Radiator of power device and radiating device

Abstract

The utility model discloses a radiator and a radiating device of a power device, and the radiator of the power device comprises a heat conduction plate which comprises a connecting end and a fixed end, and the connecting end is used for being connected with the power device; the fixed end is arranged in the heat dissipation plate in an embedded mode, a plurality of heat dissipation fins are arranged on the heat dissipation plate, and the heat dissipation fins are fixedly connected with the heat dissipation plate at preset intervals. According to the utility model, the heat dissipation plate and the heat dissipation fins are arranged, the heat of the power device is guided into the heat dissipation plate through the heat conduction plate, and the heat dissipation fins on the heat dissipation plate exchange heat with air in a manner of increasing the contact area with the air, so that the heat dissipation efficiency can be improved without circuit support, maintenance is not needed, and the use process is stable and safe.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a radiator and a heat dissipation device of a power device. Background Art

[0002] With the development of electronic products, more and more functions are added, the integration of components and chips is getting higher and higher, and the power consumption per unit area is getting higher and higher. Therefore, higher and higher requirements are placed on the heat dissipation performance of electronic products. When heat cannot be transported in time, it is easy to cause the temperature of electronic equipment to rise, affecting the use effect and even causing fire. Therefore, large electronic equipment is usually equipped with radiators for timely heat dissipation; there are many types of radiators, such as water circulation heat dissipation, wind heat dissipation, etc.

[0003] In the prior art, there are many types of radiators, but radiators usually require additional circuit structures to drive them. For example, electric fans are used to increase the air flow rate to dissipate heat, and circuits are used to drive water circulation to remove heat. However, due to the need for additional circuit support, the structure is relatively complex and requires regular maintenance. When the circuit is damaged, it poses a risk to the normal use of the power device.

[0004] Therefore, the prior art still needs to be improved and developed. Utility Model Content

[0005] In order to solve the problem in the prior art that the radiator uses additional electric drive, has a complex structure, requires regular maintenance, and poses risks to the normal use of electronic equipment when the circuit is damaged, the utility model provides a radiator and a heat dissipation device for a power device.

[0006] The utility model is realized by the following technical solutions:

[0007] A heat sink for a power device, wherein the heat sink for the power device comprises:

[0008] A thermal conduction plate, the thermal conduction plate comprising a connection end and a fixed end, the connection end being used to connect to a power device;

[0009] The fixed end is embedded in the heat sink, and a plurality of heat sink fins are arranged on the heat sink. The heat sink is fixedly connected to the heat sink at a predetermined distance.

[0010] The heat sink of the power device, wherein the heat sink comprises a first heat dissipation surface and a second heat dissipation surface;

[0011] A plurality of heat dissipation fins are arranged on the first heat dissipation surface;

[0012] A plurality of heat dissipation fins are arranged on the second heat dissipation surface.

[0013] The radiator of the power device, wherein a plurality of the heat dissipation fins on the first heat dissipation surface are uniformly arranged at a certain distance intervals;

[0014] A plurality of the heat dissipation fins on the second heat dissipation surface are uniformly arranged at distance intervals.

[0015] The radiator of the power device, wherein the arrangement directions of the heat dissipation fins on the first heat dissipation surface and the heat dissipation fins on the second heat dissipation surface are the same.

[0016] The radiator of the power device, wherein the heat dissipation plate is molded on the heat conduction plate; the heat dissipation fins are formed by secondary extrusion on the heat dissipation plate.

[0017] The radiator of the power device, wherein the heat dissipation plate and the heat dissipation fins are components made of nano-infrared heat dissipation particles.

[0018] The radiator of the power device, wherein the connection end of the heat conduction plate is welded on the power device.

[0019] The radiator of the power device, wherein a plurality of fixing holes are arranged on the fixed end of the heat conduction plate, and the plurality of fixing holes are hollowed out and arranged in an array.

[0020] The radiator of the power device, wherein a plurality of ear plates are arranged at one end of the heat conduction plate corresponding to the fixed end, and the plurality of fixing holes are arranged on the ear plates.

[0021] A heat dissipation device, wherein the heat dissipation device includes the radiator of the power device described above.

[0022] The beneficial effects of the present utility model are as follows: The present utility model is provided with a heat dissipation plate and heat dissipation fins. The heat of the power device is introduced into the heat dissipation plate through the heat conduction plate, and the heat dissipation fins on the heat dissipation plate exchange heat with the air in a way of increasing the contact area with the air, which can improve the heat dissipation efficiency without circuit support, without maintenance, and is stable and safe during the use process. Description of the Drawings

[0023] Figure 1 is a three-dimensional structural schematic diagram of the radiator of the power device of the present utility model;

[0024] Figure 2 is a structural diagram of the radiator of the power device of the present utility model.

[0025] In Figures 1 to 2Middle: 100, thermal conductive plate; 110, connecting end; 120, fixing end; 130, ear plate; 131, fixing hole; 200, heat sink; 201, first heat dissipation surface; 202, second heat dissipation surface; 210, heat dissipation fins; 300, power device. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and effect of the utility model clearer and more specific, the utility model is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0029] In the prior art, there are many types of radiators, but radiators usually require additional circuit structures to drive them. For example, electric fans are used to increase the air flow rate to dissipate heat, and circuits are used to drive water circulation to remove heat. However, due to the need for additional circuit support, the structure is relatively complex and requires regular maintenance. When the circuit is damaged, it poses a risk to the normal use of the power device.

[0030] Based on the above problems in the prior art, the utility model provides a heat sink for a power device, such as Figure 1 As shown, the heat sink of the power device includes: a thermal conductive plate 100, the thermal conductive plate 100 includes a connecting end 110 and a fixed end 120, the connecting end 110 is used to connect with the power device; a heat sink 200, the fixed end 120 is embedded in the heat sink 200, and a plurality of heat sink fins 210 are arranged on the heat sink 200, and the heat sink fins 210 are fixedly connected to the heat sink 200 at a predetermined distance.

[0031] The utility model is provided with a heat dissipation plate 200 and heat dissipation fins 210. The heat of the power device is introduced into the heat dissipation plate 200 through a heat conduction plate 100. The heat dissipation fins 210 on the heat dissipation plate 200 exchange heat with the air in a way that increases the contact area with the air, which can improve the heat dissipation efficiency without the support of a circuit, without maintenance, and is stable and safe during use.

[0032] In the above embodiment, as Figure 1 shown, the main body of the radiator of the power device of the utility model is composed of a heat conduction plate 100 and a heat dissipation plate 200. Among them, the heat conduction plate 100 is made of a material that is easy to conduct heat, such as materials like copper and aluminum. For the convenience of understanding, in this embodiment, the two ends of the heat conduction plate 100 are respectively named a connection end 110 and a fixed end 120. During actual use, the connection end 110 is used to connect with the power device, thereby conducting the heat generated in the power device. Specifically, the installation can be achieved through methods such as welding and bolt fixation. The fixed end 120 is used to fix the heat dissipation plate 200. In this embodiment, the fixed end 120 is embedded in the heat dissipation plate 200, thereby transferring the heat of the power device 300 to the heat dissipation plate 200 through the heat conduction plate 100 for heat exchange with the air. Specifically, to achieve the effect of improving the heat dissipation efficiency, in this embodiment, a number of heat dissipation fins 210 are also provided on the heat dissipation plate 200. The number of heat dissipation fins 210 is fixedly connected to the heat dissipation plate 200 at a predetermined distance. By setting the heat dissipation fins 210, the contact area between the heat dissipation plate 200 and the air can be increased, thereby achieving the effect of improving the heat dissipation efficiency.

[0033] In the first embodiment of the utility model;

[0034] The above heat dissipation plate 200 and heat dissipation fins 210 are components made of materials that are easy to conduct heat. Specifically, they can be materials such as silver, copper, aluminum, etc., or alloy materials such as brass. During actual use, heat exchange is formed with the air through the good heat conduction performance of the heat dissipation plate 200 and heat dissipation fins 210 to achieve the effect of continuous heat dissipation.

[0035] In the second embodiment of the utility model;

[0036] The above heat dissipation plate 200 and heat dissipation fins 210 are components made of nano-infrared heat dissipation particles. Nano-infrared heat dissipation particles are nano-scale particles, which are new materials that can radiate infrared rays. Specifically, refer to a heat dissipation material and its preparation method disclosed in CN102181212B. This material has the characteristics of excellent heat conduction efficiency, stable and uniform heat dissipation, can dissipate heat in the form of infrared radiation, and has a long service life, up to 25,000 hours. The heat dissipation plate 200 and heat dissipation fins 210 made of nano-infrared heat dissipation particles have the function of active heat dissipation, which can further improve the heat dissipation efficiency while continuously dissipating heat.

[0037] In the third embodiment of the present utility model;

[0038] The above heat dissipation plate 200 and heat dissipation fins 210 are components made of epoxy resin and nano-infrared heat dissipation particles. Among them, epoxy resin is a kind of high molecular polymer, and its molecular formula is (C 11 H 12 O 3 ) n , which refers to the general term of a class of polymers containing more than two epoxy groups in the molecule. It is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, it can be ring-opened by a variety of compounds containing active hydrogen and cured and cross-linked to form a network structure. Therefore, it is a thermosetting resin. In actual production, epoxy resin is used as an adhesive, mainly to fix the shape of the nano-infrared heat dissipation particles. The radiator of the power device of the present utility model is shaped by mixing nano-infrared heat dissipation particles into epoxy resin to form a heat dissipation plate 200 with heat dissipation fins 210 of a predetermined shape. After being connected to the power device 300 through the heat conduction plate 100, the heat generated on the power device 300 can be conducted to the heat dissipation plate 200, and heat exchange with the air is carried out through the conduction and active radiation of heat by the nano-infrared heat dissipation particles, achieving the effect of improving the heat dissipation efficiency without the support of electric energy, thereby reducing the cost of regular maintenance during actual use and avoiding the risk of heat dissipation stagnation caused by the damage of the radiator circuit.

[0039] Furthermore, in another feasible implementation manner of the present utility model, as Figure 1 and Figure 2 shown, in actual setting, in this embodiment, the heat dissipation plate 200 is set as a flat plate-shaped component. For the convenience of understanding, the two sides of the heat dissipation plate 200 are respectively named the first heat dissipation surface 201 and the second heat dissipation surface 202. During actual use, the heat conduction plate 100 fixes the heat dissipation plate 200 on one side of the power device 300 in a suspended state, that is, both the first heat dissipation surface 201 and the second heat dissipation surface 202 have the effect of radiating heat into the air. The above heat dissipation fins 210 are vertically arranged relative to the heat dissipation plate 200, and a plurality of heat dissipation fins 210 are arranged on the first heat dissipation surface 201, and a plurality of heat dissipation fins 210 are arranged on the second heat dissipation surface 202. Since the heat dissipation fins 210 and the heat dissipation plate 200 are made of the same material, a plurality of heat dissipation fins 210 actually increase the contact area between the heat dissipation plate 200 and the air, so the effect of improving the heat exchange rate with the air can be achieved.

[0040] In another feasible implementation manner of the present utility model, as Figure 1 and Figure 2As shown, considering the different distributions of cold air and hot air in space, the cold air is relatively heavier than the hot air and is located below in the space, resulting in a certain difference in the heat dissipation efficiency between the first heat dissipation surface 201 and the second heat dissipation surface 202 of the heat dissipation plate 200. Therefore, when actually setting the heat dissipation fins 210 in this embodiment, there should also be a difference in the distances between the heat dissipation fins 210 on the first heat dissipation surface 201 and the second heat dissipation surface 202. That is, the heat dissipation fins 210 on the first heat dissipation surface 201 are evenly arranged at a certain distance, and the heat dissipation fins 210 on the second heat dissipation surface 202 are evenly arranged at a certain distance. In a specific implementation manner of the present utility model, as Figure 1 and Figure 2 shown, the size of the interval between the heat dissipation fins on the first heat dissipation surface 201 is larger than the size of the interval between the heat dissipation fins 210 on the second heat dissipation surface 202. The reason for this setting is that the first heat dissipation surface 201 is located on the upper side of the heat dissipation plate 200, and after continuous heat dissipation, the air temperature is higher than the temperature below in the space. Therefore, setting a larger distance between the heat dissipation fins 210 can achieve a certain heat dissipation effect. While the second heat dissipation surface 202 is located on the lower side of the heat dissipation plate 200, and the air temperature is lower than the temperature above in the space. Therefore, setting a smaller distance between the heat dissipation fins 210 can increase the heat exchange rate with the air, thereby achieving the effect of improving the heat dissipation efficiency.

[0041] In another implementable manner of the present utility model, as Figure 1 and Figure 2 shown, the setting directions of the heat dissipation fins 210 on the above-mentioned first heat dissipation surface 201 and the heat dissipation fins 210 on the second heat dissipation surface 202 are the same. The purpose of this setting is, on the one hand, to facilitate production, that is, the staff can accurately observe the different setting distances of the heat dissipation fins 210 on the first heat dissipation surface 201 and the second heat dissipation surface 202 from the side of the heat dissipation plate 200 for accurate setting. On the other hand, it makes the structure of the heat dissipation plate 200 more beautiful and convenient for the staff to install and handle.

[0042] In another feasible embodiment of the present utility model, the above heat dissipation plate 200 is arranged on the heat conduction plate 100 through molding. That is, in actual setting, based on the above third embodiment, the radiator of the power device of the present utility model has two installation methods. One is to insert the heat conduction plate 100 into the auxiliary mold of the heat dissipation plate 200, and then pour in a mixture of liquid epoxy resin and nano-infrared heat dissipation particles. When the mixture of liquid epoxy resin and nano-infrared heat dissipation particles solidifies into a solid, the molding of the heat dissipation plate 200 is completed. At this time, the fixed end 120 of the heat conduction plate 100 is embedded in the heat dissipation plate 200 and is tightly combined, which is beneficial to heat conduction. Then, the connection end 110 of the heat conduction plate is welded to the power device 300, and the installation of the radiator of the power device of the present utility model can be completed.

[0043] In another installation method, the staff first welds the heat conduction plate 100 to the power device 300, then sets an auxiliary mold at the fixed end 120 of the heat conduction plate 100, and then pours in a mixture of liquid epoxy resin and nano-infrared heat dissipation particles. When the mixture of liquid epoxy resin and nano-infrared heat dissipation particles solidifies into a solid, the molding of the heat dissipation plate 200 is completed. At this time, the auxiliary mold is disassembled, and the fixed end 120 of the heat conduction plate 100 is embedded in the heat dissipation plate 200 and is tightly combined, and the installation of the radiator of the power device of the present utility model is completed.

[0044] In the above embodiment, the scenarios corresponding to the two different installation methods are different. The first installation method has a better effect of molding. By the method of prefabricating and then installing, the cooperation between the radiator and the power device 300 can be more beautiful. The second installation method is for the situation of installing a radiator for the existing working power device 300. The staff installs it according to the actual situation on site, which has a higher installation freedom. In addition, in this embodiment, the shape and size of the heat dissipation plate 200 are determined according to the heat dissipation requirements of the power device 300. In this embodiment, it can be made by cooperating to make a suitable auxiliary mold. For this, the present application does not limit the specific shape of the heat dissipation plate 200.

[0045] Further, in another feasible embodiment of the present utility model, the above heat dissipation fins 210 are arranged on the heat dissipation plate 200 by means of secondary extrusion molding. That is, in the above manufacturing steps of the heat dissipation plate 200, the manufacturing of the heat dissipation fins 210 may not be included. The heat dissipation fins 210 are arranged on the heat dissipation plate 200 by means of later secondary extrusion molding. The reason for such a setting is that the heat dissipation requirements of different power devices 300 are different, and it is even necessary to measure the working environment and working temperature of the power device 300 on-site before formulating. Therefore, in this embodiment, the heat dissipation fins 210 are arranged on the heat dissipation plate 200 by means of secondary extrusion molding, which can achieve the setting requirements of custom customization, so as to meet the usage requirements in different situations.

[0046] In another feasible embodiment of the present utility model, as Figure 1 and Figure 2 shown, a plurality of fixing holes 131 are further arranged on the fixed end 120 of the above heat conduction plate 100. The plurality of fixing holes are arranged in an array. The advantage of such a setting is that when the fixed end 120 and the heat dissipation plate 200 form an embedded plastic shape, due to the existence of the fixing holes 131, the material of the heat dissipation plate 200 forms a combination with the positions of the fixing holes 131 during the molding process of the heat dissipation plate 200. After fixing, a stable fixing structure is formed. That is, in addition to realizing the embedded fixing effect of the fixed end 120 of the heat conduction plate 100, a clamping connection is also formed at the positions of the fixing holes 131, so as to ensure the stability of the combination of the heat conduction plate 100 and the heat dissipation plate 200, and prevent the heat dissipation plate 200 from falling off the heat conduction plate 100 due to reasons such as material aging and accidental bumps during actual use.

[0047] Further, in another feasible embodiment of the present utility model, as Figure 1 and Figure 2 shown, a plurality of ear plates 130 are further arranged at one end of the above heat conduction plate 100 corresponding to the fixed end 120. The ear plates 130 protrude from the fixed end 120. The above plurality of fixing holes 131 are arranged on the ear plates 130. The advantage of such a setting is that on the one hand, it is convenient for the staff to distinguish the connection end 110 and the fixed end 120 of the heat conduction plate 100, playing an anti-fooling effect during the installation process. On the other hand, by arranging the ear plates 130, the embedded size of the fixed end 120 inside the heat dissipation plate 200 is further increased, and at the same time, the irregularity of the embedded part is improved, so that the formed heat dissipation plate 200 forms a clamping structural cooperation pattern with the ear plates 130, further improving the stability of the combination of the heat dissipation plate 200 and the heat conduction plate 100. In addition, since the fixing holes 131 are arranged on the ear plates 130, the structural strength of the main body of the heat conduction plate 100 can be guaranteed, the deformation degree of the heat conduction plate 100 after long-term use can be reduced, and the heat dissipation effect can be guaranteed.

[0048] Taking the above third embodiment as an example, the actual use process of the radiator of the power device of the present utility model is as follows:

[0049] like Figure 1 and Figure 2 As shown, the fixed end 120 of the thermal conductive plate 100 is inserted into the auxiliary mold, and a mixture of liquid epoxy resin and nano infrared heat dissipation particles is poured into the auxiliary mold. After the mixture of epoxy resin and nano infrared heat dissipation particles is completely solidified, the auxiliary mold is removed to form a combined structure in which the thermal conductive plate 100 and the heat dissipation plate 200 are fixedly connected.

[0050] According to the actual heat dissipation and working environment of the power device 300, the spacing between the heat dissipation fins 210 on the first heat dissipation surface 201 and the second heat dissipation surface 202 of the heat dissipation plate 200 is calculated, and the mixed material is extruded and arranged on the heat dissipation plate 200 by extrusion secondary molding to form the heat dissipation fins 210 integrated with the heat dissipation plate 200;

[0051] Finally, the connection end 110 of the thermal conductive plate 100 is fixed to the power device 300 by welding, so as to realize the installation of the heat sink of the power device. When the power device 300 after the heat sink is installed is actually used, the heat generated is transferred to the heat sink 200 through the thermal conductive plate 100, and then the nano-infrared heat dissipation particles in the heat sink 200 actively radiate the heat, thereby achieving the effect of accelerated heat dissipation.

[0052] Based on the above embodiments, the utility model also provides a heat dissipation device, which includes a heat sink of a power device described in any one of the above embodiments, and the heat sink of the power device includes: a heat conduction plate, the heat conduction plate includes a connection end and a fixed end, and the connection end is used to connect with the power device; a heat sink, the fixed end is embedded in the heat sink, and a plurality of heat dissipation fins are arranged on the heat sink, and the heat dissipation fins are fixedly connected to the heat sink at a predetermined distance. The utility model is provided with a heat sink and heat dissipation fins, and the heat of the power device is introduced into the heat sink through the heat conduction plate. The heat dissipation fins on the heat sink exchange heat with the air in a manner of increasing the contact area with the air, which can improve the heat dissipation efficiency without the need for circuit support, and does not require maintenance, and the use process is stable and safe.

[0053] In summary, the utility model provides a heat sink and heat dissipation device for a power device, wherein the heat sink of the power device includes: a heat conduction plate, which includes a connection end and a fixed end, the connection end is used to connect with the power device; a heat sink, the fixed end is embedded in the heat sink, and a plurality of heat dissipation fins are arranged on the heat sink, and the heat dissipation fins are fixedly connected to the heat sink at a predetermined distance. The utility model is provided with a heat sink and heat dissipation fins, and the heat of the power device is introduced into the heat sink through the heat conduction plate, and the heat dissipation fins on the heat sink exchange heat with the air in a manner of increasing the contact area with the air, which can improve the heat dissipation efficiency without the need for circuit support, and does not require maintenance, and the use process is stable and safe.

[0054] It should be understood that the application of the present utility model is not limited to the above examples. For those of ordinary skill in the art, improvements or modifications can be made according to the above description, and all such improvements and modifications shall fall within the protection scope of the appended claims of the present utility model.

Claims

1. A heat sink for a power device, characterized in that: The heat sink of the power device comprises: A thermal conduction plate, the thermal conduction plate comprising a connection end and a fixed end, the connection end being used to connect to a power device; A heat sink, wherein the fixed end is embedded in the heat sink, and a plurality of heat sink fins are arranged on the heat sink, and the heat sink fins are fixedly connected to the heat sink at a predetermined distance; The heat sink and the heat sink fins are components made of nano infrared heat dissipation particles; The heat sink comprises a first heat sink surface and a second heat sink surface; A plurality of heat dissipation fins are arranged on the first heat dissipation surface; A plurality of heat dissipation fins are arranged on the second heat dissipation surface; The size of the spacing between the heat dissipation fins on the first heat dissipation surface is greater than the size of the spacing between the heat dissipation fins on the second heat dissipation surface.

2. The heat sink for a power device according to claim 1, characterized in that: The plurality of heat dissipation fins on the first heat dissipation surface are evenly arranged at a certain distance; The plurality of heat dissipation fins on the second heat dissipation surface are evenly spaced.

3. The heat sink for a power device according to claim 2, characterized in that: The heat dissipation fins on the first heat dissipation surface and the heat dissipation fins on the second heat dissipation surface are arranged in the same direction.

4. The heat sink for a power device according to claim 1, characterized in that: The heat sink is molded and arranged on the heat conduction plate; the heat sink fins are extruded and secondary molded and arranged on the heat sink.

5. The heat sink for a power device according to claim 1, characterized in that: The connection end of the thermal conductive plate is welded and arranged on the power device.

6. The heat sink for a power device according to claim 1, characterized in that: A plurality of fixing holes are arranged on the fixed end of the heat conducting plate, and the plurality of fixing holes are hollowed out and arranged in an array.

7. The heat sink for a power device according to claim 6, characterized in that: A plurality of ear plates are arranged at one end of the heat conducting plate corresponding to the fixed end, and a plurality of the fixing holes are arranged on the ear plates.

8. A heat dissipation device, characterized in that: The heat dissipation device comprises the heat sink of the power device as described in any one of claims 1 to 7.

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