Detection device of semiconductor production line material box
By designing a detection device including positioning, illumination and processing units in the semiconductor production line, the problem of inaccurate state detection caused by blocking light by the material box stopper or cover plate is solved, and accurate detection of the material box status is achieved to ensure the normal operation of the production line.
Patent Information
- Application Number
- CN202421963995.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-14
AI Technical Summary
In semiconductor production lines, the stopper or cover of the material box may block or not block light, making it difficult for the detection equipment to accurately judge the status of the material box, affecting the normal operation of the production line.
A detection device for semiconductor production line material box is designed, including a positioning unit, an illumination unit and a processing unit. The illumination unit uses a laser light source to emit structured light, and the processing unit captures the image formed by the light spot through the image capturer, and uses the judgment module to provide detection information on the state of the material box according to the image.
By identifying the image of the light spot, the detection device can accurately determine whether the cover plate of the material box is covered or the switching position of the barrier lever, thereby ensuring the normal operation of the semiconductor production line.
Smart Images
Figure CN222966098U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a detection device for a semiconductor production line, in particular to a detection device for a cassette in a semiconductor production line. Background Art
[0002] The cassette (Magazine) used in a semiconductor production line is mainly used to hold the semiconductor products produced in the production line according to requirements during the process stages such as packaging and electroplating. In order to meet the requirements of various specifications of semiconductor products and different process steps, the cassettes also have different specifications, and common specifications such as having a retaining bar, a cover plate, etc. Therefore, when the cassette cooperates with the process in the production line, there may be a structural switch of whether the retaining bar or the cover plate blocks or not. It is necessary to properly master the state of the cassette cooperating with the production line operation to ensure the normal operation of the overall production line. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a detection device for a cassette in a semiconductor production line that specializes in detecting the state of the cassette in the production line.
[0004] The detection device for a cassette in a semiconductor production line of the utility model includes a positioning unit suitable for placing the cassette, an illumination unit spaced from the positioning unit, and a processing unit spaced from the illumination unit.
[0005] The illumination unit includes a bracket and at least one laser light source disposed on the bracket and suitable for emitting structured light toward the cassette.
[0006] The processing unit includes an image capture device for capturing an image to be analyzed by photographing the light spot formed by the structured light irradiated on the cassette, and a judgment module information-connected to the image capture device and used for providing detection information representing the state of the cassette according to the image to be analyzed.
[0007] For the detection device for a cassette in a semiconductor production line of the utility model, the cassette includes a body extending along a first axis and having two openings located at opposite ends along the first axis respectively, BCPI - 240325 Page 2 / 6
[0008] and two cover plates respectively and openably closing the openings. The body also has two identification grooves formed at the top and respectively extending inward along the first axis from the openings. The structured light emitted by the illumination unit extends along a second axis perpendicular to the first axis and is inclined toward the identification grooves for irradiation with respect to the longitudinal axis extending longitudinally.
[0009] The detection device for a semiconductor production line cassette of the present utility model, the cassette includes a body extending along a first axis and having two openings respectively located at opposite ends along the first axis, a blocking rod pivotally provided on the body, and a linkage module connected to the blocking rod and exposed at the top of the body. The blocking rod can rotate together with the linkage module, and when the linkage module rotates between a first state and a second state, it respectively moves to an open position where it does not block the opening, and a blocking position where it blocks one of the openings. The structured light emitted by the illumination unit extends along a second axis perpendicular to the first axis and is inclinedly irradiated towards the linkage module with respect to a longitudinal axis extending longitudinally.
[0010] The detection device for a semiconductor production line cassette of the present utility model, at least one laser light source of the illumination unit is movably arranged on the bracket along the longitudinal axis.
[0011] The detection device for a semiconductor production line cassette of the present utility model, the illumination unit includes two laser light sources spaced apart from each other and arranged on the bracket.
[0012] The detection device for a semiconductor production line cassette of the present utility model, the laser light source of the illumination unit and the image capture device of the processing unit are spaced apart from each other along the first axis.
[0013] The detection device for a semiconductor production line cassette of the present utility model, the image capture device of the processing unit takes a picture of the cassette in a direction parallel to the longitudinal axis.
[0014] The beneficial effect of the present utility model is that for the cassette used in the semiconductor production line, the structured light emitted by at least one laser light source of the illumination unit can form a light spot after irradiating a specific position of the cassette. By identifying the image to be analyzed of the light spot, specialized detection can be carried out for the structure such as whether a cover plate is covered or the position of the blocking rod is switched, thereby ensuring the normal operation of the semiconductor production line. Description of the Drawings
[0015] Figure 1 is an incomplete front view showing an embodiment of the detection device for a semiconductor production line cassette of the present utility model;
[0016] Figure 2 is an exploded perspective view showing a cassette detected by the embodiment;
[0017] Figure 3 is an incomplete side view showing the relative positions of an illumination unit and an image capture device of a processing unit in the embodiment BCPI - 240325 Page 3 / 6
[0018] of the image capture device;
[0019] Figure 4 is a block diagram illustrating the detection method using the embodiment.
[0020] Figure 5 is a schematic diagram illustrating a setting step of the detection method.
[0021] Figure 6 is similar to Figure 5 and is a schematic diagram showing the result obtained by an analysis step of the detection method in cooperation with Figure 5
[0022] Figure 7 is a top - view schematic diagram illustrating the cassette of another specification.
[0023] Figure 8 and Figure 9 are both schematic diagrams showing the result obtained by an analysis step of another implementation aspect of the detection method in cooperation with Figure 7 Detailed Description of the Preferred Embodiment
[0024] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0025] Referring to Figure 1 and Figure 2 , an embodiment of a detection device for a cassette in a semiconductor production line of the present invention is provided. This embodiment includes a positioning unit 1 suitable for placing a cassette 9, an illumination unit 2 spaced apart from the positioning unit 1, and a processing unit 3 spaced apart from the illumination unit 2. The cassette 9 includes a body 91 extending along a first axis L1 and having two openings 910 located at opposite ends along the first axis L1, and two covers 92 (only one of which is shown in Figure 1 and Figure 2 ) that can respectively open and close the openings 910. Additionally, in order to accommodate the specification with the covers 92, the body 91 further has two identification grooves 911 formed at the top and respectively extending inward along the first axis L1 from the openings 910.
[0026] Specifically, the positioning unit 1 is a base that can position the cassette 9, thereby cooperating with a conveying mechanism (not shown in the figure) of the semiconductor production line for taking or placing semiconductor products in the cassette 9, so that the conveying mechanism can operate accurately and reliably.
[0027] The light irradiation unit 2 includes a bracket 21 and two laser light sources 22 that are spaced apart from each other along a longitudinal axis L3 extending longitudinally and are movably disposed on the bracket 21 along the longitudinal axis L3, and are adapted to emit a structured light toward the cassette 9. Wherein, the structured light extends along a second axis L2 perpendicular to the first axis L1 and is used to irradiate any one of the identification slots 911 obliquely relative to the longitudinal axis L3. Based on the position of the structured light set for irradiation, the position of the laser light source 22 on the bracket 21 can be adjusted to change the irradiation direction and angle of the structured light, ensuring that the structured light can be accurately irradiated on the expected position of the cassette 9.
[0028] The processing unit 3 includes an image capture device 31 for capturing a spot formed by the structured light irradiated on the cassette 9 to obtain an image to be analyzed, and a judgment module 32 informationally connected to the image capture device 31 and used to provide detection information representing the state of the cassette 9 according to the image to be analyzed. The image capture device 31 preferably can adopt a charge coupled device (CCD), but as long as the actual effect can ensure that even under the low light source required for the operation of the semiconductor production line, the required image to be analyzed can still be captured and a resolution sufficient for the subsequent judgment module 32 to identify can be provided. And the image capture device 31 captures the cassette 9 in a direction parallel to the longitudinal axis L3. In order to avoid the laser light source 22 causing occlusion and also to make the structured light irradiate the cassette 9 obliquely, the laser light source 22 is as Figure 3 presented, spaced apart from the image capture device 31 along the first axis L1. In addition, the judgment module 32 specifically refers to the software installed in the system of this embodiment and the assembly of the hardware devices required to perform the image identification of the image to be analyzed.
[0029] Refer to Figure 4 , a detection method is performed using the embodiment of the detection device for the cassette of the semiconductor production line of the present invention, and it is described in terms of the specifications of the cassette 9 having the cover plate 92 as Figure 2 presented. The detection method includes a positioning step 61, an irradiation step 62, a setting step 63, an analysis step 64, and a decision-making step 65.
[0030] Refer to Figure 4 and cooperate with Figure 1 and Figure 2, the positioning step 61 is to place the cartridge 9 on the positioning unit 1 to ensure that the cartridge 9 is stably fixed in the correct position, facilitating the subsequent detection process and the processes to be performed on the semiconductor components contained inside the cartridge 9.
[0031] In the irradiating step 62, after properly adjusting the laser light source 22 of the light-irradiating unit 2, the structured light emitted by the laser light source 22 is irradiated obliquely relative to the longitudinal axis L3 on the top of the cartridge 9 in a form extending along the second axis L2 to form the light spot, and the image capture device 31 captures the cartridge 9 to obtain the image to be analyzed. Among them, each structured light is approximately as Figure 2 presented, with the position of spanning the corresponding identification slot 911 along the second axis L2 as the criterion, facilitating the actual presentation of the difference in the light spots with or without the cover plate 92 covered.
[0032] Refer to Figure 5 and cooperate with Figure 4 , in the setting step 63, for the image to be analyzed, by writing specific logic in software, a detection range Z for the judgment module 32 (see Figure 1 ) to perform image recognition is defined, and an upper reference line A1 and a lower reference line A2 spaced from each other along the first axis L1 are set in the detection range Z to define a permitted range between the upper reference line A1 and the lower reference line A2.
[0033] In the analysis step 64, the judgment module 32 identifies whether a detection logic part of the light spot within the detection range Z exceeds the permitted range along the first axis L1. It should be noted first that in this embodiment, the identification mechanism of the structured light on one side is used for illustration, and the identification mechanism on the other side is exactly the same.
[0034] At the same time, refer to
[0035] and cooperate with Figure 5 and Figure 6 and cooperate with Figure 1 , specifically, the possible presentation states of the light spot are a line segment extending along the second axis L2 as presented in Figure 6 , or as Figure 5Two line segments extending along the second axis L2 and spaced apart from each other are presented. For the cassette 9 of this specification, the line segment corresponding to the position of the identification slot 911 is set as the detection logic unit. For the cassette 9, if the cover plate 92 on the same side is covered on the body 91, the light spot will not be truncated by the identification slot 911, and will be displaced due to the presence of the cover plate 92, so that the detection logic unit will be as Figure 6 presented, extending beyond the allowable range along the first axis L1. And when the presentation state of the light spot is as Figure 5 presented by two line segments, it means that the light spot has been truncated by the identification slot 911 that will be exposed when the cover plate 92 is not covered. At this time, the detection logic unit of the light spot will not extend beyond the allowable range along the first axis L1. For the cassette 9, it also means that the cover plate 92 on the same side is not covered on the body 91. That is to say, the detection information obtained in the analysis step 64 is whether the detection logic unit extends beyond the allowable range along the first axis L1.
[0036] Then refer to Figures 4 to 6 and cooperate with Figure 1 . In the decision-making step 65, the judgment module 32 determines whether to continue the operation of the semiconductor production line according to the detection information. Specifically, when the detection information indicates that the cover plate 92 on the same side has been opened, the semiconductor components inside the cassette 9 can be output or placed, so the semiconductor production line can continue to operate. On the contrary, if the detection information indicates that the cover plate 92 has not been opened accidentally, if the semiconductor production line continues to operate at this time, it may cause operation errors or even damage to surrounding equipment. At this time, a warning signal can be sent out externally, or even the semiconductor production line can be directly stopped.
[0037] Refer to Figures 7 to 9 and cooperate with Figure 4 . In another implementation aspect of the detection method, the same embodiment is still used, but the cassette 9 uses another specification. Page 6 / 6 of the cassette BCPI-240325
[0038] 9 includes a body 91 extending along the first axis L1 and having openings 910 located at opposite ends along the first axis L1, a retaining rod 93 pivotally mounted on the body 91, and a linkage module 94 connected to the retaining rod 93 and exposed at the top of the body 91. The retaining rod 93 can rotate together with the linkage module 94, and when the linkage module 94 rotates between a first state and a second state, it moves to an open position where it does not block the opening 910 and a blocking position where it blocks one of the openings 910, respectively. Therefore, in the irradiation step 62, the structured light is irradiated on the linkage module 94 of the cassette 9.
[0039] In an embodiment of the cassette 9 for this specification, if the light spot is as Figure 8 presented, with a short line segment away from a long line segment aligned with another short line segment, it represents that the linkage module 94 is in the first state, that is, the retaining rod 93 is in the open position; and if the light spot is as Figure 9 presented, with the short line segment away from the long line segment aligned with the long line segment, it represents that the linkage module 94 is in the second state, and at this time the retaining rod 93 is in the blocking position. Therefore, in this embodiment, the short line segment away from the long line segment is set as the detection logic part, by judging whether the detection logic part exceeds the allowable range along the first axis L1. Specifically, when the detection logic part is as Figure 9 presented and exceeds the allowable range along the first axis L1, it represents that the retaining rod 93 is in the blocking position. Thus, the embodiment can also perform dedicated detection on the cassette 9 of this specification through the detection method, ensuring that the cassette 9 is in the correct state during specific process steps of the semiconductor production line, so as to cooperate with surrounding equipment to perform operations such as taking out and placing semiconductor products to maintain the normal operation of the semiconductor production line.
Claims
1. A detection device for a material box of a semiconductor production line, comprising a positioning unit suitable for placing a material box; characterized in that: The detection device for the semiconductor production line material box comprises: an illumination unit, which is spaced apart from the positioning unit and comprises a bracket, and at least one laser light source disposed on the bracket and adapted to emit structured light toward the material box; and The processing unit is spaced apart from the illumination unit and includes an image capturer for photographing a light spot formed by the structured light irradiating the material box to obtain an image to be analyzed, and a judgment module connected to the image capturer and used to provide detection information representing the state of the material box according to the image to be analyzed.
2. The detection device for semiconductor production line material box according to claim 1, characterized in that: The material box includes a main body extending along a first axis and having two openings located at opposite ends along the first axis, and two cover plates that can be opened and closed respectively. The main body also has two identification grooves formed at the top and extending inward from the openings along the first axis respectively. The structured light emitted by the lighting unit extends along a second axis perpendicular to the first axis, and is irradiated toward the identification groove at an angle relative to the longitudinal axis extending longitudinally.
3. The detection device for semiconductor production line material box according to claim 1, characterized in that: The material box includes a main body extending along a first axis and having two openings respectively located at opposite ends along the first axis, a baffle rod pivotally mounted on the main body, and a linkage module connected to the baffle rod and exposed at the top of the main body, the baffle rod can rotate together with the linkage module, and when the linkage module rotates between the first state and the second state, it moves to an open position that does not block the openings and a blocked position that blocks one of the openings, respectively, the structured light emitted by the illumination unit extends along a second axis perpendicular to the first axis, and is irradiated toward the linkage module at an angle relative to the longitudinal axis extending longitudinally.
4. The detection device for semiconductor production line material box according to claim 2 or 3, characterized in that: At least one laser light source of the illumination unit is disposed on the support so as to be movably disposed along the longitudinal axis.
5. The detection device for semiconductor production line material box according to claim 4, characterized in that: The illumination unit includes two laser light sources which are spaced apart from each other and arranged on the bracket.
6. The detection device for semiconductor production line material box according to claim 2 or 3, characterized in that: The laser light source of the illumination unit is spaced apart from the image capturer of the processing unit along the first axis.
7. The detection device for semiconductor production line material box according to claim 6, characterized in that: The image capturer of the processing unit shoots toward the material box in a direction parallel to the longitudinal axis.