Packaging substrate for DDR (Double Data Rate)

Abstract

The utility model belongs to the technical field of semiconductors, and provides a packaging substrate for a DDR (Double Data Rate), which comprises a bottom plate, a fixed mechanism arranged at the top of the bottom plate, a heat dissipation mechanism arranged at the top of the bottom plate, a friction layer arranged at the top of the bottom plate, a movable plate arranged in a connecting seat, and a movable seat arranged on the side wall of the movable plate, the movable seat is arranged on the side wall of the movable plate, the supporting rod is arranged in the movable seat, the spring is arranged on the side wall of the movable plate, the connecting rod is arranged on the side wall of the movable plate, the arc-shaped plate is arranged in the connecting seat, the leaf spring is arranged in the connecting seat, and the cover plate is arranged in the connecting seat. And meanwhile, the movable plate drives the connecting rod to rotate synchronously when rotating, the fixing effect on the memory bank is achieved through cooperation of the connecting base and the cover plate, and meanwhile the memory bank is protected.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and specifically relates to a packaging substrate for DDR. Background Art

[0002] DDR, namely Double Data Rate Synchronous Dynamic Random Access Memory, is one type of memory. Memory can also be called main memory, which is the storage space directly addressable by the CPU and is made of semiconductor devices.

[0003] In the Chinese patent with the publication number CN214798306U, a packaging substrate for DDR is mentioned, which includes a core board, a pad area formed by multiple pads on the front surface of the core board, and solder mask films provided on the front and back surfaces of the core board. Through holes penetrating the core board are provided in the pad area, and copper rings are arranged around the through holes for exhaust and glue flow in the forming process. The copper rings act as dams to block the direct impact of the etching solution on the pads, compensating for the etching of the pads by the etching solution and greatly improving the dimensional quality of the pads.

[0004] However, during use, the welding joint between the memory module and the substrate may become detached, rendering the memory module unusable. At the same time, the memory module itself cannot be protected, resulting in damage to the memory module.

[0005] Therefore, those skilled in the art have proposed a packaging substrate for DDR to solve the problems raised in the background art. Summary of the Utility Model

[0006] To solve the above technical problems, the utility model provides a packaging substrate for DDR to solve the problem of memory module protection in the prior art.

[0007] A packaging substrate for DDR includes a bottom plate, a fixing mechanism arranged on the top of the bottom plate, a heat dissipation mechanism arranged on the top of the bottom plate, and a friction layer arranged on the top of the bottom plate.

[0008] Preferably, the fixing mechanism includes a connecting seat, a movable plate arranged in the connecting seat, a movable seat arranged on the side wall of the movable plate, a support rod arranged in the movable seat, a spring arranged on the side wall of the movable plate, a connecting rod arranged on the side wall of the movable plate, an arc-shaped plate arranged in the connecting seat, a leaf spring arranged in the connecting seat, and a cover plate arranged in the connecting seat.

[0009] Preferably, a plurality of groups of connecting seats are provided. The bottom of the connecting seat is fixedly connected to the top of the bottom plate. One end of the support rod is fixedly connected to the inside of the connecting seat. The movable seat is hinged to the other end of the support rod. The movable plate is hinged to the inside of the connecting seat through the support rod. One end of the spring is fixedly connected to the inside of the connecting seat. A plurality of groups of leaf springs and arc-shaped plates are provided. The side walls of the leaf springs and arc-shaped plates are fixedly connected to the inside of the connecting seat. The cover plate is slidably connected to the inside of the connecting seat.

[0010] Preferably, the heat dissipation mechanism includes a limit seat, a support frame arranged in the limit seat, a magnetic block arranged on the side wall of the support frame, and a cooling layer arranged at the bottom of the support frame.

[0011] Preferably, two groups of limit seats and support frames are provided. The two groups of limit seats are fixedly connected to the top of the bottom plate. The support frame is rotatably connected to the inside of the limit seat. Two groups of magnetic blocks are provided. The two groups of magnetic blocks are fixedly connected to the side wall of the support frame. The cooling layer is bonded to the bottom of the support frame.

[0012] Preferably, the top of the bottom plate is fixedly connected to the heat absorption layer. A baffle is fixedly connected to the top of the bottom plate. The baffle is located outside the heat absorption layer.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. By pushing the cover plate downward, the bottom of the cover plate contacts the side wall of the movable plate. At the same time, when the cover plate moves downward, it contacts the side wall of the arc-shaped plate. By using the cooperation between the arc-shaped plate and the movable plate, the cover plate moves into the inside of the connecting seat. By pushing the bottom of the movable plate to move to one side with the cover plate, and at the same time, the acting force when the spring is compressed pushes the cover plate, so that the rotating rod column at the bottom of the cover plate moves towards the bottom of the arc-shaped plate. At the same time, the cover plate forms a pressure on the leaf spring. By using the reverse acting force of the leaf spring, the cover plate is fixed inside the connecting seat, achieving the fixing effect of the cover plate. At the same time, when the movable plate rotates, it drives the connecting rod to rotate synchronously. By using the cooperation between the connecting seat and the cover plate, the fixing effect on the memory module is achieved, and at the same time, the memory module is protected.

[0015] 2. By pulling the support frame, the magnetic blocks between the two groups of support frames move away from each other. By using the rotational connection between the support frame and the limit seat, the support frame rotates to both sides. By pushing the cooling layer, the cooling layer is bonded to the side wall and the bottom of the support frame, ensuring that the cooling layer and the support frame move synchronously. By rotating the support frame, when the support frame rotates, it drives the cooling layer to rotate. By using the suction force between the two magnetic blocks on both sides, the two support frames on both sides contact each other, achieving the fixing effect of the support frame. At the same time, the cooling layer is located on the top of the memory module, achieving the cooling effect on the memory module. Description of the Drawings

[0016] Figure 1This is a schematic structural diagram of the whole utility model;

[0017] Figure 2 This is a schematic structural diagram of the connection between the connection seat and the bottom plate of the utility model;

[0018] Figure 3 This is a schematic structural diagram of a partial bottom plate of the utility model;

[0019] Figure 4 This is a schematic structural diagram of the connection between the connection seat and the movable plate of the utility model.

[0020] In the figure:

[0021] 1. Bottom plate; 2. Fixing mechanism; 3. Baffle; 4. Heat dissipation mechanism; 5. Friction layer; 6. Heat absorption layer;

[0022] 201. Connection seat; 202. Cover plate; 203. Connecting rod; 204. Movable seat; 205. Support rod; 206. Spring; 207. Movable plate; 208. Arc plate; 209. Leaf spring;

[0023] 401. Limit seat; 402. Cooling layer; 403. Support frame; 404. Magnet. Specific implementation mode

[0024] The following further describes in detail the implementation mode of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0025] As shown in the attached Figure 1 to the attached Figure 4 shown:

[0026] Embodiment 1: The present utility model provides a packaging substrate for DDR, including a bottom plate 1, a fixing mechanism 2 arranged on the top of the bottom plate 1, a heat dissipation mechanism 4 arranged on the top of the bottom plate 1, and a friction layer 5 arranged on the top of the bottom plate 1.

[0027] Furthermore, the fixing mechanism 2 includes a connection seat 201, a movable plate 207 arranged in the connection seat 201, a movable seat 204 arranged on the side wall of the movable plate 207, a support rod 205 arranged in the movable seat 204, a spring 206 arranged on the side wall of the movable plate 207, a connecting rod 203 arranged on the side wall of the movable plate 207, an arc plate 208 arranged in the connection seat 201, a leaf spring 209 arranged in the connection seat 201, and a cover plate 202 arranged in the connection seat 201.

[0028] Further, a plurality of sets of the connecting seats 201 are provided. The bottom of the connecting seat 201 is fixedly connected to the top of the bottom plate 1. One end of the support rod 205 is fixedly connected to the inside of the connecting seat 201. The movable seat 204 is hinged to the other end of the support rod 205. The movable plate 207 is hinged to the inside of the connecting seat 201 through the support rod 205. One end of the spring 206 is fixedly connected to the inside of the connecting seat 201. A plurality of sets of the leaf springs 209 and the arc-shaped plates 208 are provided. The side walls of the leaf springs 209 and the arc-shaped plates 208 are fixedly connected to the inside of the connecting seat 201. The cover plate 202 is slidably connected to the inside of the connecting seat 201.

[0029] Further, the heat dissipation mechanism 4 includes a limit seat 401, a support frame 403 disposed in the limit seat 401, a magnetic block 404 disposed on the side wall of the support frame 403, and a cooling layer 402 disposed at the bottom of the support frame 403.

[0030] Further, two sets of the limit seats 401 and the support frames 403 are provided. The two sets of the limit seats 401 are fixedly connected to the top of the bottom plate 1. The support frame 403 is rotatably connected to the inside of the limit seat 401. Two sets of the magnetic blocks 404 are provided. The two sets of the magnetic blocks 404 are fixedly connected to the side wall of the support frame 403. The cooling layer 402 is adhesively bonded to the bottom of the support frame 403.

[0031] Further, the top of the bottom plate 1 is fixedly connected to the heat absorption layer 6. A baffle 3 is fixedly connected to the top of the bottom plate 1. The baffle 3 is located outside the heat absorption layer 6.

[0032] As can be seen from the above, by pulling the connecting rod 203, the connecting rod 203 drives the movable plate 207 to move. Utilizing the hinge between the movable plate 207 and the support rod 205, the movable plate 207 changes from moving to rotating. By the rotation of the movable plate 207, the movable plate 207 becomes perpendicular. By pulling the cover plate 202, the bottom of the cover plate 202 is disengaged from the inside of the connecting seat 201. It should be noted that when the movable plate 207 rotates, the movable plate 207 compresses the spring 206, avoiding the situation where the cover plate 202 cannot move out of the connecting seat 201. At the same time, the bottom of the cover plate 202 is provided with a rotating rod column, and the sliding connection between the rotating rod column and the connecting seat 201 realizes the fixing effect on the cover plate 202. When the cover plate 202 moves out of the top of the connecting seat 201, by pulling the support frame 403, the magnetic blocks 404 between the two support frames 403 move away from each other. Utilizing the rotational connection between the support frame 403 and the limit seat 401, the support frame 403 rotates to both sides. By pushing the cooling layer 402, the cooling layer 402 is bonded to the side wall and the bottom of the support frame 403, ensuring that the cooling layer 402 and the support frame 403 move synchronously. By placing the memory module on the top of the friction layer 5, the position of the memory module is restricted by the friction layer 5. By rotating the support frame 403, the support frame 403 drives the cooling layer 402 to rotate when rotating. Utilizing the suction force between the two magnetic blocks 404 on both sides, the two support frames 403 contact each other, realizing the fixing effect on the support frame 403. At the same time, the cooling layer 402 is located on the top of the memory module, realizing the cooling effect on the memory module. By pushing the cover plate 202 downward, the bottom of the cover plate 202 contacts the side wall of the movable plate 207. At the same time, when the cover plate 202 moves downward, it contacts the side wall of the arc-shaped plate 208. Utilizing the cooperation between the arc-shaped plate 208 and the movable plate 207, the cover plate 202 moves into the inside of the connecting seat 201. By the cover plate 202 pushing the bottom of the movable plate 207 to move to one side, and at the same time the acting force of the spring 206 during compression pushes the cover plate 202, the rotating rod column at the bottom of the cover plate 202 moves towards the bottom of the arc-shaped plate 208. At the same time, the cover plate 202 forms a pressure on the leaf spring 209. Utilizing the reverse acting force of the leaf spring 209, the cover plate 202 is in the inside of the connecting seat 201, realizing the fixing effect on the cover plate 202. At the same time, when the movable plate 207 rotates, it drives the connecting rod 203 to rotate synchronously. It should be noted that a groove is provided on the side wall of the cover plate 202, enabling the connecting rod 203 to move in the groove, avoiding the situation where the connecting rod 203 and the cover plate 202 are stuck. Utilizing the cooperation between the connecting seat 201 and the cover plate 202, the fixing effect on the memory module is realized, and at the same time, the memory module is protected.

[0033] Embodiment 2: This embodiment is basically the same as the previous embodiment, except that a heat absorption layer 6 is fixedly connected to the top of the bottom plate 1, and a baffle 3 is fixedly connected to the top of the bottom plate 1. The baffle 3 is located outside the heat absorption layer 6.

[0034] As can be seen from the above, since heat is generated when the memory module is in use, to ensure the normal use of the memory module, the heat absorption layer 6 is used to absorb the heat in the bottom plate 1, and through the temperature difference between the inside and outside of the baffle 3, the heat absorbed by the heat absorption layer 6 is conducted to achieve the heat dissipation effect of the memory module. At the same time, the baffle 3 protects the memory module and reduces the situation of dust adsorption on the outside of the memory module.

[0035] The embodiments of the present invention are given for the purposes of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A DDR package substrate, characterized in that: It comprises a bottom plate (1), a fixing mechanism (2) arranged on the top of the bottom plate (1), a heat dissipation mechanism (4) arranged on the top of the bottom plate (1), and a friction layer (5) arranged on the top of the bottom plate (1).

2. A DDR package substrate as claimed in claim 1, characterized in that: The fixing mechanism (2) comprises a connecting seat (201), a movable plate (207) arranged in the connecting seat (201), a movable seat (204) arranged on the side wall of the movable plate (207), a support rod (205) arranged in the movable seat (204), a spring (206) arranged on the side wall of the movable plate (207), a connecting rod (203) arranged on the side wall of the movable plate (207), an arc plate (208) arranged in the connecting seat (201), a leaf spring (209) arranged in the connecting seat (201), and a cover plate (202) arranged in the connecting seat (201).

3. A DDR package substrate as claimed in claim 2, characterized in that: The connecting seat (201) is provided with a plurality of groups, the bottom of the connecting seat (201) is fixedly connected to the top of the bottom plate (1), one end of the support rod (205) is fixedly connected to the inside of the connecting seat (201), the movable seat (204) is hinged to the other end of the support rod (205), the movable plate (207) is hinged to the inside of the connecting seat (201) through the support rod (205), one end of the spring (206) is fixedly connected to the inside of the connecting seat (201), the leaf spring (209) and the arc plate (208) are both provided with a plurality of groups, the side walls of the leaf spring (209) and the arc plate (208) are fixedly connected to the inside of the connecting seat (201), and the cover plate (202) is slidably connected to the inside of the connecting seat (201).

4. A DDR package substrate as claimed in claim 1, characterized in that: The heat dissipation mechanism (4) comprises a limiting seat (401), a support frame (403) arranged in the limiting seat (401), a magnetic block (404) arranged on the side wall of the support frame (403), and a cooling layer (402) arranged at the bottom of the support frame (403).

5. A DDR package substrate as claimed in claim 4, characterized in that: The limiting seat (401) and the supporting frame (403) are each provided with two groups, the two groups of limiting seats (401) are fixedly connected to the top of the bottom plate (1), the supporting frame (403) is rotatably connected to the inside of the limiting seat (401), the magnetic blocks (404) are provided with two groups, the two groups of magnetic blocks (404) are fixedly connected to the side walls of the supporting frame (403), and the cooling layer (402) is bonded to the bottom of the supporting frame (403).

6. A DDR package substrate as claimed in claim 1, characterized in that: The top of the bottom plate (1) is fixedly connected to the heat absorption layer (6), and a baffle (3) is fixedly connected to the top of the bottom plate (1), and the baffle (3) is located outside the heat absorption layer (6).

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