 9 drives the cleaning brush to have different cleaning contact ranges.

[0053] Take the spraying as an example.

[0054] The Z-direction guide device 5 and the Z-direction drive device 4 cooperate with each other to drive the swing arm device 9 to a suitable horizontal height. After that, the steering drive device 7 controls the vertical guide rod 17 to rotate, so that the swing arm device 9 rotates to a certain extent. At the same time, the spray head on the swing arm device 9 sprays under the operation of the connected spray equipment to clean the surface of the wafer.

[0055] It can be seen from the above text description and the accompanying drawings that the following advantages are achieved after adopting the utility model:

[0056] 1. Through the cooperation of the Z-axis drive device and the Z-axis guide device, the swing arm device can be driven to achieve stable up and down displacement to meet different working heights with high adaptability.

[0057] 2. Through the steering drive equipment, the swing arm device is controlled to have a larger coverage angle, which can increase the operating range and meet the needs of different wafer models.

[0058] 3. By adopting the configuration of the accommodating space, the centralized layout of each device is realized as much as possible, reducing the occupation of the internal space of the cleaning device and having a better waterproof effect.

[0059] 4. According to needs, the swing arm device can be made to carry the cleaning brush or the spray head, meeting the needs of different cleaning processes and having good versatility.

[0060] 5. For the layout of the cleaning device, two of the present utility models can be adopted to form a double swing arm coverage, having a better working range. Through the height dislocation of the swing arm device, there will be no movement interference.

[0061] In addition, the indicated orientation or positional relationship described in the present utility model is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or structure referred to must have a specific orientation, or be operated in a specific orientation structure. Therefore, it should not be construed as a limitation of the present utility model.

[0062] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A swing arm device for a wafer cleaning device, comprising a device base, characterized in that: A plurality of vertical guide plates are arranged on the base of the equipment, and a accommodating space is formed between the vertical guide plates. A partition plate is arranged at the upper end of the vertical guide plate. A vertical guide plate is arranged as a driving bearing plate. The driving bearing plate is arranged inside the accommodating space and a Z-direction driving device is arranged. Another adjacent vertical guide plate is arranged as a displacement guide plate. The displacement guide plate is arranged inside the accommodating space and a Z-direction guiding device is arranged. The Z-direction driving device is arranged with a mounting plate, and the mounting plate is connected to the Z-direction guiding device. A steering driving device is installed on the Z-direction guiding device, and the steering driving device is conductively connected with a vertical adjustment component. The upper end of the vertical adjustment component passes through the partition plate, and the lower end of the vertical adjustment component is movably connected with the mounting plate. A swing arm device is arranged on the vertical adjustment component, and a reserved space is arranged in the swing arm device. A mounting hole conductive with the reserved space is arranged at the front end of the swing arm device.

2. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: The Z-direction driving device is a Z-direction linear motor, a mounting plate is arranged at the driving end of the Z-direction linear motor, the mounting plate is movably connected to the Z-direction guiding device, and a steering driving device is arranged on the mounting plate.

3. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: The Z-direction guiding device comprises a guide rail connected to a vertical guide plate, a slider is movably arranged on the guide rail, a contact plate is arranged on the slider, and the contact plate is connected to the Z-direction driving device.

4. The swing arm device suitable for wafer cleaning equipment according to claim 3, characterized in that: The guide rails are parallel I-shaped rails, and the two sides of the slider are embedded in the corresponding I-shaped rails; the contact plate is also provided with a lower end guide plate, and the lower end guide plate is provided with a guide hole, and one end of the vertical adjustment component passes through the guide hole.

5. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: The steering drive device is a servo motor, a main drive wheel is arranged on the driving end of the servo motor, the vertical adjustment component includes an auxiliary drive wheel movably connected to the mounting plate, a belt is sleeved between the main drive wheel and the auxiliary drive wheel, a vertical guide rod is arranged on the auxiliary drive wheel, and the vertical guide rod is connected to the swing arm device.

6. The swing arm device suitable for wafer cleaning equipment according to claim 5, characterized in that: The vertical guide rod is a hollow structure, and a wiring / liquid supply space is formed inside. A conducting hole is provided on one side of the vertical guide rod, and a connecting valve head is provided on the conducting hole. An electric wire or a water pipe is provided in the vertical guide rod.

7. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: A driving component is arranged in the reserved space, a cleaning brush is arranged on the mounting hole, the driving component is connected to the cleaning brush, and the driving component is a servo motor.

8. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: A water pipe is arranged in the reserved space, a spray head is arranged on the mounting hole, and the spray head is connected to the water pipe.

9. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: The vertical guide plate is provided with a clearance hole.

10. The swing arm device suitable for wafer cleaning equipment according to claim 1, characterized in that: The partition plate is provided with a through hole, the through hole is provided with a waterproof ring, and the upper end of the vertical adjustment component passes through the waterproof ring.

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