Wafer ball pushing device

Abstract

The utility model belongs to the technical field of ball pushing devices, and provides a wafer ball pushing device which comprises a base and a first supporting leg, a first mounting rod is fixedly connected to the base, a first motor is fixedly connected to the first mounting rod, a first rotating shaft is fixedly connected to the output end of the first motor, and a second rotating shaft is fixedly connected to the output end of the first rotating shaft. The first rotating shaft is rotationally connected to the base in a penetrating mode, a first driving gear is fixedly connected to the end, away from the first motor, of the first rotating shaft, a driven gear is connected to the first driving gear in an engaged mode, and the driven gear is rotationally connected to the base. According to the utility model, the driven gear drives the connecting shaft to revolve, the connecting shaft slides in the groove rod to drive the connecting rod to push the push rod in a reciprocating manner, and the push rod pushes the wafer in the feeding hollow cylinder in a reciprocating manner, so that the wafer falls onto the conveying belt from the discharge port, and further the wafer can be continuously pushed and conveyed without being held by hand for conveying; therefore, the physical power of workers is saved, and the production efficiency of wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of ball pushing devices, in particular to a wafer ball pushing device. Background Art

[0002] In the processing of semiconductor wafers, it is usually necessary to grind and polish the back surface of the wafers. Before grinding and polishing, the wafers need to be bonded and fixed to a substrate (such as glass, ceramics, sapphire wafers, silicon wafers, etc.) using wax or glue. After grinding and polishing, the wafers need to be separated from the substrate, then cleaned and enter the next process. The thickness of the ground and polished wafers is usually about 100 microns or less.

[0003] However, most of the existing semiconductor wafer ball pushing devices cannot continuously push the wafers and cannot adjust the transportation route, thus reducing the wafer production efficiency. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the defects existing in the prior art, and a wafer ball pushing device is proposed.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A wafer ball pushing device includes a base and a first support leg. A first mounting rod is fixedly connected to the base. A first motor is fixedly connected to the first mounting rod. The output end of the first motor is fixedly connected to a first rotating shaft. The first rotating shaft passes through and is rotatably connected to the base. The end of the first rotating shaft away from the first motor is fixedly connected to a first driving gear. A driven gear is meshed with the first driving gear. The driven gear is rotatably connected to the base. A connecting shaft is eccentrically connected to the driven gear. A slotted rod is arranged on the connecting shaft. A connecting rod is fixedly connected to the slotted rod. The end of the connecting rod away from the slotted rod is fixedly connected to a push rod. A support rod is fixedly connected to the base. The end of the support rod away from the base is fixedly connected to a transport box. The transport box passes through and is slidably connected to the connecting rod. A feeding hollow cylinder is fixedly connected to the transport box through. A wafer is arranged on the feeding hollow cylinder. A discharge port is arranged on the transport box.

[0006] As a further description of the above technical solution:

[0007] A circular plate is fixedly connected to the first support leg. A square opening is arranged on the circular plate. A second motor is fixedly connected to the first support leg. The output end of the second motor is fixedly connected to a second rotating shaft. The end of the second rotating shaft away from the second motor is fixedly connected to a second driving gear. The second driving gear is meshed with a toothed ring through the square opening. The toothed ring is rotatably connected to the circular plate. A connecting rod is fixedly connected to the toothed ring. The end of the connecting rod away from the toothed ring is fixedly connected to a second mounting rod.

[0008] As a further description of the above technical solution:

[0009] Both ends of the second mounting rod are rotatably connected through rotating rods. A third motor is fixedly connected to the second mounting rod. The output end of the third motor is fixedly connected to a third rotating shaft. One end of the third rotating shaft away from the third motor penetrates and is fixedly connected with a driving bevel gear. A driven bevel gear is meshed with the driving bevel gear. A group of rotating rods penetrate and are fixedly connected to the driven bevel gear. A conveyor belt is arranged on the rotating rods.

[0010] As a further description of the above technical solution:

[0011] The bottom of the base is fixedly connected with second support legs. There are four groups of the second support legs, and the four groups of second support legs are evenly distributed at the bottom of the base.

[0012] As a further description of the above technical solution:

[0013] There are four groups of the first support legs, and the four groups of first support legs are evenly distributed at the bottom of the circular plate.

[0014] As a further description of the above technical solution:

[0015] The size of the driven gear is twice that of the first driving gear.

[0016] As a further description of the above technical solution:

[0017] The conveyor belt is located on the lower side of the discharge port.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the driven gear drives the connecting shaft to revolve. The connecting shaft slides in the groove rod and drives the connecting rod to reciprocally push the push rod. The push rod reciprocally pushes the wafer in the feeding hollow cylinder, so that the wafer falls from the discharge port onto the conveyor belt. Furthermore, the wafer can be continuously pushed, and the feeding and transportation of the wafer are realized. There is no need for manual holding for transportation, thus saving the physical strength of workers and improving the production efficiency of the wafer.

[0020] 2. In the utility model, the rotation of the second driving gear drives the tooth ring to rotate. The rotation of the tooth ring drives the conveyor belt on the second mounting rod to rotate through the connecting rod. Furthermore, the purpose of transporting the wafer in multiple directions can be realized, so that the transportation direction can be adjusted according to the needs of wafer processing and production, greatly improving the production efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a top perspective view of a wafer ball pushing device proposed by the utility model;

[0022] Figure 2 Structural schematic of a wafer ball pushing device proposed by the present utility model Figure 1 ;

[0023] Figure 3 Structural schematic of a wafer ball pushing device proposed by the present utility model Figure 2 ;

[0024] Figure 4 Side view three-dimensional diagram of a wafer ball pushing device proposed by the present utility model.

[0025] Legend description:

[0026] 1. Base; 2. First mounting rod; 3. First motor; 4. First rotating shaft; 5. First driving gear; 6. Driven gear; 7. Connecting shaft; 8. Connecting rod; 9. Push rod; 10. Support rod; 11. Transport box; 12. Feeding hollow cylinder; 13. Wafer; 14. Discharge port; 15. First support leg; 16. Circular plate; 17. Tooth ring; 18. Square opening; 19. Second motor; 20. Second rotating shaft; 21. Second driving gear; 22. Connecting rod; 23. Second mounting rod; 24. Third motor; 25. Third rotating shaft; 26. Driving bevel gear; 27. Driven bevel gear; 28. Rotating rod; 29. Transmission belt; 30. Second support leg; 31. Grooved rod. Specific implementation manner

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Refer to Figures 1 - 4, an embodiment provided by the present utility model: a wafer ball pushing device, including a base 1 and a first support leg 15. A first mounting rod 2 is fixedly connected to the base 1. A first motor 3 is fixedly connected to the first mounting rod 2. The output end of the first motor 3 is fixedly connected to a first rotating shaft 4. The first rotating shaft 4 is rotatably connected through the base 1. The end of the first rotating shaft 4 away from the first motor 3 is fixedly connected to a first driving gear 5. A driven gear 6 is meshed with the first driving gear 5. The driven gear 6 is rotatably connected to the base 1. A connecting shaft 7 is eccentrically connected to the driven gear 6. A sliding groove rod 31 is arranged on the connecting shaft 7. A connecting rod 8 is fixedly connected to the groove rod 31. The end of the connecting rod 8 away from the groove rod 31 is fixedly connected to a push rod 9. A support rod 10 is fixedly connected to the base 1. The end of the support rod 10 away from the base 1 is fixedly connected to a transport box 11. The transport box 11 is slidably connected through the connecting rod 8. A feed hollow cylinder 12 is fixedly connected through the transport box 11. A wafer 13 is arranged on the feed hollow cylinder 12. A discharge port 14 is arranged on the transport box 11. By driving the connecting shaft 7 to revolve through the driven gear 6, the connecting shaft 7 slides in the groove rod 31 to drive the connecting rod 8 to reciprocally push the push rod 9. The push rod 9 reciprocally pushes the wafer 13 in the feed hollow cylinder 12, so that the wafer 13 falls from the discharge port 14 onto the conveyor belt 29, and thus can continuously push the wafer 13 to perform feeding and transportation of the wafer 13, without manual holding for transportation, thereby saving the physical strength of workers and improving the production efficiency of the wafer 13.

[0029] A circular plate 16 is fixedly connected to the first support leg 15. A square opening 18 is provided on the circular plate 16. A second motor 19 is fixedly connected to the first support leg 15. The output end of the second motor 19 is fixedly connected to a second rotating shaft 20. The end of the second rotating shaft 20 away from the second motor 19 is fixedly connected to a second driving gear 21. The second driving gear 21 is meshed and connected to a toothed ring 17 through the square opening 18. The toothed ring 17 is rotatably connected to the circular plate 16. A connecting rod 22 is fixedly connected to the toothed ring 17. The end of the connecting rod 22 away from the toothed ring 17 is fixedly connected to a second mounting rod 23. Both ends of the second mounting rod 23 penetrate and are rotatably connected to a rotating rod 28. A third motor 24 is fixedly connected to the second mounting rod 23. The output end of the third motor 24 is fixedly connected to a third rotating shaft 25. The end of the third rotating shaft 25 away from the third motor 24 penetrates and is fixedly connected to a driving bevel gear 26. The driving bevel gear 26 is meshed and connected to a driven bevel gear 27. A group of rotating rods 28 penetrate and are fixedly connected to the driven bevel gear 27. A conveyor belt 29 is provided on the rotating rod 28. The rotation of the second driving gear 21 drives the rotation of the toothed ring 17. The rotation of the toothed ring 17 drives the rotation of the conveyor belt 29 on the second mounting rod 23 through the connecting rod 22. Thus, the purpose of transporting the wafer 13 in multiple directions can be achieved. Therefore, the transportation direction can be adjusted according to the processing and production requirements of the wafer 13, greatly improving the production efficiency of the wafer 13. The bottom of the base 1 is fixedly connected to second support legs 30. There are four groups of second support legs 30, and the four groups of second support legs 30 are evenly distributed at the bottom of the base 1. There are four groups of first support legs 15, and the four groups of first support legs 15 are evenly distributed at the bottom of the circular plate 16. The size of the driven gear 6 is twice that of the first driving gear 5. The conveyor belt 29 is located on the lower side of the discharge port 14.

[0030] Working principle: First, place the wafer 13 into the feeding hollow cylinder 12, and then let it fall into the bottom of the transport box 11 along the feeding hollow cylinder 12. When it is necessary to transport and convey the wafer 13, the first motor 3 can be started. The output end of the first motor 3 drives the first rotating shaft 4 to rotate. The rotation of the first rotating shaft 4 drives the first driving gear 5 to rotate. The rotation of the first driving gear 5 drives the driven gear 6 to rotate. The rotation of the driven gear 6 drives the connecting shaft 7 to slide on the groove rod 31. The sliding of the connecting shaft 7 on the groove rod 31 drives the connecting rod 8 to make a reciprocating motion back and forth. The connecting rod 8 drives the push rod 9 to continuously push the wafer 13 at the bottom of the feeding hollow cylinder 12, so that the wafer 13 exits from the discharge port 14 and falls onto the conveyor belt 29. Then, start the third motor 24. The output end of the third motor 24 drives the third rotating shaft 25 to rotate. The rotation of the third rotating shaft 25 drives the driving bevel gear 26 to rotate. The rotation of the driving bevel gear 26 drives the driven bevel gear 27 to rotate. The rotation of the driven bevel gear 27 drives the rotating rod 28 to rotate. The rotation of the rotating rod 28 drives the conveyor belt 29 to rotate to transport the wafer 13. When adjusting the transport route of the conveyor belt 29 according to the production requirements of the wafer 13, the second motor 19 can be started. The output end of the second motor 19 drives the second rotating shaft 20 to rotate. The rotation of the second rotating shaft 20 drives the second driving gear 21 to rotate. The rotation of the second driving gear 21 drives the toothed ring 17 to rotate. The rotation of the toothed ring 17 drives the second mounting rod 23 to rotate through the connecting rod 22. The rotation of the second mounting rod 23 drives the conveyor belt 29 to rotate. Thus, the purpose of transporting the wafer 13 in multiple directions can be achieved, and the transport direction can be adjusted according to the processing and production requirements of the wafer 13, greatly improving the production efficiency of the wafer 13.

[0031] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer ball pushing device, comprising a base (1) and a first supporting leg (15), characterized in that: The base (1) is fixedly connected to a first mounting rod (2), the first mounting rod (2) is fixedly connected to a first motor (3), the output end of the first motor (3) is fixedly connected to a first rotating shaft (4), the first rotating shaft (4) is rotatably connected to the base (1), the end of the first rotating shaft (4) away from the first motor (3) is fixedly connected to a first driving gear (5), the first driving gear (5) is meshingly connected to a driven gear (6), the driven gear (6) is rotatably connected to the base (1), the driven gear (6) is eccentrically connected to a connecting shaft (7), the connecting shaft (7) is connected to the driven gear (6), and the connecting shaft (7) is connected to the driven gear (6). A sliding groove rod (31) is mounted on the shaft (7), a connecting rod (8) is fixedly connected to the groove rod (31), an end of the connecting rod (8) away from the groove rod (31) is fixedly connected to a push rod (9), a support rod (10) is fixedly connected to the base (1), an end of the support rod (10) away from the base (1) is fixedly connected to a transport box (11), the transport box (11) passes through the sliding connecting rod (8), a feeding hollow cylinder (12) is fixedly connected to the transport box (11), a wafer (13) is arranged on the feeding hollow cylinder (12), and a discharge port (14) is arranged on the transport box (11).

2. The wafer ball pushing device according to claim 1, characterized in that: A circular plate (16) is fixedly connected to the first supporting leg (15), a square opening (18) is provided on the circular plate (16), a second motor (19) is fixedly connected to the first supporting leg (15), an output end of the second motor (19) is fixedly connected to a second rotating shaft (20), an end of the second rotating shaft (20) away from the second motor (19) is fixedly connected to a second driving gear (21), the second driving gear (21) is meshedly connected to a gear ring (17) through the square opening (18), the gear ring (17) is rotatably connected to the circular plate (16), a connecting rod (22) is fixedly connected to the gear ring (17), and an end of the connecting rod (22) away from the gear ring (17) is fixedly connected to a second mounting rod (23).

3. The wafer ball pushing device according to claim 2, characterized in that: The two ends of the second mounting rod (23) are rotatably connected with rotating rods (28), the second mounting rod (23) is fixedly connected with a third motor (24), the output end of the third motor (24) is fixedly connected with a third rotating shaft (25), one end of the third rotating shaft (25) away from the third motor (24) is fixedly connected with a driving bevel gear (26), the driving bevel gear (26) is meshingly connected with a driven bevel gear (27), the driven bevel gear (27) is fixedly connected with a group of rotating rods (28), and the rotating rods (28) are provided with a transmission belt (29).

4. The wafer ball pushing device according to claim 1, characterized in that: The bottom of the base (1) is fixedly connected with a second supporting leg (30), and the second supporting legs (30) are provided in four groups, and the four groups of the second supporting legs (30) are evenly distributed on the bottom of the base (1).

5. The wafer ball pushing device according to claim 1, characterized in that: The first supporting legs (15) are provided in four groups, and the four groups of the first supporting legs (15) are evenly distributed at the bottom of the circular plate (16).

6. The wafer ball pushing device according to claim 1, characterized in that: The size of the driven gear (6) is twice that of the first driving gear (5).

7. The wafer ball pushing device according to claim 3, characterized in that: The conveyor belt (29) is located on one side below the discharge port (14).

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