Rigid connection regulator heat dissipation plate

Abstract

The utility model discloses a rigidly-connected regulator heat dissipation plate, which belongs to the technical field of automobile regulators and comprises a support, an IC (integrated circuit) and a heat dissipation plate, the IC is mounted in the support, the heat dissipation plate is mounted on the support, the IC is positioned below the heat dissipation plate, bolts are mounted in the support, the IC and the heat dissipation plate, and the heat dissipation plate is mounted on the support. According to the utility model, the IC and the heat dissipation plate are connected with the bracket through the bolts, and the bolts are rigidly connected with the anti-rotation nuts in the bracket through the threads, so that the connection strength of the heat dissipation plate and the bracket is enhanced by using a rigid connection mode on the premise of ensuring that the heat dissipation function of a product is not influenced; in this way, the risk of product failure caused by insufficient colloid strength in a traditional mode is reduced, the product production efficiency is improved, meanwhile, the product quality is improved, the arranged anti-rotation nut is used for bearing the bolt, and after injection molding is conducted through the external tooth structure, the anti-rotation nut is prevented from rotating in a plastic piece, and the anti-rotation nut is prevented from rotating when the bolt is screwed down.

Description

Technical Field

[0001] The utility model relates to the technical field of automotive regulators, and particularly relates to a regulator heat dissipation plate with a rigid connection. Background Art

[0002] A regulator heat dissipation plate is a device for dissipating heat from heat-generating electronic components. For the circuit module of an automotive regulator, its main heat dissipation method is through the heat dissipation plate, and the design and connection method of the heat dissipation plate will directly affect the service life of the product. In the existing regulator, a layer of thermal conductive silicone is applied to the contact surface between the electronic component and the heat dissipation plate to make the heat generated by the component more effectively conducted to the heat dissipation plate, and then the heat is dissipated through the heat dissipation plate. The heat dissipation plate is connected to the bracket using sealant silicone.

[0003] However, there are still certain defects in the existing regulator heat dissipation plate. The current connection method between the heat dissipation plate and the sealant silicone requires additional production time for the sealant silicone to cure, thus increasing the production and manufacturing time. Moreover, because it is a colloidal connection, during use such as vibration, the heat dissipation plate may fall off due to insufficient tensile strength of the adhesive material, resulting in product failure. In addition, due to the thermal expansion and contraction of the colloid caused by the cold and heat changes in the environment, there is also a risk of the heat dissipation plate falling off and the product failing due to insufficient colloid strength. Therefore, the adhesive connection method is unreliable. For this reason, a regulator heat dissipation plate with a rigid connection is proposed. Summary of the Invention

[0004] The purpose of the utility model is to provide a regulator heat dissipation plate with a rigid connection to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A regulator heat dissipation plate with a rigid connection, comprising a bracket, an IC, and a heat dissipation plate. The IC is installed inside the bracket, the heat dissipation plate is installed on the bracket, the IC is located below the heat dissipation plate, and bolts are installed inside the bracket, the IC, and the heat dissipation plate.

[0006] As a further preferred technical solution: Installation holes are provided at the bottom of the bracket, and anti-rotation nuts are installed inside the installation holes;

[0007] Among them, internal threads for receiving bolts are provided inside the anti-rotation nuts, and two rows of teeth are symmetrically provided on the anti-rotation nuts. The anti-rotation nuts are used for anti-rotation work inside the plastic parts through the tooth components after injection molding.

[0008] As a further preferred technical solution: A limit boss is provided on one side of the bracket and behind the anti-rotation nut. The height of the limit boss is lower than the height of the IC, and the movement of the IC in the length direction is restricted by the limit boss.

[0009] As a further preference of the present technical solution: a support table surface is provided on the side of the bracket away from the limit boss, and the support table surface is arranged in a "C" shape. The heat dissipation plate is carried by the support table surface, and by setting the support table surface in a "C" shape, the stability of carrying the heat dissipation plate is improved.

[0010] As a further preference of the present technical solution: two anti-rotation bosses are symmetrically arranged inside the bracket. One side of each of the two anti-rotation bosses is in contact with the support table surface, and the heights of the two anti-rotation bosses are lower than the height of the support table surface. The two anti-rotation bosses are used to limit the width direction of the IC.

[0011] As a further preference of the present technical solution: a first receiving hole and a second receiving hole are respectively formed on the IC and the heat dissipation plate, and both the formed first receiving hole and the second receiving hole are used to receive bolts;

[0012] Wherein, the bolt sequentially passes through the second receiving hole and the first receiving hole.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. In the present utility model, the IC and the heat dissipation plate are connected to the bracket by bolts. Among them, the bolt and the anti-rotation nut inside the bracket are rigidly connected by threads. Thus, on the premise of ensuring that the heat dissipation function of the product is not affected, a rigid connection method is used to strengthen the connection strength between the heat dissipation plate and the bracket, thereby reducing the risk of product failure caused by insufficient colloid strength in the traditional method, and improving the product quality while improving the production efficiency of the product;

[0015] 2. In the present utility model, installation holes are formed at the bottom of the bracket, and the anti-rotation nut is injection-molded inside the bracket by injection molding. The anti-rotation nut is provided with internal threads for receiving bolts, and there is a tooth structure on its outer part for anti-rotation of the anti-rotation nut in the plastic part after injection molding, thereby preventing the anti-rotation nut from rotating when the bolt is tightened, and thus realizing rigid connection;

[0016] 3. In the present utility model, the heat dissipation plate is carried by the support table surface, and by setting the support table surface in a "C" shape, the stability of carrying the heat dissipation plate is improved. And the two anti-rotation bosses are used to limit the width direction of the IC, thereby preventing the left and right rotation of the IC, and thus improving the welding efficiency and welding quality of the IC;

[0017] 4. In the present utility model, the movement of the IC in the length direction is restricted by the provided limit boss, so as to ensure that the first receiving hole on the IC is vertically aligned with the anti-rotation nut inside the bracket, thereby ensuring the rigid connection between the IC and the bracket through the bolt. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of a regulator heat dissipation plate with a rigid connection of the present utility model;

[0019] Figure 2 Explosion structure schematic diagram of a heat dissipation plate of a regulator with a rigid connection according to the present utility model;

[0020] Figure 3 First structure schematic diagram of a bracket in a heat dissipation plate of a regulator with a rigid connection according to the present utility model;

[0021] Figure 4 Explosion structure schematic diagram of a bracket in a heat dissipation plate of a regulator with a rigid connection according to the present utility model;

[0022] Figure 5 Second structure schematic diagram of a bracket in a heat dissipation plate of a regulator with a rigid connection according to the present utility model.

[0023] In the figure: 1. Bracket; 11. Mounting hole; 12. Anti-rotation nut; 13. Limiting boss; 14. Support table surface; 15. Anti-rotation boss; 2. IC; 21. First receiving hole; 3. Heat dissipation plate; 31. Second receiving hole; 4. Bolt. Specific implementation mode

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model.

[0025] Embodiment 1

[0026] Please refer to Figures 1-5 , the present utility model provides a technical solution: a heat dissipation plate of a regulator with a rigid connection, including a bracket 1, an IC 2 and a heat dissipation plate 3. The IC 2 is installed in the bracket 1, the heat dissipation plate 3 is installed on the bracket 1, the IC 2 is located below the heat dissipation plate 3, and a bolt 4 is installed in the bracket 1, the IC 2 and the heat dissipation plate 3.

[0027] In this embodiment, specifically: the IC 2 and the heat dissipation plate 3 are connected to the bracket 1 through the bolt 4, and the bolt 4 is rigidly connected to the anti-rotation nut 12 in the bracket 1 by means of threads.

[0028] In this embodiment, specifically: a mounting hole 11 is opened at the bottom of the bracket 1, and the anti-rotation nut 12 is installed in the mounting hole 11, and the anti-rotation nut 12 is injection-molded into the bracket 1 by injection molding;

[0029] Among them, the anti-rotation nut 12 is provided with an internal thread for receiving the bolt 4, and two rows of teeth are symmetrically provided on the anti-rotation nut 12. The tooth member is used to prevent the anti-rotation nut 12 from rotating in the plastic part after injection molding, so as to prevent the anti-rotation nut 12 from rotating when the bolt 4 is tightened, thereby realizing a rigid connection.

[0030] In this embodiment, specifically: a limiting boss 13 is provided on one side of the bracket 1 and behind the anti-rotation nut 12. The height of the limiting boss 13 is lower than the height of the IC 2. The provided limiting boss 13 is used to limit the movement of the IC 2 in the length direction, so as to ensure that the first receiving hole 21 on the IC 2 is vertically aligned with the anti-rotation nut 12 in the bracket 1, thereby ensuring the rigid connection between the IC 2 and the bracket 1 through the bolt 4.

[0031] In this embodiment, specifically: a supporting table surface 14 is provided on the side of the bracket 1 away from the limiting boss 13, and the supporting table surface 14 is arranged in a "C" shape. The provided supporting table surface 14 is used to carry the heat dissipation plate 3, and by setting the supporting table surface 14 in a "C" shape, the stability of carrying the heat dissipation plate 3 is improved.

[0032] In this embodiment, specifically: two anti-rotation bosses 15 are symmetrically arranged in the bracket 1. One side of each of the two anti-rotation bosses 15 is in contact with the supporting table surface 14, and the height of the two anti-rotation bosses 15 is lower than the height of the supporting table surface 14. The provided two anti-rotation bosses 15 are used to limit the width direction of the IC 2, thereby preventing the IC 2 from rotating left and right, and thus improving the welding efficiency and welding quality of the IC 2.

[0033] In this embodiment, specifically: a first receiving hole 21 and a second receiving hole 31 are respectively formed in the IC 2 and the heat dissipation plate 3. The formed first receiving hole 21 and second receiving hole 31 are both used to receive the bolt 4;

[0034] Among them, the bolt 4 sequentially passes through the second receiving hole 31 and the first receiving hole 21.

[0035] Embodiment 2

[0036] Please refer to Figures 3-5 : An installation hole 11 is formed at the bottom of the bracket 1, and an anti-rotation nut 12 is installed in the installation hole 11. The anti-rotation nut 12 is injection-molded into the bracket 1 by injection molding;

[0037] Among them, an internal thread for receiving the bolt 4 is provided in the anti-rotation nut 12, and two rows of teeth are symmetrically provided on the anti-rotation nut 12. The provided tooth member is used to prevent the anti-rotation nut 12 from rotating in the plastic part after injection molding, so as to prevent the anti-rotation nut 12 from rotating when the bolt 4 is tightened, thereby realizing a rigid connection.

[0038] In this embodiment, specifically: a limiting boss 13 is provided on one side of the bracket 1 and behind the anti-rotation nut 12. The height of the limiting boss 13 is lower than the height of the IC 2. The provided limiting boss 13 is used to limit the movement of the IC 2 in the length direction, so as to ensure that the first receiving hole 21 on the IC 2 is vertically aligned with the anti-rotation nut 12 in the bracket 1, thereby ensuring the rigid connection between the IC 2 and the bracket 1 through the bolt 4.

[0039] In this embodiment, specifically: on the side of the bracket 1 away from the limiting boss 13, there is a supporting table surface 14, and the supporting table surface 14 is arranged in a "C" shape. The provided supporting table surface 14 is used to carry the heat dissipation plate 3, and by setting the supporting table surface 14 in a "C" shape, the stability of carrying the heat dissipation plate 3 is improved.

[0040] In this embodiment, specifically: two anti-rotation bosses 15 are symmetrically arranged inside the bracket 1. One side of each of the two anti-rotation bosses 15 is in contact with the supporting table surface 14, and the heights of the two anti-rotation bosses 15 are lower than the height of the supporting table surface 14. The provided two anti-rotation bosses 15 are used to limit the width direction of the IC 2, thereby preventing the left-right rotation of the IC 2, and thus improving the welding efficiency and welding quality of the IC 2.

[0041] Working principle: During use, the IC 2 and the heat dissipation plate 3 are connected to the bracket 1 through bolts 4. Among them, the bolts 4 are rigidly connected to the anti-rotation nuts 12 inside the bracket 1 by threads, and the anti-rotation nuts 12 are injection-molded inside the bracket 1. After injection molding, the provided tooth-like members can effectively prevent the anti-rotation nuts 12 from rotating inside the plastic parts, thereby preventing the anti-rotation nuts 12 from rotating when the bolts 4 are tightened, and thus achieving a rigid connection.

[0042] At this time, the provided limiting boss 13 is used to limit the movement of the IC 2 in the length direction, so as to ensure that the first receiving hole 21 on the IC 2 is vertically aligned with the anti-rotation nut 12 inside the bracket 1, thereby ensuring the rigid connection between the IC 2 and the bracket 1 through the bolts 4. And the supporting table surface 14 is used to carry the heat dissipation plate 3. Since the supporting table surface 14 is set in a "C" shape, the stability of carrying the heat dissipation plate 3 is improved. At the same time, the provided two anti-rotation bosses 15 are used to limit the width direction of the IC 2, thereby preventing the left-right rotation of the IC 2, and thus improving the welding efficiency and welding quality of the IC 2.

[0043] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A rigidly connected regulator heat sink, comprising a bracket (1), an IC (2) and a heat sink (3), characterized in that: The IC (2) is installed in the bracket (1), the heat sink (3) is installed on the bracket (1), the IC (2) is located below the heat sink (3), and bolts (4) are installed in the bracket (1), the IC (2) and the heat sink (3).

2. A rigidly connected regulator heat sink according to claim 1, characterized in that: The bottom of the bracket (1) is provided with a mounting hole (11), and an anti-rotation nut (12) is installed in the mounting hole (11); The anti-rotation nut (12) is provided with an internal thread for receiving the bolt (4), and the anti-rotation nut (12) is symmetrically provided with two rows of teeth.

3. A rigidly connected regulator heat sink according to claim 2, characterized in that: A limiting boss (13) is provided on one side of the bracket (1) and behind the anti-rotation nut (12); the height of the limiting boss (13) is lower than the height of the IC (2).

4. A rigidly connected regulator heat sink according to claim 3, characterized in that: A support table (14) is provided on the side of the bracket (1) away from the limiting boss (13), and the support table (14) is arranged in a "C" shape.

5. A rigidly connected regulator heat sink according to claim 4, characterized in that: Two anti-rotation bosses (15) are symmetrically arranged in the bracket (1), one side of the two anti-rotation bosses (15) is in contact with the support table (14), and the height of the two anti-rotation bosses (15) is lower than the height of the support table (14).

6. The rigidly connected regulator heat sink according to claim 1, characterized in that: The IC (2) and the heat sink (3) are respectively provided with a first receiving hole (21) and a second receiving hole (31); Wherein, the bolt (4) passes through the second receiving hole (31) and the first receiving hole (21) in sequence.

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