Wafer with electromagnetic shielding structure
By designing a push rod and slide structure including a rotating table, a support plate and a motor-driven push rod, the problem of inconvenient fixation of the wafer during operation is solved, and more efficient operation and lower error rate are achieved.
Patent Information
- Application Number
- CN202422000701.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-19
AI Technical Summary
The existing wafers with electromagnetic shielding structure are inconvenient to fix during operation, resulting in operation errors and low working efficiency.
A structure including a rotating table, a support plate, a fixing plate, a motor, a threaded rod, a threaded sleeve, a slider, a push rod and a buffer pad are designed. The push rod is driven by a motor to push the clamping and buffer pad, driving the slider to slide, realize the clamping and fixing of the wafer, and drive the rotating table and wafer to rotate through the pedal to achieve operation in different directions.
This design makes the wafer more easily fixed, reduces operating errors, and improves the operator's operating efficiency on wafers with electromagnetic shielding structures.
Smart Images
Figure CN222966144U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafers, in particular to a wafer with an electromagnetic shielding structure. Background Art
[0002] A wafer with an electromagnetic shielding structure refers to a structure in which one or more layers of electromagnetic shielding materials are formed on the surface or inside of the wafer during the wafer manufacturing process to effectively block or weaken the influence of external electromagnetic interference on the internal circuits of the chip. This structure can significantly improve the electromagnetic compatibility (EMC) of the chip and ensure the normal operation of the chip in a harsh electromagnetic environment.
[0003] When the wafer with an electromagnetic shielding structure is in use, there are still the following defects: it is not convenient to fix during the operation of the wafer with an electromagnetic shielding structure by the staff, resulting in operation errors, and the working efficiency of the staff in operating the wafer with an electromagnetic shielding structure is not high. Therefore, it is of great application value to develop a wafer with an electromagnetic shielding structure. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the defects existing in the prior art, and to provide a wafer with an electromagnetic shielding structure.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A wafer with an electromagnetic shielding structure includes a rotating table and a first support plate. A first fixing plate is fixedly connected to the rotating table. A second fixing plate is fixedly connected to the first fixing plate. A motor is fixedly connected to the second fixing plate. A threaded rod is fixedly connected to the output end of the motor. A threaded sleeve is threadedly connected to the threaded rod. A sliding rod is provided on the threaded sleeve. A third fixing plate is fixedly connected to the rotating table. The threaded sleeve and the sliding rod are slidably connected to the third fixing plate. A first push rod is fixedly connected to the threaded sleeve. A first clamping plate is fixedly connected to the first push rod. A first connecting rod is hinged to the first push rod. A triangular turntable is hinged to the first connecting rod. A first connecting shaft is fixedly connected to the rotating table. The triangular turntable is rotatably connected to the first connecting shaft. A fourth fixing plate is fixedly connected to the rotating table. A sliding plate is slidably connected to the fourth fixing plate. A second push rod is fixedly connected to the sliding plate. A second connecting rod is hinged to the second push rod. The second connecting rod is hinged to the triangular turntable. A second clamping plate is fixedly connected to the second push rod. Buffer pads are provided on the second clamping plate and the first clamping plate. A wafer body is attached to the buffer pads.
[0006] As a further description of the above technical solution:
[0007] A fixing plate five is fixedly connected to the first support plate. A second connecting shaft is rotatably connected to the fixing plate five. A first connecting ring is fixedly connected to the second connecting shaft. A third connecting rod is fixedly connected to the first connecting ring. A first connecting plate is rotatably connected to the third connecting rod. A second connecting ring is provided on the first connecting plate. A second connecting plate is rotatably connected to the second connecting ring. A fourth connecting ring is fixedly connected to the second connecting plate. A third connecting shaft is fixedly connected to the fourth connecting ring. A second support plate is fixedly connected to the first support plate. A fixing plate six is fixedly connected to the second support plate. The fixing plate six is fixedly connected to a rotating table. A fifth connecting ring is fixedly connected to the second connecting shaft. A third connecting plate is fixedly connected to the fifth connecting ring. A pedal is fixedly connected to the third connecting plate. A spring is fixedly connected to the third connecting plate. One end of the spring away from the third connecting plate is fixedly connected to the first support plate.
[0008] As a further description of the above technical solution:
[0009] A fixing plate seven is fixedly connected to the rotating table. A fan is fixedly connected to the fixing plate seven.
[0010] As a further description of the above technical solution:
[0011] The fan is arranged on one side of the wafer body. There are three groups of buffer pads.
[0012] As a further description of the above technical solution:
[0013] There are two groups of second push rods. There are two groups of fixing plates four.
[0014] As a further description of the above technical solution:
[0015] The fifth connecting ring is arranged on one side of the third connecting plate. The third connecting shaft is arranged on one side of the second support plate.
[0016] As a further description of the above technical solution:
[0017] The pedal is arranged below the rotating table. The motor is arranged above the rotating table.
[0018] The utility model has the following beneficial effects:
[0019] 1. In the utility model, the staff starts the motor and pushes the first push rod. The first push rod pushes the first clamping plate and the buffer pad on the first clamping plate, driving two groups of sliding plates to slide on two groups of fixing plates four. Two groups of second push rods push two groups of second clamping plates and two groups of buffer pads. In this way, three groups of buffer pads can be driven to perform a clamping movement towards the wafer body. This is more convenient for the staff to operate the wafer of the electromagnetic shielding structure, facilitating fixation and reducing operation errors.
[0020] 2. In the present utility model, when a staff member steps on the pedal, the rotating table is driven to rotate, and the wafer body is driven to rotate. When stepping on the pedal, the spring is compressed. When the pedal is released, the wafer body is driven to rotate in the reverse direction to the original position by the reaction force of the spring, which can facilitate the staff to operate the wafer with an electromagnetic shielding structure in different directions, and also improve the working efficiency of the staff in operating the wafer with an electromagnetic shielding structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 FIG. is a schematic perspective view of a wafer with an electromagnetic shielding structure proposed by the present utility model Figure 1 ;
[0022] Figure 2 FIG. is a schematic perspective view of a wafer with an electromagnetic shielding structure proposed by the present utility model Figure 2 ;
[0023] Figure 3 FIG. is a schematic partial structure view of a wafer with an electromagnetic shielding structure proposed by the present utility model Figure 1 ;
[0024] Figure 4 FIG. is a schematic partial structure view of a wafer with an electromagnetic shielding structure proposed by the present utility model Figure 2 .
[0025] LEGEND DESCRIPTION:
[0026] 1. Rotating table; 2. First fixing plate; 3. Second fixing plate; 4. Motor; 5. Threaded rod; 6. Threaded sleeve; 7. Slide bar; 8. Third fixing plate; 9. First push rod; 10. First clamping plate; 11. First connecting rod; 12. Triangular turntable; 13. First connecting shaft; 14. Fourth fixing plate; 15. Slide plate; 16. Second push rod; 17. Second connecting rod; 18. Second clamping plate; 19. Buffer pad; 20. Wafer body; 21. First support plate; 22. Fifth fixing plate; 23. Second connecting shaft; 24. First connecting ring; 25. Third connecting rod; 26. First connecting plate; 27. Second connecting ring; 28. Second connecting plate; 29. Fourth connecting ring; 30. Third connecting shaft; 31. Second support plate; 32. Sixth fixing plate; 33. Fifth connecting ring; 34. Third connecting plate; 35. Pedal; 36. Spring; 37. Seventh fixing plate; 38. Fan. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0027] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0028] Referring to Figures 1 - 4 , an embodiment provided by the present utility model: a wafer with an electromagnetic shielding structure, including a rotating table 1 and a first support plate 21. A first fixing plate 2 is fixedly connected to the rotating table 1. A second fixing plate 3 is fixedly connected to the first fixing plate 2. A motor 4 is fixedly connected to the second fixing plate 3. The output end of the motor 4 is fixedly connected to a threaded rod 5. A threaded sleeve 6 is threadedly connected to the threaded rod 5. A sliding rod 7 is provided on the threaded sleeve 6. A third fixing plate 8 is fixedly connected to the rotating table 1. The threaded sleeve 6 and the sliding rod 7 are slidably connected to the third fixing plate 8. A first push rod 9 is fixedly connected to the threaded sleeve 6. A first clamping plate 10 is fixedly connected to the first push rod 9. A first connecting rod 11 is hinged to the first push rod 9. A triangular turntable 12 is hinged to the first connecting rod 11. A first connecting shaft 13 is fixedly connected to the rotating table 1. The triangular turntable 12 is rotatably connected to the first connecting shaft 13. A fourth fixing plate 14 is fixedly connected to the rotating table 1. A sliding plate 15 is slidably connected to the fourth fixing plate 14. A second push rod 16 is fixedly connected to the sliding plate 15. A second connecting rod 17 is hinged to the second push rod 16. The second connecting rod 17 is hinged to the triangular turntable 12. A second clamping plate 18 is fixedly connected to the second push rod 16. Buffer pads 19 are provided on the second clamping plate 18 and the first clamping plate 10. A wafer body 20 is attached to the buffer pads 19. When the staff starts the motor 4 and pushes the first push rod 9, the first push rod 9 drives the first clamping plate 10 and the buffer pad 19 on the first clamping plate 10, driving the two sliding plates 15 to slide on the two fourth fixing plates 14. The two second push rods 16 drive the two second clamping plates 18 and the two buffer pads 19, so that the three buffer pads 19 can be driven to move in the direction of the wafer body 20 for clamping. This makes it more convenient for the staff to operate the wafer with the electromagnetic shielding structure, facilitating fixation and reducing operation errors.
[0029] A fixed plate five 22 is fixedly connected to the support plate one 21. A connecting shaft two 23 is rotatably connected to the fixed plate five 22. A connecting ring one 24 is fixedly connected to the connecting shaft two 23. A connecting rod three 25 is fixedly connected to the connecting ring one 24. A connecting plate one 26 is rotatably connected to the connecting rod three 25. A connecting ring two 27 is provided on the connecting plate one 26. A connecting plate two 28 is rotatably connected to the connecting ring two 27. A connecting ring four 29 is fixedly connected to the connecting plate two 28. A connecting shaft three 30 is fixedly connected to the connecting ring four 29. A support plate two 31 is fixedly connected to the support plate one 21. A fixed plate six 32 is fixedly connected to the support plate two 31. The fixed plate six 32 is fixedly connected to the rotating table 1. A connecting ring five 33 is fixedly connected to the connecting shaft two 23. A connecting plate three 34 is fixedly connected to the connecting ring five 33. A pedal 35 is fixedly connected to the connecting plate three 34. A spring 36 is fixedly connected to the connecting plate three 34. One end of the spring 36 away from the connecting plate three 34 is fixedly connected to the support plate one 21. A fixed plate seven 37 is fixedly connected to the rotating table 1. A fan 38 is fixedly connected to the fixed plate seven 37. The fan 38 is arranged on one side of the wafer body 20. There are three groups of buffer pads 19, two groups of push rods two 16, and two groups of fixed plates four 14. The connecting ring five 33 is arranged on one side of the connecting plate three 34. The connecting shaft three 30 is arranged on one side of the support plate two 31. The pedal 35 is arranged below the rotating table 1. The motor 4 is arranged above the rotating table 1. When the staff steps on the pedal 35, it drives the rotating table 1 to rotate and drives the wafer body 20 to rotate. When stepping on the pedal 35, the spring 36 is compressed. When releasing the pedal 35, through the reaction force of the spring 36, the wafer body 20 is driven to rotate in the reverse direction to the original position, which can facilitate the staff to perform operations on the wafer with an electromagnetic shielding structure in different directions, and at the same time improve the working efficiency of the staff in operating the wafer with an electromagnetic shielding structure.
[0030] Working principle: A first electromagnetic protection layer is provided on the wafer and disposed on the peripheral surface of the wafer. It is usually made of a metal material such as copper, aluminum or alloy to provide shielding against electromagnetic fields. A second electromagnetic protection layer provided on the wafer covers the bottom surface of the wafer. It also uses a metal material such as a metal sputtering layer to jointly form a complete electromagnetic shielding structure with the first electromagnetic protection layer. At this time, the staff places the wafer body 20 between three groups of buffer pads 19. Then, the staff starts the motor 4 fixedly connected to the fixing plate two 3, drives the threaded rod 5 to rotate, and drives the threaded sleeve 6 and the slide rod 7 to slide on the fixing plate three 8. The slide rod 7 is provided to prevent the threaded sleeve 6 from rotating with the threaded rod 5. The threaded sleeve 6 pushes the first push rod 9, the first push rod 9 pushes the first clamping plate 10 and the buffer pads 19 on the first clamping plate 10, drives the first connecting rod 11 to deflect on the first push rod 9, drives the triangular turntable 12 to rotate on the first connecting shaft 13, drives two groups of second connecting rods 17 to deflect, drives two groups of second push rods 16 to move, drives two groups of sliding plates 15 to slide on two groups of fixing plates four 14. The two groups of second push rods 16 push two groups of second clamping plates 18 and two groups of buffer pads 19, so as to drive the three groups of buffer pads 19 to perform a clamping movement towards the wafer body 20. This is more convenient for the staff to operate the wafer with an electromagnetic shielding structure, facilitates fixation and reduces operation errors. The staff steps on the pedal 35, drives the second connecting shaft 23 to rotate on the fixing plate five 22, drives the first connecting ring 24 to rotate with the second connecting shaft 23, drives the third connecting rod 25 to deflect, drives the first connecting plate 26 to rotate on the third connecting rod 25, drives the second connecting ring 27 to rotate, and through the second connecting ring 27, drives the second connecting plate 28 to rotate, drives the buffer pad 19 to rotate, drives the third connecting shaft 30 to rotate on the fixing plate six 32, drives the rotating table 1 to rotate, and drives the wafer body 20 to rotate. When the staff steps on the pedal 35, the spring 36 is compressed. When the pedal 35 is released, the reaction force of the spring 36 drives the third connecting plate 34 back to the original position, drives the second connecting shaft 23 to rotate reversely to the original position on the fixing plate five 22, drives the third connecting shaft 30 to rotate reversely to the original position, drives the rotating table 1 to rotate reversely to the original position, and drives the wafer body 20 to rotate reversely to the original position. Through this operation that can return to the original position, it is convenient for the staff to operate the wafer with an electromagnetic shielding structure in different directions, and at the same time, it also improves the working efficiency of the staff in operating the wafer with an electromagnetic shielding structure. When the staff needs to perform an operation on 20, the staff can start 38 to dissipate heat from 20.
[0031] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A wafer with an electromagnetic shielding structure, comprising a rotating table (1) and a supporting plate (21), characterized in that: The rotating table (1) is fixedly connected to a fixing plate 1 (2), the fixing plate 1 (2) is fixedly connected to a fixing plate 2 (3), the fixing plate 2 (3) is fixedly connected to a motor (4), the output end of the motor (4) is fixedly connected to a threaded rod (5), the threaded rod (5) is threadedly connected to a threaded sleeve (6), the threaded sleeve (6) is provided with a sliding rod (7), the rotating table (1) is fixedly connected to a fixing plate 3 (8), the threaded sleeve (6) and the sliding rod (7) are slidably connected to the fixing plate 3 (8), the threaded sleeve (6) is fixedly connected to a push rod 1 (9), the push rod 1 (9) is fixedly connected to a clamping plate 1 (10), the push rod 1 (9) is hinged with a connecting rod 1 (11), the connecting rod 1 A triangular turntable (12) is hinged on (11), a connecting shaft (13) is fixedly connected to the rotating table (1), the triangular turntable (12) is rotatably connected to the connecting shaft (13), a fixed plate (14) is fixedly connected to the rotating table (1), a slide plate (15) is slidably connected to the fixed plate (14), a push rod (16) is fixedly connected to the slide plate (15), a connecting rod (17) is hinged to the push rod (16), the connecting rod (17) is hinged to the triangular turntable (12), a clamping plate (18) is fixedly connected to the push rod (16), a buffer pad (19) is provided on the clamping plate (18) and the clamping plate (10), and a wafer body (20) is attached to the buffer pad (19).
2. The wafer with an electromagnetic shielding structure according to claim 1, characterized in that: The support plate 1 (21) is fixedly connected to a fixing plate 5 (22), the fixing plate 5 (22) is rotatably connected to a connecting shaft 2 (23), the connecting shaft 2 (23) is fixedly connected to a connecting ring 1 (24), the connecting ring 1 (24) is fixedly connected to a connecting rod 3 (25), the connecting rod 3 (25) is rotatably connected to a connecting plate 1 (26), the connecting plate 1 (26) is provided with a connecting ring 2 (27), the connecting ring 2 (27) is rotatably connected to a connecting plate 2 (28), the connecting plate 2 (28) is fixedly connected to a connecting ring 4 (29), the connecting ring 4 (29) is fixedly connected to A connecting shaft three (30), the supporting plate one (21) is fixedly connected to a supporting plate two (31), the supporting plate two (31) is fixedly connected to a fixing plate six (32), the fixing plate six (32) is fixedly connected to the rotating table (1), the connecting shaft two (23) is fixedly connected to a connecting ring five (33), the connecting ring five (33) is fixedly connected to a connecting plate three (34), the connecting plate three (34) is fixedly connected to a pedal (35), the connecting plate three (34) is fixedly connected to a spring (36), and one end of the spring (36) away from the connecting plate three (34) is fixedly connected to the supporting plate one (21).
3. The wafer with an electromagnetic shielding structure according to claim 2, characterized in that: A fixing plate seven (37) is fixedly connected to the rotating platform (1), and a fan (38) is fixedly connected to the fixing plate seven (37).
4. The wafer with an electromagnetic shielding structure according to claim 3, characterized in that: The fan (38) is arranged on one side of the wafer body (20), and the buffer pads (19) are provided in three groups.
5. The wafer with an electromagnetic shielding structure according to claim 4, characterized in that: The push rod 2 (16) is provided with two groups, and the fixing plate 4 (14) is provided with two groups.
6. The wafer with an electromagnetic shielding structure according to claim 5, characterized in that: The connecting ring five (33) is arranged on one side of the connecting plate three (34), and the connecting shaft three (30) is arranged on one side of the supporting plate two (31).
7. The wafer with an electromagnetic shielding structure according to claim 6, characterized in that: The pedal (35) is arranged below the rotating platform (1), and the motor (4) is arranged above the rotating platform (1).