Wafer taking device

Abstract

The utility model relates to the technical field of wafer reclaiming, and discloses a wafer reclaiming device, which is characterized in that a slide rail I is connected with a slide block I in a sliding manner, the slide block I is fixedly connected with a positioning plate, the positioning plate is fixedly connected with a clamping block, the fixing plate is fixedly connected with a slide rail II, the slide rail II is connected with a slide block II in a sliding manner, and the slide block II is fixedly connected with the clamping block. A positioning block is fixedly connected to the second sliding block, a connecting rod is hinged to the positioning block, and the side, away from the positioning block, of the connecting rod is hinged to the positioning plate. According to the utility model, the second air cylinder is arranged, so that the positioning plate drives the two groups of clamping blocks to move inwards along the first sliding rail through the first sliding block, and the two groups of clamping blocks move inwards to clamp a wafer in the middle, so that the wafer is more convenient to clamp during material taking, and the phenomenon that the wafer is inconvenient to clamp and falls off during material taking is avoided; the wafer taking efficiency can be effectively improved, and the wafer is more convenient to take, so that the wafer taking practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer material taking, in particular to a wafer material taking device. Background Art

[0002] A wafer is a basic raw material for manufacturing semiconductor devices. A wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits. Its raw material is silicon. According to the material, wafers can be divided into silicon wafers, gallium nitride wafers, silicon carbide wafers, etc. Among them, silicon wafers are the most commonly used type and are widely used in the manufacture of various chips and electronic components. The diameters of wafers have various specifications, and common ones include 2 inches, 4 inches, 6 inches, 8 inches, and 12 inches, etc. Wafers of different sizes are suitable for different manufacturing requirements and application scenarios.

[0003] The existing technology has the following deficiencies: The existing wafers are not convenient to clamp during material taking, making the material taking of wafers very inconvenient. After the existing wafers are taken, it is not convenient to adjust the angle, making it inconvenient to place the wafers elsewhere after material taking. The existing wafers are not convenient to adjust the height during material taking, thus affecting the convenience of wafer material taking. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a wafer material taking device is proposed.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A wafer material taking device includes a bottom plate. A support column is rotatably connected to the bottom plate. One side of the support column away from the bottom plate is fixedly connected with a connecting plate. One side of the connecting plate away from the support column is fixedly connected with a fixing plate. One side of the fixing plate is fixedly connected with an extension plate. A second cylinder is fixedly connected to the extension plate. A second limiting block is fixedly connected to the fixing plate. The output end of the second cylinder is fixedly connected with a second pushing column. The second pushing column penetrates and is slidably connected to the middle of the second limiting block. A first slide rail is fixedly connected to the fixing plate. A first slider is slidably connected to the first slide rail. A positioning plate is fixedly connected to the first slider. A clamping block is fixedly connected to the positioning plate. A second slide rail is fixedly connected to the fixing plate. A second slider is slidably connected to the second slide rail. A positioning block is fixedly connected to the second slider. A connecting rod is hinged to the positioning block. One side of the connecting rod away from the positioning block is hinged to the positioning plate.

[0006] As a further description of the above technical solution:

[0007] There are two groups of the first slider, the positioning plate, the clamping block, and the connecting rod, and they are symmetrically arranged.

[0008] As a further description of the above technical solution:

[0009] The first slide rail and the second slide rail are vertically arranged. The side of the second push column away from the second cylinder is fixedly connected to the positioning block. The support column and the connecting plate are vertically arranged.

[0010] As a further description of the above technical solution:

[0011] A support block is fixedly connected to the bottom plate. A driving motor is fixedly connected to the support block. The output end of the driving motor is fixedly connected to a transmission shaft. A first limiting block is fixedly connected to the bottom plate. A first bevel gear is fixedly connected to the side of the transmission shaft away from the driving motor. The first bevel gear is meshed with a second bevel gear. The support column is fixedly connected to the middle of the second bevel gear.

[0012] As a further description of the above technical solution:

[0013] The transmission shaft penetrates and is rotatably connected to the first limiting block. The first bevel gear and the second bevel gear are vertically arranged.

[0014] As a further description of the above technical solution:

[0015] A support plate is fixedly connected to the bottom plate. A limiting plate is fixedly connected to the side of the support plate away from the bottom plate. The support column penetrates and is rotatably connected to the middle of the limiting plate. There are two groups of support plates and they are symmetrically arranged.

[0016] As a further description of the above technical solution:

[0017] A first cylinder is fixedly connected to the bottom plate. The output end of the first cylinder is fixedly connected to a first push column. A placement plate is fixedly connected to the side of the first push column away from the first cylinder. A wafer is arranged on the placement plate.

[0018] As a further description of the above technical solution:

[0019] The clamping block is arranged directly above the placement plate.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, a second cylinder is arranged, so that the positioning plate drives two groups of clamping blocks to move inwards along the first slide rail through the first slider. The two groups of clamping blocks move inwards to clamp the wafer in the middle, making it more convenient to clamp the wafer during material taking, avoiding the wafer falling due to inconvenient clamping during material taking, effectively improving the efficiency of wafer material taking, making it more convenient to take the wafer, and thus improving the practicability during wafer material taking.

[0022] 2. In the present utility model, by arranging the first cylinder, the output end of the first cylinder drives the first push rod to move upward, the first push rod drives the placement plate to move upward, and the placement plate drives the wafer to move upward, making it more convenient to adjust the height when picking up the wafer, avoiding the influence on the picking speed of the wafer due to inconvenient height adjustment during picking, and effectively improving the convenience of picking up the wafer.

[0023] 3. In the present utility model, by arranging the driving motor, the connecting plate rotates to drive the fixing plate to rotate, the fixing plate rotates to drive the first slide rail, the first slider, the positioning plate, and the clamping block to rotate, and the clamping block drives the wafer clamped in the middle to rotate and adjust the direction, making it more convenient to adjust the direction after clamping the wafer, avoiding the inconvenience of changing the direction for discharging after picking up the wafer, effectively improving the convenience of discharging after picking up the wafer, and enabling better discharging after picking up the wafer. Description of the Drawings

[0024] Figure 1 Schematic three-dimensional structure of a wafer picking device proposed by the present utility model Figure 1 ;

[0025] Figure 2 Schematic three-dimensional structure of a wafer picking device proposed by the present utility model Figure 2 ;

[0026] Figure 3 Schematic partial cross-sectional structure diagram of a wafer picking device proposed by the present utility model;

[0027] Figure 4 is Figure 1 The enlarged view of part A in

[0028] Legend Explanation:

[0029] 1. Bottom plate; 2. Support block; 3. Driving motor; 4. Transmission shaft; 5. First limit block; 6. First bevel gear; 7. Second bevel gear; 8. Support plate; 9. Limit plate; 10. Support column; 11. Connecting plate; 12. First cylinder; 13. First push rod; 14. Placement plate; 15. Wafer; 16. Fixing plate; 17. Second cylinder; 18. Extension plate; 19. Second limit block; 20. Second push rod; 21. First slide rail; 22. First slider; 23. Positioning plate; 24. Clamping block; 25. Link; 26. Second slide rail; 27. Second slider; 28. Positioning block. Detailed Embodiment

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] Referring to Figures 1-4 , an embodiment provided by the present invention: a wafer picking device, a bottom plate 1, a support column 10 is rotatably connected to the bottom plate 1, a connecting plate 11 is fixedly connected to the side of the support column 10 away from the bottom plate 1, a fixing plate 16 is fixedly connected to the side of the connecting plate 11 away from the support column 10, an extension plate 18 is fixedly connected to one side of the fixing plate 16, a second cylinder 17 is fixedly connected to the extension plate 18, a second limiting block 19 is fixedly connected to the fixing plate 16, the output end of the second cylinder 17 is fixedly connected to a second pushing column 20, the second pushing column 20 penetrates and is slidably connected to the middle of the second limiting block 19, a first slide rail 21 is fixedly connected to the fixing plate 16, a first slider 22 is slidably connected to the first slide rail 21, a positioning plate 23 is fixedly connected to the first slider 22, a clamping block 24 is fixedly connected to the positioning plate 23, a second slide rail 26 is fixedly connected to the fixing plate 16, a second slider 27 is slidably connected to the second slide rail 26, a positioning block 28 is fixedly connected to the second slider 27, a connecting rod 25 is hingedly connected to the positioning block 28, and the side of the connecting rod 25 away from the positioning block 28 is hingedly connected to the positioning plate 23. By setting the second cylinder 17, the output end of the second cylinder 17 drives the second pushing column 20 to push forward, the second pushing column 20 pushes the positioning block 28, the positioning block 28 drives the second slider 27 to move forward, the positioning block 28 moves to pull the connecting rod 25, the connecting rod 25 pulls the positioning plate 23, and the positioning plate 23 drives the two groups of clamping blocks 24 to move inward along the first slide rail 21 through the first slider 22. The two groups of clamping blocks 24 move inward to clamp the middle wafer 15, making it more convenient to clamp the wafer 15 during picking, avoiding the wafer 15 from being inconvenient to clamp and falling during picking, effectively improving the picking efficiency of the wafer 15, making it more convenient to pick the wafer 15, thereby improving the practicability during wafer 15 picking. The first slider 22, the positioning plate 23, the clamping block 24, and the connecting rod 25 are all provided with two groups and are symmetrically arranged. The first slide rail 21 and the second slide rail 26 are perpendicularly arranged. The side of the second pushing column 20 away from the second cylinder 17 is fixedly connected to the positioning block 28. The support column 10 and the connecting plate 11 are perpendicularly arranged.

[0032] A support block 2 is fixedly connected to the bottom plate 1, a drive motor 3 is fixedly connected to the support block 2, a transmission shaft 4 is fixedly connected to the output end of the drive motor 3, a first limiting block 5 is fixedly connected to the bottom plate 1, a first bevel gear 6 is fixedly connected to the side of the transmission shaft 4 away from the drive motor 3, the first bevel gear 6 is meshed and connected with a second bevel gear 7, a support column 10 is fixedly connected to the middle of the second bevel gear 7, the transmission shaft 4 passes through and is rotatably connected to the first limiting block 5, the first bevel gear 6 and the second bevel gear 7 are vertically arranged, a support plate 8 is fixedly connected to the bottom plate 1, a limiting plate 9 is fixedly connected to the side of the support plate 8 away from the bottom plate 1, the support column 10 passes through and is rotatably connected to the middle of the limiting plate 9, there are two groups of support plates 8 and they are symmetrically arranged. By setting the drive motor 3, the output end of the drive motor 3 drives the transmission shaft 4 to rotate. One side of the transmission shaft 4 drives the first bevel gear 6 to rotate along the first limiting block 5. The rotation of the first bevel gear 6 drives the second bevel gear 7 to rotate. The rotation of the second bevel gear 7 drives the support column 10 to rotate along the middle of the limiting plate 9 and the bottom plate 1. The rotation of the support column 10 drives the connecting plate 11 to rotate. The rotation of the connecting plate 11 drives the fixing plate 16 to rotate. The rotation of the fixing plate 16 drives the first slide rail 21, the first slider 22, the positioning plate 23, and the clamping block 24 to rotate. The clamping block 24 drives the wafer 15 clamped in the middle to rotate and adjust the direction, making it more convenient to adjust the direction of the wafer 15 after clamping, avoiding the inconvenience of changing the direction for discharging after the wafer 15 is picked up, effectively improving the convenience of discharging the wafer 15 after picking up, and enabling the wafer 15 to be discharged better after picking up. A first cylinder 12 is fixedly connected to the bottom plate 1, a first push column 13 is fixedly connected to the output end of the first cylinder 12, a placement plate 14 is fixedly connected to the side of the first push column 13 away from the first cylinder 12, a wafer 15 is arranged on the placement plate 14, and the clamping block 24 is arranged directly above the placement plate 14. By setting the first cylinder 12, the output end of the first cylinder 12 drives the first push column 13 to move upward. The first push column 13 drives the placement plate 14 to move upward. The placement plate 14 drives the wafer 15 to move upward, making it more convenient to adjust the height of the wafer 15 during picking up, avoiding the influence of inconvenient height adjustment on the picking speed of the wafer 15, and effectively improving the convenience of picking up the wafer 15.

[0033] Working principle: Cylinder 12 is set. The output end of cylinder 12 drives the push column 13 to move upward. The push column 13 drives the placement plate 14 to move upward, and the placement plate 14 drives the wafer 15 to move upward, making it more convenient to adjust the height when picking up the wafer 15, avoiding the influence on the picking speed of the wafer 15 due to inconvenient height adjustment during picking, and effectively improving the convenience of picking up the wafer 15. When the wafer 15 moves to the middle of the two clamping blocks 24, cylinder 17 is set. The output end of cylinder 17 drives the push column 20 to push forward. The push column 20 pushes the positioning block 28. The positioning block 28 drives the slider 27 to move forward. The movement of the positioning block 28 pulls the connecting rod 25, and the connecting rod 25 pulls the positioning plate 23. The positioning plate 23 drives the two clamping blocks 24 to move inward along the slide rail 21 through the slider 22. The two clamping blocks 24 move inward to clamp the wafer 15 in the middle, making it more convenient to clamp the wafer 15 when picking up, avoiding the wafer 15 from falling due to inconvenient clamping during picking, effectively improving the picking efficiency of the wafer 15, making it more convenient to pick up the wafer 15, and thus improving the practicability when picking up the wafer 15. The driving motor 3 is set. The output end of the driving motor 3 drives the transmission shaft 4 to rotate. One side of the transmission shaft 4 drives the first bevel gear 6 to rotate along the limiting block 1 5. The rotation of the first bevel gear 6 drives the second bevel gear 7 to rotate. The rotation of the second bevel gear 7 drives the support column 10 to rotate on the bottom plate 1 along the middle of the limiting plate 9. The rotation of the support column 10 drives the connecting plate 11 to rotate. The rotation of the connecting plate 11 drives the fixing plate 16 to rotate. The rotation of the fixing plate 16 drives the slide rail 21, the slider 22, the positioning plate 23, and the clamping block 24 to rotate to adjust the direction of the wafer 15 clamped in the middle, making it more convenient to adjust the direction after clamping the wafer 15, avoiding the inconvenience of changing the direction for discharging after picking up the wafer 15, effectively improving the convenience of discharging the wafer 15 after picking up, and enabling the wafer 15 to be discharged better after picking up.

[0034] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer retrieving device, comprising a base plate (1), characterized in that: The base plate (1) is rotatably connected to a support column (10); a side of the support column (10) away from the base plate (1) is fixedly connected to a connecting plate (11); a side of the connecting plate (11) away from the support column (10) is fixedly connected to a fixing plate (16); one side of the fixing plate (16) is fixedly connected to an extension plate (18); a second cylinder (17) is fixedly connected to the extension plate (18); a second limit block (19) is fixedly connected to the fixing plate (16); a second push column (20) is fixedly connected to the output end of the second cylinder (17); the second push column (20) penetrates and is slidably connected to the middle of the second limit block (19); The fixed plate (16) is fixedly connected with a slide rail 1 (21), the slide rail 1 (21) is slidably connected with a slider 1 (22), the slider 1 (22) is fixedly connected with a positioning plate (23), the positioning plate (23) is fixedly connected with a clamping block (24), the fixed plate (16) is fixedly connected with a slide rail 2 (26), the slide rail 2 (26) is slidably connected with a slider 2 (27), the slider 2 (27) is fixedly connected with a positioning block (28), the positioning block (28) is hingedly connected with a connecting rod (25), and the connecting rod (25) is hingedly connected to the positioning plate (23) at a side away from the positioning block (28).

2. A wafer retrieving device according to claim 1, characterized in that: The slide block 1 (22), the positioning plate (23), the clamping block (24) and the connecting rod (25) are each provided with two groups and are symmetrically arranged.

3. The wafer retrieving device according to claim 1, characterized in that: The slide rail 1 (21) and the slide rail 2 (26) are arranged vertically, the side of the push column 2 (20) away from the cylinder 2 (17) is fixedly connected to the positioning block (28), and the support column (10) and the connecting plate (11) are arranged vertically.

4. The wafer retrieving device according to claim 1, characterized in that: The base plate (1) is fixedly connected to a support block (2), the support block (2) is fixedly connected to a drive motor (3), the output end of the drive motor (3) is fixedly connected to a transmission shaft (4), the base plate (1) is fixedly connected to a limiting block (5), a side of the transmission shaft (4) away from the drive motor (3) is fixedly connected to a first bevel gear (6), the first bevel gear (6) is meshingly connected to a second bevel gear (7), and the support column (10) is fixedly connected to the middle of the second bevel gear (7).

5. A wafer retrieving device according to claim 4, characterized in that: The transmission shaft (4) passes through and is rotatably connected to the first limit block (5), and the first bevel gear (6) and the second bevel gear (7) are arranged vertically.

6. The wafer retrieving device according to claim 1, characterized in that: A support plate (8) is fixedly connected to the base plate (1), and a side of the support plate (8) away from the base plate (1) is fixedly connected to a limit plate (9), and the support column (10) passes through and is rotatably connected to the middle of the limit plate (9). The support plates (8) are provided in two groups and are symmetrically arranged.

7. The wafer retrieving device according to claim 1, characterized in that: The base plate (1) is fixedly connected to a cylinder 1 (12), the output end of the cylinder 1 (12) is fixedly connected to a push column 1 (13), the side of the push column 1 (13) away from the cylinder 1 (12) is fixedly connected to a placement plate (14), and a wafer (15) is provided on the placement plate (14).

8. The wafer retrieving device according to claim 1, characterized in that: The clamping block (24) is arranged directly above the placement plate (14).

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