Wafer lifting mechanism of CVD (Chemical Vapor Deposition) equipment

Abstract

The utility model provides a wafer lifting mechanism of CVD (Chemical Vapor Deposition) equipment, belongs to the technical field of wafer lifting, and aims to solve the problem that the mounting efficiency of the lifting mechanism is affected due to the fact that a long time is consumed when corrugated pipes of the existing lifting mechanism are connected. Comprising a positioning mounting disc, a positioning connecting base, a corrugated pipe, a wafer bearing table, a limiting partition plate, a driving rotating shaft, a transmission structure, a connecting structure and a driving threaded disc. The positioning connecting seat is arranged at the upper part of the positioning mounting disc; the corrugated pipe is fixedly connected to the upper part of the positioning connecting seat; the wafer bearing table is arranged at the upper part of the positioning connecting seat; the limiting partition plate is connected to the upper part of the wafer bearing table in a sliding manner; the driving rotating shaft is rotationally connected to the left side and the right side of the wafer bearing table; the driving thread disc is rotationally connected to the middle part of the positioning connecting seat; according to the utility model, the inconvenience of screwing the bolt for multiple times is avoided, a large amount of time is saved, and the disassembly and assembly efficiency of the corrugated pipe is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer lifting, and more specifically, particularly relates to a wafer lifting mechanism of a CVD device. Background Technique

[0002] When a CVD device manufactures a diamond wafer, it is necessary to lift and lower the wafer in the reaction chamber through the action of a lifting mechanism until the wafer moves to a specified position for subsequent deposition and growth. The existing lifting mechanism consists of a lifting block, a connecting shaft, a bellows, a rodless cylinder, etc. When in use, the wafer is lifted by pushing the bellows and the lifting block by the cylinder.

[0003] For example, CN217556284U discloses a wafer lifting mechanism of a CVD device, which relates to the technical field of CVD vacuum coating equipment. Aiming at the problems that the wafer lifting mechanism in the existing CVD device cavity mostly adopts a direct connection method of a cylinder, one of the disadvantages is that rotation may occur during the lifting process, resulting in positioning deviation, and the other is interference with other components of the device. The following solutions are proposed. One outer wall of the rodless cylinder is connected with a cylinder fixing plate by screws. One inner wall side of the rodless cylinder is provided with a first guide rod, and the inner wall side of the rodless cylinder far from the first guide rod is provided with a second guide rod. The utility model has the following advantages: By ventilating one air inlet of the rodless cylinder, the piston rod moves upward. Using the characteristics of the rodless cylinder, the connecting rod does not rotate. The lifting bellows is driven to move upward through a floating joint. Using the characteristics of the floating joint, no radial force is generated between the connecting rod and the plastic bearing.

[0004] Based on the above, most of the bellows of the existing lifting mechanism are connected to the wafer carrier through bolts. When connecting, it is necessary to screw each of the multiple bolts one by one, resulting in a large labor burden on the assembly personnel and taking a long time, which affects the installation efficiency of the lifting mechanism. Content of the Utility Model

[0005] In order to solve the above technical problems, the utility model provides a wafer lifting mechanism of a CVD device to solve the problem that most of the bellows of the existing lifting mechanism are connected to the wafer carrier through bolts. When connecting, it is necessary to screw each of the multiple bolts one by one, resulting in a large labor burden on the assembly personnel and taking a long time, which affects the installation efficiency of the lifting mechanism.

[0006] The purpose and effect of the wafer lifting mechanism of the CVD device of the utility model are achieved by the following specific technical means:

[0007] A wafer lifting mechanism of a CVD device, comprising a positioning mounting plate, a positioning connecting seat, a bellows, a wafer carrier, a limiting partition, a driving rotating shaft, a transmission structure, a connecting structure and a driving threaded disc; there are two positioning connecting seats, and the lower positioning connecting seat is arranged on the upper part of the positioning mounting plate; the bellows is fixedly connected to the upper part of the lower positioning connecting seat; the upper positioning connecting seat is fixedly connected to the upper part of the bellows; the wafer carrier is arranged on the upper part of the upper positioning connecting seat; the limiting partition is slidably connected up and down to the upper part of the wafer carrier, and the limiting partition is elastically connected to the wafer carrier through a spring; there are two driving rotating shafts, and the two driving rotating shafts are respectively rotatably connected to the left and right sides of the wafer carrier, and the two driving rotating shafts are both elastically connected to the wafer carrier through scroll springs; the transmission structure is arranged above the positioning mounting plate; the connecting structure is arranged outside the positioning connecting seat; there are two driving threaded discs, and the two driving threaded discs are respectively rotatably connected to the middle parts of the two positioning connecting seats.

[0008] Further, the connecting structure includes a guiding and limiting cover and a limiting connecting groove; there are two guiding and limiting covers, and the two guiding and limiting covers are respectively fixedly connected to the inner sides of the two positioning connecting seats; there are multiple limiting connecting grooves, and the multiple limiting connecting grooves are circumferentially arrayed on the outer sides of the two guiding and limiting covers.

[0009] Further, the connecting structure further includes a direction limiting ratchet, a positioning connecting rotating shaft and a direction limiting pawl; there are two direction limiting ratchets, and the two direction limiting ratchets are respectively fixedly connected to the outer sides of the two driving threaded discs; there are two positioning connecting rotating shafts, and the two positioning connecting rotating shafts are respectively rotatably connected to the inner sides of the two positioning connecting seats, and the two positioning connecting rotating shafts are respectively elastically connected to the two positioning connecting seats through scroll springs; there are two direction limiting pawls, and the two direction limiting pawls are respectively fixedly connected to the outer sides of the two positioning connecting rotating shafts, and the two direction limiting pawls and the two direction limiting ratchets together form two ratchet transmission structures.

[0010] Further, the connection structure further includes a first traction rope and a positioning connection block; there are two first traction ropes, and the two first traction ropes are respectively fixedly connected to the outer sides of the two positioning connection rotating shafts. The two first traction ropes respectively pass through the two guiding and limiting covers and are fixedly connected to a limiting ring; there are multiple positioning connection blocks, and the multiple positioning connection blocks are circumferentially and arrayed and threadedly connected to the inner sides of the two driving threaded disks. The multiple positioning connection blocks are respectively slidably connected to the inner sides of the multiple limiting connection grooves. Multiple L-shaped limiting grooves are circumferentially and arrayed on the upper part of the positioning mounting disk and the lower part of the wafer carrier table.

[0011] Further, the transmission structure includes a guiding mounting rotating shaft and a positioning connecting rod; there are two guiding mounting rotating shafts, and the two guiding mounting rotating shafts are respectively rotatably connected to the left and right sides of the wafer carrier table; there are two positioning connecting rods, and the two positioning connecting rods are respectively slidably connected up and down to the left and right sides of the wafer carrier table. The two positioning connecting rods are both fixedly connected to the limiting partition plate, and the two positioning connecting rods are respectively sleeved on the outer sides of the two guiding mounting rotating shafts.

[0012] Further, the transmission structure further includes a limiting connecting rod and a counterweight; two groups of limiting connecting rods are hinged to the upper part of each guiding mounting rotating shaft. Each group of limiting connecting rods is composed of two connecting plates hinged to each other. A positioning seat is sleeved on the lower part of each guiding mounting rotating shaft, and both groups of limiting connecting rods are hinged to the positioning seat; a counterweight is connected to the middle of each group of limiting connecting rods by a rope.

[0013] Further, the transmission structure further includes a driven bevel gear, a driving bevel gear and a second traction rope; there are two driven bevel gears, and the two driven bevel gears are respectively fixedly connected to the lower parts of the two guiding mounting rotating shafts; there are two driving bevel gears, and the two driving bevel gears are respectively fixedly connected to the inner sides of the two driving rotating shafts. The two driving bevel gears are respectively meshed with the two driven bevel gears; there are two second traction ropes, and the two second traction ropes are respectively fixedly connected to the outer sides of the two driving rotating shafts. The two second traction ropes pass through the wafer carrier table and are fixedly connected to the positioning mounting disk.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model limits the wafer during the movement of the wafer carrier table through a limiting partition, avoiding the change of the wafer position, effectively ensuring the growth effect of the wafer. By rotating the driving threaded disc, the installation and disassembly of the bellows can be completed, effectively avoiding the inconvenience of screwing bolts multiple times, reducing the labor burden of the assembly personnel, saving a large amount of time, effectively improving the disassembly and assembly efficiency of the bellows, further improving the replacement efficiency of the damaged bellows, and improving the assembly and maintenance efficiency of the lifting mechanism. The driving threaded disc is limited by the direction limiting pawl and the direction limiting ratchet wheel, effectively ensuring the installation stability of the bellows. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the overall structural schematic diagram of the utility model.

[0017] Figure 2 is the schematic diagram of the positional relationship between the limiting partition and the driving rotating shaft of the utility model.

[0018] Figure 3 is the structural schematic diagram of the guiding installation rotating shaft of the utility model.

[0019] Figure 4 is the schematic diagram of the connection relationship between the positioning connection seat and the bellows of the utility model.

[0020] Figure 5 is the schematic diagram of the positional relationship between the driving threaded disc and the positioning connection rotating shaft of the utility model.

[0021] Figure 6 is the disassembled structural schematic diagram of the guiding limiting cover and the driving threaded disc of the utility model.

[0022] In the figure, the corresponding relationship between the component names and the drawing reference numerals is as follows:

[0023] 1, positioning installation disc; 2, positioning connection seat; 201, guiding limiting cover; 202, limiting connection groove; 203, positioning connection rotating shaft; 204, direction limiting pawl; 205, first traction rope; 3, bellows; 4, wafer carrier table; 401, guiding installation rotating shaft; 402, driven bevel gear; 403, positioning connecting rod; 404, limiting connecting rod; 405, counterweight; 5, limiting partition; 6, driving rotating shaft; 601, driving bevel gear; 602, second traction rope; 7, driving threaded disc; 701, direction limiting ratchet wheel; 702, positioning connection block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following further describes in detail the embodiments of the utility model in conjunction with the drawings and embodiments.

[0025] Embodiment 1:

[0026] As shown in the attachedFigure 1 to the attached Figure 3 as shown in

[0027] The utility model provides a wafer lifting mechanism for a CVD device, which comprises a positioning mounting plate 1, a positioning connecting seat 2, a bellows 3, a wafer carrier 4, a limiting partition 5, a driving rotating shaft 6 and a transmission structure; there are two positioning connecting seats 2, and the lower positioning connecting seat 2 is arranged on the upper part of the positioning mounting plate 1; the bellows 3 is fixedly connected to the upper part of the lower positioning connecting seat 2; the upper positioning connecting seat 2 is fixedly connected to the upper part of the bellows 3; the wafer carrier 4 is arranged on the upper part of the upper positioning connecting seat 2; the limiting partition 5 is slidably connected up and down to the upper part of the wafer carrier 4, and the limiting partition 5 is elastically connected to the wafer carrier 4 through a spring; there are two driving rotating shafts 6, and the two driving rotating shafts 6 are respectively rotatably connected to the left and right sides of the wafer carrier 4, and the two driving rotating shafts 6 are both elastically connected to the wafer carrier 4 through scroll springs; the transmission structure is arranged above the positioning mounting plate 1.

[0028] Among them, the transmission structure includes a guiding mounting rotating shaft 401 and a positioning connecting rod 403; there are two guiding mounting rotating shafts 401, and the two guiding mounting rotating shafts 401 are respectively rotatably connected to the left and right sides of the wafer carrier 4; there are two positioning connecting rods 403, and the two positioning connecting rods 403 are respectively slidably connected up and down to the left and right sides of the wafer carrier 4, the two positioning connecting rods 403 are both fixedly connected to the limiting partition 5, and the two positioning connecting rods 403 are respectively sleeved on the outer sides of the two guiding mounting rotating shafts 401.

[0029] Among them, the transmission structure further includes a limiting connecting rod 404 and a counterweight 405; two groups of limiting connecting rods 404 are hinged to the upper part of each guiding mounting rotating shaft 401, each group of limiting connecting rods 404 is composed of two connecting plates hinged to each other, a positioning seat is sleeved on the lower part of each guiding mounting rotating shaft 401, and the two groups of limiting connecting rods 404 are both hinged to the positioning seat; a counterweight 405 is connected to the middle of each group of limiting connecting rods 404 through a rope.

[0030] Among them, the transmission structure further includes a driven bevel gear 402, a driving bevel gear 601 and a second towing rope 602; there are two driven bevel gears 402, and the two driven bevel gears 402 are respectively fixedly connected to the lower parts of the two guiding mounting rotating shafts 401; there are two driving bevel gears 601, and the two driving bevel gears 601 are respectively fixedly connected to the inner sides of the two driving rotating shafts 6, and the two driving bevel gears 601 are respectively meshed with the two driven bevel gears 402; there are two second towing ropes 602, and the two second towing ropes 602 are respectively fixedly connected to the outer sides of the two driving rotating shafts 6, and the two second towing ropes 602 pass through the wafer carrier 4 and are fixedly connected to the positioning mounting plate 1.

[0031] Specific usage method and function of this embodiment: When pushing the wafer to move, the wafer carrier 4 will move away from or close to the positioning mounting disk 1. At this time, the second traction rope 602 will pull the driving rotating shaft 6 and the driving bevel gear 601 to rotate. The driving bevel gear 601 will push the driven bevel gear 402 and the guiding mounting rotating shaft 401 to rotate. At this time, the counterweight 405 drives the limit connecting rod 404 to swing under the action of centrifugal force, thereby pulling the positioning seat upward. The positioning seat will push the positioning connecting rod 403 and the limit partition 5 upward to limit the wafer. When the wafer carrier 4 stops moving, the limit partition 5 automatically resets under the action of the spring, and the driving rotating shaft 6 no longer rotates. At this time, the positioning seat will reset under the pressure when the positioning connecting rod 403 resets and the gravity of the counterweight 405. The positioning connection seat 2 can connect the positioning mounting disk 1, the bellows 3 and the wafer carrier 4.

[0032] Embodiment Two:

[0033] As shown in the Figure 4 to the Figure 6 accompanying drawings:

[0034] On the basis of Embodiment One, it further includes a connection structure and a driving threaded disk 7; the connection structure is arranged on the outer side of the positioning connection seat 2; there are two driving threaded disks 7, and the two driving threaded disks 7 are respectively rotatably connected to the middle parts of the two positioning connection seats 2.

[0035] Among them, the connection structure includes a guiding limit cover 201 and a limit connection groove 202; there are two guiding limit covers 201, and the two guiding limit covers 201 are respectively fixedly connected to the inner sides of the two positioning connection seats 2; there are multiple limit connection grooves 202, and the multiple limit connection grooves 202 are circumferentially and arrayedly opened on the outer sides of the two guiding limit covers 201.

[0036] Among them, the connection structure further includes a direction limiting ratchet 701, a positioning connection rotating shaft 203 and a direction limiting pawl 204; there are two direction limiting ratchets 701, and the two direction limiting ratchets 701 are respectively fixedly connected to the outer sides of the two driving threaded disks 7; there are two positioning connection rotating shafts 203, and the two positioning connection rotating shafts 203 are respectively rotatably connected to the inner sides of the two positioning connection seats 2, and the two positioning connection rotating shafts 203 are respectively elastically connected to the two positioning connection seats 2 through scroll springs; there are two direction limiting pawls 204, and the two direction limiting pawls 204 are respectively fixedly connected to the outer sides of the two positioning connection rotating shafts 203, and the two direction limiting pawls 204 and the two direction limiting ratchets 701 together form two ratchet transmission structures.

[0037] Among them, the connection structure further includes a first traction rope 205 and a positioning connection block 702; there are two first traction ropes 205, and the two first traction ropes 205 are respectively fixedly connected to the outer sides of two positioning connection rotating shafts 203. The two first traction ropes 205 respectively pass through two guiding and limiting covers 201 and are then fixedly connected to a limiting ring; there are multiple positioning connection blocks 702, and the multiple positioning connection blocks 702 are circumferentially arrayed and threadedly connected to the inner sides of two driving threaded disks 7. The multiple positioning connection blocks 702 are respectively slidably connected to the inner sides of multiple limiting connection grooves 202. Multiple L-shaped limiting grooves are circumferentially arrayed on the upper part of the positioning installation disk 1 and the lower part of the wafer carrier 4.

[0038] Specific usage method and function of this embodiment: When installing the corrugated pipe 3, first snap the positioning connection block 702 into the L-shaped limiting groove, and then rotate the driving threaded disk 7 to make the positioning connection block 702 move outward along the limiting connection groove 202 of the guiding and limiting cover 201 until it fits tightly with the L-shaped limiting groove. At this time, the direction-limiting ratchet 701 will slide outside the direction-limiting pawl 204. When the driving threaded disk 7 is subjected to a reverse acting force, the direction-limiting pawl 204 will limit the direction-limiting ratchet 701, making the driving threaded disk 7 unable to reverse. When it is necessary to remove the corrugated pipe 3, pull the first traction rope 205 outward to make the positioning connection rotating shaft 203 drive the direction-limiting pawl 204 to rotate. At this time, the direction-limiting pawl 204 no longer contacts the direction-limiting ratchet 701. Reversing the driving threaded disk 7 can reset the positioning connection block 702, and at this time, the corrugated pipe 3 can be directly removed.

[0039] In this article, the following points need to be noted:

[0040] 1. The attached drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure. Other structures can refer to the general design.

[0041] 2. Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0042] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A wafer lifting mechanism of a CVD device, comprising a positioning mounting plate (1), a positioning connection seat (2), a bellows (3), a wafer carrying platform (4), a limiting baffle (5), a driving shaft (6), a transmission structure, a connecting structure and a driving threaded plate (7); two positioning connection seats (2) are provided, the lower positioning connection seat (2) is provided on the upper part of the positioning mounting plate (1); the bellows (3) is fixedly connected to the upper part of the lower positioning connection seat (2); the upper positioning connection seat (2) is fixedly connected to the upper part of the bellows (3); the wafer carrying platform (4) is provided on the upper part of the upper positioning connection seat (2); the characteristics are: The limit baffle (5) is slidably connected to the upper part of the wafer supporting platform (4) up and down, and the limit baffle (5) is elastically connected to the wafer supporting platform (4) through a spring; two driving shafts (6) are provided, and the two driving shafts (6) are respectively rotatably connected to the left and right sides of the wafer supporting platform (4), and the two driving shafts (6) are elastically connected to the wafer supporting platform (4) through a volute spring; the transmission structure is arranged above the positioning mounting plate (1); the connection structure is arranged on the outer side of the positioning connecting seat (2); two driving threaded disks (7) are provided, and the two driving threaded disks (7) are respectively rotatably connected to the middle parts of the two positioning connecting seats (2).

2. A wafer lifting mechanism for a CVD device as claimed in claim 1, characterized in that: The transmission structure comprises a guide installation rotating shaft (401) and a positioning connecting rod (403); two guide installation rotating shafts (401) are provided, and the two guide installation rotating shafts (401) are respectively rotatably connected to the left and right sides of the wafer supporting platform (4); two positioning connecting rods (403) are provided, and the two positioning connecting rods (403) are respectively slidably connected to the left and right sides of the wafer supporting platform (4) up and down, and the two positioning connecting rods (403) are fixedly connected to the limiting partition (5), and the two positioning connecting rods (403) are respectively sleeved on the outer sides of the two guide installation rotating shafts (401).

3. A wafer lifting mechanism for a CVD device as claimed in claim 2, characterized in that: The transmission structure further comprises a limit connecting rod (404) and a counterweight (405); the upper part of each guide installation rotating shaft (401) is hinged with two groups of the limit connecting rods (404), each group of the limit connecting rods (404) is composed of two mutually hinged connecting plates, the lower part of each guide installation rotating shaft (401) is sleeved with a positioning seat, and the two groups of the limit connecting rods (404) are hinged to the positioning seat; the middle part of each group of the limit connecting rods (404) is connected to a counterweight (405) via a rope.

4. A wafer lifting mechanism for a CVD device as claimed in claim 3, characterized in that: The transmission structure further comprises a driven bevel gear (402), a driving bevel gear (601) and a second traction rope (602); two driven bevel gears (402) are provided, and the two driven bevel gears (402) are respectively fixedly connected to the lower parts of the two guide mounting shafts (401); two driving bevel gears (601) are provided, and the two driving bevel gears (601) are respectively fixedly connected to the inner sides of the two driving shafts (6), and the two driving bevel gears (601) are respectively meshed with the two driven bevel gears (402); two second traction ropes (602) are provided, and the two second traction ropes (602) are respectively fixedly connected to the outer sides of the two driving shafts (6), and the two second traction ropes (602) are fixedly connected to the positioning mounting plate (1) after passing through the wafer carrier (4).

5. The wafer lifting mechanism of a CVD device according to claim 1, characterized in that: The connection structure comprises a guide limiting cover (201) and a limiting connection groove (202); two guide limiting covers (201) are provided, and the two guide limiting covers (201) are respectively fixedly connected to the inner sides of the two positioning connection seats (2); a plurality of limiting connection grooves (202) are provided, and the plurality of limiting connection grooves (202) are arranged in a circular array on the outer sides of the two guide limiting covers (201).

6. A wafer lifting mechanism for a CVD device as claimed in claim 5, characterized in that: The connection structure further comprises a direction limiting ratchet (701), a positioning connection rotating shaft (203) and a direction limiting pawl (204); two direction limiting ratchet wheels (701) are provided, and the two direction limiting ratchet wheels (701) are respectively fixedly connected to the outer sides of the two driving threaded disks (7); two positioning connection rotating shafts (203) are provided, and the two positioning connection rotating shafts (203) are respectively rotatably connected to the inner sides of the two positioning connection seats (2), and the two positioning connection rotating shafts (203) are respectively elastically connected to the two positioning connection seats (2) via volute springs; two direction limiting pawls (204) are provided, and the two direction limiting pawls (204) are respectively fixedly connected to the outer sides of the two positioning connection rotating shafts (203), and the two direction limiting pawls (204) and the two direction limiting ratchets (701) together constitute two ratchet transmission structures.

7. A wafer lifting mechanism for a CVD device as claimed in claim 6, characterized in that: The connection structure also includes a first traction rope (205) and a positioning connection block (702); two first traction ropes (205) are provided, and the two first traction ropes (205) are respectively fixedly connected to the outer sides of the two positioning connection rotating shafts (203), and the two first traction ropes (205) are respectively passed through the two guide limit covers (201) and fixedly connected to a limit ring; a plurality of positioning connection blocks (702) are provided, and the plurality of positioning connection blocks (702) are threadedly connected to the inner sides of the two driving threaded disks (7) in a circumferential array, and the plurality of positioning connection blocks (702) are respectively slidably connected to the inner sides of the plurality of limit connection grooves (202), and the upper part of the positioning installation disk (1) and the lower part of the wafer carrier (4) are both provided with a plurality of L-shaped limit grooves in a circumferential array.

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