5G mixed metal substrate with high thermal conductivity

Abstract

The utility model belongs to the field of heat dissipation substrates, particularly relates to a high-heat-conductivity 5G mixed metal substrate, and aims to solve the problems that only rapid heat dissipation of the bottom of an electronic element can be realized, and the top of the electronic element cannot be subjected to heat conduction and rapid heat dissipation during heat conduction and heat dissipation of the electronic element in the prior art. In order to solve the problem that the heat dissipation effect of an electronic component is not obvious in the prior art, and the overall heat dissipation performance of the electronic component is reduced, the utility model provides the following scheme that the electronic component comprises a heat dissipation bottom metal plate, the top side of the heat dissipation bottom metal plate is provided with a bottom layer substrate and a heat dissipation mechanism, and the heat dissipation mechanism is arranged at the top of the top layer substrate and used for efficiently dissipating heat of the electronic component. When the electronic component is used, the received heat can be efficiently and rapidly dissipated to the surrounding air, so that the purpose of conducting heat and rapidly dissipating heat at the top of the electronic component is achieved, the phenomenon that the heat dissipation effect of the whole electronic component is still not obvious is prevented, the heat dissipation efficiency is further enhanced, and the overall heat dissipation performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation substrates, in particular to a high - thermal - conductivity 5G hybrid metal substrate. Background Technique

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper - clad laminate. For single - sided and double - sided printed boards, during manufacturing, hole processing, electroless copper plating, electroplating copper, etching, etc. are selectively carried out on the substrate material - copper - clad laminate.

[0003] After retrieval, the patent with the authorization announcement number CN211128377U proposes a high - thermal - conductivity 5G hybrid metal substrate, which includes a top - layer substrate and a copper foil layer. The top - layer substrate is successively provided with a top - layer substrate, a bottom - layer substrate, and a heat - dissipation bottom metal plate from top to bottom. A heat - conducting through - hole is opened directly below the electronic component, and the heat - conducting through - hole vertically penetrates through the copper foil layer, the top - layer substrate, the bottom - layer substrate, and the heat - dissipation bottom metal plate. An irregular heat - conducting block is sunken in the inner wall of the heat - conducting through - hole, and a heat - conducting ring is provided at the bottom of the irregular heat - conducting block. The heat - conducting ring is clamped and pressed in a clamping inner ring groove, and the clamping inner ring groove is opened between the heat - dissipation bottom metal plate and the top - layer substrate. The bottom surface of the heat - conducting ring is fixedly connected to the top surface of the heat - dissipation bottom metal plate. The utility model presses a variety of metals together with the substrate, and dissipates heat quickly through multiple heat - dissipation forms such as metal - contact conduction and air - flow heat dissipation, greatly improving the heat - dissipation ability of the electronic component itself and improving the efficient long - term operation state of the electronic component. However, there are the following problems in this technical solution:

[0004] Currently, when conducting heat dissipation for the electronic components on the substrate, only the rapid heat dissipation at the bottom of the electronic component can be achieved, and the top of the electronic component cannot be quickly heat - conducted and dissipated, resulting in an obvious heat - dissipation effect for the overall electronic component still not being achieved, reducing the overall heat - dissipation performance.

[0005] In view of the above problems, the present utility model document proposes a high - thermal - conductivity 5G hybrid metal substrate. Content of the Utility Model

[0006] The present utility model provides a high - thermal - conductivity 5G hybrid metal substrate, which solves the problem that when conducting heat dissipation for the electronic components on the substrate in the prior art, only the rapid heat dissipation at the bottom of the electronic component can be achieved, and the top of the electronic component cannot be quickly heat - conducted and dissipated, resulting in an obvious heat - dissipation effect for the overall electronic component still not being achieved, reducing the overall heat - dissipation performance.

[0007] The present utility model provides the following technical solutions:

[0008] A high - thermal - conductivity 5G hybrid metal substrate, comprising:

[0009] A heat dissipation bottom metal plate, a bottom layer substrate is arranged on the top side of the heat dissipation bottom metal plate, a top layer substrate is arranged on the top side of the bottom layer substrate, a copper foil layer is laminated on the top side of the top layer substrate, and after the surface of the copper foil layer is etched and partitioned, there are multiple component welding areas for patch welding, and electronic components are welded on each component welding area;

[0010] A heat dissipation mechanism, which is arranged on the top of the top layer substrate and is used for efficiently dissipating heat from the electronic components.

[0011] In a possible design, the heat dissipation mechanism includes a plurality of heat sinks, each heat sink corresponds to an electronic component, a thermal conductive silicone grease in contact with the bottom side of the heat sink is arranged on the top side surface of the electronic component, and mounting plates are fixedly arranged on both sides of the heat sink.

[0012] In a possible design, a plurality of support blocks are arranged on the top of the top layer substrate, the plurality of support blocks are divided into multiple groups, each group of support blocks is arranged at the bottom of the mounting plate, and a limit groove for the mounting plate to be limited and clamped is formed on the top side of each support block.

[0013] In a possible design, two magnets are arranged on the bottom side of the inner wall of each limit groove, and two iron sheets adsorbed to the magnets are arranged on the bottom side of each mounting plate.

[0014] In a possible design, fixing plates are fixedly arranged on both sides of each support block, two screws penetrate through the top of the fixing plate, and a plurality of threaded holes for the screws to be threadedly connected are formed on the top side of the top layer substrate.

[0015] In a possible design, a heat conduction through hole is formed directly below each electronic component, the heat conduction through hole vertically penetrates through the copper foil layer, the top layer substrate, the bottom layer substrate and the heat dissipation bottom metal plate, and a special-shaped heat conduction block is fixedly installed on the inner wall of the heat conduction through hole.

[0016] In a possible design, a plurality of card slots corresponding to and communicating with the heat conduction through holes are formed on the top of the bottom layer substrate, a heat conduction ring is fixedly installed on the inner wall of each card slot, the inner wall of the heat conduction ring is fixed to the bottom outer wall of the special-shaped heat conduction block, and the bottom side of the heat conduction ring is fixed to the top side of the heat dissipation bottom metal plate.

[0017] In this application, during use, first, heat conduction through holes are provided directly below each electronic component, and the through holes vertically penetrate the copper foil layer, the top substrate, the bottom substrate, and the heat dissipation bottom metal plate. Then, the special-shaped heat conduction blocks fixedly installed on the inner walls of the heat conduction through holes can increase the contact area with air, thereby accelerating heat dissipation. Multiple slots corresponding to and communicating with the heat conduction through holes are provided on the top of the bottom substrate, and heat conduction rings are fixedly installed on the inner walls of the slots. Since the inner wall of the heat conduction ring is fixed to the bottom outer wall of the special-shaped heat conduction block and the bottom side is fixed to the top side of the heat dissipation bottom metal plate, a complete heat conduction path is formed, enabling heat to be efficiently and rapidly transferred from the electronic component to the heat dissipation bottom metal plate at the bottom, facilitating rapid heat dissipation and achieving the effect of high heat conduction and heat dissipation;

[0018] Next, the support blocks are installed on the top substrate. Screws penetrate through the fixing plates fixed on both sides of the support blocks and are threadedly connected to the internal corresponding threaded holes, thereby fixing the support blocks to the top substrate, facilitating the subsequent installation and fixing of the heat sink, achieving the effects of convenient installation and disassembly, improving convenience. Then, the heat sinks are placed corresponding to each electronic component, and the heat sinks are in direct contact with the thermal grease on the top surface of the electronic components, enabling effective transfer of heat from the electronic components to the heat sinks. The heat received by the heat sinks can be efficiently and rapidly dissipated into the surrounding air, thereby achieving the purpose of rapid heat conduction and heat dissipation at the top of the electronic components, preventing the overall heat dissipation effect of the electronic components from being still not obvious, further enhancing the heat dissipation efficiency, improving the overall heat dissipation performance. At the same time, the support blocks fixed on both sides of the heat sinks are clamped into the limiting grooves provided on the top of the support blocks, which is beneficial for limiting and fixing the mounting plate, facilitating the installation and fixing of the heat sinks, ensuring that the heat sinks can be stably fixed on the support blocks. The magnets provided on the bottom side of the inner wall of the limiting grooves are adsorbed to the iron sheets provided on the bottom side of the mounting plate. Thus, the magnetic adsorption connection method not only facilitates the installation and disassembly of the heat sinks but also helps improve the contact tightness between the heat sinks and the electronic components, improving the use effect.

[0019] In this utility model, for the high - thermal - conductivity 5G hybrid metal substrate, through the heat dissipation mechanism, heat can be effectively transferred from the electronic components to the heat sinks, and the heat received by the heat sinks can be efficiently and rapidly dissipated into the surrounding air, thereby achieving the purpose of rapid heat conduction and heat dissipation at the top of the electronic components;

[0020] In this utility model, for the high - thermal - conductivity 5G hybrid metal substrate, through the settings of structures such as magnets, iron sheets, screws, and threaded holes, the support blocks can be fixedly installed on the top substrate, facilitating the subsequent installation and fixing of the heat sinks. At the same time, it ensures that the heat sinks can be stably fixed on the support blocks, not only facilitating the installation and disassembly of the heat sinks but also helping improve the contact tightness between the heat sinks and the electronic components;

[0021] In the present utility model, the received heat can be efficiently and quickly dissipated into the surrounding air, thereby achieving the purpose of quickly dissipating heat from the top of the electronic component, preventing the overall heat dissipation effect of the electronic component from still being not obvious, further enhancing the heat dissipation efficiency, and improving the overall heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 1 is a front view structural schematic diagram of a highly thermally conductive 5G hybrid metal substrate provided by an embodiment of the present utility model;

[0023] Figure 2 FIG. 2 is a structural schematic diagram of an electronic component of a highly thermally conductive 5G hybrid metal substrate provided by an embodiment of the present utility model;

[0024] Figure 3 FIG. 3 is a side view sectional structural schematic diagram of a bottom substrate of a highly thermally conductive 5G hybrid metal substrate provided by an embodiment of the present utility model;

[0025] Figure 4 FIG. 4 is a split structural schematic diagram of a heat sink of a highly thermally conductive 5G hybrid metal substrate provided by an embodiment of the present utility model;

[0026] Figure 5 FIG. 5 is a structural schematic diagram of a heat sink of a highly thermally conductive 5G hybrid metal substrate provided by an embodiment of the present utility model.

[0027] Reference Numerals:

[0028] 1. Heat dissipation bottom metal plate; 2. Bottom substrate; 3. Top substrate; 4. Electronic component; 5. Special-shaped heat conduction block; 6. Heat conduction ring; 7. Card slot; 8. Heat sink; 9. Support block; 10. Fixing plate; 11. Screw; 12. Threaded hole; 13. Limiting groove; 14. Magnet; 15. Iron sheet. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0030] Embodiment 1

[0031] Please refer to Figures 1-5 , a metal substrate, comprising:

[0032] The heat dissipation bottom metal plate 1 has a bottom substrate 2 provided on its top side, a top substrate 3 provided on the top side of the bottom substrate 2, a copper foil layer laminated on the top side of the top substrate 3. After etching and partitioning on the surface of the copper foil layer, there are multiple component soldering areas for chip soldering left. An electronic component 4 is soldered on each component soldering area. The substrate consists of a copper foil layer, a top substrate 3, a bottom substrate 2, and a heat dissipation bottom metal plate 1 from top to bottom, ensuring that heat can be efficiently conducted through different material layers. The surface of the copper foil layer is etched and partitioned to form multiple component soldering areas for chip soldering, which are used to fix the electronic component 4.

[0033] A heat dissipation mechanism is provided on the top of the top substrate 3 for efficiently dissipating heat from the electronic component 4. The heat dissipation mechanism includes multiple heat sinks 8, each heat sink 8 corresponding to an electronic component 4. A thermal grease in contact with the bottom side of the heat sink 8 is provided on the top side surface of the electronic component 4. Mounting plates are fixedly provided on both sides of the heat sink 8. The heat sink 8 is placed corresponding to each electronic component 4, and the heat sink 8 is in direct contact with the thermal grease on the top side surface of the electronic component 4, so that heat can be effectively transferred from the electronic component 4 to the heat sink 8. The heat received on the heat sink 8 can be efficiently and quickly dissipated into the surrounding air, thus achieving the purpose of quickly dissipating heat conducted from the top of the electronic component 4 and preventing the overall phenomenon that the heat dissipation effect of the electronic component 4 is still not obvious.

[0034] Multiple support blocks 9 are provided on the top of the top substrate 3. The multiple support blocks 9 are divided into multiple groups, and each group of support blocks 9 is provided at the bottom of the mounting plate. A limiting groove 13 for limiting and clamping the mounting plate is provided on the top side of each support block 9. At the same time, the support blocks 9 fixed on both sides of the heat sink 8 are clamped into the limiting groove 13 opened on the top of the support block 9, which is beneficial to limit and fix the mounting plate, so as to facilitate the installation and fixation of the heat sink 8 and ensure that the heat sink 8 can be stably fixed on the support block 9.

[0035] Two magnets 14 are provided on the bottom side of the inner wall of each limiting groove 13, and two iron sheets 15 adsorbed to the magnets 14 are provided on the bottom side of each mounting plate. The magnets 14 provided on the bottom side of the inner wall of the limiting groove 13 are adsorbed to the iron sheets 15 provided on the bottom side of the mounting plate. Furthermore, through the magnetic adsorption connection method, it is not only convenient for the installation and disassembly of the heat sink 8, but also helps to improve the contact tightness between the heat sink 8 and the electronic component 4.

[0036] On both sides of each support block 9, fixing plates 10 are fixedly arranged. Two screws 11 penetrate through the top of the fixing plate 10. A plurality of threaded holes 12 for the threaded connection of the screws 11 are formed in the top side of the top-layer substrate 3. The screws 11 penetrate through the fixing plates 10 fixed on both sides of the support block 9 and are threadedly connected to the corresponding threaded holes 12, so that the support block 9 can be fixedly installed on the top-layer substrate 3, facilitating the subsequent installation and fixing of the heat sink 8, achieving the effects of convenient installation and disassembly, and improving the convenience.

[0037] This application can be used in the field of heat dissipation substrates, and can also be used in other fields applicable to this application.

[0038] Among them, the heat dissipation bottom metal plate 1, the electronic component 4, the special-shaped heat conduction block 5, and the heat conduction ring 6 are the same as the heat dissipation bottom metal plate 1, the electronic component 5, the special-shaped heat conduction block 6, and the heat conduction ring 9 mentioned in the Chinese Patent Authorization Announcement No. CN211128377U, and their structures and mechanisms will not be elaborated here.

[0039] Embodiment 2

[0040] Reference Figures 1-3 , on the basis of Embodiment 1, an improvement is made: a highly heat-conductive 5G hybrid metal substrate, which is applied to the field of heat dissipation substrates;

[0041] A heat conduction through hole is formed directly below each electronic component 4. The heat conduction through hole vertically penetrates through the copper foil layer, the top-layer substrate 3, the bottom-layer substrate 2, and the heat dissipation bottom metal plate 1. A special-shaped heat conduction block 5 is fixedly installed on the inner wall of the heat conduction through hole. A plurality of card slots 7 corresponding to and communicating with the heat conduction through holes are formed in the top of the bottom-layer substrate 2. A heat conduction ring 6 is fixedly installed on the inner wall of each card slot 7. The inner wall of the heat conduction ring 6 is fixed to the bottom outer wall of the special-shaped heat conduction block 5, and the bottom side of the heat conduction ring 6 is fixed to the top side of the heat dissipation bottom metal plate 1.

[0042] The special-shaped heat conduction block 5 fixedly installed on the inner wall of the heat conduction through hole can increase the contact area with the air, thereby accelerating the dissipation of heat. A plurality of card slots 7 corresponding to and communicating with the heat conduction through holes are formed in the top of the bottom-layer substrate 2, and a heat conduction ring 6 is fixedly installed on the inner wall of the card slot 7. Since the inner wall of the heat conduction ring 6 is fixed to the bottom outer wall of the special-shaped heat conduction block 5 and the bottom side is fixed to the top side of the heat dissipation bottom metal plate 1, a complete heat conduction path is formed, enabling heat to be efficiently and quickly transferred from the electronic component 4 to the bottom heat dissipation bottom metal plate 1, which is beneficial for rapid heat dissipation and achieves the effect of high heat conduction and heat dissipation.

[0043] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of changes or substitutions, which should all be covered within the protection scope of the present utility model; without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A high thermal conductivity 5G hybrid metal substrate, characterized in that: include: A heat dissipation bottom metal plate (1), wherein a bottom substrate (2) is arranged on the top side of the heat dissipation bottom metal plate (1), a top substrate (3) is arranged on the top side of the bottom substrate (2), a copper foil layer is pressed on the top side of the top substrate (3), and a surface of the copper foil layer is etched to leave a plurality of component welding areas for surface mount welding, and an electronic component (4) is welded on each component welding area; A heat dissipation mechanism, the heat dissipation mechanism being arranged on the top of the top substrate (3) and used for efficiently dissipating heat from the electronic components (4); The heat dissipation mechanism comprises a plurality of heat sinks (8), each of the heat sinks (8) corresponding to an electronic component (4), a top surface of the electronic component (4) being provided with thermal conductive silicone grease in contact with a bottom side of the heat sink (8), and mounting plates being fixedly provided on both sides of the heat sink (8); A plurality of support blocks (9) are arranged on the top of the top substrate (3); the plurality of support blocks (9) are divided into a plurality of groups; each group of support blocks (9) is arranged at the bottom of the mounting plate; and a limit groove (13) for the mounting plate to be limited and clamped is provided on the top side of each support block (9); Two magnets (14) are provided on the bottom side of the inner wall of each limiting groove (13), and two iron sheets (15) adsorbed to the magnets (14) are provided on the bottom side of each mounting plate.

2. A high thermal conductivity 5G hybrid metal substrate according to claim 1, characterized in that: A fixing plate (10) is fixedly provided on both sides of each support block (9), two screws (11) penetrate the top of the fixing plate (10), and a plurality of threaded holes (12) for threaded connection of the screws (11) are provided on the top side of the top substrate (3).

3. A high thermal conductivity 5G hybrid metal substrate according to claim 1, characterized in that: A heat-conducting through hole is provided directly below each electronic component (4), the heat-conducting through hole vertically penetrating the copper foil layer, the top substrate (3), the bottom substrate (2) and the heat-dissipating bottom metal plate (1), and a special-shaped heat-conducting block (5) is fixedly mounted on the inner wall of the heat-conducting through hole.

4. A high thermal conductivity 5G hybrid metal substrate according to claim 3, characterized in that: The top of the bottom substrate (2) is provided with a plurality of slots (7) corresponding to and communicating with the heat-conducting through holes, and a heat-conducting ring (6) is fixedly mounted on the inner wall of each slot (7), the inner wall of the heat-conducting ring (6) is fixed to the bottom outer wall of the special-shaped heat-conducting block (5), and the bottom side of the heat-conducting ring (6) is fixed to the top side of the heat-dissipating bottom metal plate (1).

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