Wafer stabbing common guide rail rigid-flexible composite motion stabbing equipment

Abstract

The utility model relates to the technical field of chip transfer equipment, and discloses wafer stabbing common guide rail rigid-flexible composite motion wafer stabbing equipment, which comprises a portal frame, and a guide rail assembly, a wafer mechanism and a wafer stabbing head assembly which are horizontally arranged on the portal frame, wherein the stabbing crystal head assembly comprises a stabbing crystal base, a first voice coil motor, a symmetrical flexible hinge, a first-stage flexible platform, a second voice coil motor, a unilateral / symmetrical flexible hinge and a second-stage flexible platform; the wafer rotating table mechanism comprises a Y-axis base table and a wafer assembly installed at the bottom of the Y-axis base table in a sliding mode, and the wafer assembly comprises a wafer base and a rotating table. The problems of low wafer positioning efficiency of a rigid platform and bending deformation caused by superposition of a flexible two-dimensional platform and a rotating platform with overlarge inertia during huge transfer of Mini / Micro LEDs are solved, a rigid-flexible composite motion technology is adopted, the wafer stabbing efficiency is remarkably improved, meanwhile, the whole equipment is easy to install, the guide rail assembly is reduced, the cost is low, and green manufacturing is achieved.

Description

Technical Field

[0001] This utility model relates to the technical field of chip transfer equipment, specifically a wafer die-bonding co-guide rigid-flexible compound motion die-bonding equipment. Background Technique

[0002] Operations such as Mini / Micro LED chip transfer require the motion platform to start and stop frequently, providing a time window of several milliseconds to achieve array operations. Although the stroke is short, the motion platform cannot reach a high speed due to frequent starts and stops, resulting in low efficiency and high energy consumption.

[0003] Taking Mini LED transfer as an example, hundreds of chips need to be transferred per second, but the motion platform starts and stops repeatedly, and the positioning can only be within twenty times per second, resulting in low efficiency. Secondly, the motion platform accelerates and decelerates frequently, requiring a large-thrust motor, so it is heavy and costly. Finally, the braking force during deceleration of the motion platform dissipates kinetic energy, resulting in a large amount of energy loss, which is not conducive to realizing green manufacturing.

[0004] In the prior art, a chip mass transfer method and a chip mass transfer device with the Chinese patent publication number of CN113937039B provide a rigid-flexible compound motion double-gantry die-bonding scheme, which is suitable for large panel manufacturing and the equipment cost is relatively high. In addition, although the single-sided drive flexible hinge two-dimensional platform can achieve a large range of high-speed displacement response, it cannot adjust the rotation posture of the wafer. Finally, the single-sided drive flexible hinge die-bonding platform proposed in the prior art has displacement coupling. When the die-bonding frequency is as high as 100Hz and the entire cycle is only 10ms, the displacement coupling compensation brings difficulties to speed regulation and die-bonding motion control.

[0005] Most of the existing Mini LEDs use swing-arm die-bonding equipment, and the panel size that can be transferred is only a few inches. The direct-view panels are all made of small panels spliced together. There are die-bonding equipment on the market that use a fixed gantry. The die-bonding motion platform is installed on the side of the gantry crossbeam, and the wafer motion platform is installed at the bottom of the crossbeam. It is necessary to ensure the horizontal and verticality of the die-bonding and wafer platforms, which is difficult to install.

[0006] Based on this, this utility model designs a wafer die-bonding co-guide rigid-flexible compound motion die-bonding equipment to solve the above problems. Content of the Utility Model

[0007] The purpose of this utility model is to provide a wafer die-bonding co-guide rigid-flexible compound motion die-bonding equipment to solve the problems of difficult installation, high cost, displacement coupling, and low chip transfer efficiency mentioned in the above background technique.

[0008] To achieve the above purpose, this utility model provides the following technical solutions:

[0009] The wafer die-bonding co-guide rigid-flexible compound motion die-bonding equipment proposed by this utility model includes a gantry, a guide rail assembly horizontally arranged on the gantry, a wafer rotating table mechanism, a Z-axis base vertically arranged, and a die-bonding head assembly;

[0010] The die-bonding head assembly and the wafer rotating table mechanism move along the length direction of the guide rail assembly to adjust the X-axis direction positions of the die-bonding head and the wafer;

[0011] A height adjustment mechanism for the die-bonding head assembly is arranged between the Z-axis base and the guide rail assembly to adjust the Z-axis direction position of the die-bonding head;

[0012] A Y-axis linear drive mechanism is arranged between the wafer rotating table mechanism and the guide rail assembly to adjust the Y-axis direction position of the wafer;

[0013] The die-bonding head assembly includes a die-bonding base, a first voice coil motor, a symmetric flexible hinge, a first-stage flexible platform, a second voice coil motor, a unilateral / symmetric flexible hinge, and a second-stage flexible platform. Among them, the first voice coil motor is fixed on one side inside the die-bonding base. The symmetric flexible hinge is located on one side of the first voice coil motor, and the output end of the first voice coil motor is fixedly installed at the middle of one of the flexible hinges of the symmetric flexible hinge. The symmetric flexible hinge is connected to the unilateral / symmetric flexible hinge through the first-stage flexible platform, and the unilateral / symmetric flexible hinge is connected to the second voice coil motor through the second-stage flexible platform. The die-bonding head is installed at the bottom of the second-stage flexible platform to transfer the chips on the wafer to the chip substrate at the bottom of the wafer;

[0014] The wafer rotating table mechanism includes a Y-axis base and a wafer assembly slidably installed at the bottom of the Y-axis base. The wafer assembly includes a wafer base and a rotating table rotatably installed on the top of the wafer base. The wafer is located inside the rotating table. An outer frame and an inner frame are arranged between the inner wall of the rotating table and the wafer, and the outer frame is fixedly connected to the inner wall of the rotating table. Both sides of the outer end face of the inner frame are connected to the outer frame through outer flexible units, and both sides of the inner end face of the inner frame are connected to the wafer through inner flexible units. The outer flexible units and the inner flexible units are arranged in a staggered manner around the wafer;

[0015] The wafer rotating table mechanism further includes a first driving device and a second driving device that are in parallel drive and fixed on the inner wall of the outer frame. The driving end of the first driving device is fixedly connected to the inner frame to drive the wafer to move longitudinally, and the driving end of the second driving device is fixedly connected to the wafer to make it move transversely.

[0016] Optionally, the guide rail assembly includes at least one set of side guide rails, which are horizontally installed on the cross beam at the top of the gantry. Multiple sets of first sliding components and second sliding components are slidably installed on the side guide rails. Among them, the first sliding component is fixedly installed with the Y-axis base below it, driving the wafer rotating table mechanism to move in the X-axis direction, and the second sliding component is fixedly installed with the height adjustment mechanism, driving the Z-axis base and the die bonding head assembly to move synchronously in the X-axis direction.

[0017] Optionally, the guide rail assembly further includes a bottom guide rail, which is parallel to the side guide rails and is arranged on the side of the cross beam away from the side guide rails;

[0018] The bottom of the bottom guide rail is slidably installed with the bottom support plate and the Y-axis base respectively, and the bottom support plate is connected to the height adjustment mechanism to form an overall support structure.

[0019] Optionally, the height adjustment mechanism includes a moving seat and a first servo motor located between the Z-axis base and the guide rail assembly. The moving seat is vertically movably installed with the Z-axis base, and the first servo motor is vertically installed on the moving seat. The output end of the first servo motor drives the Z-axis base and the die bonding head assembly to move synchronously in the Z-axis direction.

[0020] Optionally, the first voice coil motor is a circular voice coil motor with high thrust density, and the second voice coil motor adopts a mountain-shaped voice coil motor that allows the mover to move laterally, and it has a gap in the width direction.

[0021] Optionally, a first grating is arranged in the moving direction of the symmetric flexible hinge. The first grating is fixed on the first-stage flexible platform to measure the moving position of the first-stage flexible platform;

[0022] A second grating is arranged in the moving direction of the single-sided / symmetric flexible hinge. The second grating is fixed on the second-stage flexible platform to measure the moving position of the second-stage flexible platform;

[0023] The first grating is a standard grating scale, and the second grating adopts a grating scale with a grating line width larger than that of the first grating.

[0024] Optionally, both the first driving device and the second driving device adopt voice coil motors or flat motors driven by non-contact electromagnetic force.

[0025] Optionally, one side of the outer flexible unit and the inner flexible unit is a hook-type flexible hinge combination mechanism, and the other side is a sheet-type flexible hinge. The hook-type flexible hinge combination mechanism includes two mutually cooperating L-shaped hook blocks and a sheet-type flexible hinge connected between the two L-shaped hook blocks. One of the L-shaped hook blocks is connected to the inner wall of the outer frame, and the other L-shaped hook block is connected to the outer wall of the inner frame.

[0026] Optionally, both sides of the outer flexible unit and the inner flexible unit are sheet-type flexible hinges.

[0027] Optionally, the wafer rotating table mechanism further includes a second servo motor, the output end of the second servo motor is fixed with a worm, and the worm is rotatably installed on the wafer base;

[0028] The outer ring of the rotating table has a circle of racks, and the worm is adapted to the racks to drive the rotating table to drive the wafer to rotate.

[0029] Compared with the prior art, the beneficial effects of the present utility model are:

[0030] The present utility model adopts a fixed gantry structure, with only one set of guide rails installed on the cross beam, a die bonding platform and a wafer platform installed on the guide rails, the die bonding platform is in the middle, and the wafer platforms are arranged on both sides of the die bonding platform, which is easy to install and has low cost.

[0031] Furthermore, in order to reduce the coupling degree of the die bonding platform, a two-dimensional flexible hinge platform is installed on the die bonding platform, and the die bonding head adopts a bipolar flexible hinge series mechanism. The first-stage flexible hinge adopts a standard circular voice coil motor with high thrust density and a standard grating scale, which improves the utilization efficiency of standard components and reduces the manufacturing cost; the second-stage flexible hinge adopts a decoupled voice coil motor and a wide grating line grating scale to realize the decoupling of drive and feedback, reduce the difficulty of displacement coupling control, and significantly improve the die bonding efficiency, which is increased from dozens of chip transfer speeds per second to hundreds of times.

[0032] Furthermore, a longitudinal movement Y-axis is provided on the wafer platform, and a rotating table with an embedded two-dimensional flexible hinge is erected on the Y-axis, which is convenient for realizing motion superposition, that is, realizing intermittent adjustment of the wafer rotation posture and real-time adjustment of the position deviation.

[0033] At the same time, when applied to a Mini / Micro LED high-speed die bonding device where the wafer urgently needs to adjust the rotation posture and quickly and accurately position, the rotating table is placed on the outer layer, and the above two-dimensional flexible hinge platform is installed inside. The motor with large inertia is installed on the rotating base, which is suitable for infrequent adjustment; the light-weight wafer disk is arranged in the inner and outer double flexible hinge platforms of the wafer to realize high-speed and high-precision positioning.

[0034] The present utility model adopts a rigid-flexible composite motion technology. The rigid motion adopts a uniform speed mode, and the flexible motion adopts a reciprocating motion mode of a flexible hinge. The synthesized speed forms an intermittent motion positioning mode, which avoids the low efficiency and guide rail wear problems caused by short-distance rapid start and stop. And on this basis, it solves the problems of low positioning efficiency of the rigid platform wafer during Mini / Micro LED mass transfer, and the bending deformation and excessive inertia and low positioning efficiency caused by the superposition of the flexible two-dimensional platform and the rotating platform.

[0035] Of course, it is not necessary for any product implementing this utility model to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of this utility model, the following will briefly introduce the drawings required for describing the embodiments. Obviously, the drawings in the following description are only some embodiments of this utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0037] Figure 1 A perspective view of the die-bonding co-guide rigid-flexible composite motion die-bonding equipment of this utility model is given;

[0038] Figure 2 is Figure 1 the front view of;

[0039] Figure 3 is Figure 1 the side view of;

[0040] Figure 4 is an enlarged view of the upper half of the gantry;

[0041] Figure 5 is a structural schematic diagram of the side single guide rail;

[0042] Figure 6 is a structural schematic diagram of the side double guide rail;

[0043] Figure 7 is a structural schematic diagram of the side + bottom stacked guide rail;

[0044] Figure 8 is a structural schematic diagram of an embodiment of the die-bonding head assembly;

[0045] Figure 9 is a structural schematic diagram of another embodiment of the die-bonding head assembly;

[0046] Figure 10 is a perspective view of the wafer base part;

[0047] Figure 11 is a top view of an embodiment of the wafer assembly;

[0048] Figure 12 is a top view of another embodiment of the wafer assembly.

[0049] In the drawings, the list of components represented by each reference numeral is as follows:

[0050] 1 - Equipment base, 11 - Panel adjustment table;

[0051] 2 - Gantry, 21 - Cross beam;

[0052] 3 - Guide rail assembly, 31 - Side guide rail, 32 - First sliding assembly, 33 - Second sliding assembly, 34 - Bottom guide rail, 35 - Bottom support plate;

[0053] 4 - Z - axis base, 41 - Moving seat, 42 - First servo motor;

[0054] 5 - Die bonding head assembly, 51 - Die bonding base, 52 - First voice coil motor, 53 - Symmetrical flexible hinge, 54 - First flexible platform, 55 - Second voice coil motor, 56 - Unilateral / symmetrical flexible hinge, 57 - Second flexible platform, 58 - Die bonding head, 59 - First grating, 510 - Second grating;

[0055] 6 - Wafer rotating table mechanism, 61 - Y - axis base, 62 - Wafer assembly, 63 - Second servo motor, 64 - Worm, 621 - Wafer base, 622 - Rotating table, 623 - Outer frame, 624 - Inner frame, 625 - First driving device, 626 - Second driving device, 627 - Outer flexible unit, 628 - Inner flexible unit, 629 - Wafer. Detailed implementation manners

[0056] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the protection scope of the present utility model.

[0057] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0058] Embodiment 1

[0059] Please refer to Figures 1-4, in the die bonding co-guide rigid-flexible compound motion die bonding equipment provided by the present utility model, it includes an equipment base 1, a gantry 2, a guide rail assembly 3 horizontally arranged on the gantry 2, a wafer rotating table mechanism 6, a Z-axis base 4 vertically arranged, and a die bonding head assembly 5. Among them, the gantry 2 is fixed on one side of the top of the equipment base 1. A panel adjustment table 11 that can move longitudinally is arranged at the middle position of the top of the equipment base 1. Before chip transfer, the chip substrate is placed on the top of the panel adjustment table 11. The panel adjustment table 11 can adjust the height and the front and back positions, that is, freely adjust in the Y-axis and Z-axis directions corresponding to the present utility model, so as to adjust the position of the chip substrate. During die bonding, the panel adjustment table 11 moves along the Y-axis to adapt to the movement action of completing die bonding for each row of chips on the chip substrate and prepare for the next row. Since this is prior art, it will not be elaborated here. The guide rail assembly 3 includes at least one set of side guide rails 31. Considering better support stability, two sets of parallel side guide rails 31 can also be installed, such as Figure 6 . The side guide rails 31 are horizontally installed on the cross beam 21 at the top of the gantry 2 and are fixedly installed on the side of the cross beam 21. A plurality of first sliding components 32 and second sliding components 33 are slidably installed on the side guide rails 31. Among them, the first sliding component 32 is fixedly installed with the wafer rotating table mechanism 6 located below it, that is, connected to the Y-axis base 61, driving the wafer rotating table mechanism 6 to move in the X-axis direction; the second sliding component 33 is fixedly installed with the height adjustment mechanism, driving the Z-axis base 4 and the die bonding head assembly 5 to move synchronously in the X-axis direction. The height adjustment mechanism includes a moving seat 41 between the Z-axis base 4 and the guide rail assembly 3 and a first servo motor 42. The moving seat 41 is installed up and down with the Z-axis base 4. The first servo motor 42 is vertically installed on the moving seat 41, and the output end of the first servo motor 42 drives the Z-axis base 4 and the die bonding head assembly 5 to move synchronously in the Z-axis direction.

[0060] In this embodiment, as Figure 5 shown, a fixed gantry structure is adopted. Only one set of guide rail structure is installed on the cross beam 21. The die bonding platform and the wafer platform are installed on the guide rail at the same time. That is, the movement position of the die bonding head assembly 5 is in the middle of the guide rail, and the movement position of the wafer rotating table mechanism 6 is set on both sides of the die bonding head assembly 5. In this way, the installation is easy and the cost is low.

[0061] In the above, the die bonding head assembly 5 and the wafer rotating table mechanism 6 move along the length direction of the guide rail assembly 3 to adjust the X-axis direction position of the die bonding head 58 and the wafer 629.

[0062] In the above, a height adjustment mechanism for the die bonding head assembly 5 is arranged between the Z-axis base 4 and the guide rail assembly 3 to adjust the Z-axis direction position of the die bonding head 58.

[0063] In the above, a Y-axis linear drive mechanism is arranged between the wafer rotating table mechanism 6 and the guide rail assembly 3 to adjust the Y-axis direction position of the wafer 629.

[0064] Further, it should be noted that Figure 8 In Figure 8 , the die bonding head assembly 5 includes a die bonding base 51, a first voice coil motor 52, a symmetric flexible hinge 53, a first-stage flexible platform 54, a second voice coil motor 55, a single-sided / symmetric flexible hinge 56, and a second-stage flexible platform 57. Among them, the first voice coil motor 52 is fixed on one inner side of the die bonding base 51. The symmetric flexible hinge 53 consists of two parallel flexible hinge plates, which are vertically installed on one side of the first voice coil motor 52. And the output end of the first voice coil motor 52 is fixedly installed at the middle part of one of the flexible hinges of the symmetric flexible hinge 53. The symmetric flexible hinge 53 is connected to the single-sided / symmetric flexible hinge 56 through the first-stage flexible platform 54. The single-sided / symmetric flexible hinge 56 is connected to the second voice coil motor 55 through the second-stage flexible platform 57. The single-sided / symmetric flexible hinge 56 also consists of two parallel flexible hinge plates, which are horizontally installed at the middle part of the symmetric flexible hinge 53, forming an H-shaped stable guiding structure. The die bonding head 58 is installed at the bottom of the second-stage flexible platform 57 to transfer the chips on the wafer 629 to the chip substrate at the bottom of the wafer 629.

[0065] Among them, the first voice coil motor 52 is a circular voice coil motor with high thrust density. The second voice coil motor 55 is a mountain-shaped voice coil motor that allows the mover to move laterally and has a gap in the width direction. A first grating 59 is arranged in the moving direction of the symmetric flexible hinge 53. The first grating 59 is fixed on the first-stage flexible platform 54 to measure the moving position of the first-stage flexible platform 54. The first grating 59 is a standard grating scale. The first-stage flexible platform 54 uses a standard circular voice coil motor with high thrust density in cooperation with a standard grating scale, improving the utilization efficiency of standard components and reducing the manufacturing cost. In addition, a second grating 510 is arranged in the moving direction of the single-sided / symmetric flexible hinge 56. The second grating 510 is fixed on the second-stage flexible platform 57 to measure the moving position of the second-stage flexible platform 57. The second grating 510 uses a grating scale with a grating line width larger than that of the first grating 59. The second-stage flexible platform 57 uses a decoupled mountain-shaped voice coil motor and a wide grating line grating scale to achieve the decoupling of drive and feedback, reducing the difficulty of displacement coupling control and significantly improving the die bonding efficiency, which is increased from dozens of chip transfer speeds per second originally to hundreds of times.

[0066] As elaborated in detail above, in the thimble head assembly 5, the first-stage flexible platform 54 adopts a symmetrically arranged flexible hinge guiding mechanism, namely the symmetric flexible hinge 53. This has no vertical parasitic displacement, and a circular voice coil motor with a large thrust density, namely the first voice coil motor 52, can be used. Therefore, only a standard grating scale needs to be installed to achieve displacement measurement. The second-stage flexible platform 57 also adopts a parallel arranged flexible hinge, namely the single-sided / symmetric flexible hinge 56, which has no lateral parasitic displacement. A voice coil motor with a gap in the width direction, namely the second voice coil motor 55, needs to be installed, and a grating scale with a wider grating line needs to be installed so that the second-stage flexible platform 57 can work properly when the first-stage flexible platform 54 moves.

[0067] This utility model adopts a single-stage flexible hinge mechanism, and a single mode is easier to control. Additionally, repeatedly, since the inertia of the first-stage flexible platform 54 is larger than that of the second-stage flexible platform 57, circular voice coil motors with a large thrust density are respectively adopted to achieve an equal working frequency design. Moreover, the first-stage flexible platform 54 has a larger space, and longer symmetric flexible hinges 53 are symmetrically arranged. The symmetric arrangement is to avoid lateral parasitic displacement, and the longer flexible hinges are to reduce the stress stiffening phenomenon.

[0068] Furthermore, as Figure 10 , Figure 11 shown, the wafer rotating table mechanism 6 is designed as a combination of a series of double flexible platforms and a parallel double drive device. The second-stage inner flexible unit 628 is directly connected to the first-stage outer flexible unit 627 through a flexible hinge, facilitating the realization of motion superposition. Specifically, the wafer rotating table mechanism 6 includes a Y-axis base 61 and a wafer assembly 62 slidably mounted at the bottom of the Y-axis base 61. The wafer assembly 62 includes a wafer base 621 and a rotating table 622 rotatably mounted on the top of the wafer base 621. The wafer 629 is located inside the rotating table 622. An outer frame 623 and an inner frame 624 are provided between the inner wall of the rotating table 622 and the wafer 629. The outer frame 623 is fixedly connected to the inner wall of the rotating table 622. Both sides of the outer end face of the inner frame 624 are connected to the outer frame 623 through outer flexible units 627, and both sides of the inner end face of the inner frame 624 are connected to the wafer 629 through inner flexible units 628. The outer flexible units 627 and the inner flexible units 628 are arranged in a staggered manner around the wafer 629.

[0069] One side of the above-mentioned outer flexible unit 627 and inner flexible unit 628 is a hook-type flexible hinge combination mechanism, and the other side is a sheet-type flexible hinge. The hook-type flexible hinge combination mechanism includes two mutually cooperating L-shaped hook blocks and a sheet-type flexible hinge connected between the two L-shaped hook blocks, as Figure 11As shown, one end of an L-shaped hook block is connected to the inner wall of the outer frame 623, and one end of another L-shaped hook block is connected to the outer wall of the inner frame 624, forming a flexible connection structure among the outer frame 623, the inner frame 624, and the wafer 629.

[0070] The wafer rotating table mechanism 6 further includes a first driving device 625 and a second driving device 626 that are fixedly installed on the inner wall of the outer frame 623 and driven in parallel. The driving end of the first driving device 625 is fixedly connected to the inner frame 624 and is used to drive the wafer 629 to move longitudinally. The driving end of the second driving device 626 is fixedly connected to the wafer 629 to make it move laterally. When there are displacement deviations in both the lateral and longitudinal directions of the first driving device 625 and the second driving device 626, the first driving device 625 and the second driving device 626 are synchronously driven for quick response and adjustment. It can also perform position adjustment by individually driving when there is an offset in the lateral or longitudinal direction.

[0071] In the above, both the first driving device 625 and the second driving device 626 adopt voice coil motors driven by non-contact electromagnetic force, such as voice coil motors composed of a magnetic yoke and a coil. When a single-sided guiding flexible hinge is adopted, that is, Figure 11 one side is a hook-type flexible hinge combination mechanism, and the other side is a symmetric flexible guiding structure composed of a sheet-type flexible hinge. It has a large linear range, the flexible hinge deforms unilaterally, can achieve large displacements, is suitable for using a voice coil motor whose driving force is independent of distance, has a fast response, the magnetic yoke of the voice coil motor is on the outer frame 623 at the fixed end, and the coil is on the mobile end of the platform, realizing displacement coupling control with high control accuracy.

[0072] Among them, in order to reduce the motion load of the flexible hinge, the stator of the driving motor with a large mass is installed on the outer layer frame, that is, the motor with a large inertia is installed on the outer frame 623, which is suitable for infrequent adjustments. Only the mover with a light mass is installed on the outer flexible unit 627 and the inner flexible unit 628. At the same time, the light-weight wafer 629 is arranged in the two-dimensional inner flexible unit 628.

[0073] In addition, the wafer rotating table mechanism 6 further includes a second servo motor 63. The output end of the second servo motor 63 is fixedly connected to a worm 64, and the worm 64 is rotatably installed on the wafer base 621; a rack is provided on the outer ring of the rotating table 622, and the worm 64 is adapted to the rack. The second servo motor 63 is used to drive the worm 64 and the rack to be sequentially driven, so that the rotating table 622 drives the wafer 629 to rotate, achieving the purpose of rotation deviation correction, and is applicable to the rapid rotation attitude adjustment and rapid high-precision positioning of the wafer in the Mini / Micro LED high-speed die-bonding equipment.

[0074] Embodiment 2.

[0075] Please refer to Figure 7, based on the side guide rail 31 in the first embodiment, the guide rail assembly 3 further includes a bottom guide rail 34. The bottom guide rail 34 is parallel to the side guide rail 31 and is arranged on the side of the cross beam 21 away from the side guide rail 31. This structural design not only maintains a certain distance between the upper and lower guide rails to reduce the rigid friction force, but also further improves the installation stability of the entire die bonding device.

[0076] The bottom of the bottom guide rail 34 is respectively slidably installed with the bottom support plate 35 and the Y-axis base 61. Among them, the bottom support plate 35 is connected to the height adjustment mechanism to form an overall support structure, and the bottom guide rail 34 also provides stable support for strengthening the wafer rotating table mechanism 6.

[0077] Embodiment Three

[0078] Please refer to Figure 9 , compared with the die bonding head assembly 5 in the first embodiment, the single-sided / symmetric flexible hinge 56 is horizontally installed on the side of the symmetric flexible hinge 53 away from the first voice coil motor 52, and the rest of the structure and connection relationship are the same. On this far side, the single-sided / symmetric flexible hinge 56 is connected to the second voice coil motor 55 through the second-stage flexible platform 57. The single-sided / symmetric flexible hinge 56 is also two parallel flexible hinge plates, which are horizontally installed between the first-stage flexible platform 53 and the second-stage flexible platform 57. The second voice coil motor 55 is located at the top of the second-stage flexible platform 57, and the die bonding head 58 is installed at the bottom of the second-stage flexible platform 57 to transfer the chips on the wafer 629 to the chip substrate at the bottom of the wafer 629.

[0079] Among them, in order to reduce the coupling degree of the die bonding platform and reduce the manufacturing cost, for the two-dimensional flexible hinge die bonding mechanism composed of the above first-stage symmetric flexible hinge 53 and second-stage single-sided / symmetric flexible hinge 56, the flexible hinge adopts a large-stroke flexible hinge with single-sided guidance arranged in parallel or symmetrically arranged to form a flexible hinge structure with non-linear stiffness.

[0080] Embodiment Four

[0081] Please refer to Figure 12 , compared with the wafer rotating table mechanism 6 in the first embodiment, both sides of the outer flexible unit 627 and the inner flexible unit 628 are sheet-type flexible hinges, and the rest of the structure and connection relationship of the wafer rotating table mechanism 6 are the same. When using the symmetric flexible hinge structure of the outer flexible unit 627 and the inner flexible unit 628, the displacement is not coupled, so stress stiffening occurs, the stiffness is large, and a greater thrust is required. The first driving device 625 and the second driving device 626 both adopt flat motors driven by non-contact electromagnetic force, which are composed of permanent magnets and electromagnets. The electromagnets are on the outer frame 623 at the fixed end, and the permanent magnets are at the moving end, and it also has the advantage of being easy to dissipate heat.

[0082] Therefore, in this solution, when a symmetrically fixed-guided flexible hinge is adopted, the flexible hinge has highly nonlinear characteristics and is suitable for a double-single-stage iron-core motor with a thrust inversely proportional to the square of the distance. The maximum driving force is obtained at the point where the stiffness of the flexible hinge is the largest, compensating for the nonlinearity of the stiffness of the rigid and flexible components.

[0083] In addition to the field of panel die bonding, the common-rail rigid-flexible composite motion platform of the present utility can also be applied to large-format inspection equipment, dispensing equipment, welding equipment, etc.

[0084] In the above content, the exemplary implementation manners of the solution proposed by the present utility are described in detail with reference to the preferred embodiments. However, those skilled in the art can understand that, without departing from the concept of the present utility, various modifications and variations can be made to the above specific embodiments, and various combinations of the technical features and structures proposed by the present utility can be made without exceeding the protection scope of the present utility. The protection scope of the present utility is determined by the appended claims.

Claims

1. A wafer piercing common guide rail rigid-flexible composite motion piercing equipment, comprising a gantry, a guide rail assembly and a wafer rotating table mechanism arranged horizontally on the gantry, a vertically arranged Z-axis base and a piercing head assembly; The crystal thorn head assembly and the wafer rotating platform mechanism move along the length direction of the guide rail assembly to adjust the X-axis position of the crystal thorn head and the wafer; A height adjustment mechanism of the crystal head assembly is provided between the Z-axis base and the guide rail assembly to adjust the Z-axis position of the crystal head; A Y-axis linear drive mechanism is provided between the wafer rotating table mechanism and the guide rail assembly to adjust the Y-axis position of the wafer; Features: The thorn crystal head assembly includes a thorn crystal base, a first voice coil motor, a symmetrical flexible hinge, a first-level flexible platform, a second voice coil motor, a unilateral / symmetrical flexible hinge, and a second-level flexible platform, wherein the first voice coil motor is fixed on one side of the inner portion of the thorn crystal base, the symmetrical flexible hinge is located on one side of the first voice coil motor, and the output end of the first voice coil motor is fixedly installed with the middle part of one of the symmetrical flexible hinges, the symmetrical flexible hinge is connected with the unilateral / symmetrical flexible hinge through the first-level flexible platform, the unilateral / symmetrical flexible hinge is connected with the second voice coil motor through the second-level flexible platform, and the thorn crystal head is installed at the bottom of the second-level flexible platform to transfer the chip on the wafer to the chip substrate at the bottom of the wafer; The wafer rotating table mechanism comprises a Y-axis base and a wafer assembly slidably mounted on the bottom of the Y-axis base, the wafer assembly comprises a wafer base and a rotating table rotatably mounted on the top of the wafer base, the wafer is located inside the rotating table, an outer frame and an inner frame are arranged between the inner wall of the rotating table and the wafer, and the outer frame is fixedly connected to the inner wall of the rotating table, both sides of the outer end surface of the inner frame are connected to the outer frame through outer flexible units, both sides of the inner end surface of the inner frame are connected to the wafer through inner flexible units, and the outer flexible units and the inner flexible units are alternately arranged in pairs around the wafer; The wafer rotating table mechanism also includes a first driving device and a second driving device fixed on the inner wall of the outer frame and driven in parallel, wherein the driving end of the first driving device is fixedly connected to the inner frame for driving the wafer to move longitudinally, and the driving end of the second driving device is fixedly connected to the wafer for causing it to move laterally.

2. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 1 is characterized by: The guide rail assembly includes at least one set of side guide rails, which are horizontally installed on the crossbeam at the top of the gantry. Multiple sets of first sliding assemblies and second sliding assemblies are slidably installed on the side guide rails, wherein the first sliding assembly is fixedly installed with the Y-axis base located below it, driving the wafer rotation table mechanism to move in the X-axis direction, and the second sliding assembly is fixedly installed with the height adjustment mechanism, driving the Z-axis base and the crystal head assembly to move synchronously in the X-axis direction.

3. The wafer piercing common guide rail rigid-flexible composite motion piercing device according to claim 2 is characterized by: The guide rail assembly further comprises a bottom guide rail, and the bottom guide rail is arranged on a side of the cross beam away from the side guide rail; The bottom of the bottom guide rail is slidably mounted on the bottom support plate and the Y-axis base respectively, and the bottom support plate is connected to the height adjustment mechanism.

4. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 3 is characterized by: The height adjustment mechanism includes a moving seat and a first servo motor located between the Z-axis base and the guide rail assembly. The moving seat and the Z-axis base are movably installed up and down. The first servo motor is vertically installed on the moving seat. The output end of the first servo motor drives the Z-axis base and the crystal head assembly to move synchronously in the Z-axis direction.

5. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 1 is characterized by: The first voice coil motor is a circular voice coil motor with high thrust density, and the second voice coil motor is a mountain-shaped voice coil motor that allows the mover to move laterally and has a gap in the width direction.

6. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 1 is characterized by: A first grating is arranged in the moving direction of the symmetrical flexible hinge, wherein the first grating is fixed on the first-stage flexible platform to measure the moving position of the first-stage flexible platform; A second grating is arranged in the moving direction of the unilateral / symmetrical flexible hinge, and the second grating is fixed on the second-level flexible platform to measure the moving position of the second-level flexible platform; The first grating is a standard grating ruler, and the second grating adopts a grating ruler with a grating line width greater than that of the first grating.

7. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 1 is characterized by: The first driving device and the second driving device both adopt voice coil motors or flat-panel motors driven by non-contact electromagnetic force.

8. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 7 is characterized in that: One side of the outer flexible unit and the inner flexible unit is a hook-type flexible hinge combination mechanism, and the other side is a sheet-type flexible hinge. The hook-type flexible hinge combination mechanism includes two L-shaped hook blocks that cooperate with each other and a sheet-type flexible hinge connected between the two L-shaped hook blocks, one of the L-shaped hook blocks is connected to the inner wall of the outer frame, and the other L-shaped hook block is connected to the outer wall of the inner frame.

9. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 7, characterized in that: Both sides of the outer flexible unit and the inner flexible unit are sheet-type flexible hinges.

10. The wafer pricking common guide rail rigid-flexible composite motion pricking device according to claim 8 or 9, characterized in that: The wafer rotating platform mechanism further comprises a second servo motor, a worm is fixed to the output end of the second servo motor, and the worm is rotatably mounted on the wafer base; The outer ring of the rotating table has a circle of racks, and the worm is matched with the racks to drive the rotating table to drive the wafer to rotate.

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