Power assembly

Abstract

The utility model discloses a power assembly, which comprises a power module and a radiator, the power module comprises a mold sealing body, a heat dissipation substrate, a chip and pins, the heat dissipation surface of a second metal layer of the heat dissipation substrate is exposed from a second surface, the chip is wrapped in the mold sealing body and is in conductive connection with a first metal layer, and the pins are in conductive connection with the first metal layer. One end of each pin is coated in the mold sealing body and is conductively connected with the chip, and the other end of each pin extends out of the side surface of the mold sealing body; the radiator is in heat-conducting connection with the radiating surface; the second surface of the mold sealing body comprises a first area located between the pins and the heat dissipation face, the surface, facing the mold sealing body, of the heat dissipation device comprises a second area corresponding to the first area, one of the first area and the second area is provided with a convex part, the other one of the first area and the second area is provided with a concave part, and the convex part is located in the concave part to position the power module on the heat dissipation device. According to the embodiment, the creepage distance between the pins and the heat dissipation surface can be increased, the risk of electric leakage is reduced, and in addition, the concave parts and the convex parts can serve as positioning structures to achieve positioning of the power module and the radiator.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, in particular to a power component. Background Art

[0002] In order to enhance the heat dissipation capacity, currently, a power module with a ceramic heat dissipation substrate dissipates heat by means of an external radiator. Among them, the metal layer on one side of the ceramic heat dissipation substrate is exposed from the encapsulation body of the power module, and the radiator is attached to the exposed metal layer. In order to reduce the length of the power module, the distance between its pins and the exposed metal layer is short, posing a potential leakage risk. In addition, during the assembly process of the power module and the radiator, there is also a problem that the power module is offset and cannot be accurately installed on the radiator. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a power component, which can increase the creepage distance, reduce the potential leakage risk, and can also realize the positioning between the power module and the radiator.

[0004] The power component according to the first embodiment of the utility model includes:

[0005] A power module, including an encapsulation body, a heat dissipation substrate, a chip and pins. The encapsulation body includes a first surface, a second surface arranged oppositely, and a side surface located between the first surface and the second surface. The heat dissipation substrate includes a first metal layer, a second metal layer and an insulating layer. The insulating layer is located between the first metal layer and the second metal layer. The first metal layer, the insulating layer and a part of the second metal layer are encapsulated in the encapsulation body, and the heat dissipation surface of the second metal layer away from the insulating layer is exposed from the second surface. The chip is encapsulated in the encapsulation body and is electrically connected to the first metal layer. One end of the pin is encapsulated in the encapsulation body and is electrically connected to the chip, and the other end extends out from the side surface of the encapsulation body;

[0006] A radiator, which is thermally connected to the heat dissipation surface;

[0007] Wherein, the second surface of the encapsulation body includes a first area located between the pin and the heat dissipation surface. The surface of the radiator facing the encapsulation body includes a second area corresponding to the first area. One of the first area and the second area has a convex part, and the other has a concave part. The convex part is located in the concave part to position the power module on the radiator.

[0008] The power component according to the first embodiment of the utility model has at least the following beneficial effects:

[0009] In this embodiment, by providing a recess or a protrusion in the first region between the pin and the heat dissipation surface, the creepage distance between the pin and the heat dissipation surface can be increased, thereby reducing or eliminating the risk of leakage. In addition, the recess or the protrusion can also serve as a positioning structure to cooperate with the protrusion or the recess on the radiator to limit the displacement between the power module and the radiator, facilitating the positioning during the assembly of the power module and the radiator.

[0010] In other embodiments of the present utility model, the first region is provided with the recess, and both ends of the recess respectively penetrate through to the other two side surfaces of the mold-sealed body adjacent to the side surface where the pin is located.

[0011] In other embodiments of the present utility model, the extending direction of the recess is parallel to the side surface where the pin is located.

[0012] In other embodiments of the present utility model, the first region is provided with the recess, the radiator includes a heat dissipation component and an insulating component, the heat dissipation component includes a heat dissipation body and a positioning boss, the positioning boss is arranged on the surface of the heat dissipation body facing the power module, and the insulating component covers the surface of the heat dissipation body facing the power module and the positioning boss;

[0013] Wherein, the protrusion includes the positioning boss and the insulating component covering the positioning boss.

[0014] In other embodiments of the present utility model, the positioning boss is an independent structure different from the heat dissipation body, and the positioning boss is made of an insulating material.

[0015] In other embodiments of the present utility model, the positioning boss is bonded to the heat dissipation body, or the radiator further includes a locking component, the locking component has a locked state of locking the positioning boss to the heat dissipation body and an unlocked state of unlocking, and when the locking component is in the unlocked state, the positioning boss can move relative to the heat dissipation body.

[0016] In other embodiments of the present utility model, the first region is provided with the recess, the radiator includes a heat dissipation component and an insulating component, the insulating component covers the surface of the heat dissipation component facing the power module, and the protrusion is connected to the surface of the insulating component facing the power module.

[0017] In other embodiments of the present utility model, the protrusion and the insulating component are connected as an integral structure, or the protrusion is an independent structure different from the insulating component, and the protrusion is made of an insulating material and is bonded to the insulating component.

[0018] In other embodiments of the present utility model, the convex portion is provided in the first region, and the convex portion is integrally connected to the potting body.

[0019] In other embodiments of the present utility model, a plurality of power modules are provided, and a plurality of groups of the second regions are provided in the radiator corresponding to the first regions of the respective power modules. Each power module is positioned on the radiator through the correspondingly provided convex portion and concave portion.

[0020] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The following further describes the present utility model in conjunction with the drawings and embodiments, wherein:

[0022] Figure 1 is a schematic cross-sectional view of a typical power module;

[0023] Figure 2 is a three-dimensional schematic diagram of a power component in the first embodiment of the present utility model;

[0024] Figure 3 is Figure 2 a three-dimensional schematic diagram of the power module in;

[0025] Figure 4 is Figure 2 a schematic cross-sectional view of the power component in;

[0026] Figure 5 is Figure 4 an enlarged schematic diagram of an embodiment of region A in;

[0027] Figure 6 is Figure 4 an enlarged schematic diagram of another embodiment of region A in;

[0028] Figure 7 is a three-dimensional schematic diagram of a power component in the second embodiment of the present utility model;

[0029] Figure 8 is Figure 7 a schematic cross-sectional view of the power component in;

[0030] Figure 9 is Figure 8 an enlarged schematic diagram of region B in.

[0031] Reference numerals:

[0032] Power module 100, molded package 110, first surface 111, second surface 112, heat dissipation substrate 120, first metal layer 121, second metal layer 122, heat dissipation surface 1221, insulating layer 123, chip 130, pin 140, source pin 141, drain pin 142;

[0033] Radiator 200, heat dissipation component 210, heat dissipation main body 211, positioning boss 212, heat dissipation column 213, insulating component 220;

[0034] Protrusion 300;

[0035] Recess 400. Detailed implementation mode

[0036] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0038] In the description of the present invention, the meaning of several is more than one, and the meaning of multiple is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0040] In the description of the present utility model, the descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0041] The present utility model relates to a power component including a power module and a heat sink. For ease of understanding, first, in combination with Figure 1 A typical power module is described. As shown in the figure, the power module 100 includes a molded body 110, a heat dissipation substrate 120, a chip 130, and pins 140.

[0042] The molded body 110 is usually formed after curing epoxy resin, which can insulate and protect the heat dissipation substrate 120, the chip 130, and the pins 140. Specifically, the chip 130, a part of the heat dissipation substrate 120, and a part of the pins 140 are covered in the molded body 110. The molded body 110 includes a first surface 111 and a second surface 112 arranged opposite to each other, and a plurality of side surfaces located between the first surface 111 and the second surface 112. Exemplarily, the first surface 111 is the upper surface, the second surface 112 is the lower surface, and the plurality of side surfaces are respectively the left side surface, the right side surface, the front side surface, and the rear side surface. Among them, the left side surface and the right side surface are located on both sides of the length direction of the molded body, and the front side surface and the rear side surface are located on both sides of the width direction of the molded body.

[0043] The heat dissipation substrate 120 can be a direct bonding copper (DBC) substrate, a direct plating copper (DPC) substrate, or an active metal bonding (AMB) substrate, etc. The main structure of the heat dissipation substrate 120 is an insulating layer and metal layers connected to both sides of the insulating layer. One metal layer is used to connect the chip, and the other metal layer will be exposed from the molded body 110 after molding, so as to transfer the heat generated during the operation of the chip to the outside. Refer to Figure 1, the heat dissipation substrate 120 includes a first metal layer 121, a second metal layer 122 and an insulating layer 123. The insulating layer 123 is located between the first metal layer 121 and the second metal layer 122. The first metal layer 121, the insulating layer 123 and a part of the second metal layer 122 are encapsulated in the encapsulation body 110, and the heat dissipation surface 1221 of the second metal layer 122 away from the insulating layer 123 exposes from the second surface 112. Exemplarily, the first metal layer 121, the insulating layer 123 and the second metal layer 122 are distributed in sequence along the up-down direction, and the heat dissipation surface 1221 is the lower surface of the second metal layer 122. The first metal layer 121 and the second metal layer 122 can be made of copper or other materials with conductive and heat-conductive properties, and the insulating layer 123 can be made of ceramic or other materials with insulating and heat-conductive properties.

[0044] The chip 130 is encapsulated in the encapsulation body 110 and is electrically connected to the first metal layer 121. Exemplarily, the chip 130 is stacked on the upper surface of the first metal layer 121, and the lower side of the chip 130 is fixedly connected to the first metal layer 121 by means of welding or sintering, etc., so that the drain of the chip 130 is in a conducting state with the first metal layer 121.

[0045] One end of the pin 140 is encapsulated in the encapsulation body 110 and is electrically connected to the chip 130, and the other end extends out from the side surface of the encapsulation body 110. Exemplarily, the pin 140 includes a source pin 141 electrically connected to the source of the chip 130 and a drain pin 142 electrically connected to the drain of the chip 130. Among them, the source pin 141 extends out from the right side surface of the encapsulation body 110, and the drain pin 142 extends out from the left side surface of the encapsulation body 110. It should be noted that the so-called electrical connection between the pin 140 and the chip 130 can either refer to the direct electrical connection between the pin 140 and the chip 130 or the indirect electrical connection between the pin 140 and the chip 130 through other structures. Exemplarily, the source pin 141 is directly electrically connected to the source of the chip 130, and the drain pin 142 is fixedly connected to the upper surface of the first metal layer 121 and is indirectly electrically connected to the drain of the chip 130 through the first metal layer 121.

[0046] In the related art, in order to reduce the length of the power module, the straight-line distance between its pin 140 and the exposed heat dissipation surface 1221 is short, such as Figure 1 the distance L in, resulting in a short creepage distance and there is a hidden danger of electric leakage. Based on this, the present utility model proposes a power component, which can increase the creepage distance between the power module pin and the heat dissipation surface, and at the same time can realize the positioning between the power module and the radiator. The following will be described in conjunction with the drawings and specific embodiments.

[0047] Referring to Figure 2, the power component 10 of the first embodiment of the present utility model includes a power module 100 and a heat sink 200. The power module 100 includes a molded body 110, a heat dissipation substrate 120, a chip 130, and pins 140. Among them, the heat dissipation substrate 120, the chip 130, and the pins 140 can all be understood with reference to Figure 1 the structure in

[0048] The heat sink 200 is thermally connected to the power module 100 and is used to assist the power module 100 in heat dissipation. Exemplarily, the heat sink 200 includes a heat dissipation component 210 mainly for heat dissipation. The heat dissipation component 210 includes a heat dissipation body 211. The heat dissipation body 211 is made of a metal material with a high thermal conductivity. Its upper surface is directly attached to the heat dissipation surface 1221 or is thermally connected through a thermally conductive material. Exemplarily, the heat dissipation body 211 is a rectangular heat sink; in addition, the heat sink 200 may further include heat dissipation columns 213 or heat dissipation fins to increase the heat dissipation area and improve the heat dissipation efficiency.

[0049] In this embodiment, the second surface 112 of the molded body 110 includes a first region located between the pins 140 and the heat dissipation surface 1221 (the approximate range is marked by the dotted line box in Figure 3 ). Exemplarily, with reference to Figure 3 , the pins 140 of the molded body 110 include a source pin 141 located on the right side surface of the molded body 110 and a drain pin 142 located on the left side surface of the molded body 110. Then, the second surface 112 of the molded body 110 includes a first region located between the source pin 141 and the right side of the heat dissipation surface 1221, and a first region located between the drain pin 142 and the left side of the heat dissipation surface 1221. Among them, a recess 400 is provided in the first region. The recess 400 may be formed by recessing from the second surface 112. Exemplarily, the recess 400 is the Figure 3 groove shown in

[0050] With reference to Figure 2 , the surface of the heat sink 200 facing the molded body 110 includes a second region corresponding to the first region, and the second region has a protrusion 300. Exemplarily, the upper surface of the heat sink 200 has a protrusion 300. The protrusion 300 may be a convex rib shown in the figure.

[0051] In this embodiment, by providing the recess 400 in the first region between the pins 140 and the heat dissipation surface 1221, the creepage distance between the pins 140 and the heat dissipation surface 1221 can be increased, thereby reducing or eliminating the risk of electric leakage. In addition, the recess 400 can also be used as a positioning structure to cooperate with the protrusion 300 on the heat sink 200 to limit the displacement between the power module 100 and the heat sink 200, facilitating the preliminary positioning during the assembly of the power module 100 and the heat sink 200.

[0052] Based on the first embodiment, in some embodiments of the present utility model, referring to Figure 2 , both ends of the recess 400 penetrate through to the other two side surfaces of the encapsulation body 110 adjacent to the side surface where the lead 140 is located. In this way, it can be ensured that the extending range of the recess 400 can cover the connection part between the lead 140 and the encapsulation body 110 in the width direction, so that each position on the side surface where the lead 140 is located is separated from the heat dissipation surface 1221 through the recess 400. Exemplarily, taking the Figure 3 drain lead 142 as an example, if the side surface where the drain lead 142 is located is the left side surface, then the two side surfaces adjacent to the left side surface are the front side surface and the rear side surface respectively. Then, both ends of the recess 400 corresponding to the drain lead 142 penetrate through to the front side surface and the rear side surface.

[0053] When both ends of the recess 400 penetrate through to the other two side surfaces of the encapsulation body 110 adjacent to the side surface where the lead 140 is located, in some specific embodiments, referring to Figure 3 , the extending direction of the recess 400 is parallel to the side surface where the lead 140 is located, with a regular shape and being convenient for cooperation and positioning with the convex part 300. Exemplarily, in this embodiment, the recess 400 is arranged as a straight groove and is parallel to the width direction of the encapsulation body 110.

[0054] It should be noted that the present utility model does not limit the shape of the recess 400. Besides the straight shape in the above embodiment, it can also be other shapes such as an arc shape or a broken line shape.

[0055] Based on the first embodiment, in some embodiments of the present utility model, referring to Figure 4 、 Figure 5 , the heat sink 200 includes a heat dissipation component 210, and the heat dissipation component 210 includes a heat dissipation main body 211 and a positioning boss 212. Among them, the heat dissipation main body 211 is made of a metal material with a high thermal conductivity, which can be understood by referring to the foregoing embodiments. The positioning boss 212 is arranged on the surface of the heat dissipation main body 211 facing the power module 100. Exemplarily, the positioning boss 212 is arranged on the upper surface of the heat dissipation main body 211.

[0056] Since the heat dissipation main body 211 is usually made of a metal material that can conduct electricity and the distance between the heat dissipation main body 211 and the power module 100 is relatively close, to avoid potential leakage hazards, the heat sink 200 further includes an insulating component 220. The insulating component 220 covers the surface of the heat dissipation main body 211 facing the power module 100 and the positioning boss 212. The insulating component 220 can be fixedly connected to the heat dissipation main body 211 and the positioning boss 212 by bonding or other means. In some embodiments, the insulating component 220 is an insulating film.

[0057] In this embodiment, the convex portion 300 includes a positioning boss 212 and an insulating member 220 covering the positioning boss 212. Exemplarily, the insulating member 220 includes a first portion 221 covering the upper surface of the heat dissipation main body 211 and a second portion 222 covering the positioning boss 212. Then, the convex portion 300 includes the positioning boss 212 and the second portion 222 of the insulating member 220.

[0058] When the heat dissipation component 210 includes a heat dissipation main body 211 and a positioning boss 212, in some specific embodiments, referring to Figure 5 ..., the positioning boss 212 is an independent structure different from the heat dissipation main body 211, and the positioning boss 212 is made of insulating material. In this way, the hidden danger of electric leakage can be further avoided.

[0059] In some specific embodiments, the positioning boss 212 can be fixedly connected to the heat dissipation main body 211 by an adhesive method. In other specific embodiments, the positioning boss 212 can also be connected to the heat dissipation main body 211 through a locking component (not shown). Specifically, the locking component has a locking state for locking the positioning boss 212 to the heat dissipation main body 211 and an unlocking state for unlocking. Exemplarily, the locking component includes a threaded fastener. A through hole is provided on the positioning boss 212, and a threaded hole is correspondingly provided on the heat dissipation main body 211. The threaded fastener passes through the through hole of the positioning boss 212 and is screwed onto the heat dissipation main body 211, and then the positioning boss 212 can be fixed on the heat dissipation main body 211. Further, when the locking component is in the unlocking state, the positioning boss 212 can still move relative to the heat dissipation main body 211. After the positioning boss 212 moves, the locking component can lock the positioning boss 212 to the heat dissipation main body 211 again. In this way, the position of the positioning boss 212 on the heat dissipation main body 211 can be adjusted, so as to adapt to the positioning of power modules 100 of different sizes. Exemplarily, a plurality of threaded holes can be provided on the heat dissipation main body 211. By screwing the threaded fastener into different threaded holes, the positioning boss 212 can be fixed at different positions on the heat dissipation main body 211. In addition, a strip-shaped groove can be provided on the heat dissipation main body 211. The threaded fastener passes through the through hole on the positioning boss and the strip-shaped groove on the heat dissipation main body 211, and is locked by a nut, and the positioning boss 212 can also be fixed at different positions on the heat dissipation main body 211.

[0060] On the basis of the first embodiment, in other embodiments of the present invention, referring to Figure 6 ..., the radiator 200 includes a heat dissipation component 210 and an insulating member 220. Among them, the difference between this embodiment and the Figure 5 embodiment is: Figure 5In the embodiment, the convex portion 300 is connected to the heat dissipation component 210. In this embodiment, the convex portion 300 is connected to the insulating component 220. Specifically, the insulating component 220 covers the surface of the heat dissipation component 210 facing the power module 100, and the convex portion 300 is connected to the surface of the insulating component 220 facing the power module 100. Exemplarily, the insulating component 220 covers the upper surface of the heat dissipation component 210, and the convex portion 300 is connected to the upper surface of the insulating component 220.

[0061] When the convex portion 300 is connected to the insulating component 220, in some specific embodiments, the convex portion 300 and the insulating component 220 are connected as an integral structure. In this way, the step of connecting the convex portion 300 to the insulating component 220 can be omitted, and only the insulating component 220 needs to be covered on the heat dissipation component 210, which is simple to operate.

[0062] When the convex portion 300 is connected to the insulating component 220, in some specific embodiments, the convex portion 300 is an independent structure different from the insulating component 220, and the convex portion 300 is made of an insulating material. The convex portion 300 is fixedly connected to the insulating component 220 by an adhesive bonding method. In this way, in this embodiment, the existing heat dissipation component 210 and insulating component 220 do not need to be modified, and the existing heat dissipation component 210 and insulating component 220 can be used, which helps to reduce costs.

[0063] Refer to Figures 7 to 9 , which shows a schematic diagram related to the second embodiment of the present invention. As Figure 7 shown, the power assembly 10 of this embodiment includes a power module 100 and a radiator 200. The power module 100 includes a molded body 110, a heat dissipation substrate 120, a chip 130, and pins 140. Among them, the heat dissipation substrate 120, the chip 130, and the pins 140 can all be understood with reference to the structure in Figure 1 .

[0064] In this embodiment, the difference from the embodiment in Figure 2 includes: Figure 2 In the embodiment in, the convex portion 300 is provided on the radiator 200, and the concave portion 400 is provided on the molded body 110. In this embodiment, the convex portion 300 is provided on the molded body 110, while the concave portion 400 is provided on the radiator 200. Among them, the convex portion 300 on the molded body 110 can also play a role in increasing the creepage distance and cooperating with the concave portion 400 for positioning.

[0065] In this embodiment, the convex portion 300 and the molded body 110 are connected as an integral structure. Exemplarily, by adjusting the cavity of the mold, the convex portion 300 can be directly formed during the process of forming the molded body 110 with epoxy resin. In some other embodiments, the convex portion 300 can also be an independent structure made of an insulating material and fixedly connected to the molded body 110 by an adhesive bonding method or the like.

[0066] Based on the first embodiment or the second embodiment, with reference to Figure 2 , Figure 7 , in some embodiments of the present utility model, a plurality of power modules 100 are provided, and the radiator 200 is provided with multiple groups of second regions corresponding to the first regions of each power module 100. A group of second regions includes one or more second regions. Exemplarily, when the pin 140 includes a source pin 141 and a drain pin 142, one power module 100 includes two first regions, and then a group of second regions of the radiator 200 corresponding to this power module 100 includes two second regions. Each power module 100 is positioned on the radiator 200 through the correspondingly provided convex portion 300 and concave portion 400. Taking the example shown in Figure 2 as an example, the encapsulation body 110 has a concave portion 400, and then the radiator 200 has multiple groups of convex portions 300. Taking the example shown in Figure 7 as an example, the encapsulation body 110 has a convex portion 300, and then the radiator 200 has multiple groups of concave portions 400. Thus, in this embodiment, heat dissipation of multiple power modules 100 can be achieved through one radiator 200.

[0067] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present utility model within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A power assembly, characterized in that: include: A power module, comprising a molded body, a heat dissipation substrate, a chip and a pin, wherein the molded body comprises a first surface, a second surface and a side surface located between the first surface and the second surface, the heat dissipation substrate comprises a first metal layer, a second metal layer and an insulating layer, the insulating layer is located between the first metal layer and the second metal layer, the first metal layer, the insulating layer and a part of the second metal layer are encapsulated in the molded body, and a heat dissipation surface of the second metal layer away from the insulating layer is exposed from the second surface, the chip is encapsulated in the molded body and conductively connected to the first metal layer, one end of the pin is encapsulated in the molded body and conductively connected to the chip, and the other end extends from the side surface of the molded body; A heat sink, thermally connected to the heat dissipation surface; Among them, the second surface of the molded body includes a first area located between the pin and the heat dissipation surface, and the surface of the heat sink facing the molded body includes a second area arranged corresponding to the first area, one of the first area and the second area has a convex portion, and the other has a concave portion, and the convex portion is located in the concave portion to position the power module on the heat sink.

2. The power component according to claim 1, characterized in that: The first region is provided with the recess, and two ends of the recess are respectively passed through to the other two side surfaces of the mold package body adjacent to the side surface where the pin is located.

3. The power assembly according to claim 2, characterized in that: The extending direction of the recess is parallel to the side surface where the pin is located.

4. The power assembly according to claim 1, characterized in that: The first area is provided with the recessed portion, the heat sink comprises a heat dissipation component and an insulating component, the heat dissipation component comprises a heat dissipation body and a positioning boss, the positioning boss is provided on the surface of the heat dissipation body facing the power module, and the insulating component covers the surface of the heat dissipation body facing the power module and the positioning boss; Wherein, the convex portion includes the positioning boss and the insulating component covering the positioning boss.

5. The power assembly according to claim 4, characterized in that: The positioning boss is an independent structure different from the heat dissipation body, and the positioning boss is made of insulating material.

6. The power component according to claim 5, characterized in that: The positioning boss is bonded to the heat dissipation body, or the heat sink further comprises a locking component, the locking component having a locking state for locking the positioning boss to the heat dissipation body and an unlocking state for releasing the locking, and when the locking component is in the unlocking state, the positioning boss can move relative to the heat dissipation body.

7. The power assembly according to claim 1, characterized in that: The first region is provided with the recessed portion, the heat sink comprises a heat dissipation component and an insulating component, the insulating component covers a surface of the heat dissipation component facing the power module, and the protrusion is connected to a surface of the insulating component facing the power module.

8. The power assembly according to claim 7, characterized in that: The convex portion is connected to the insulating component as an integral structure, or the convex portion is an independent structure different from the insulating component, and the convex portion is made of an insulating material and is bonded to the insulating component.

9. The power assembly according to claim 1, characterized in that: The first region is provided with the convex portion, and the convex portion is connected with the mold sealing body to form an integrated structure.

10. The power assembly according to claim 1, characterized in that: There are multiple power modules, and the heat sink is provided with multiple groups of the second areas corresponding to the first areas of each power module. Each power module is positioned on the heat sink through the correspondingly provided convex parts and the concave parts.

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