Heating assembly and aerosol-generating device

Abstract

The utility model discloses a heating assembly and an aerosol generating device. The heating assembly is used for the aerosol generating device, the heating assembly comprises a heating piece and an infrared radiation layer, and a heating cavity used for containing an aerosol forming substrate is formed in the heating piece; the infrared radiation layer covers at least part of the cavity wall of the heating cavity, and the thickness of the infrared radiation layer ranges from 0.05 micrometer to 30 micrometers. Thus, the infrared radiation layer is arranged on the wall of the heating cavity in the heating piece, the heating assembly can make direct contact with the aerosol-forming substrate, an isolation layer does not need to be arranged, then the heat conduction efficiency and the heating efficiency of the aerosol-forming substrate can be improved, the thickness of the infrared radiation layer is set to range from 0.05 micrometer to 30 micrometers, and the heating efficiency of the aerosol-forming substrate is improved. Damage caused by the fact that the infrared radiation layer is too thin and makes contact with the aerosol forming substrate can be avoided, and too low heat conduction efficiency caused by the fact that the infrared radiation layer is too thick can be avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic atomization, and more specifically, to a heating component and an aerosol generating device. Background Art

[0002] An aerosol generating device is a small device that can heat an aerosol generating substrate by means of heat not burning (HNB) to generate an aerosol. Specifically, the aerosol generating device usually heats the aerosol generating substrate to a temperature at which an aerosol can be generated but is not high enough to burn, so that the aerosol generating substrate can generate an aerosol for the user to inhale without burning.

[0003] Currently, when the heating component in the aerosol generating device heats the aerosol generating substrate, an infrared radiation layer for heat transfer is provided on the heating component, and the heat can be quickly transferred to the aerosol generating substrate for heating. However, due to the low high-temperature resistance strength of the infrared radiation layer in the prior art, it cannot be directly in contact with the aerosol generating substrate, and an isolation layer needs to be provided to isolate it from the aerosol generating substrate, resulting in low heat conduction efficiency and thus reduced heating efficiency of the aerosol generating substrate. Summary of the Utility Model

[0004] Embodiments of the present application provide a heating component and an aerosol generating device.

[0005] A heating component according to an embodiment of the present application is used for an aerosol generating device. The heating component includes a heating element and an infrared radiation layer. A heating cavity for accommodating an aerosol forming substrate is provided inside the heating element; the infrared radiation layer covers at least part of the cavity wall of the heating cavity, and the thickness of the infrared radiation layer is 0.05 μm to 30 μm.

[0006] In this way, by providing an infrared radiation layer on the cavity wall of the heating cavity inside the heating element, the heating component can be directly in contact with the aerosol forming substrate without the need to provide an isolation layer, thereby improving the heat conduction efficiency and the heating efficiency of the aerosol forming substrate. And when the thickness of the infrared radiation layer is less than 0.05 μm, due to the friction when the infrared radiation layer is in contact with the aerosol forming substrate, the infrared radiation layer is easily damaged; when the thickness of the infrared radiation layer is greater than 30 μm, the infrared radiation layer is too thick, resulting in a decrease in the heat conduction rate of the heating element in the infrared radiation layer and an increase in the time for heating the aerosol forming substrate. By setting the thickness of the infrared radiation layer to 0.05 μm to 30 μm, it is possible to avoid damage to the infrared radiation layer easily caused by contact with the aerosol forming substrate due to its thinness while ensuring the heat conduction efficiency of the heating element in the infrared radiation layer.

[0007] In some embodiments, the thickness of the infrared radiation layer is from 10 μm to 30 μm.

[0008] Thus, due to the different materials forming the infrared radiation layer, the thickness of the infrared radiation layer capable of maintaining the strength and conduction efficiency of the infrared radiation layer is also different. By setting the thickness of the infrared radiation layer to be from 10 μm to 30 μm, it is possible to avoid the infrared radiation layer being too thin and being easily damaged when contacting the aerosol-forming matrix, and at the same time ensure the conduction efficiency of the heat of the heating element in the infrared radiation layer.

[0009] In some embodiments, the roughness of the infrared radiation layer is less than 5 μm.

[0010] Thus, when the roughness of the infrared radiation layer is greater than 5 μm, the greater the friction between the infrared radiation layer and the aerosol-forming matrix, the more easily the infrared radiation layer is damaged. By making the roughness of the infrared radiation layer less than 5 μm, the frictional force between the infrared radiation layer and the aerosol-forming matrix can be reduced, avoiding damage to the infrared radiation layer due to friction, and improving the service life of the infrared radiation layer.

[0011] In some embodiments, the infrared radiation layer is configured to be formed by crosslinking and curing an organic plastic and an infrared radiation substance, and the diameter of the infrared radiation substance is less than 5 μm.

[0012] Thus, by using a crosslinking and curing process to form the infrared radiation layer from an organic plastic and an infrared radiation substance, more covalent bond connections can be generated between the molecules of the organic plastic and the infrared radiation substance, thereby improving the strength and corrosion resistance of the infrared radiation layer. By making the diameter of the infrared radiation substance less than 5 μm, the roughness of the infrared radiation layer can be reduced, thereby reducing the friction between the infrared radiation layer and the aerosol-forming matrix and improving the service life of the infrared radiation layer.

[0013] In some embodiments, the heat-resistant temperature of the infrared radiation layer is greater than 300 °C.

[0014] Thus, since the aerosol-forming matrix can generate aerosol at around 300 °C, by raising the heat-resistant temperature of the infrared radiation layer to be greater than 300 °C, in the case of direct contact with the aerosol-forming matrix, deformation of the heating element caused by high temperature can be avoided, and at the same time the infrared radiation glass layer can withstand high temperature, and the infrared radiation layer will not melt when the heating assembly heats the aerosol-forming matrix.

[0015] In some embodiments, the roughness of the infrared radiation layer is less than 1 μm.

[0016] Thus, due to different formation methods of the infrared radiation layer, the roughness of the generated infrared radiation layer will also be different. When the roughness of the infrared radiation layer is greater than 1 μm, the friction between the infrared radiation layer and the aerosol-forming matrix is greater, and it is easier for the infrared radiation layer to be damaged. By making the roughness of the infrared radiation layer less than 1 μm, the frictional force between the infrared radiation layer and the aerosol-forming matrix can be reduced, avoiding damage to the infrared radiation layer caused by friction and improving the service life of the infrared radiation layer.

[0017] In some embodiments, the heating element includes an engagement structure located on at least part of the cavity wall of the heating cavity, and the infrared radiation layer is located on the engagement structure.

[0018] Thus, through the engagement structure formed on the heating element, the infrared radiation layer and the engagement structure can be tightly connected, giving the infrared radiation layer a high bonding strength.

[0019] In some embodiments, the engagement structure includes a plurality of micropores with a size of 0.05 μm to 1 μm and a depth of less than 1 μm.

[0020] Thus, when the micropores on the engagement structure are less than 0.05 μm and the depth of the micropores is greater than 1 μm, the infrared radiation layer has a low strength because the micropores are too small to contact the blackening liquid sufficiently; when the micropores on the engagement structure are less than 0.05 μm and the depth of the micropores is greater than 1 μm, the micropores are too large, and the density of the infrared radiation layer formed after contact with the blackening liquid is insufficient, resulting in a low strength of the infrared radiation layer. Therefore, by controlling the size of the micropores to be 0.05 μm to 1 μm and the depth of the micropores to be less than 1 μm, the density of the infrared radiation layer generated with the blackening liquid is relatively high, and thus the strength of the infrared radiation layer is relatively high and it is not easily damaged.

[0021] In some embodiments, the wall thickness of the heating element is 0.06 mm to 0.12 mm.

[0022] Thus, when the wall thickness of the heating element is set to be less than 0.06 mm, the heating element is too thin and its strength is low, so the heating element is prone to deformation and damage; when the wall thickness of the heating element is set to be greater than 0.12 mm, the heating element is too thick and the heat conduction efficiency is reduced; by setting the wall thickness of the heating element to 0.06 mm to 0.12 mm, it is possible to avoid the heating component being too heavy and affecting the heat conduction efficiency, and at the same time prevent the wall thickness of the heating element from being too thin and being prone to deformation.

[0023] In some embodiments, the heating element is cylindrical, and one end of the heating element is provided with an outwardly turned flared opening.

[0024] Thus, the heating element is cylindrical in shape, enabling it to adapt to the shape of the aerosol-forming substrate, facilitating the insertion and extraction of the aerosol-forming substrate and preventing it from remaining in the heating element. An outwardly turned flared opening is provided at one end of the heating element to enhance the port strength of the heating element and thus avoid deformation of the heating element.

[0025] In some embodiments, the heating assembly further includes a thermocouple wire, which is welded to the outer wall of the heating element.

[0026] Thus, by welding the thermocouple wire to the outer wall of the heating element, the temperature of the heating element can be known, and then the heat generated by the heating element can be controlled to prevent damage to the infrared radiation layer due to excessive temperature.

[0027] In some embodiments, the thermocouple wire includes polytetrafluoroethylene, constantan, and iron wire, and the polytetrafluoroethylene wraps the constantan and the iron wire.

[0028] Thus, by using polytetrafluoroethylene to wrap the constantan and iron wire, the thermocouple wire can withstand high-temperature erosion, thereby increasing the service life of the thermocouple wire.

[0029] In some embodiments, the heating assembly includes a heat-insulating layer located on the outer wall of the heating element.

[0030] Thus, by providing a heat-insulating layer on the outer wall of the heating element, direct contact between the heating element and other components can be isolated, thereby preventing heat generated by the heating element from being exchanged with other components, resulting in heat loss and reducing the heating efficiency of the aerosol-forming substrate.

[0031] In some embodiments, the thickness of the heat-insulating layer is from 0.5 mm to 2 mm.

[0032] Thus, when the thickness of the heat-insulating layer is set to less than 0.5 mm, the heat-insulating layer is too thin and the heat-insulating efficiency is low; when the thickness of the heat-insulating layer is set to greater than 0.5 mm, the heat-insulating layer is too thick, increasing the weight of the heating assembly and being unfavorable for miniaturization; by setting the thickness of the heat-insulating layer to 0.5 mm to 2 mm, the heat-insulating effect of the heating element can be ensured while the volume of the heating assembly is small, which is beneficial to the miniaturization of the heating assembly.

[0033] In some embodiments, the heating assembly includes an antioxidant layer located on the outer wall of the heating element.

[0034] Thus, by providing an antioxidant layer on the outer wall of the heating element, direct contact between the outer wall of the heating element and the outside air can be prevented, thereby avoiding oxidation of the outer wall of the heating element during heating.

[0035] In some embodiments, the thickness of the antioxidant layer is from 1 μm to 10 μm.

[0036] Thus, when the thickness of the antioxidant layer is less than 1 μm, the antioxidant layer is too thin and the protection against oxidation of the heating element is weak; when the thickness of the antioxidant layer is greater than 10 μm, the antioxidant layer is too thick, which not only prevents the heating element from being oxidized, but also easily causes the heating element to be too heavy and increases the cost. By controlling the thickness of the antioxidant layer within the range of 1 μm to 10 μm, it not only meets the requirement of protecting the heating element from oxidation, but also avoids the heating component from being too heavy and increasing the cost.

[0037] In some embodiments, the heating component includes an electromagnetic induction coil, and the electromagnetic induction coil is located outside the heating element.

[0038] Thus, by arranging the electromagnetic induction coil outside the heat insulation layer, an electromagnetic heating component can be formed with the heating element, thereby heating the aerosol generating substrate.

[0039] An aerosol generating device according to an embodiment of the present application includes the heating component described in any one of the above.

[0040] Additional aspects and advantages of the embodiments of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0042] Figure 1 is a schematic structural diagram of an aerosol generating device according to some embodiments of the present application;

[0043] Figure 2 is a schematic structural diagram of a heating component according to some embodiments of the present application;

[0044] Figure 3 is Figure 3 a cross-sectional view of the heating component along III to III in;

[0045] Figure 4 is Figure 3 an enlarged schematic view of structure A in;

[0046] Reference numerals:

[0047] 100, Aerosol generating device; 10, Heating component; 11, Heating element; 111, Heating cavity; 112, Engaging structure; 1121, Micropores; 113, Flared outer lip; 12, Infrared radiation layer; 13, Thermocouple wire; 14, Heat insulation layer; 15, Antioxidant layer; 16, Electromagnetic induction coil. Detailed implementation manners

[0048] The following details the implementation manners of the present invention. The examples of the implementation manners are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The implementation manners described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0049] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0051] The disclosure herein provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described herein. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0052] Please refer to Figure 1 and Figure 2 , a heating component 10 of an embodiment of the present application is used for an aerosol generating device 100. The heating component 10 includes a heating element 11 and an infrared radiation layer 12. A heating cavity 111 for accommodating an aerosol-forming substrate is provided inside the heating element 11; the infrared radiation layer 12 covers at least part of the cavity wall of the heating cavity 111, and the thickness of the infrared radiation layer 12 is 0.05 μm to 30 μm.

[0053] In this way, by providing the infrared radiation layer 12 on the wall of the heating cavity 111 inside the heating element 11, the heating component 10 can be directly in contact with the aerosol-forming substrate without the need to provide an isolation layer, thereby improving the heat conduction efficiency and the heating efficiency of the aerosol-forming substrate. Moreover, when the thickness of the infrared radiation layer 12 is less than 0.05 μm, the infrared radiation layer 12 is easily damaged due to friction when contacting the aerosol-forming substrate; when the thickness of the infrared radiation layer 12 is greater than 30 μm, the infrared radiation layer 12 is too thick, resulting in a decrease in the heat conduction rate of the heating element 11 in the infrared radiation layer 12 and an increase in the time for heating the aerosol-forming substrate. By setting the thickness of the infrared radiation layer 12 to 0.05 μm to 30 μm, it is possible to avoid damage easily caused when the infrared radiation layer 12 is too thin and contacts the aerosol-forming substrate, while ensuring the heat conduction efficiency of the heating element 11 in the infrared radiation layer 12.

[0054] Among them, the aerosol generating device 100 is a device that generates aerosol by heating rather than burning the aerosol generating substrate. The aerosol generating device 100 includes a heating component 10, which is usually arranged around the aerosol generating substrate, and the heating component 10 can be used to generate heat, so as to heat the aerosol generating substrate to generate aerosol. The heating component 10 includes a heating element 11, and a heating cavity 111 for accommodating the aerosol forming substrate can be formed inside the heating element 11, so that the aerosol generating substrate extends into the heating cavity 111 for heating. The heating component 10 further includes an infrared radiation layer 12, which can transfer the heat generated by the heating element 11 to the aerosol forming substrate in the ways of heat conduction and heat radiation for heating.

[0055] Specifically, the size of the heating cavity 111 formed inside the heating element 11 needs to be adapted to the shape and size of the aerosol forming substrate. For example, if the shape of the aerosol forming substrate is cylindrical, the shape of the heating cavity 111 is cylindrical; the size of the heating cavity 111 needs to make the aerosol forming substrate contact the infrared radiation layer 12.

[0056] When the heating component 10 heats the aerosol forming substrate, the influence of the wall thickness of the heating element 11 on the heat conduction efficiency needs to be considered. Thus, the wall thickness of the heating element 11 can be set to 0.06 mm to 0.12 mm.

[0057] In this way, when the wall thickness of the heating element 11 is set to be less than 0.06 mm, the heating element 11 is too thin, resulting in low strength of the heating element 11, so the heating element 11 is prone to deformation and damage; when the wall thickness of the heating element 11 is set to be greater than 0.12 mm, the heating element 11 is too thick, resulting in a decrease in the heat conduction efficiency; by setting the wall thickness of the heating element 11 to 0.06 mm to 0.12 mm, it is possible to avoid the overweight of the heating component 10 and the influence on the heat conduction efficiency, and at the same time prevent the wall thickness of the heating element 11 from being too thin and prone to deformation.

[0058] When manufacturing the heating element 11, the shape of the heating element 11 needs to be set as a cylinder, and an outward-turning flared mouth 113 is provided at one end of the heating element 11. In this way, setting the shape of the heating element 11 as a cylinder can adapt to the shape of the aerosol forming substrate, which is beneficial to the extension and retraction of the aerosol forming substrate and prevents the aerosol forming substrate from remaining in the heating element 11. And an outward-turning flared mouth 113 is provided at one end of the heating element 11, which can strengthen the port strength of the heating element 11, so as to avoid deformation of the heating element 11.

[0059] Optionally, the material of the heating element 11 can be one of low-carbon steel, iron or stainless steel.

[0060] Therefore, due to the relatively high thermal conductivity and strength of low-carbon steel, iron, and stainless steel, by setting the heating element 11 as one of low-carbon steel, iron, or stainless steel, it is possible to ensure the heat conduction efficiency while avoiding deformation of the heating element 11, and the heating element 11 being low-carbon steel, iron, or stainless steel can become a component of electromagnetic heating in the heating assembly 10.

[0061] The infrared radiation layer 12 is formed on at least part of the cavity wall of the heating cavity 111. For example, the infrared radiation layer 12 can be formed by crosslinking and curing on the cavity walls of all the heating cavities 111, or by uniformly crosslinking and curing on three-quarters of the cavity walls of the heating cavity 111, etc.

[0062] It should be noted that, depending on different materials and different forming processes, the thickness of the formed infrared radiation layer 12 needs to be controlled within 0.05 μm to 30 μm.

[0063] For example, when the infrared radiation layer 12 is formed by a crosslinking and curing process of an organic plastic and an infrared radiation substance, the thickness of the infrared radiation layer 12 can be 10 μm to 30 μm; when the infrared radiation layer 12 is formed by self-oxidation of the heating element 11. The thickness of the infrared radiation layer 12 can be 0.05 μm to 10 μm.

[0064] Thus, due to the different materials forming the infrared radiation layer 12, the thickness of the infrared radiation layer 12 that can maintain the strength and conduction efficiency of the infrared radiation layer 12 is also different. By setting the thickness of the infrared radiation layer 12 to 10 μm to 30 μm, it is possible to avoid damage easily caused when the infrared radiation layer 12 is too thin and contacts the aerosol-forming matrix while ensuring the heat conduction efficiency of the heating element 11 in the infrared radiation layer 12.

[0065] Please refer to Figure 1 , in some embodiments, the infrared radiation layer 12 is configured to be formed by crosslinking and curing an organic plastic and an infrared radiation substance, and the diameter of the infrared radiation substance is less than 5 μm.

[0066] Thus, by using a crosslinking and curing process to form the infrared radiation layer 12 from an organic plastic and an infrared radiation substance, it is possible to generate more covalent bond connections between the molecules of the organic plastic and the infrared radiation substance, thereby improving the strength and corrosion resistance of the infrared radiation layer 12. By making the diameter of the infrared radiation substance less than 5 μm, it is possible to reduce the roughness of the infrared radiation layer 12, thereby reducing the friction between the infrared radiation layer 12 and the aerosol-forming matrix and increasing the service life of the infrared radiation layer 12.

[0067] Specifically, the infrared radiation layer 12 can be formed by mixing an organic plastic and an infrared radiation material and then crosslinking and curing at a temperature of 220°C - 330°C. Among them, crosslinking and curing is a process method that connects the molecules in the organic plastic and the infrared radiation material through covalent bonds to form a three-dimensional network structure. The formed three-dimensional network structure is stronger and more stable than simple physical crosslinking, and can significantly improve the mechanical strength, wear resistance and corrosion resistance of the infrared radiation layer 12.

[0068] The organic plastic can include one of silicone resin, phenolic resin, polyimide resin, and Teflon resin; the infrared radiation material includes graphite-based and oxide-based materials. The graphite-based materials include graphene and graphite, and the oxide-based materials include one or more mixtures of iron tetroxide, ferrite, cobaltate, nickel oxide, chromium sesquioxide, cobalt oxide, and copper oxide.

[0069] Before mixing the organic plastic and the infrared radiation material and crosslinking and curing them on the inner wall of the heating chamber 111, it is necessary to determine the specific gravity of the organic plastic and the infrared radiation material. For example, when the infrared radiation material is graphite-based, the weight ratio of the infrared radiation material is 5% to 30%, and the weight ratio of the organic plastic is 70% to 95%; when the infrared radiation material is oxide-based, the weight ratio of the infrared radiation material is 20% to 50%, and the weight ratio of the organic plastic is 50% to 80%.

[0070] After determining the specific gravity of the organic plastic and the infrared radiation material, it is necessary to control the size of the infrared radiation material to control the roughness of the formed infrared radiation layer 12. The smaller the size of the material, the smaller the formed roughness. For example, by controlling the diameter of the infrared radiation material to be less than 5 μm, the roughness of the infrared radiation layer 12 can be controlled to be less than 5 μm.

[0071] In this way, when the roughness of the infrared radiation layer 12 is greater than 5 μm, the friction between the infrared radiation layer 12 and the aerosol-forming matrix is greater, and it is easier to damage the infrared radiation layer 12. By making the roughness of the infrared radiation layer 12 less than 5 μm, the frictional force between the infrared radiation layer 12 and the aerosol-forming matrix can be reduced, avoiding damage to the infrared radiation layer 12 due to friction, and improving the service life of the infrared radiation layer 12.

[0072] Optionally, in some embodiments, when the infrared radiation layer 12 is formed by the self-oxidation reaction of the heating element 11, the roughness of the infrared radiation layer 12 is less than 1 μm.

[0073] Thus, when the infrared radiation layer 12 is formed by the self-oxidation of the heating element 11 and the roughness of the infrared radiation layer 12 is greater than 1 μm, the greater the friction between the infrared radiation layer 12 and the aerosol-forming matrix, the more likely the infrared radiation layer 12 is to be damaged. By making the roughness of the infrared radiation layer 12 less than 1 μm, the frictional force between the infrared radiation layer 12 and the aerosol-forming matrix can be reduced, avoiding damage to the infrared radiation layer 12 caused by friction and improving the service life of the infrared radiation layer 12.

[0074] Optionally, according to different materials and different forming processes, the Mohs hardness of the formed infrared radiation layer 12 needs to be controlled within a range greater than 4. Among them, the Mohs hardness is a standard for measuring the hardness of minerals.

[0075] For example, the Mohs hardness of the infrared radiation layer 12 formed through the self-oxidation reaction needs to be controlled within a range greater than 5; the Mohs hardness of the infrared radiation layer 12 formed through the cross-linking and curing process needs to be controlled within a range greater than 4.

[0076] Thus, when the Mohs hardness of the infrared radiation layer 12 is less than 4, due to the insufficient hardness of the infrared radiation layer 12, it is easy to damage the infrared radiation layer 12 when it comes into contact with the aerosol-forming matrix; by setting the Mohs hardness of the infrared radiation layer 12 to be greater than 4, it is possible to avoid damage to the infrared radiation layer 12 due to the friction of the aerosol-forming matrix when the infrared radiation layer 12 comes into contact with the aerosol-forming matrix.

[0077] In some embodiments, the heat-resistant temperature of the infrared radiation layer 12 is greater than 300 °C.

[0078] Thus, since the aerosol-forming matrix can generate aerosol at around 300 °C, by raising the heat-resistant temperature of the infrared radiation layer 12 to be greater than 300 °C, in the case of direct contact with the aerosol-forming matrix, deformation of the heating element 11 caused by high temperature can be avoided, and at the same time, the infrared radiation glass layer can withstand high temperatures, and the infrared radiation layer 12 will not melt when the heating assembly 10 heats the aerosol-forming matrix.

[0079] Specifically, due to the different ways in which the infrared radiation layer 12 is formed, the heat-resistant temperature of the infrared radiation layer 12 is different. For example, by mixing an organic plastic and an infrared radiation substance and then placing them in an environment of 220 °C - 330 °C for cross-linking and curing to form the infrared radiation layer 12, and since the organic plastic can withstand high temperatures above 300 °C, the heat-resistant temperature of the infrared radiation layer 12 can be made greater than 300 °C.

[0080] For another example, an infrared radiation layer 12 is formed by the self-oxidation reaction of the heating element 11, so that the infrared radiation layer 12 is an oxide formed by self-oxidation. The oxide has high stability and does not contain organic components, and can withstand high temperatures, so that the infrared radiation layer 12 will not fall off due to high-temperature carbonization. Furthermore, the heat-resistant temperature of the infrared radiation layer 12 is greater than 1000 °C.

[0081] Please refer to Figure 3 and Figure 4 , in some embodiments, the heating element 11 includes an engagement structure 112. The engagement structure 112 is located on at least part of the inner wall of the heating cavity 111, and the infrared radiation layer 12 is located on the engagement structure 112.

[0082] In this way, the infrared radiation layer 12 is formed by self-oxidation on the engagement structure 112 formed on the heating element 11, so that the infrared radiation layer 12 and the engagement structure 112 can be tightly connected, and no additional infrared radiation material needs to be bonded to the inner wall of the heating element 11 through an organic adhesive, so that the infrared radiation layer 12 has a high bonding strength.

[0083] Specifically, when the infrared radiation layer 12 is formed by the self-oxidation of the heating element 11, after the heating element 11 is placed in a hydrochloric acid solution with a preset concentration (the preset concentration can be 10%-30%) for pickling for a preset time (the preset time can be 10 minutes to 60 minutes), the hydrochloric acid solution can corrode the inner wall of the heating element 11, so that an engagement structure 112 is formed on the inner wall of the heating element 11, so that the infrared radiation layer 12 can be generated on the engagement structure 112, improving the bonding degree between the infrared radiation layer 12 and the heating element 11.

[0084] Among them, the engagement structure 112 includes a plurality of micropores 1121. The size of the micropores 1121 is 0.05 μm to 1 μm, and the depth of the micropores 1121 is less than 1 μm.

[0085] In this way, when the micropores 1121 on the engagement structure 112 are less than 0.05 μm and the depth of the micropores 1121 is greater than 1 μm, since the micropores 1121 are too small to contact the blackening solution sufficiently, the strength of the infrared radiation layer 12 is small; when the micropores 1121 on the engagement structure 112 are less than 0.05 μm and the depth of the micropores 1121 is greater than 1 μm, the micropores 1121 are too large, and the density of the infrared radiation layer 12 formed after contacting the blackening solution is insufficient, resulting in a small strength of the infrared radiation layer 12. Therefore, when the size of the micropores 1121 is controlled to be 0.05 μm to 1 μm and the depth of the micropores 1121 is less than 1 μm, the density of the infrared radiation layer 12 generated with the blackening solution is relatively high, and further, the strength of the infrared radiation layer 12 is relatively high and it is not easily damaged.

[0086] Please refer to Figure 2 andFigure 3 , in some embodiments, the heating assembly 10 further includes a thermocouple wire 13, and the thermocouple wire 13 is welded to the outer wall of the heating element 11.

[0087] In this way, by welding the thermocouple wire 13 to the outer wall of the heating element 11, the temperature of the heating element 11 can be understood, and then the heat generated by the heating element 11 can be controlled to prevent the infrared radiation layer 12 from being damaged due to excessive temperature.

[0088] Specifically, in order to clearly understand the heating temperature of the heating element 11, the heating assembly 10 further includes a thermocouple wire 13. Among them, the thermocouple wire 13 is connected to the outer wall of the heating element 11 by welding. Through the thermoelectric effect, the temperature on the heating element 11 can be measured, and after the measurement result is transmitted to the controller, by controlling the current magnitude of the heating assembly 10, the heat generated by the heating assembly 10 can be controlled.

[0089] Among them, the thermocouple wire 13 includes polytetrafluoroethylene, constantan and iron wire. By wrapping the constantan and iron wire with polytetrafluoroethylene, the thermocouple wire 13 can be formed. In this way, by using polytetrafluoroethylene to wrap the constantan and iron wire, the thermocouple wire 13 can withstand high-temperature erosion, thereby improving the service life of the thermocouple wire 13.

[0090] Please refer to Figure 3 , in some embodiments, the heating assembly 10 includes a heat insulation layer 14, and the heat insulation layer 14 is located on the outer wall of the heating element 11.

[0091] In this way, by providing the heat insulation layer 14 on the outer wall of the heating element 11, the direct contact between the heating element 11 and other devices can be isolated, so that the heat generated by the heating element 11 can be prevented from exchanging heat with other devices, resulting in heat loss and reducing the heating efficiency of the aerosol formation matrix.

[0092] Specifically, the heating assembly 10 further includes a heat insulation layer 14. The heat insulation layer 14 can be provided around the outer wall of the heating element 11, and according to the shape of the heating element 11, the heat insulation layer 14 can wrap the heating element 11.

[0093] It should be noted that the material of the heat insulation layer 14 can be polyether ether ketone. In this way, due to the small thermal conductivity coefficient and small thermal expansion coefficient of the polyether ether ketone material, by setting the heat insulation layer 14 as the polyether ether ketone material, heat insulation can be achieved on the high-temperature heating element 11 while it is not easy to deform.

[0094] When setting the heat insulation layer 14 on the outer wall of the heating element 11, the thickness of the heat insulation layer 14 needs to be controlled to be 0.5 mm to 2 mm.

[0095] Thus, when the thickness of the heat insulation layer 14 is set to be less than 0.5 mm, the heat insulation layer 14 is too thin and the heat preservation efficiency is relatively low; when the thickness of the heat insulation layer 14 is set to be greater than 0.5 mm, the heat insulation layer 14 is too thick, increasing the weight of the heating component 10, which is not conducive to miniaturization; by setting the thickness of the heat insulation layer 14 to be 0.5 mm to 2 mm, while ensuring the heat insulation effect of the heating element 11, the volume of the heating component 10 is relatively small, which is conducive to the miniaturization of the heating component 10.

[0096] Please refer to Figure 3 , in some embodiments, the heating component 10 includes an antioxidant layer 15, and the antioxidant layer 15 is located on the outer wall of the heating element 11.

[0097] Thus, by providing the antioxidant layer 15 on the outer wall of the heating element 11, it is possible to prevent the outer wall of the heating element 11 from directly contacting the outside air, thereby avoiding the oxidation of the outer wall of the heating element 11 during heating.

[0098] Specifically, in order to protect the outer wall of the heating element 11 from undergoing an oxidation reaction, an antioxidant layer 15 can be formed on the inner wall of the heating element 11. It should be noted that the heat insulation layer 14 can wrap the antioxidant layer 15, that is, the oxidation layer 15 is clamped between the heat insulation layer 14 and the heating element 11, thereby further preventing the outer wall of the heating element 11 from contacting the outside and being oxidized.

[0099] Among them, the material of the antioxidant layer 15 is nickel or chromium. An antioxidant layer 15 is formed on the outer wall of the heating element 11 by electroplating, chemical plating or depositing a layer of nickel or chromium to prevent the outer wall of the heating element 11 from being oxidized during the heating process.

[0100] Thus, since nickel and chromium do not react with acids and alkalis under normal circumstances, by determining the material of the antioxidant layer 15 as nickel or chromium, it is possible to avoid the oxidation of the heating element 11 during alkaline cleaning and acid pickling.

[0101] It should be noted that the thickness of the antioxidant layer 15 can be 1 μm to 10 μm. For example, the thickness of the antioxidant layer can be 1.5 μm, 2 μm or 2.5 μm, etc.

[0102] Thus, when the thickness of the antioxidant layer 15 is less than 1 μm, the antioxidant layer 15 is too thin and the protective property against the oxidation of the heating element 11 is relatively weak; when the thickness of the antioxidant layer 15 is greater than 10 μm, the antioxidant layer 15 is too thick, and while preventing the oxidation of the heating element 11, it is likely to cause the heating element 11 to be too heavy and increase the cost. By controlling the thickness of the antioxidant layer 15 within 1 μm to 10 μm, it not only meets the requirement of protecting the heating element 11 from oxidation, but also avoids the heating component 10 from being too heavy and increasing the cost.

[0103] Please refer to Figure 2 and Figure 3 In some embodiments, an electromagnetic induction coil 16 is disposed on the outer side of the heat insulation layer 14, and the electromagnetic induction coil 16 is used to heat the heating element 11.

[0104] Thus, by disposing the electromagnetic induction coil 16 on the outer side of the heat insulation layer 14, an electromagnetic heating assembly 10 can be formed with the heating element 11, thereby heating the aerosol generating substrate.

[0105] Specifically, when manufacturing the heating assembly 10, an electromagnetic induction coil 16 is further disposed on the outer wall of the heat insulation layer 14, and the electromagnetic induction coil 16 can be used to heat the heating element 11.

[0106] Wherein, the electromagnetic induction coil 16 is made of copper wire and is spirally wound around the outer wall of the heat insulation layer 14, and the heat insulation layer 14 is clamped between the electromagnetic induction coil 16 and the antioxidant layer 15. When the electromagnetic induction coil 16 is energized, the electromagnetic induction coil 16 can generate a magnetic field. When the conductive heating element 11 is placed in the magnetic field, an induced current can be generated in the conductive heating element 11 in the magnetic field to form an eddy current. When the eddy current flows inside the heating element 11, the electrons inside the heating element 11 will become active and collide and rub against each other, thereby generating heat to heat the aerosol generating substrate.

[0107] Please refer to again Figure 1 and Figure 2 an aerosol generating device 100 according to an embodiment of the present application. The aerosol generating device 100 includes the heating assembly 10 as described in any one of the above. For the sake of brevity, it will not be described in detail here.

[0108] In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present invention. In the present specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0109] Any process or method description, whether in a flowchart or otherwise described herein, can be understood to represent a module, segment, or portion of code that includes one or more executable instructions for implementing a specific logical function or process. The scope of the preferred embodiments of the present application includes additional implementations where functions may be executed in a substantially simultaneous manner or in a reverse order according to the functions involved, rather than in the order shown or discussed. This should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0110] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heating assembly for an aerosol generating device, characterized in that: The heating assembly comprises: A heating element, wherein a heating chamber for accommodating an aerosol-forming substrate is disposed inside the heating element; an infrared radiation layer, wherein the infrared radiation layer covers at least a portion of the cavity wall of the heating cavity, and the thickness of the infrared radiation layer is 0.05 μm to 30 μm; The heating element comprises a meshing structure, the meshing structure is located on at least a portion of the cavity wall of the heating cavity, and the infrared radiation layer is located on the meshing structure; The meshing structure includes a plurality of micropores.

2. The heating assembly according to claim 1, characterized in that The infrared radiation layer has a thickness of 10 μm to 30 μm.

3. The heating assembly according to claim 1, characterized in that The infrared radiation layer has a roughness less than 5 μm.

4. The heating assembly according to claim 1, characterized in that The infrared radiation layer is configured to be formed by cross-linking and curing of organic plastic and infrared radiation material, and the diameter of the infrared radiation material is less than 5 μm.

5. The heating assembly according to claim 1, characterized in that The heat-resistant temperature of the infrared radiation layer is greater than 300°C.

6. The heating assembly according to claim 1, characterized in that The infrared radiation layer has a roughness less than 1 μm.

7. The heating assembly according to claim 6, characterized in that The size of the micropores is 0.05 μm to 1 μm, and the depth of the micropores is less than 1 μm.

8. The heating assembly according to claim 1, characterized in that The wall thickness of the heating element is 0.06 mm to 0.12 mm.

9. The heating assembly according to claim 1, characterized in that The heating element is in a cylindrical shape, and one end of the heating element is provided with an outward-turned bell mouth.

10. The heating assembly according to claim 1, wherein: The heating assembly further comprises a thermocouple wire, and the thermocouple wire is welded to the outer wall of the heating element.

11. The heating assembly according to claim 10, characterized in that The thermocouple wire comprises polytetrafluoroethylene, constantan and iron wire, and the polytetrafluoroethylene wraps the constantan and the iron wire.

12. The heating assembly according to claim 1, wherein: The heating assembly comprises a heat insulating layer, and the heat insulating layer is located on the outer wall of the heating element.

13. The heating assembly according to claim 12, characterized in that The thickness of the heat insulation layer is 0.5 mm to 2 mm.

14. The heating assembly according to claim 1, wherein: The heating assembly comprises an anti-oxidation layer, and the anti-oxidation layer is located on the outer wall of the heating element.

15. The heating assembly according to claim 14, characterized in that The thickness of the anti-oxidation layer is 1 μm to 10 μm.

16. The heating assembly according to claim 1, wherein: The heating assembly comprises an electromagnetic induction coil, and the electromagnetic induction coil is located outside the heating element.

17. An aerosol generating device, characterized in that: The aerosol generating device comprises a heating assembly as claimed in any one of claims 1 to 16.

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