Power module and electric controller

Abstract

The utility model relates to the technical field of vehicles, and provides a power module and an electric controller. Wherein the power module comprises a cooling device, an inversion element, a packaging shell and a convergence element; the inversion element is installed on the cooling device, so that the cooling device can dissipate heat of the inversion element, the packaging shell covers the outer side of the inversion element and is connected with the cooling device, the convergence element is arranged on the packaging shell, and the convergence element is electrically connected with the inversion element. The current enters the inversion element through the confluence element, is inverted and then is output through the confluence element; the packaging shell is provided with a heat conduction piece, one end of the heat conduction piece is insulated from and connected with the confluence element, and the other end of the heat conduction piece is connected with the cooling device so as to transfer heat of the confluence element to the cooling device. The cooling device can absorb heat generated when the inversion element and the confluence element work at the same time, so that the cooling device can cool the inversion element and the confluence element at the same time, the temperature of the power module during work is reduced, and the service life of the power module is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the technical field of vehicles, and in particular, to a power module and an electric controller. Background Art

[0002] An electric motor in a vehicle needs to be provided with an electric motor controller. The user controls and drives the electric motor through the electric motor controller to control the working state of the vehicle. The core component in the electric motor controller is inseparable from a power drive module component (hereinafter referred to as "power module"). The power module is mainly composed of semiconductor chips such as diodes, MOSFETs, IGBTs, and SICs combined and encapsulated. Its main working principle is to invert the direct current of the battery pack into alternating current to drive the electric motor. When the power module works, a large amount of heat will be generated. Therefore, a heat dissipation solution that meets the function must be used. Usually, the power module will be encapsulated with a substrate for cooling, a plastic shell, a gel, etc. The components for inverting direct current in the power module are encapsulated in the space formed by the plastic shell and the substrate, and the gel is filled in the plastic shell. The heat generated by the components for inverting direct current is transferred to the substrate, so that the substrate completes the heat dissipation of the components for inverting direct current.

[0003] However, after the components for inverting direct current invert the direct current into alternating current, the alternating current needs to be output. Usually, a busbar component is provided outside the plastic shell. The busbar component is electrically connected to the components for inverting direct current. The busbar component collects the inverted alternating current and outputs it to the electric motor. The busbar component collecting the inverted alternating current will also generate a large amount of heat, causing the temperature of the electric motor controller to rise and affecting the normal operation of the electric motor controller, and shortening the service life of the electric motor controller. Summary of the Utility Model

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a power module and an electric controller.

[0005] The present disclosure provides a power module, including a cooling device, an inverting element, a packaging shell, and a busbar component;

[0006] The inverting element is installed on the cooling device. The packaging shell covers the outside of the inverting element and is connected to the cooling device. The busbar component is arranged on the packaging shell and is electrically connected to the inverting element;

[0007] A heat conducting member is provided on the packaging shell. One end of the heat conducting member is insulated from and connected to the busbar component, and the other end is connected to the cooling device to transfer the heat of the busbar component to the cooling device.

[0008] Optionally, part of the heat conducting member is embedded inside the side wall of the encapsulation case. A connection port is formed on one side of the encapsulation case close to the cooling device. One end of the heat conducting member is exposed on the side of the encapsulation case facing away from the cooling device to be insulated and connected to the busbar element, and the other end abuts against the cooling device through the connection port.

[0009] Optionally, the busbar element is arranged on the side of the encapsulation case facing away from the cooling device. A connection groove penetrating through the encapsulation case is provided on the side of the encapsulation case far from the cooling device. The connection groove and the heat conducting member are arranged at intervals. The inverter element is electrically connected to the busbar element through the connection groove.

[0010] Optionally, the inverter element includes a plurality of single-tube element groups, the busbar element includes a circuit board, the connection groove includes a plurality of sub-connection grooves, the plurality of sub-connection grooves are arranged at intervals along the length direction of the circuit board, the plurality of single-tube element groups are arranged in one-to-one correspondence with the plurality of sub-connection grooves, and the plurality of single-tube element groups respectively protrude out of the sub-connection grooves to be electrically connected to the circuit board.

[0011] Optionally, each single-tube element group includes a plurality of single-tube elements. The sub-connection groove extends along the width direction of the circuit board. The plurality of single-tube elements are arranged along the width direction of the circuit board. Part of the single-tube elements protrudes out of the sub-connection groove to be electrically connected to the circuit board. The plurality of single-tube element groups are connected in parallel with the circuit board, and the plurality of single-tube elements are connected in parallel with the circuit board.

[0012] Optionally, the number of the heat conducting members is multiple, and the multiple heat conducting members and the multiple sub-connection grooves are arranged alternately.

[0013] Optionally, an insulating sheet is provided between the inverter element and the cooling device. One side of the insulating sheet is connected to the cooling device, and the other side is connected to the inverter element.

[0014] Optionally, the insulating sheet includes a ceramic layer, a first metal layer and a second metal layer;

[0015] The first metal layer and the second metal layer are respectively connected to both sides of the ceramic layer. The first metal layer is welded to the inverter element, and the second metal layer is welded to the cooling device.

[0016] Optionally, the cooling device includes a cold plate body and a substrate. A cooling groove is formed by recessing one side of the cold plate body. The substrate covers the notch of the cooling groove, and the edge of the substrate is hermetically connected to the edge of the notch of the cooling groove. The cold plate body is provided with a water inlet and a water outlet communicated with the cooling groove. The inverter element is installed on the side of the substrate facing away from the inside of the cooling groove, and the encapsulation shell is connected to the side of the substrate facing away from the inside of the cooling groove;

[0017] And / or, an insulating and heat-conducting pad is provided between the encapsulation shell and the busbar element. One side of the insulating and heat-conducting pad is adhesively connected to the busbar element, and the other side is adhesively connected to the outer side of the encapsulation shell. The heat-conducting member is connected to the insulating and heat-conducting pad;

[0018] And / or, the inside of the encapsulation shell is filled with gel.

[0019] The present disclosure also provides an electric controller, including a housing and the power module as described in any one of the above. The power module is installed inside the housing.

[0020] The present disclosure provides a power module and an electric controller. By setting the power module to include a cooling device, an inverter element, an encapsulation shell, and a busbar element; the inverter element is installed on the cooling device, so that the cooling device can dissipate heat from the inverter element. The encapsulation shell covers the outside of the inverter element and is connected to the cooling device. The busbar element is arranged on the encapsulation shell, and the busbar element is electrically connected to the inverter element, so that current enters the inverter element through the busbar element, undergoes inversion, and then is output through the busbar element; a heat-conducting member is provided on the encapsulation shell, one end of the heat-conducting member is insulated and connected to the busbar element, and the other end is connected to the cooling device to transfer the heat of the busbar element to the cooling device. The cooling device can simultaneously absorb the heat generated when the inverter element and the busbar element work, so that the cooling device can dissipate heat from the inverter element and the busbar element at the same time, reducing the temperature of the power module during operation, ensuring that the overall temperature of the power module during operation is within a suitable range, enabling the electric controller equipped with the power module to work properly for a long time, and extending the service life of the power module. Description of the Drawings

[0021] The drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure.

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is an exploded view of the power module described in the embodiments of the present disclosure;

[0024] Figure 2 It is a schematic structural diagram of the power module described in the embodiments of the present disclosure;

[0025] Figure 3 It is Figure 2 a cross-sectional view taken along the A-A direction in

[0026] Figure 4 It is an exploded view of the cooling device described in the embodiments of the present disclosure;

[0027] Figure 5 It is the front view and top view of the substrate described in the embodiments of the present disclosure;

[0028] Figure 6 It is the front view of the assembled inverter element and cooling device described in the embodiments of the present disclosure;

[0029] Figure 7 It is Figure 6 an enlarged view of the structure at B in

[0030] Figure 8 It is a partial sectional view structure diagram of the power module described in the embodiments of the present disclosure;

[0031] Figure 9 It is a partial sectional view structure diagram of the power module after removing the busbar element and the insulating heat-conducting pad described in the embodiments of the present disclosure;

[0032] Figure 10 It is an exploded view of the electric controller described in the embodiments of the present disclosure.

[0033] Wherein, 1. Cooling device; 11. Cold plate body; 12. Substrate; 121. Cooling column; 13. Cooling groove; 14. Water inlet; 15. Water outlet; 16. Annular sealing ring; 2. Inverter element; 21. Single-tube element group; 3. Package shell; 31. Heat-conducting member; 32. Connection groove; 321. Sub-communication groove; 4. Busbar element; 5. Insulating sheet; 51. First metal layer; 52. Second metal layer; 53. Ceramic layer; 6. Insulating heat-conducting pad; 7. Housing. Specific embodiments

[0034] In order to more clearly understand the above objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.

[0035] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, the present disclosure may be practiced in other ways different from those described herein. Obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.

[0036] Referring to Figures 1 to 10 As shown, an embodiment of the present disclosure provides a power module, which includes a cooling device 1, an inverter element 2, a packaging shell 3, and a busbar element 4. The inverter element 2 is installed on the cooling device 1. The packaging shell 3 covers the outside of the inverter element 2 and is connected to the cooling device 1. The busbar element 4 is disposed on the side of the packaging shell 3 facing away from the cooling device 1, and the busbar element 4 is electrically connected to the inverter element 2. A heat conducting member 31 is provided on the packaging shell 3. One end of the heat conducting member 31 is insulated and connected to the busbar element 4, and the other end is connected to the cooling device 1 to transfer the heat of the busbar element 4 to the cooling device 1.

[0037] Specifically, the cooling device 1 can be selected as a cold plate using air cooling for temperature reduction. Of course, it can also be selected as a cold plate using liquid cooling. It can be selected that the packaging shell 3 and the inverter element 2 are disposed on the same side of the cooling device 1. Screw holes are provided at the edge of the cooling device 1, and a convex structure is provided on the outer side surface of the packaging shell 3. Screw holes are provided on the convex structure. Bolts are used to threadedly connect the convex structure on the outer side surface of the packaging shell 3 to the screw holes at the edge of the cooling device 1, so that the packaging shell 3 is attached to the outer surface of the cooling device 1.

[0038] The above-mentioned inverter element 2 can be selected as a single-tube element. After direct current is input into the single-tube element, the single-tube element converts the direct current into alternating current and outputs it to the busbar element 4. The busbar element 4 can be selected as pins or connectors disposed on the outer side surface of the packaging shell 3. Of course, it can also be selected that the busbar element 4 is a circuit board disposed on the outer side surface of the packaging shell 3.

[0039] The above-mentioned packaging shell 3 can be selected to be provided with through holes. Wires are passed through the through holes in the packaging shell 3. One end of the wire is connected to the busbar element 4, and the other end is connected to the inverter element 2. Of course, it can also be selected that through slots are provided on the packaging shell 3. The inverter element 2 has pins, and the pins extend in the direction facing away from the cooling device 1 and protrude out of the through slots, so that the pins of the inverter element 2 can be connected to the busbar element 4.

[0040] The above-mentioned heat conducting member 31 can be selected as a metal sheet. The heat conducting member 31 can be arranged on the outer side of the encapsulation shell 3. And an insulating coating is provided at one end of the heat conducting member 31 connected to the busbar element 4, so as to prevent the heat conducting member 31 from short-circuiting the busbar element 4. Both ends of the heat conducting member 31 are respectively in contact with the busbar element 4 and the cooling device 1, so as to transfer the heat of the busbar element 4 to the cooling device 1. After the cooling device 1 is started, it can cool the inverter element 2 and the busbar element 4 at the same time, thereby improving the overall heat dissipation effect of the power module. Of course, it is also possible to select a part of the heat conducting member 31 to be embedded inside the housing of the encapsulation shell 3, and both ends of the heat conducting member 31 are respectively exposed outside the encapsulation shell 3, so that one end of the heat conducting member 31 is in contact with the busbar element 4 and the other end is in contact with the cooling device 1.

[0041] The above-mentioned encapsulation shell 3 can be selected as a box structure. An opening is provided on one side of the box. When the encapsulation shell 3 covers the outside of the inverter element 2, the side of the box with the opening is attached to the cooling device 1. The inverter element 2 enters the inside of the box through the opening, so that the encapsulation shell 3 covers the outside of the inverter element 2, so that the encapsulation shell 3 and the cooling device 1 jointly enclose a working space; a gel is filled inside the encapsulation shell 3, that is, the gel is filled in the working space enclosed by the encapsulation shell 3 and the inverter element 2. The gel fills the working space. The gel can improve the position stability of the inverter element 2, and the gel can absorb the vibration received by the encapsulation shell 3. The heat generated when the inverter element 2 works can also be transferred to the cooling device 1 through the gel.

[0042] When the power module provided by the present disclosure is specifically used, the busbar element 4 is electrically connected to the motor of the vehicle, the inverter element 2 is connected to the busbar element 4. After the current flows from the busbar element 4 into the inverter element 2 and the direct current is inverted into alternating current, the inverted alternating current is output to the motor through the busbar element 4; when the power module works, the cooling device 1 is started, and the heat generated by the work of the inverter element 2 is transferred to the cooling device 1. The heat generated by the current flowing on the busbar element 4 is transferred to the cooling device 1 through the heat conducting member 31, so that the cooling device 1 continuously absorbs the heat of the busbar element 4 and the inverter element 2 after being started, and the cooling device simultaneously dissipates the heat of the inverter element 2 and the busbar element 4, reducing the temperature when the power module works, ensuring that the overall temperature of the power module is within a suitable range during operation, enabling the electronic controller equipped with the power module to work normally for a long time, and extending the service life of the power module.

[0043] The power module provided by the embodiments of the present disclosure includes a cooling device 1, an inverter element 2, a packaging shell 3, and a busbar element 4; the inverter element 2 is installed on the cooling device 1 so that the cooling device 1 can dissipate heat from the inverter element 2. The packaging shell 3 covers the outside of the inverter element 2 and is connected to the cooling device 1. The busbar element 4 is arranged on the packaging shell 3, and the busbar element 4 is electrically connected to the inverter element 2, so that current enters the inverter element 2 through the busbar element 4, undergoes inversion, and then is output through the busbar element 4; a heat conducting member 31 is provided on the packaging shell 3. One end of the heat conducting member 31 is insulated from and connected to the busbar element 4, and the other end is connected to the cooling device 1 to transfer the heat of the busbar element 4 to the cooling device 1. The cooling device 1 can simultaneously absorb the heat generated when the inverter element 2 and the busbar element 4 work, improving the heat dissipation effect of the cooling device 1, ensuring that the overall temperature of the power module is within a suitable range, enabling the electronic controller equipped with the power module to work normally for a long time, and extending the service life of the power module.

[0044] Referring to Figure 1 , Figure 3 and Figure 9 As shown, in some embodiments, part of the heat conducting member 31 is embedded inside the side wall of the packaging shell 3. A connection port is formed on the side of the packaging shell 3 close to the cooling device 1. One end of the heat conducting member 31 is exposed on the side of the packaging shell 3 facing away from the cooling device 1 to be insulated from and connected to the busbar element 4, and the other end abuts against the cooling device 1 through the connection port. With such a setting, part of the heat conducting member 31 is inside the side wall of the packaging shell 3, enabling the side wall of the packaging shell 3 to protect the heat conducting member 31 from external force collision and external contamination.

[0045] Specifically, the side wall of the packaging shell 3 abuts against the cooling device 1, that is, the part between the side of the packaging shell 3 facing away from the cooling device 1 and the cooling device 1 is the side wall of the packaging shell 3; it can be selected that one side wall of the packaging shell 3 has a receiving cavity, and the side of the packaging shell 3 facing the cooling device 1 is provided with a connection port communicating with the receiving cavity. The side of the packaging shell 3 facing away from the cooling device 1 can be selected to be provided with a receiving groove, and an opening is provided at the bottom of the receiving groove. The opening at the bottom of the receiving groove communicates with the receiving cavity; the heat conducting member 31 is installed in the receiving cavity, one end of the heat conducting member 31 abuts against the cooling device 1 through the connection port, and the other end of the heat conducting member 31 enters the receiving groove through the opening at the bottom of the receiving groove, so that the heat conducting member 31 in the receiving groove can be insulated from and connected to the busbar element 4.

[0046] Referring to Figure 1 , Figure 3 , Figure 8 and Figure 9As shown, in some embodiments, the busbar element 4 is disposed on the side of the package housing 3 facing away from the cooling device 1. A connection groove 32 penetrating the package housing 3 is provided on the side of the package housing 3 away from the cooling device 1. The connection groove 32 is spaced apart from the heat conducting member 31. The inverter element 2 is electrically connected to the busbar element 4 through the connection groove 32. With such an arrangement, the busbar element 4, the package housing 3, the inverter element 2, and the cooling device 1 are stacked in sequence, making the power module structure compact. The connection groove 32 provides a structural basis for the electrical connection between the busbar element 4 and the inverter element 2. The area of the busbar element 4 is usually large, and there is enough area on the side of the package housing 3 away from the cooling device 1 to mount the busbar element 4. And for the efficiency of the inverter current, the inverter element 2 usually has multiple connection points for connecting to the busbar element 4. The connection groove 32 has enough extension space on the side of the package housing 3 facing away from the cooling device 1 to ensure that there are multiple connection points between the inverter element 2 and the busbar element 4.

[0047] Specifically, the busbar element 4 is disposed on the side of the package housing 3 facing away from the cooling device 1, so that the busbar element 4, the package housing 3, the inverter element 2, and the cooling device 1 are stacked in sequence, making the power module structure compact.

[0048] The above-mentioned package housing 3 can be selected to extend in a direction parallel to the cooling device 1. The extension direction of the package housing 3 is the length direction of the package housing 3, and the direction perpendicular to the surface where the cooling device 1 is connected to the package housing 3 is the height direction of the package housing 3; the connection groove 32 can be selected to extend along the length direction of the package housing 3. Of course, it can also be selected that the connection groove 32 extends along the width direction of the package housing 3.

[0049] The above-mentioned inverter element 2 can be selected to be provided with pins, and the pins extend in a direction away from the cooling device 1, so that the pins of the inverter element 2 extend out of the connection groove 32 to be connected to the busbar element 4, so that current can flow between the inverter element 2 and the busbar element 4. Of course, it can also be selected to use wires to penetrate through the connection groove 32 to electrically connect the busbar element 4 and the inverter element 2.

[0050] Refer to Figure 1 、 Figure 3 、 Figure 8 and Figure 9 As shown, in some embodiments, the inverter element 2 includes a plurality of single transistor element groups 21, the busbar element 4 includes a circuit board, the connection groove 32 includes a plurality of sub-connection grooves 321, the plurality of sub-connection grooves 321 are spaced apart along the length direction of the circuit board, the plurality of single transistor element groups 21 are arranged in one-to-one correspondence with the plurality of sub-connection grooves 321, and the plurality of single transistor element groups 21 extend out of the corresponding sub-connection grooves 321 to be electrically connected to the circuit board. With such an arrangement, the plurality of single transistor element groups 21 cooperate with each other to realize the inversion and amplification of current, and the plurality of sub-connection grooves 321 cooperate with the plurality of single transistor element groups 21 so that the plurality of single transistor element groups 21 can be connected to the circuit board.

[0051] Specifically, the single-tube element group 21 may optionally include multiple single-tube elements. A single-tube element refers to an individual transistor with an independent package. Such a single-tube element has a simple structure and functions such as amplification, switching, and voltage regulation.

[0052] Each single-tube element in the above-mentioned single-tube element group 21 is provided with pins. The pins of each single-tube element extend in a direction away from the cooling device 1, enabling the pins to be connected to the circuit board, thereby electrically connecting the circuit board to the multi-single-tube element group 21.

[0053] The length direction of the above-mentioned circuit board is the same as the length direction of the package shell 3. The sub-through groove 321 may optionally extend along the width direction of the circuit board. Multiple single-tube element groups 21 are arranged at intervals along the width direction of the circuit board, enabling each single-tube element group 21 to extend out of the corresponding sub-through groove 321 and be connected to the circuit board.

[0054] Refer to Figure 1 、 Figure 3 、 Figure 8 and Figure 9 As shown, in some embodiments, the single-tube element group 21 includes multiple single-tube elements. The sub-through groove 321 extends along the width direction of the circuit board. Multiple single-tube elements are arranged along the width direction of the circuit board. A part of the single-tube elements extends out of the sub-through groove 321 and is electrically connected to the circuit board. Multiple single-tube element groups 21 are connected in parallel with the circuit board, and multiple single-tube elements are connected in parallel with the circuit board. With such an arrangement, multiple single-tube elements can invert and amplify the current input to the current board, enabling each single-tube element in the multiple single-tube element groups 21 to perform inversion and amplification operations simultaneously, thereby improving the working efficiency of the power module.

[0055] Specifically, the single-tube elements may optionally be arranged at intervals along the width direction of the circuit board. Of course, the single-tube elements may also be arranged along the width direction of the circuit board. The single-tube element may optionally include a main body part and an extension part. The extension part extends in a direction away from the cooling device 1, enabling the extension part to extend out of the sub-through groove 321. The circuit board may optionally be provided with mounting holes corresponding to the multiple single-tube elements one by one. The extension parts of the multiple single-tube elements are inserted into the multiple mounting holes one by one, and the extension parts are electrically connected to the circuit board by welding, thereby electrically connecting the single-tube elements to the circuit board.

[0056] Refer to Figure 1 、 Figure 3 、 Figure 8 and Figure 9As shown, in some embodiments, the number of heat conducting members 31 is multiple, and the multiple heat conducting members 31 and the multiple sub-channels 321 are arranged alternately. With such an arrangement, current exchange occurs between the single-tube element group 21 in each sub-channel 321 and the circuit board. Heat is likely to accumulate at the position of the circuit board opposite to the sub-channel 321. The multiple heat conducting members 31 and the multiple sub-channels 321 are alternately spaced, so that the heat conducting members 31 are provided around the place where heat is likely to accumulate on the circuit board, enabling the heat generated during the operation of the circuit board to be timely transferred to the cooling device 1 through the multiple heat conducting members 31, improving the heat dissipation effect of the cooling device 1 on the circuit board.

[0057] Specifically, along the length direction of the package shell 3, the multiple heat conducting members 31 and the multiple sub-channels 321 can be arranged alternately. The number of heat conducting members 31 can be selected to be one more than the number of sub-channels 321, so that there is a heat conducting member 31 on each side of each sub-channel 321.

[0058] Refer to Figure 1 、 Figure 3 、 Figure 6 、 Figure 7 、 Figure 8 and Figure 9 As shown, in some embodiments, an insulating sheet 5 is provided between the inverter element 2 and the cooling device 1. One side of the insulating sheet 5 is connected to the cooling device 1, and the other side is connected to the inverter element 2. With such an arrangement, the insulating sheet 5 is connected to the cooling device 1, and the inverter element 2 is connected to the insulating sheet 5, avoiding short circuit between the inverter element 2 and the cooling device 1, and enabling the inverter element 2 to be closely attached to the surface of the cooling device 1 through the insulating sheet 5, facilitating the transfer of heat from the inverter element 2 to the cooling device 1.

[0059] Specifically, the insulating sheet 5 can be selected as a ceramic sheet. The insulating sheet 5 can be connected to the cooling device 1 and the inverter element 2 by bonding, so that the inverter element 2 is closely attached and installed on the cooling device 1, facilitating the transfer of heat from the inverter element 2 to the cooling device 1 through the insulating sheet 5. Of course, the insulating sheet 5 can also be selected as a composite structure of multiple sheets. The sheets on both sides are metal sheets, and the sheet in the middle layer is an insulating material, so that the sheet on one side of the insulating sheet 5 can be welded to the cooling device 1, and the sheet on the other side can be welded to the inverter element 2.

[0060] Traditional inverter components are installed on the cooling device 1 through elastic buckles. The elastic force of the elastic buckles makes the inverter components contact the cooling device 1, thereby improving the efficiency of heat transfer from the inverter components to the cooling device 1. However, the elastic force of the elastic buckles is limited, and the inverter components are prone to shift due to vibration or other reasons, resulting in poor contact between the inverter components and the cooling device 1. In this application, an insulating sheet 5 is connected between the cooling device 1 and the inverter component 2, so that the inverter component 2 is attached to the cooling device 1 through the insulating sheet 5, and the relative position between the inverter component 2 and the cooling device 1 is kept stable through the insulating sheet 5, so that the heat generated by the inverter component 2 can continuously pass through the insulating sheet 5 to the cooling device 1.

[0061] Referring to Figure 1 , Figure 3 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, in some embodiments, the insulating sheet 5 includes a ceramic layer 53, a first metal layer 51, and a second metal layer 52; the first metal layer 51 and the second metal layer 52 are respectively connected to both sides of the ceramic layer 53, the first metal layer 51 is welded to the inverter component 2, and the second metal layer 52 is welded to the cooling device 1. With such a setting, the ceramic layer 53 ensures that the first metal layer 51 and the second metal layer 52 are insulated from each other. The first metal layer 51 and the second metal layer 52 are respectively welded to the inverter component 2 and the cooling device 1, ensuring that the inverter component 2 is stably installed on the cooling device 1. The first metal layer 51 and the second metal layer 52 have good heat conduction effects, so that the heat generated when the inverter component 2 works can be quickly transferred to the cooling device 1 through the first metal layer 51, the second metal layer 52, and the ceramic layer 53.

[0062] Specifically, the ceramic layer 53 is arranged between the first metal layer 51 and the second metal layer 52, so that the first metal layer 51 and the second metal layer 52 are separated from each other and insulated from each other; the cooling device 1 is usually made of metal to improve the heat conduction efficiency, and the inverter component 2 is also made of metal. Thus, the inverter component 2 is welded to the first metal layer 51, and the cooling device 1 is welded to the second metal layer 52, and the inverter component 2 can be stably installed on the cooling device 1.

[0063] When the above-mentioned first metal layer 51 and second metal layer 52 are respectively welded to the inverter component 2 and the cooling device 1, vacuum reflow soldering can be selected.

[0064] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, in some embodiments, the cooling device 1 includes a cold plate body 11 and a substrate 12. A cooling groove 13 is formed by recessing one side of the cold plate body 11. The substrate 12 covers the notch of the cooling groove 13, and the edge of the substrate 12 is sealingly connected to the edge of the notch of the cooling groove 13. The cold plate body 11 is provided with a water inlet 14 and a water outlet 15 that communicate with the cooling groove 13. The inverter element 2 is installed on the side of the substrate 12 facing away from the inside of the cooling groove 13, and the encapsulation shell 3 is connected to the side of the substrate 12 facing away from the inside of the cooling groove 13. With such a setting, the cold plate body 11 and the substrate 12 form a modular structure. Only by connecting the water inlet 14 and the water outlet 15 to the cooling water circuit, the cooling device 1 can cool the inverter element 2 and the busbar element 4, simplifying the operation of installing the power module in the electric controller.

[0065] Specifically, the cold plate body 11 can be selected as a block structure. A cooling groove 13 is formed by recessing one side surface of the cold plate body 11. The edge of the substrate 12 is welded to the edge of the notch of the cooling groove 13, so that the substrate 12 covers the notch of the cooling groove 13, and the substrate 12 is sealingly connected to the notch of the cooling groove 13, and the liquid cannot flow out of the cooling groove 13 from the notch of the cooling groove 13 when flowing in the cooling groove 13. Usually, a sealing ring is selected to be installed between the edge of the substrate 12 and the edge of the notch of the cooling groove 13 to make the edge of the substrate 12 sealingly connected to the notch of the cooling groove 13. However, this requires a sealing ring with a specific shape and size, increasing the cost of the cooling device 1. Using the welding method to seal the edge of the substrate 12 to the edge of the notch of the cooling groove 13 avoids the use of a sealing ring with a specific shape and size and facilitates the assembly operation of the cold plate body 11 and the substrate 12.

[0066] The length direction of the above-mentioned cold plate body 11 can be selected to be the same as the length direction of the encapsulation shell 3. A cooling groove 13 is formed by recessing one side surface in the height direction of the cold plate body 11. The cooling groove 13 can be selected to extend along the length direction of the cold plate body 11. The water inlet 14 and the water outlet 15 are respectively arranged at both ends of the cooling groove 13, so that the coolant can flow into the cooling groove 13 through the water inlet 14, and then the coolant flows out of the cooling groove 13 through the water outlet 15. During this process, the coolant exchanges heat with the cold plate body 11 and the substrate 12, thereby realizing the cooling effect of the cooling device 1.

[0067] On the side of the above-mentioned substrate 12 facing the bottom of the cooling groove 13, multiple cooling columns 121 can be selected to be arranged, so that when the coolant flows in the cooling groove 13, it contacts the multiple cooling columns 121, increasing the contact area between the substrate 12 and the coolant, thereby accelerating the heat exchange efficiency between the coolant and the substrate 12.

[0068] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 andFigure 5 As shown, in some embodiments, an insulating and heat-conducting pad 6 is provided between the encapsulation shell 3 and the busbar element 4. One side of the insulating and heat-conducting pad 6 is adhesively connected to the busbar element 4, and the other side is adhesively connected to the outer side of the encapsulation shell 3. The heat-conducting member 31 is connected to the insulating and heat-conducting pad 6. With this arrangement, the heat-conducting member 31 is connected to the encapsulation shell 3 through the insulating and heat-conducting pad 6. The insulating and heat-conducting pad 6 ensures the mutual insulation between the heat-conducting member 31 and the busbar element 4, and the insulating and heat-conducting pad 6 can freely adjust its shape and area, making it convenient for the insulating and heat-conducting pad 6 to adapt to different models of busbar elements.

[0069] Specifically, the insulating and heat-conducting pad 6 can be selected as a silica gel pad. The heat-conducting member 31 can be formed into a sheet structure on the side of the encapsulation shell 3 facing away from the cooling device 1. The insulating and heat-conducting pad 6 is attached to the side of the sheet structure facing away from the encapsulation shell 3, and the busbar element 4 is adhesively connected to the side of the insulating and heat-conducting pad 6 facing away from the encapsulation shell 3, so that the heat on the busbar element 4 is transferred to the heat-conducting member 31 through the insulating and heat-conducting pad 6.

[0070] In some embodiments, the encapsulation shell 3 is filled with gel. With this arrangement, the gel filled into the interior of the encapsulation shell 3 can protect the inverter element 2.

[0071] Specifically, the encapsulation shell 3 and the cooling device 1 jointly enclose a working space. The interior of the encapsulation shell 3 is filled with gel. The gel is an insulating gel and can conduct heat. That is, the working space enclosed by the encapsulation shell 3 and the inverter element 2 is filled with gel. The gel fills the working space. The gel can improve the position stability of the inverter element 2, and the gel can absorb the vibration received by the encapsulation shell 3. The heat generated when the inverter element 2 works can also be transferred to the cooling device 1 through the gel.

[0072] The embodiments of the present disclosure also provide an electric controller, including a housing 7 and a power module as described in any one of the above; the power module is installed in the housing 7.

[0073] Specifically, the power module can be selected to be installed in the housing 7 by bolts; when the cooling device 1 has a water inlet 14 and a water outlet 15, it can be selected that the housing 7 is provided with a first mating port and a second mating port. The first mating port is in communication with the water inlet 14, and an annular sealing ring 16 is provided at the water inlet 14 and the first mating port to seal the connection between the first mating port and the water inlet; the second mating port is in communication with the water outlet 15, and an annular sealing ring 16 is provided between the second mating port and the water outlet to seal the connection between the second mating port and the water outlet 15.

[0074] When the power module and the electric controller provided by the embodiments of the present disclosure are specifically used, the circuit board of the busbar element 4 is connected to the motor, and the current is input from the circuit board into a plurality of single-tube elements. The plurality of single-tube elements invert and amplify the incoming current and then output it to the circuit board. The circuit board receives the current that has been inverted and amplified and outputs it to the motor.

[0075] When the power module is operating, the coolant enters the cooling tank 13 from the water inlet 14, and then the coolant flows out of the cooling tank 13 from the water outlet 15. The coolant continuously absorbs the heat on the substrate 12; the current flows between the busbar element 4 and the inverter element 2. A part of the heat generated on the inverter element 2 is transferred to the substrate 12 through the first metal layer 51, the ceramic layer 53, and the second metal layer 52 of the insulating sheet 5, and another part of the heat is transferred to the substrate 12 through the gel in the encapsulation shell 3; the heat on the circuit board of the busbar element 4 is transferred to the heat conducting member 31 through the insulating heat conducting pad 6, and then transferred to the substrate 12 through the heat conducting member 31, so as to cool the inverter element 2 and the busbar element 4 simultaneously on the substrate 12, reduce the temperature when the power module is operating, and extend the service life of the power module and the electric controller.

[0076] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0077] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power module, characterized in that: It comprises a cooling device (1), an inverter element (2), a packaging shell (3) and a converging element (4); The inverter element (2) is mounted on the cooling device (1), the packaging shell (3) is arranged on the outside of the inverter element (2) and is connected to the cooling device (1), the converging element (4) is arranged on the packaging shell (3), and the converging element (4) is electrically connected to the inverter element (2); A heat conducting member (31) is provided on the packaging shell (3); one end of the heat conducting member (31) and the converging element (4) are insulated from and connected to each other, and the other end is connected to the cooling device (1) so as to transfer the heat of the converging element (4) to the cooling device (1).

2. The power module according to claim 1, characterized in that: Part of the heat conducting member (31) is embedded in the side wall of the packaging shell (3), and a connection port is formed on a side of the packaging shell (3) close to the cooling device (1). One end of the heat conducting member (31) is exposed on a side surface of the packaging shell (3) facing away from the cooling device (1) so as to be insulated from and connected to the conduit element (4), and the other end is in contact with the cooling device (1) through the connection port.

3. The power module according to claim 1, characterized in that: The busbar element (4) is arranged on a side of the packaging shell (3) facing away from the cooling device (1); a connecting groove (32) penetrating the packaging shell (3) is provided on a side of the packaging shell (3) away from the cooling device (1); the connecting groove (32) and the heat conducting member (31) are arranged at intervals; and the inverter element (2) is electrically connected to the busbar element (4) via the connecting groove (32).

4. The power module according to claim 3, characterized in that: The inverter element (2) comprises a plurality of single-tube element groups (21), the converging element (4) comprises a circuit board, the connecting groove (32) comprises a plurality of sub-through grooves (321), the plurality of sub-through grooves (321) are arranged at intervals along the length direction of the circuit board, the plurality of single-tube element groups (21) and the plurality of sub-through grooves (321) are arranged in a one-to-one correspondence, and the plurality of single-tube element groups (21) extend out of the sub-through grooves (321) in a one-to-one correspondence to be electrically connected to the circuit board.

5. The power module according to claim 4, characterized in that: The single-tube element group (21) comprises a plurality of single-tube elements, the sub-through slot (321) extends along the width direction of the circuit board, the plurality of single-tube elements are arranged along the width direction of the circuit board, parts of the single-tube elements extend out of the sub-through slot (321) and are electrically connected to the circuit board, the plurality of single-tube element groups (21) are connected in parallel with the circuit board, and the plurality of single-tube elements are connected in parallel with the circuit board.

6. The power module according to claim 4, characterized in that: The number of the heat conducting members (31) is plural, and the plural heat conducting members (31) and the plural sub-through grooves (321) are arranged alternately.

7. The power module according to claim 1, characterized in that: An insulating sheet (5) is provided between the inverter element (2) and the cooling device (1); one side of the insulating sheet (5) is connected to the cooling device (1), and the other side is connected to the inverter element (2).

8. The power module according to claim 7, characterized in that: The insulating sheet (5) comprises a ceramic layer (53), a first metal layer (51) and a second metal layer (52); The first metal layer (51) and the second metal layer (52) are respectively connected to two sides of the ceramic layer (53); the first metal layer (51) is welded to the inverter element (2); and the second metal layer (52) is welded to the cooling device (1).

9. The power module according to claim 1, characterized in that: The cooling device (1) comprises a cold plate body (11) and a base plate (12); one side of the cold plate body (11) is recessed to form a cooling groove (13); the base plate (12) covers the notch of the cooling groove (13); the edge of the base plate (12) is sealedly connected to the edge of the notch of the cooling groove (13); the cold plate body (11) is provided with a water inlet (14) and a water outlet (15) which are connected to the cooling groove (13); the inverter element (2) is mounted on a side of the base plate (12) which is away from the interior of the cooling groove (13); and the encapsulation shell (3) is connected to a side of the base plate (12) which is away from the interior of the cooling groove (13); And / or, an insulating thermal pad (6) is provided between the packaging shell (3) and the busbar element (4), one side of the insulating thermal pad (6) is bonded and connected to the busbar element (4), and the other side of the insulating thermal pad (6) is bonded and connected to the outer side of the packaging shell (3), and the heat conducting member (31) is connected to the insulating thermal pad (6); And / or, the packaging shell (3) is filled with gel.

10. An electric controller, characterized in that: It comprises a housing (7) and a power module according to any one of claims 1 to 9; the power module is installed in the housing (7).

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