Flip substrate easy to weld chip

Abstract

The utility model discloses a flip substrate easy to weld a chip, and relates to the related technical field of flip substrates. The circuit board comprises a substrate, the substrate is an aluminum substrate, the upper layer of the aluminum substrate is provided with an insulating layer, the insulating layer generates a circuit layer through etching, the circuit layer comprises a plurality of patch chip clamping shallow gaps, two sides of each patch chip clamping shallow gap are provided with trapezoid welding concave discs, and the trapezoid welding concave discs are arranged on the upper layer of each patch chip clamping shallow gap. A trapezoid welding guide frame is arranged above each trapezoid welding concave disc, and each trapezoid welding guide frame is coated with a solder resist ink layer. The structure can facilitate later welding, meanwhile, the welding efficiency is improved, and pseudo soldering is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field related to flip-chip substrates, and particularly relates to a flip-chip substrate that is easy to weld chips. Background Art

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. For single-sided and double-sided printed boards, during manufacturing, hole processing, electroless copper plating, electroplating copper, etching, etc. are selectively performed on the copper-clad laminate to obtain the required circuit patterns. For the manufacturing of another type of multi-layer printed board, it is also based on a thin-core copper-clad laminate as the base, and the conductive pattern layers and prepregs are alternately laminated together in one step to form interconnections between more than 3 conductive pattern layers. It has three functions: conduction, insulation, and support.

[0003] The most common is the aluminum substrate, which includes a common aluminum substrate and a superconducting aluminum substrate. There is an insulating layer on the substrate body of the common aluminum substrate and the superconducting aluminum substrate, and a circuit layer is etched on the surface of the insulating layer. However, when the existing aluminum substrate is welded, especially when welding a chip resistor, considering that the chip resistor is relatively thin, the problem of poor soldering is likely to occur, resulting in difficult soldering. Therefore, improvement is needed. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a flip-chip substrate that is easy to weld chips, and solve the problem that when the existing aluminum substrate is welded, especially when welding a chip resistor, considering that the chip resistor is relatively thin, the problem of poor soldering is likely to occur, resulting in difficult soldering.

[0005] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0006] The utility model is a flip-chip substrate that is easy to weld chips, including a substrate. The substrate is an aluminum substrate, and an insulating layer is provided on the upper layer of the aluminum substrate. The insulating layer generates a circuit layer through etching. Its characteristics are: the circuit layer includes a plurality of shallow notches for chip resistor positions. On both sides of each shallow notch for chip resistor position, there are trapezoidal welding concave discs. Above each trapezoidal welding concave disc, there is a trapezoidal welding guide frame, and a layer of solder mask ink layer is coated on each trapezoidal welding guide frame.

[0007] Preferably, in order to improve heat dissipation, a heat dissipation component is provided inside the aluminum substrate. The heat dissipation component includes a heat conduction plate and a heat sink. The side of the heat conduction plate is provided with the heat sink rising along the width direction of the aluminum substrate, and the side of the heat sink is flush with the long side of the aluminum substrate. Part of the heat conduction plate exposes the insulating layer and is higher than the insulating layer.

[0008] Preferably, in order to avoid false soldering, through holes are provided on both waists inside the trapezoidal welding concave disc, and a solder layer matching the through holes is provided on the inner side of the aluminum substrate.

[0009] Preferably, for convenient disassembly, a plug strip is provided on each side of the bottom of the trapezoidal solder guiding frame, and a slot matching the plug strip is provided on the insulating layer.

[0010] Preferably, the trapezoidal solder guiding frame is made of an insulating soft material.

[0011] Preferably, the cross-section of the trapezoidal solder guiding frame is a structure with a larger upper end and a smaller lower end.

[0012] Preferably, for the anti-blackening effect, a covering layer is coated on the insulating layer, and the covering layer is white oil.

[0013] The utility model has the following beneficial effects: By providing a shallow notch for the surface-mounted chip positioning, the shallow notch for the surface-mounted chip positioning is used to place the surface-mounted chip, fix and limit the surface-mounted chip, which is convenient for subsequent soldering. Moreover, trapezoidal welding concave discs are provided on both sides of each shallow notch for the surface-mounted chip positioning. Adding trapezoidal welding concave discs can improve the fluidity of the solder and make it flow downward during soldering. And due to the trapezoidal structure, it is more convenient for soldering, ultimately ensuring more stable soldering and preventing false soldering problems. In addition, by adding a trapezoidal solder guiding frame, it plays a role in guiding the solder flow. And a solder resist ink layer is coated on each trapezoidal solder guiding frame. The solder resist ink layer can prevent the solder from remaining on the trapezoidal solder guiding frame, allowing the solder to quickly flow into the trapezoidal welding concave disc, further improving the soldering efficiency and speed. Description of the Drawings

[0014] Figure 1 It is a schematic cross-sectional structure diagram of a flip-chip substrate for easily soldering a chip in Embodiment 1;

[0015] Figure 2 For Figure 1 the enlarged view at A;

[0016] Figure 3 For Figure 2 the enlarged view at B;

[0017] Figure 4 It is a schematic cross-sectional structure diagram of a flip-chip substrate for easily soldering a chip in Embodiment 2;

[0018] Figure 5 It is a top view of the heat dissipation component in Embodiment 2;

[0019] Figure 6 It is a partial enlarged view of the flip-chip substrate in Embodiment 3;

[0020] Figure 7Schematic diagram of the circuit connection of the gateway body in Embodiment 1;

[0021] Figure 8 Schematic diagram of the result of the covering layer in Embodiment 2;

[0022] Reference numerals: aluminum substrate 1, insulating layer 2, circuit layer 3, shallow notch 301 for patch chip positioning, trapezoidal welding concave disc 302, trapezoidal welding guide frame 303, solder resist ink layer 304, heat dissipation component 4, heat conducting plate 5, heat sink 6, through hole 7, solder layer 8, insert bar 9, slot 10, covering layer 11. Detailed implementation manners

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Embodiment 1

[0025] Please refer to Figures 1-3 As shown, a flip-chip substrate that is easy to solder chips disclosed in this embodiment includes a substrate. The substrate is an aluminum substrate 1. An insulating layer 2 is provided on the upper layer of the aluminum substrate 1. The insulating layer 2 is etched to generate a circuit layer 3. The circuit layer 3 includes a plurality of shallow notches 301 for patch chip positioning. Trapezoidal welding concave discs 302 are provided on both sides of each shallow notch 301 for patch chip positioning. Trapezoidal welding guide frames 303 are provided above each trapezoidal welding concave disc 302. A layer of solder resist ink layer 304 is coated on each trapezoidal welding guide frame 303.

[0026] Preferably, the trapezoidal welding guide frame 303 is made of an insulating soft material.

[0027] Preferably, the cross-section of the trapezoidal welding guide frame 303 is a structure with a larger upper end and a smaller lower end.

[0028] In this embodiment, a circuit layer 3 is etched and formed on the insulating layer 2. The circuit layer 3 includes a plurality of shallow notches 301 for patch chips. The shallow notches 301 for patch chips are used to place patch chips and fix and limit the patch chips, which is convenient for subsequent soldering. Moreover, trapezoidal soldering concave discs 302 are arranged on both sides of each shallow notch 301 for patch chips. Adding the trapezoidal soldering concave discs 302 can improve the fluidity of solder and make it flow downward during soldering. Moreover, due to the trapezoidal structure, soldering is more convenient, ultimately ensuring more stable soldering and preventing the problem of false soldering. In addition, by adding trapezoidal solder guiding frames 303, the function of solder diversion is achieved, and a layer of solder resist ink layer 304 is coated on each trapezoidal solder guiding frame 303. The solder resist ink layer 304 can prevent solder from remaining on the trapezoidal solder guiding frames 303 and make the solder flow quickly into the trapezoidal soldering concave discs 302, further improving the soldering efficiency and speed.

[0029] Embodiment 2

[0030] Please refer to Figures 4-5 As shown, the general structure of a flip-chip substrate for easily soldering chips disclosed in this embodiment is substantially the same as that in Embodiment 1. The difference is that, preferably, in order to improve heat dissipation, a heat dissipation component 4 is arranged inside the aluminum substrate 1. The heat dissipation component 4 includes a heat conducting plate 5 and heat sinks 6. The side of the heat conducting plate 5 is provided with the heat sinks 6 rising along the width direction of the aluminum substrate 1, and the sides of the heat sinks 6 are flush with the long side of the aluminum substrate 1. Part of the heat conducting plate 5 is exposed from the insulating layer 2 and is higher than the insulating layer 2. In this embodiment, by adding the heat dissipation component 4, the heat dissipation effect of the overall circuit board is further improved. The heat conducting plate 5 exposed on the upper surface is used to absorb heat, and then the heat is dissipated from the heat sinks 6 on both sides.

[0031] Embodiment 3

[0032] Please refer to Figure 6 As shown, the general structure of a flip-chip substrate for easily soldering chips disclosed in this embodiment is substantially the same as that in Embodiment 1. The difference is that, preferably, in order to avoid false soldering, through holes 7 are arranged on both waists inside the trapezoidal soldering concave discs 302, and a solder layer 8 matched with the through holes 7 is arranged inside the aluminum substrate 1. In this embodiment, by arranging the through holes 7 in the trapezoidal soldering concave discs 302 and arranging the solder layer 8 matched with the through holes 7 inside the aluminum substrate 1, the soldering effect is further improved when soldering the trapezoidal soldering concave discs 302, and false soldering is avoided.

[0033] Embodiment 4

[0034] Please refer to Figure 7As shown in the figure, the general structure of a flip-chip substrate for easily soldering chips disclosed in this embodiment is substantially the same as that of Embodiment 1. The difference is that, preferably, in order to facilitate disassembly, a plug strip 9 is provided on each side of the bottom of the trapezoidal solder guide frame 303, and a slot 10 matching the plug strip 9 is provided on the insulating layer 2. In this embodiment, the trapezoidal solder guide frame 303 and the insulating layer 2 are connected by means of plugging. The pad positions that do not need to be soldered are removed, thus avoiding waste and facilitating product reuse at the same time.

[0035] Embodiment 5

[0036] Please refer to Figure 8 As shown in the figure, the general structure of a flip-chip substrate for easily soldering chips disclosed in this embodiment is substantially the same as that of Embodiment 1. The difference is that, preferably, for the anti-blackening effect, a covering layer 11 is coated on the insulating layer 2. The covering layer 11 is white oil. In this embodiment, by coating a covering layer 11 composed of white oil on the insulating layer 2, since the white oil can cover the insulating layer between the pads, it avoids the light attenuation caused by the blackening of the insulating layer under high temperature and light absorption. Moreover, the white oil is white and has a reflection effect on light. At high temperature, the color change is relatively small. Therefore, the reflectivity change at high temperature is small, reducing the attenuation of the light source during use, thus achieving the anti-blackening effect.

[0037] The above are only the preferred embodiments of the present invention and do not limit the present invention. Any modification of the technical solutions recorded in the foregoing embodiments, any equivalent replacement of some technical features, and any modification, equivalent replacement, and improvement made all fall within the protection scope of the present invention.

Claims

1. A flip-chip substrate for easy chip welding, comprising a substrate, wherein the substrate is an aluminum substrate (1), an insulating layer (2) is provided on the upper layer of the aluminum substrate (1), and the insulating layer (2) is etched to generate a circuit layer (3), characterized in that: The circuit layer (3) comprises a plurality of shallow notches (301) for patch chip positioning, trapezoidal soldering recesses (302) are arranged on both sides of each of the shallow notches (301) for patch chip positioning, a trapezoidal soldering guide frame (303) is arranged above each of the trapezoidal soldering recesses (302), and a layer of solder resist ink (304) is coated on each of the trapezoidal soldering guide frames (303).

2. A flip-chip substrate that is easy to solder chips according to claim 1, characterized in that: A heat dissipation component (4) is arranged inside the aluminum substrate (1), and the heat dissipation component (4) comprises a heat conducting plate (5) and a heat sink (6), and the heat sink (6) is arranged on the side of the heat conducting plate (5) and rises along the width direction of the aluminum substrate (1), and the side of the heat sink (6) is arranged flush with the long side of the aluminum substrate (1), and the heat conducting plate (5) is partially exposed from the insulating layer (2) and is higher than the insulating layer (2).

3. The flip-chip substrate for easy chip soldering according to claim 1, characterized in that: Through holes (7) are arranged on both sides of the trapezoidal welding recess (302), and a solder layer (8) matching the through holes (7) is arranged on the inner side of the aluminum substrate (1).

4. The flip-chip substrate for easy chip soldering according to claim 1, characterized in that: An inserting strip (9) is provided on both sides of the bottom of the trapezoidal welding guide frame (303), and a slot (10) matching with the inserting strip (9) is provided on the insulating layer (2).

5. The flip-chip substrate for easy chip soldering according to claim 1, characterized in that: The trapezoidal welding guide frame (303) is made of an insulating soft material.

6. The flip-chip substrate for easy chip soldering according to claim 1, characterized in that: The cross section of the trapezoidal welding guide frame (303) is a structure with a larger upper end and a smaller lower end.

7. The flip-chip substrate for easy chip soldering according to claim 1, characterized in that: A covering layer (11) is coated on the insulating layer (2), and the covering layer (11) is white oil.

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