Semiconductor device heat dissipation device

Abstract

The utility model relates to the technical field of semiconductor device heat dissipation devices, and discloses a semiconductor device heat dissipation device which comprises a heat dissipation box, a heat dissipation assembly is arranged in the heat dissipation box and comprises a supporting frame, a supporting plate is fixedly installed on the top of the supporting frame, the supporting plate is connected with a motor through a movable block, and the movable block is connected with the motor. A motor drives a gear to rotate, the gear moves through a rack on a supporting plate, so that a fixed rod, a placement box and connected parts move left and right, more comprehensive heat dissipation of a semiconductor device is realized, a first rotating rod and fan blades are matched with each other, and the semiconductor device can stably rotate to perform better heat dissipation work; through a movable and multi-angle heat dissipation mode, the placement box can be flexibly moved to the hottest area according to the heating conditions of different parts of the semiconductor device, heat dissipation is carried out in a centralized manner, and the situation that the semiconductor device is overheated during operation to cause faults is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices for semiconductor devices, and particularly relates to a heat dissipation device for semiconductor devices. Background Art

[0002] In the application of semiconductor devices, with the continuous improvement of the performance and the increase of the integration degree of semiconductor devices, the heat generated during their operation also significantly increases. If these heats cannot be effectively dissipated, the excessive temperature will seriously affect the performance, stability and service life of semiconductor devices.

[0003] The applicant found through retrieval that the Chinese patent with the publication (announcement) number CN 219352182 U discloses "a heat dissipation device for power semiconductor devices". This patent mainly conducts the heat generated on the power semiconductor device body directly outward through the heat-conducting silica gel and fin structure of the heat dissipation component. At the same time, heat dissipation components are provided on both the heat dissipation box and the protective cover, enabling this device to dissipate heat from the upper and lower surfaces of the power semiconductor device body simultaneously, accelerating the heat dissipation speed of this device. However, it is difficult for this patent to dissipate heat from multiple angles for semiconductor devices, unable to adapt to the heat generation conditions of different parts, and prone to local overheating and damage. Therefore, we propose a heat dissipation device for semiconductor devices. Content of the Utility Model

[0004] The purpose of the utility model is to provide a heat dissipation device for semiconductor devices to solve the problems of difficult multi-angle heat dissipation for semiconductor devices, inability to adapt to the heat generation conditions of different parts, and easy local overheating and damage mentioned in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A heat dissipation device for semiconductor devices, including a heat dissipation box, a heat dissipation component is arranged inside the heat dissipation box. The heat dissipation component includes a support frame, a support plate is fixedly installed at the top of the support frame. The support plate is connected with a motor through a movable block. The output end of the motor is fixedly installed with a positioning rod, and a gear is fixedly installed on the circumferential surface of the positioning rod. The support plate is connected with a fixed block through a first support rod. A fixed rod is fixedly installed on one side of the movable block. The fixed rod is connected with a second support rod through a slider. The left end of the second support rod is fixedly connected with a positioning block. A placement box is fixedly installed on the circumferential surface of the fixed rod. The placement box is connected with a fan blade through a first rotating rod.

[0006] As a preferred solution, a heat dissipation substrate is provided inside the heat dissipation box. The device body is connected to the top of the heat dissipation substrate. A telescopic rod is fixedly installed at the bottom of the heat dissipation substrate. A spring is sleeved on the circumferential surface of the telescopic rod. One end of the telescopic rod away from the heat dissipation substrate is fixedly connected to the bottom inner wall of the heat dissipation box. A protective cover is provided on the top of the heat dissipation box.

[0007] As a preferred solution, the support frame is fixedly connected to the bottom inner wall of the heat dissipation box. A rack is fixedly installed on the top of the support plate. The movable block is movably connected to the outer surface of the support plate. The motor is fixedly connected to one side of the movable block away from the fixed rod. The gear is meshed with the rack. One end of the support plate away from the support frame is fixedly connected to the first support rod. One end of the first support rod away from the support plate is fixedly connected to the fixed block. The fixed block is fixedly connected to the bottom inner wall of the heat dissipation box.

[0008] As a preferred solution, one end of the fixed rod away from the movable block is fixedly connected to the slider. The second support rod is movably connected to the inner wall of the slider. A servo motor is fixedly installed on the inner wall surface of the placement box. The first rotating rod is fixedly connected to the output end of the servo motor. The fan blades are fixedly connected to the circumferential surface of the first rotating rod.

[0009] As a preferred solution, a fixing component is provided on the top of the heat dissipation substrate. The fixing component includes a fixing plate. A fixing piece is fixedly installed on one side of the fixing plate. A third support rod is fixedly installed on the inner wall of the fixing piece. A rotating block is rotatably connected to the circumferential surface of the third support rod. The outer surface of the rotating block is movably connected to a second rotating rod. The second rotating rod is connected to a third rotating rod through a connecting block. An activity rod is fixedly connected to the circumferential surface of the third rotating rod. A fixing sleeve is fixedly installed on one side of the fixing piece away from the fixing plate. The activity rod is slidably connected to the inner wall of the fixing sleeve. An elastic pressing block is fixedly installed at the bottom of the activity rod. A straight rod is movably connected to the inner wall of the elastic pressing block.

[0010] As a preferred solution, the second rotating rod is fixedly connected to the top inner wall of the connecting block. The bottom inner wall of the connecting block is fixedly connected to the third rotating rod.

[0011] The technical effects and advantages of the present utility model:

[0012] 1. Through the provided heat dissipation component, the motor drives the gear to rotate, and the gear moves along the rack on the support plate, causing the fixed rod, the placement box, and the connected components to move left and right. This can achieve more comprehensive heat dissipation for semiconductor devices. At the same time, the first rotating rod and the fan blade cooperate with each other to rotate stably for better heat dissipation work. This component can dissipate heat in a movable and multi-angle manner, and can flexibly move the placement box to the hottest area according to the heat generation conditions of different parts of the semiconductor device to concentrate heat dissipation, avoiding the situation where semiconductor devices malfunction due to overheating during operation;

[0013] 2. Through the provided fixing component, the rotating block, the connecting block, the second rotating rod, the movable rod, the elastic pressing block, and the connected components cooperate with each other to provide stable fixation and support for the device body, effectively preventing the device body from shaking and shifting during heat dissipation and operation. The device body can be firmly fixed on the heat dissipation substrate. At the same time, the elastic pressing block can adjust the pressure when fixing the device body to prevent damage when squeezing the device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for description in the embodiments or the prior art.

[0015] Obviously, the following described drawings are only some specific embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0016] Figure 1 It is a three-dimensional structure schematic diagram of the present invention;

[0017] Figure 2 It is a cross-sectional structure schematic diagram of the present invention;

[0018] Figure 3 It is a structure schematic diagram of the heat dissipation component of the present invention;

[0019] Figure 4 It is a partial structure schematic diagram of the heat dissipation component of the present invention;

[0020] Figure 5 It is a partial structure schematic diagram of the heat dissipation component of the present invention;

[0021] Figure 6 It is a partial overall structure schematic diagram of the present invention;

[0022] Figure 7 It is a structure schematic diagram of the fixing component of the present invention;

[0023] Figure 8 This is a partial structural schematic diagram of the fixing component of the present utility model.

[0024] In the figure: 1, heat dissipation box; 2, protective cover; 3, heat dissipation component; 301, support frame; 302, support plate; 303, movable block; 304, gear; 305, motor; 306, first support rod; 307, fixed block; 308, fixed rod; 309, slider; 310, second support rod; 311, positioning block; 312, placement box; 313, first rotating rod; 314, fan blade; 4, fixing component; 401, fixing plate; 402, fixing piece; 403, rotating block; 404, second rotating rod; 405, connecting block; 406, third rotating rod; 407, movable rod; 408, fixing sleeve; 409, elastic pressing block; 410, straight rod; 5, device body; 6, heat dissipation substrate; 71, telescopic rod; 72, spring. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0026] Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0028] In addition, the descriptions such as "first" and "second" in the present utility model are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0029] In the present utility model, unless otherwise clearly specified and defined, terms such as "connection" and "fixation" shall be understood in a broad sense. For example, "fixation" may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In addition, the technical solutions between various embodiments of the present utility model can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0031] Embodiment 1

[0032] Please refer to the attached Figure 1 - attached Figure 5, A semiconductor device heat dissipation device, comprising a heat dissipation box 1. Inside the heat dissipation box 1, there is a heat dissipation component 3. The heat dissipation component 3 includes a support frame 301. At the top of the support frame 301, a support plate 302 is fixedly installed. The support plate 302 is connected to a motor 305 through a movable block 303. At the output end of the motor 305, a positioning rod is fixedly installed, and on the circumferential surface of the positioning rod, a gear 304 is fixedly installed. The support plate 302 is connected to a fixed block 307 through a first support rod 306. On one side of the movable block 303, a fixed rod 308 is fixedly installed. The fixed rod 308 is connected to a second support rod 310 through a slider 309. At the left end of the second support rod 310, a positioning block 311 is fixedly connected. On the circumferential surface of the fixed rod 308, a placement box 312 is fixedly installed. The placement box 312 is connected to a fan blade 314 through a first rotating rod 313. Inside the heat dissipation box 1, there is a heat dissipation substrate 6. The device body 5 is connected to the top of the heat dissipation substrate 6. At the bottom of the heat dissipation substrate 6, a telescopic rod 71 is fixedly installed. On the circumferential surface of the telescopic rod 71, a spring 72 is sleeved. The end of the telescopic rod 71 away from the heat dissipation substrate 6 is fixedly connected to the bottom inner wall of the heat dissipation box 1. On the top of the heat dissipation box 1, there is a protective cover 2. The support frame 301 is fixedly connected to the bottom inner wall of the heat dissipation box 1. On the top of the support plate 302, a rack is fixedly installed. The movable block 303 is movably connected to the outer surface of the support plate 302. The motor 305 is fixedly connected to the side of the movable block 303 away from the fixed rod 308. The gear 304 and the rack are meshed and connected. The end of the support plate 302 away from the support frame 301 is fixedly connected to the first support rod 306. The end of the first support rod 306 away from the support plate 302 is fixedly connected to the fixed block 307. The fixed block 307 is fixedly connected to the bottom inner wall of the heat dissipation box 1. The end of the fixed rod 308 away from the movable block 303 is fixedly connected to the slider 309. The second support rod 310 is movably connected to the inner wall of the slider 309. On the inner wall surface of the placement box 312, a servo motor is fixedly installed. The first rotating rod 313 is fixedly connected to the output end of the servo motor. The fan blade 314 is fixedly connected to the circumferential surface of the first rotating rod 313.

[0033] On the bottom inner wall of the heat dissipation box 1, there are two groups of positioning blocks 311, second support rods 310, and support plates 302. The positioning blocks 311 are fixedly connected to the bottom inner wall of the heat dissipation box 1, which can provide stable support for the entire heat dissipation component 3. On the rear side of the heat dissipation box 1, there is a through hole, so that the airflow generated by the rotation of the fan blade 314 can be smoothly discharged through the through hole, further improving the heat dissipation performance of the semiconductor device.

[0034] Specifically, the motor 305 drives the gear 304 to rotate. The gear 304 moves by virtue of the rack on the support plate 302, thereby driving the fixed rod 308, the placement box 312 and the components connected thereto to move left and right, achieving a more comprehensive heat dissipation effect on the semiconductor device. At the same time, the first rotating rod 313 and the fan blade 314 cooperate with each other to rotate stably, thereby realizing better heat dissipation work. With the movable and multi-angle heat dissipation method, the component can flexibly move the placement box 312 to the hottest area according to the heat generation conditions of different parts of the semiconductor device, and concentrate on heat dissipation operations, effectively avoiding the situation where the semiconductor device fails due to overheating during operation.

[0035] Embodiment 2

[0036] Please refer to the attached Figure 1 and the attached Figure 6 -attached Figure 8 and, on the basis of Embodiment 1, it is further obtained that a fixing component 4 is provided on the top of the heat dissipation substrate 6. The fixing component 4 includes a fixing plate 401. A fixing member 402 is fixedly installed on one side of the fixing plate 401. A third support rod is fixedly installed on the inner wall of the fixing member 402, and a rotating block 403 is rotatably connected to the circumferential surface of the third support rod. A second rotating rod 404 is movably connected to the outer surface of the rotating block 403. The second rotating rod 404 is connected to a third rotating rod 406 through a connecting block 405. An active rod 407 is fixedly connected to the circumferential surface of the third rotating rod 406. A fixing sleeve 408 is fixedly installed on the side of the fixing member 402 away from the fixing plate 401. The active rod 407 is slidably connected to the inner wall of the fixing sleeve 408. An elastic pressing block 409 is fixedly installed at the bottom of the active rod 407. A straight rod 410 is movably connected to the inner wall of the elastic pressing block 409. The second rotating rod 404 is fixedly connected to the inner wall of the top of the connecting block 405, and the inner wall of the bottom of the connecting block 405 is fixedly connected to the third rotating rod 406.

[0037] A limiting block is fixedly installed on one side of the fixing plate 401. The straight rod 410 is fixedly connected to the bottom of the limiting block, and the end of the straight rod 410 away from the limiting block is fixedly connected to the top of the heat dissipation substrate 6, which can enhance the stability between the entire fixing component 4 and the heat dissipation substrate 6. Two groups of fixing components 4 are provided on the top of the heat dissipation substrate 6, and the device body 5 can be fixed from two different positions.

[0038] Specifically, through the cooperation of the rotating block 403, the connecting block 405, the second rotating rod 404, the movable rod 407, the elastic pressing block 409 and the associated components, the device body 5 can be firmly fixed and supported, avoiding the situation of shaking and displacement of the device body 5 during heat dissipation and operation, and the device body 5 can be firmly fixed above the heat dissipation substrate 6. At the same time, the elastic pressing block 409 can adjust the pressure when fixing the device body 5 to prevent damage during the process of squeezing the device body 5.

[0039] The working principle of this utility model: This utility model is a semiconductor device heat dissipation device. First, place the device body 5 on the heat dissipation substrate 6. In the fixing component 4, by rotating the rotating block 403 downward through the third support rod, the second rotating rod 404, the connecting block 405 and the third rotating rod 406 can be driven to move, so that the movable rod 407 slides in the fixed sleeve 408. The elastic pressing block 409 at the bottom of the movable rod 407 and the straight rod 410 cooperate with each other to fix the device body 5. At the same time, in the heat dissipation component 3, the motor 305 drives the gear 304 to move horizontally on the support plate 302, so that the movable block 303 and the connected components move, causing the first rotating rod 313 and the fan blade 314 in the placement box 312 to start rotating, and dissipating heat from the heat dissipation substrate 6 and the device body 5.

[0040] The parts not described in the above manner can be realized by adopting or referring to the existing technologies.

[0041] Of course, the above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. All equivalent structural transformations made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present utility model and should be protected by the present utility model.

Claims

1. A semiconductor device heat dissipation device, comprising a heat dissipation box and a device body, characterized in that: A heat dissipation assembly is provided inside the heat dissipation box, and the heat dissipation assembly includes a support frame, a support plate is fixedly installed on the top of the support frame, the support plate is connected to a motor through a movable block, a positioning rod is fixedly installed on the output end of the motor, and a gear is fixedly installed on the circumferential surface of the positioning rod, the support plate is connected to a fixed block through a first support rod, a fixed rod is fixedly installed on one side of the movable block, the fixed rod is connected to a second support rod through a slider, the left end of the second support rod is fixedly connected to the positioning block, a placement box is fixedly installed on the circumferential surface of the fixed rod, and the placement box is connected to fan blades through a first rotating rod.

2. A semiconductor device heat dissipation device according to claim 1, characterized in that: A heat dissipation substrate is provided inside the heat dissipation box, the device body is connected to the top of the heat dissipation substrate, a telescopic rod is fixedly installed on the bottom of the heat dissipation substrate, a spring is sleeved on the circumferential surface of the telescopic rod, one end of the telescopic rod away from the heat dissipation substrate is fixedly connected to the bottom inner wall of the heat dissipation box, and a protective cover is provided on the top of the heat dissipation box.

3. A semiconductor device heat dissipation device according to claim 2, characterized in that: The support frame is fixedly connected to the bottom inner wall of the heat sink, a rack is fixedly installed on the top of the support plate, the movable block is movably connected to the outer surface of the support plate, the motor is fixedly connected to the side of the movable block away from the fixed rod, the gear and the rack are meshingly connected, one end of the support plate away from the support frame is fixedly connected to the first support rod, one end of the first support rod away from the support plate is fixedly connected to the fixed block, and the fixed block is fixedly connected to the bottom inner wall of the heat sink.

4. A semiconductor device heat dissipation device according to claim 3, characterized in that: One end of the fixed rod away from the movable block is fixedly connected to the slider, the second support rod is movably connected to the inner wall of the slider, a servo motor is fixedly installed on the inner wall surface of the placement box, the first rotating rod is fixedly connected to the output end of the servo motor, and the fan blades are fixedly connected to the circumferential surface of the first rotating rod.

5. A semiconductor device heat dissipation device according to claim 4, characterized in that: A fixing assembly is provided on the top of the heat dissipation substrate, and the fixing assembly includes a fixing plate, a fixing piece is fixedly installed on one side of the fixing plate, a third support rod is fixedly installed on the inner wall of the fixing piece, and the circumferential surface of the third support rod is rotatably connected with a rotating block, the outer surface of the rotating block is movably connected with a second rotating rod, the second rotating rod is connected to the third rotating rod through a connecting block, and the circumferential surface of the third rotating rod is fixedly connected with a movable rod, a fixing sleeve is fixedly installed on the side of the fixing piece away from the fixing plate, the movable rod is slidably connected to the inner wall of the fixing sleeve, an elastic pressing block is fixedly installed on the bottom of the movable rod, and the inner wall of the elastic pressing block is movably connected with a straight rod.

6. A semiconductor device heat dissipation device according to claim 5, characterized in that: The second rotating rod is fixedly connected to the top inner wall of the connecting block, and the bottom inner wall of the connecting block is fixedly connected to the third rotating rod.

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