Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a heat dissipation body used for containing heat exchange media and a heat dissipation structure arranged on the outer surface of the heat dissipation body, the outer surface of the heat dissipation body comprises a heat dissipation face and a heat conduction face used for being in contact with a heat source, and the heat dissipation structure comprises a heat dissipation layer at least partially arranged on the heat dissipation face. The heat dissipation layer has pores for increasing the surface area of the heat dissipation layer. After heat generated when a heat source works is transmitted to the heat conduction face of the heat dissipation body, the heat can be transmitted to the heat exchange medium in the heat dissipation body and can also be transmitted to the heat dissipation layer on the outer side of the heat dissipation body, the outer surface of the heat dissipation body is utilized, heat dissipation is assisted through the heat dissipation layer, the heat dissipation area of the heat dissipation device is increased, and the service life of the heat dissipation device is prolonged. In addition, the heat dissipation layer is further provided with holes, the holes can increase the surface area of the heat dissipation layer, the heat dissipation capacity of the heat dissipation layer is further improved, more heat is taken away in unit time, and it is guaranteed that a heat source can work continuously, stably and normally.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device. Background Art

[0002] With the continuous development of artificial intelligence, a large amount of heat will be generated during the operation of IT equipment. In order to ensure the continuous and stable operation of the data center, an efficient heat dissipation solution is needed to transfer the heat. Among them, immersion heat dissipation solutions are being used by more and more devices.

[0003] Existing immersion cooling usually involves immersing the heat-generating electronic components in whole or in part in a chassis filled with a non-conductive fluid medium. The heat from the heat source can be transferred to the radiator, which contacts the circulating coolant inside it and indirectly takes away the heat from the heat source, thereby achieving a continuous heat dissipation effect.

[0004] In the process of implementing this solution, the inventors found that there are at least the following problems in the prior art:

[0005] The heat dissipation performance of existing immersion liquid cooling radiators is usually fixed. As the heat dissipation power increases, the required volume will also increase accordingly, while the space volume of the chassis is limited. Therefore, how to continuously optimize the radiator performance in a fixed space volume to meet the heat dissipation of the increasingly powerful heat source has become an urgent problem to be solved in this field. Utility Model Content

[0006] In view of this, the utility model provides a heat dissipation device to improve the above problem.

[0007] A heat dissipation device provided in the present application includes a heat dissipation body that can be used to accommodate a heat exchange medium and a heat dissipation structure arranged on the outer surface of the heat dissipation body, the heat dissipation body includes a heat dissipation surface and a heat conductive surface that can be used to contact a heat source, the heat dissipation structure includes a heat dissipation layer that is at least partially arranged on the heat dissipation surface, and the heat dissipation layer has pores for increasing the surface area of ​​the heat dissipation layer.

[0008] In some embodiments, the heat dissipation body is provided with the heat dissipation layer on one side of the heat conductive surface, and the heat dissipation layer is provided with an escape opening corresponding to the heat conductive surface.

[0009] In some embodiments, the heat dissipation body is provided with a heat conducting portion protruding therefrom, the heat conducting portion corresponds to the avoidance opening, and the heat conducting surface is located on a side of the heat conducting portion away from the heat dissipation body.

[0010] In some embodiments, a cavity for accommodating the heat exchange medium is provided inside the heat dissipation body, and the inner wall of the heat dissipation body is recessed to form a concave portion, and the concave portion corresponds to the heat conduction portion.

[0011] In some embodiments, the heat dissipation body includes a base plate and an upper cover disposed on the base plate, the base plate and the upper cover are sealed and enclosed to form a cavity for accommodating the heat exchange medium, and the heat conductive surface is located on a side of the base plate away from the upper cover.

[0012] In some embodiments, the heat dissipation layer includes a first heat dissipation portion provided on the outer surface of the bottom plate and a second heat dissipation portion provided on the outer surface of the upper cover, and a relief opening is provided at a position of the first heat dissipation portion corresponding to the heat conducting surface.

[0013] In some embodiments, the first heat dissipation part and the second heat dissipation part are respectively one of the following: a sintered layer or a sintered mesh formed by sintering powder, a heat dissipation fin layer formed by pin fins or fins, and a foamed layer formed by a foam metal material;

[0014] The first heat dissipation portion and the second heat dissipation portion are the same as or different from each other.

[0015] In some embodiments, the heat dissipation layer includes a sintered layer or a sintered mesh formed by sintering powder.

[0016] In some embodiments, the heat dissipation layer includes a heat dissipation fin layer formed of pin fins or fins.

[0017] In some embodiments, the heat dissipation layer includes a foamed layer formed of a foamed metal material.

[0018] Compared with the prior art, the heat dissipation device provided by the utility model has at least the following beneficial effects:

[0019] By arranging a heat dissipation layer on the outside of the heat dissipation body, after the heat generated by the heat source when working is transferred to the heat-conducting surface of the heat dissipation body, the heat can not only be transferred to the heat exchange medium inside the heat dissipation body, but also be transferred to the heat dissipation layer outside the heat dissipation body, so that the outer surface of the heat dissipation body is also utilized, and the heat dissipation layer is used to assist in heat dissipation, thereby increasing the heat dissipation area of ​​the heat dissipation device, thereby improving the overall heat dissipation performance of the heat dissipation device, and the heat dissipation layer also has pores, which can increase the surface area of ​​the heat dissipation layer, and can further improve the heat dissipation capacity of the heat dissipation layer, thereby taking away more heat per unit time, and ensuring that the heat source can continue to work stably and normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 An exploded schematic diagram of a heat dissipation device provided in a first embodiment of the utility model;

[0021] Figure 2 for Figure 1 A side view of the heat sink shown in FIG. 1 when assembled together;

[0022] Figure 3An exploded schematic diagram of a heat dissipation device provided in a second embodiment of the utility model;

[0023] Figure 4 An exploded schematic diagram of a heat dissipation device provided in a third embodiment of the present utility model;

[0024] Figure 5 An exploded schematic diagram of a heat dissipation device provided in a fourth embodiment of the present utility model;

[0025] Figure 6 This is an exploded schematic diagram of a heat dissipation device provided in the fifth embodiment of the present utility model.

[0026] In the figure: 10, heat dissipation device; 12, heat dissipation body; 14, heat dissipation surface; 16, heat conduction surface; 18, heat dissipation layer; 20, avoidance; 22, heat conduction part; 24, cavity; 26, recessed part; 28, bottom plate; 30, upper cover; 32, sealing member; 34, first heat dissipation part; 36, second heat dissipation part. DETAILED DESCRIPTION

[0027] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0028] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, top, bottom...) are only used to explain the relative position relationship between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, the element may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0030] See also Figures 1 to 6A heat dissipation device 10 provided in one embodiment of the utility model includes a heat dissipation body 12 and a heat dissipation structure. The heat dissipation body 12 can contain a heat exchange medium inside. The heat dissipation structure is located on the outer surface of the heat dissipation body 12, and the heat on the heat dissipation body 12 can be transferred to the heat dissipation structure. The outer surface of the heat dissipation body 12 includes a heat dissipation surface 14 and a heat conductive surface 16. The heat conductive surface 16 is used to contact a heat source (such as a server of IT equipment). The heat dissipation structure includes a heat dissipation layer 18 at least partially disposed on the heat dissipation surface 14. The heat generated by the heat source during operation can be transferred to the heat conductive surface 16 of the heat dissipation body 12. A part of the heat on the heat conductive surface 16 can be transferred to the heat exchange medium inside the heat dissipation body 12, and a part of the heat can be transferred to the heat dissipation surface 14 and finally transferred to the heat dissipation layer 18. At the same time, the inside and the outer surface of the heat dissipation body 12 are utilized, and the heat exchange medium and the heat dissipation layer 18 are used to dissipate heat together, thereby increasing the heat dissipation area of ​​the heat dissipation device 10, thereby improving the overall heat dissipation performance of the heat dissipation device 10, so as to take away more heat per unit time, reduce the influence of heat on the operation of the heat source, and ensure that the heat source can continue to work stably and normally.

[0031] The specific application scenario of the heat sink 10 is not limited. In the present application, the heat sink 10 is an immersed heat sink, i.e., a VC (Vapor Chamber) temperature equalizing plate, and the heat exchange medium inside it can transfer heat through a phase change reaction. During use, the heat source and the heat sink 10 are both immersed in the coolant of the chassis. Therefore, part of the heat generated by the heat source when working can be directly transferred to the coolant, and the other part is transferred to the heat sink 10. While the heat exchange medium inside the heat sink body 12 continues to work, the heat dissipation layer 18 outside the heat sink body 12 is also in contact with the coolant and continues to dissipate heat. The outer surface of the heat sink body 12 is also utilized in the limited space of the chassis to enhance the cooling effect on the heat source and ensure that the heat source can work normally and stably.

[0032] It can be understood that the heat dissipation surface 14 and the heat conductive surface 16 of the heat dissipation body 12 can be different outer surfaces of the heat dissipation body 12, or different parts of the same outer surface of the heat dissipation body 12, and the heat dissipation surface 14 can be all outer surfaces of the heat dissipation body 12 except the heat conductive surface 16, or the outer surface of one side or several sides of the heat dissipation body 12.

[0033] The heat dissipation layer 18 has pores, which can increase the surface area of ​​the heat dissipation layer 18 , thereby increasing the contact area between the heat dissipation layer 18 and the coolant, so as to improve the heat dissipation effect of the heat dissipation layer 18 .

[0034] It can be understood that pores may refer to gaps, cracks, etc. visible to the naked eye, or may refer to pores that are invisible to the naked eye, such as pores between material particles.

[0035] In one embodiment, a heat dissipation layer 18 is provided on one side of a heat conductive surface 16 of a heat dissipation body 12, and a relief opening 20 is provided on the heat dissipation layer 18 corresponding to the heat conductive surface 16. The relief opening 20 can expose the heat conductive surface 16 to facilitate direct contact between the heat source and the heat conductive surface 16, thereby improving the heat exchange efficiency between the heat source and the heat dissipation body 12.

[0036] A heat conducting portion 22 is protruded from the outer side of the heat dissipation body 12, and the heat conducting portion 22 corresponds to the avoidance opening 20, that is, the heat conducting portion 22 is inserted into or passes through the avoidance opening 20, and the heat conducting surface 16 is located on the side of the heat conducting portion 22 away from the heat dissipation body 12. By providing the heat conducting portion 22 protruding from the outer surface of the heat dissipation body 12 on the outer side of the heat dissipation body 12, it is convenient for the heat source to fit in contact with the heat conducting surface 16. After the heat source transfers the heat to the heat conducting portion 22, the heat conducting portion 22 transfers the heat to the heat exchange medium in the heat dissipation body 12 and the heat dissipation layer 18 on the outer side of the heat dissipation body 12.

[0037] The heat conducting portion 22 is located in the middle of one side of the heat dissipation body 12 , so that when the heat on the heat conducting portion 22 is transferred to the heat dissipation body 12 , the heat distribution is more uniform.

[0038] The specific connection method between the heat conducting part 22 and the heat dissipation body 12 is not limited, for example, it can be fixed by thermal conductive silicone grease, or it can be fixed by welding or integral molding. In this embodiment, the heat conducting part 22 and the heat dissipation body 12 are integrally formed, which can not only save the assembly process, but also avoid the problem of gaps between the heat conducting part 22 and the heat dissipation body 12 due to assembly, which affects the heat conduction effect.

[0039] It can be understood that the heat conducting portion 22 can be located inside the avoidance opening 20, that is, the heat conducting portion 22 does not extend outside the avoidance opening 20, or the heat conducting portion 22 can extend outside the avoidance opening 20 in a direction away from the heat dissipation body 12. In this embodiment, the heat conducting portion 22 extends outside the avoidance opening 20, so that the heat conducting surface 16 is located outside the avoidance opening 20, preventing the heat dissipation layer 18 from affecting the contact between the heat source and the heat conducting surface 16.

[0040] A cavity 24 is provided inside the heat dissipation body 12, and the cavity 24 is used to accommodate a heat exchange medium. The inner wall of the heat dissipation body 12, that is, the side wall close to the cavity 24, is recessed to form a recessed portion 26, and the recessed portion 26 corresponds to the heat conducting portion 22. The recessed portion 26 extends toward the heat conducting surface 16, and a portion of the recessed portion 26 is located on the inner side of the heat conducting portion 22. The recessed portion 26 is connected to the cavity 24, so the heat exchange medium in the cavity 24 can flow into the recessed portion 26, which can shorten the distance between the heat exchange medium and the heat conducting surface 16, that is, shorten the distance between the heat source and the heat exchange medium, thereby shortening the heat transfer path between the heat source and the heat exchange medium, so that the heat of the heat source can be transferred to the heat exchange medium more quickly, so as to reduce the temperature of the heat source more quickly.

[0041] In one embodiment, the heat dissipation body 12 includes a base plate 28 and an upper cover 30. The upper cover 30 is covered on the base plate 28 and sealed with the base plate 28. The base plate 28 and the upper cover 30 enclose a cavity 24 for accommodating a heat exchange medium. The heat conducting surface 16 is located on a side of the base plate 28 away from the upper cover 30, that is, the heat conducting portion 22 extends from the base plate 28 in a direction away from the upper cover 30.

[0042] Specifically, the heat dissipation body 12 is provided with a liquid injection port, which is connected to the cavity 24 for injecting heat exchange medium into the cavity 24. The heat dissipation device 10 is provided with a seal 32 at the liquid injection port, which is used to seal the liquid injection port to prevent the heat exchange medium in the cavity 24 from leaking.

[0043] The heat dissipation surface 14 is located on the outer surface of the bottom plate 28 and / or the upper cover 30, and the heat dissipation layer 18 is provided on the outer surface of the bottom plate 28 and / or the upper cover 30. Specifically, in the present embodiment, the outer surfaces of the bottom plate 28 and the upper cover 30 both include the heat dissipation surface 14, and the heat dissipation layer 18 includes a first heat dissipation portion 34 and a second heat dissipation portion 36 respectively provided on the outer surfaces of the bottom plate 28 and the upper cover 30, that is, the first heat dissipation portion 34 is provided on the side of the bottom plate 28 away from the upper cover 30, and the second heat dissipation portion 36 is provided on the side of the upper cover 30 away from the bottom plate 28, and the first heat dissipation portion 34 is provided with an avoidance opening 20 at a position corresponding to the heat conducting surface 16. By respectively providing the first heat dissipation portion 34 and the second heat dissipation portion 36 on the bottom plate 28 and the upper cover 30 of the heat dissipation body 12, the first heat dissipation portion 34 and the second heat dissipation portion 36 can both contact with the coolant to assist in heat dissipation, and the heat dissipation area of ​​the heat dissipation device 10 can be further increased to improve its heat dissipation performance.

[0044] The specific structures of the first heat dissipation part 34 and the second heat dissipation part 36 are not limited. In the present application, the first heat dissipation part 34 and the second heat dissipation part 36 are respectively selected from one of the following: a sintered layer or a sintered mesh formed by sintering powder, a heat dissipation fin layer formed by pin fins or fins, and a foamed layer formed by a foam metal material. The first heat dissipation part 34 and the second heat dissipation part 36 can be the same or different.

[0045] like Figure 1 As shown, in the first embodiment, the sintered layer includes a sintered mesh formed by sintering powder, that is, a mesh structure fixed on the surface of the heat dissipation body 12 after sintering the powder, and the meshes of the mesh structure constitute the pores of the heat dissipation layer 18. Specifically, the first heat dissipation portion 34 and the second heat dissipation portion 36 are both sintered meshes.

[0046] There are no restrictions on the type (ie, material of the powder), shape (ie, shape of the mesh), and number of layers of the sintered mesh.

[0047] like Figure 3As shown, in the second embodiment, the heat dissipation layer 18 includes a sintered layer formed by sintering powder, that is, a layered structure formed by sintering the powder and fixed on the surface of the heat dissipation body 12, and the gaps between the powders constitute the pores of the heat dissipation layer 18. Specifically, the first heat dissipation portion 34 and the second heat dissipation portion 36 are both sintered layers.

[0048] There are no restrictions on the type of the sintered layer (ie, the material of the powder), mesh size (ie, the particle size of the powder), thickness, and other parameters.

[0049] like Figure 4 As shown, in the third embodiment, the heat dissipation layer 18 includes a heat dissipation fin layer formed by pin fins, that is, the heat dissipation layer 18 is composed of pin fins, the number of pin fins is multiple, the multiple pin fins are spaced apart from each other, and the gaps between different pin fins constitute the pores of the heat dissipation layer 18. Specifically, the first heat dissipation portion 34 and the second heat dissipation portion 36 are both composed of pin fins.

[0050] The specific shape of the pin fins is not limited, for example, cylindrical pin fins, quadrilateral pin fins, other polygonal pin fins, special-shaped pin fins, etc.

[0051] like Figure 5 As shown, in the fourth embodiment, the heat dissipation layer 18 includes a heat dissipation fin layer formed by fins, that is, the heat dissipation layer 18 is composed of fins, the number of fins is multiple, and the gaps between different fins constitute the pores of the heat dissipation layer 18. Specifically, the first heat dissipation portion 34 and the second heat dissipation portion 36 are both composed of fins.

[0052] The specific type of fins is not limited, such as folded fins, wave fins, offset fins, window fins, etc.

[0053] like Figure 6 As shown, in the fifth embodiment, the heat dissipation layer 18 includes a foamed layer formed of a foamed metal material, that is, the heat dissipation layer 18 is a layered structure composed of foamed metal, and the pores in the foamed metal constitute the pores of the heat dissipation layer 18. Specifically, the first heat dissipation portion 34 and the second heat dissipation portion 36 are both foamed layers.

[0054] The specific material of the foam metal is not limited, such as foam copper, foam aluminum, foam nickel, etc.

[0055] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A heat dissipation device, characterized in that: It includes a heat dissipation body that can be used to accommodate a heat exchange medium and a heat dissipation structure arranged on the outer surface of the heat dissipation body. The outer surface of the heat dissipation body includes a heat dissipation surface and a heat conductive surface that can be used to contact a heat source. The heat dissipation structure includes a heat dissipation layer that is at least partially arranged on the heat dissipation surface. The heat dissipation layer has pores for increasing the surface area of ​​the heat dissipation layer.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation body is provided with the heat dissipation layer on one side of the heat conduction surface, and the heat dissipation layer is provided with an escape opening corresponding to the heat conduction surface.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation body is convexly provided with a heat conduction portion, the heat conduction portion corresponds to the avoidance opening, and the heat conduction surface is located at a side of the heat conduction portion away from the heat dissipation body.

4. The heat dissipation device according to claim 3, characterized in that: A cavity for accommodating the heat exchange medium is provided inside the heat dissipation body, and the inner wall of the heat dissipation body is recessed to form a concave portion, and the concave portion corresponds to the heat conduction portion.

5. The heat dissipation device according to claim 1, characterized in that: The heat dissipation body includes a bottom plate and an upper cover arranged on the bottom plate, the bottom plate and the upper cover are sealed and cooperated to enclose and form a cavity for accommodating the heat exchange medium, and the heat conduction surface is located on a side of the bottom plate away from the upper cover.

6. The heat dissipation device according to claim 5, characterized in that: The heat dissipation layer includes a first heat dissipation portion arranged on the outer surface of the bottom plate and a second heat dissipation portion arranged on the outer surface of the upper cover, and a relief opening is arranged at a position of the first heat dissipation portion corresponding to the heat conducting surface.

7. The heat dissipation device according to claim 6, characterized in that: The first heat dissipation part and the second heat dissipation part are respectively one of the following: a sintered layer or a sintered mesh formed by sintering powder, a heat dissipation fin layer formed by pin fins or fins, and a foamed layer formed by a foam metal material; The first heat dissipation portion and the second heat dissipation portion are the same as or different from each other.

8. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation layer includes a sintered layer or a sintered mesh formed by sintering sintered powder.

9. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation layer includes a heat dissipation fin layer formed of pin fins or fins.

10. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation layer includes a foaming layer formed of a foam metal material.

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