Silicon wafer cutting fluid feeding device

Abstract

The utility model discloses a silicon wafer cutting fluid feeding device which comprises a bottom plate and a diamond wire cutting machine, the diamond wire cutting machine is fixedly connected to the upper surface of the bottom plate, one side of the diamond wire cutting machine is fixedly connected with a placing seat used for placing a silicon wafer, one side of the placing seat is fixedly connected with a three-way pipe, and the other side of the placing seat is fixedly connected with a liquid outlet pipe. The two ends of the three-way pipe are fixedly connected with universal coiled pipes, the upper surface of the bottom plate is fixedly connected with a water pump, one end of a water outlet of the water pump is fixedly connected with a connecting pipe, the connecting pipe is communicated with the three-way pipe, and the upper surface of the bottom plate is fixedly connected with a tank body used for containing cutting fluid. According to the device, the diamond wire can be cooled, the temperature of the diamond wire is prevented from being too high, the silicon wafer cutting effect is improved, the spraying position of cutting liquid can be changed at will, the spraying effect of the cutting liquid is improved, impurities in the cutting liquid can be filtered out, and therefore the cutting liquid can be repeatedly used, and the cutting efficiency is improved. And the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cutting, in particular to a liquid feeding device for silicon wafer cutting fluid. Background Art

[0002] A silicon wafer cutting machine is mainly used for cutting metal materials and semiconductor substrate materials such as silicon, germanium, gallium arsenide, etc., and can process solar panels, silicon wafers, ceramic wafers, aluminum foil wafers, etc. The workpieces are fine and beautiful, and the cut edges are smooth, which can greatly improve the processing efficiency and optimize the processing effect.

[0003] The diamond wire cutting machine automatically controls the workbench to continuously feed towards the diamond wire control console, or controls the diamond wire control console to continuously feed towards the workbench, so that grinding occurs between the diamond wire and the object to be cut to form a cut. Since it is a friction cut, a large amount of heat will be generated during cutting. If it is in a high-temperature state for a long time, the cutting surface of the silicon wafer will be uneven, resulting in the silicon wafer being unusable and causing unnecessary economic losses. Content of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a liquid feeding device for silicon wafer cutting fluid is proposed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A liquid feeding device for silicon wafer cutting fluid, including a bottom plate and a diamond wire cutting machine. The diamond wire cutting machine is fixedly connected to the upper surface of the bottom plate. One side of the diamond wire cutting machine is fixedly connected with a placement seat for placing silicon wafers. One side of the placement seat is fixedly connected with a three-way pipe, and both ends of the three-way pipe are fixedly connected with universal serpentine pipes. The upper surface of the bottom plate is fixedly connected with a water pump. One end of the water outlet of the water pump is fixedly connected with a connecting pipe, and the connecting pipe is communicated with the three-way pipe. The upper surface of the bottom plate is fixedly connected with a tank body for containing cutting fluid. A water outlet is opened at the bottom of the tank body. The bottom of the tank body is fixedly connected with a water outlet pipe communicated with the water outlet, and the water outlet pipe is communicated with the water inlet of the water pump.

[0007] As a further scheme of the utility model, a collection groove is opened on the upper surface of the placement seat. One side of the placement seat is fixedly connected with a water inlet pipe communicated with the collection groove. The top of the tank body is provided with a top cover. The water inlet pipe passes through the top cover and is communicated with the inside of the tank body. A filtering component is arranged inside the tank body to filter the cutting fluid flowing back into the tank body.

[0008] As a further solution of the present utility model, the filtering assembly includes a filtering barrel which is arranged inside the tank body. Two clamping grooves are formed at the top of the tank body. At the position of the circumferential outer wall of the filtering barrel at the top, two symmetrically distributed T-shaped blocks are fixedly connected. The T-shaped blocks pass through the clamping grooves and move along the groove direction of the clamping grooves, so as to support the filtering barrel.

[0009] As a further solution of the present utility model, two symmetrically distributed clamping blocks are fixedly connected to the bottom of the top cover, and the clamping blocks are inserted into the clamping grooves, so as to resist the T-shaped blocks.

[0010] As a further solution of the present utility model, a fixing frame is fixedly connected to the upper surface of the top cover. A motor is fixedly connected inside the fixing frame. One end of the output shaft of the motor passes through the top cover and is fixedly connected with a transmission shaft. A U-shaped scraper is fixedly connected to the bottom end of the transmission shaft.

[0011] As a further solution of the present utility model, the U-shaped scraper is located inside the filtering barrel to scrape the inner wall of the filtering barrel.

[0012] As a further solution of the present utility model, the top cover is fixed to the tank body by bolts.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. Through the setting of the water pump, the water pump pumps out the cutting fluid in the tank body through the water outlet pipe, and then conveys the cutting fluid into the universal snake-shaped pipe through the connecting pipe and the three-way pipe, and sprays the cutting fluid onto the cutting position of the silicon wafer, so as to cool the diamond wire, avoid the too high temperature of the diamond wire, and improve the cutting effect of the silicon wafer.

[0015] 2. Through the setting of the universal snake-shaped pipe, the universal snake-shaped pipe can be bent at will to change the state of the universal snake-shaped pipe, so as to change the spraying position of the cutting fluid at will and improve the spraying effect of the cutting fluid.

[0016] 3. Through the setting of the filtering barrel, after the spraying of the cutting fluid is completed, the cutting fluid will return to the tank body through the water inlet pipe. At this time, the filtering barrel can filter the impurities in the cutting fluid, so that the cutting fluid can be reused, saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the front-side three-dimensional structural schematic diagram of the silicon wafer cutting fluid feeding device proposed by the present utility model;

[0018] Figure 2 It is the enlarged structural schematic diagram of part A of the silicon wafer cutting fluid feeding device proposed by the present utility model;

[0019] Figure 3Schematic diagram of the split structure of the tank body of the silicon wafer cutting fluid feeding device proposed by the present utility model;

[0020] Figure 4 Partial enlarged schematic diagram of the top cover of the silicon wafer cutting fluid feeding device proposed by the present utility model;

[0021] Figure 5 Schematic cross-sectional view of the tank body of the silicon wafer cutting fluid feeding device proposed by the present utility model.

[0022] In the figure: 1, water pump; 2, bottom plate; 3, placement seat; 4, water outlet pipe; 5, fixing frame; 6, diamond wire cutting machine; 7, collection tank; 8, universal flexible pipe; 9, connecting pipe; 10, three-way pipe; 11, water inlet pipe; 12, top cover; 13, tank body; 14, clamping block; 15, transmission shaft; 16, U-shaped scraper; 17, clamping groove; 18, water outlet; 19, filter barrel. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. The described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Refer to Figures 1 - 5 , the silicon wafer cutting fluid feeding device includes a bottom plate 2 and a diamond wire cutting machine 6. The diamond wire cutting machine 6 is fixed on the upper surface of the bottom plate 2 by bolts. One side of the diamond wire cutting machine 6 is fixed with a placement seat 3 for placing silicon wafers by bolts. One side of the placement seat 3 is fixed with a three-way pipe 10 by bolts. Universal flexible pipes 8 are welded to both ends of the three-way pipe 10. A water pump 1 is fixed on the upper surface of the bottom plate 2 by bolts. One end of the water outlet of the water pump 1 is fixed with a connecting pipe 9 by bolts, and the connecting pipe 9 is communicated with the three-way pipe 10. A tank body 13 for containing cutting fluid is fixed on the upper surface of the bottom plate 2 by bolts. A water outlet 18 is opened at the bottom of the tank body 13. A water outlet pipe 4 communicated with the water outlet 18 is fixed at the bottom of the tank body 13 by bolts, and the water outlet pipe 4 is communicated with the water inlet of the water pump 1. Place the silicon wafer on the placement seat 3, and then cut the silicon wafer by the diamond wire cutting machine 6. During the cutting process, the water pump 1 pumps out the cutting fluid in the tank body 13 through the water outlet pipe 4, and then the water pump 1 conveys the cutting fluid into the connecting pipe 9. Subsequently, the cutting fluid enters the two universal flexible pipes 8 through the three-way pipe 10 and sprays out from the universal flexible pipes 8, so as to be sprayed on the position where the silicon wafer is cut to cool the diamond wire and prevent the temperature of the diamond wire from being too high.

[0025] In the present utility model, a collection groove 7 is formed on the upper surface of the placement seat 3. A water inlet pipe 11 communicating with the collection groove 7 is welded to one side of the placement seat 3. A top cover 12 is provided at the top of the tank body 13. The water inlet pipe 11 passes through the top cover 12 and communicates with the inside of the tank body 13. The cutting fluid sprayed onto the silicon wafer cutting position will flow into the collection groove 7, and the cutting fluid entering the collection groove 7 will flow back into the tank body 13 through the water inlet pipe 11. A filtering component is provided in the tank body 13 to filter the cutting fluid flowing back into the tank body 13. The filtering component includes a filtering barrel 19. The filtering barrel 19 is arranged in the tank body 13. Two clamping grooves 17 are formed at the top of the tank body 13. Two symmetrically distributed T-shaped blocks are welded to the circumferential outer wall of the filtering barrel 19 at the top position. The T-shaped blocks pass through the clamping grooves 17 and move along the grooves of the clamping grooves 17, so that the filtering barrel 19 is supported. The cutting fluid entering the tank body 13 will enter the filtering barrel 19, and the filtering barrel 19 will filter the cutting fluid and screen out the impurities in the cutting fluid, so that the cutting fluid can be reused, saving costs.

[0026] Particularly, two symmetrically distributed clamping blocks 14 are welded to the bottom of the top cover 12, and the clamping blocks 14 are inserted into the clamping grooves 17 to resist the T-shaped blocks. Since the clamping blocks 14 resist the T-shaped blocks, the filtering barrel 19 can be prevented from moving. A fixing frame 5 is fixed to the upper surface of the top cover 12 by bolts. A motor is fixed in the fixing frame 5 by bolts. One end of the output shaft of the motor passes through the top cover 12 and is fixed to a transmission shaft 15 by bolts. The bottom end of the transmission shaft 15 is fixed to a U-shaped scraper 16 by bolts. The U-shaped scraper 16 is located inside the filtering barrel 19 and scrapes the inner wall of the filtering barrel 19. The motor drives the transmission shaft 15 to rotate, and the transmission shaft 15 drives the U-shaped scraper 16 to rotate, so that the U-shaped scraper 16 scrapes and cleans the inner wall of the filtering barrel 19, thus preventing impurities from adhering to the inner wall of the filtering barrel 19. The top cover 12 is fixed to the tank body 13 by bolts.

[0027] Working principle: When in use, place the silicon wafer on the placement seat 3, and then cut the silicon wafer by the diamond wire cutting machine 6. During the cutting process, the water pump 1 pumps out the cutting fluid in the tank body 13 through the water outlet pipe 4, and then conveys the cutting fluid into the connecting pipe 9 through the water pump 1. Subsequently, the cutting fluid enters the two universal snake-shaped pipes 8 through the three-way pipe 10 and sprays out from the universal snake-shaped pipes 8, thus spraying onto the silicon wafer cutting position to cool the diamond wire and prevent the diamond wire from being overheated, improving the cutting effect of the silicon wafer. The cutting fluid sprayed onto the silicon wafer cutting position will flow into the collection groove 7, and the cutting fluid entering the collection groove 7 will flow back into the tank body 13 through the water inlet pipe 11. The cutting fluid entering the tank body 13 will enter the filtering barrel 19, and the filtering barrel 19 will filter the cutting fluid and screen out the impurities in the cutting fluid, so that the cutting fluid can be reused, saving costs.

[0028] In addition, the terms "installed", "set up", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or constituent parts. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific circumstances.

Claims

1. A silicon wafer cutting liquid feeding device, comprising a base plate (2) and a diamond wire cutting machine (6), wherein the diamond wire cutting machine (6) is fixedly connected to the upper surface of the base plate (2), characterized in that: A placement seat (3) for placing silicon wafers is fixedly connected to one side of the diamond wire cutting machine (6), a three-way pipe (10) is fixedly connected to one side of the placement seat (3), and both ends of the three-way pipe (10) are fixedly connected to universal serpentine pipes (8). A water pump (1) is fixedly connected to the upper surface of the base plate (2), and a connecting pipe (9) is fixedly connected to one end of the water outlet of the water pump (1), and the connecting pipe (9) is connected to the three-way pipe (10). A tank body (13) for holding cutting fluid is fixedly connected to the upper surface of the base plate (2), and a water outlet (18) is provided at the bottom of the tank body (13), and a water outlet pipe (4) connected to the water outlet (18) is fixedly connected to the bottom of the tank body (13), and the water outlet pipe (4) is connected to the water inlet of the water pump (1).

2. The silicon wafer cutting liquid feeding device according to claim 1, characterized in that: The upper surface of the placement seat (3) is provided with a collecting groove (7); one side of the placement seat (3) is fixedly connected with a water inlet pipe (11) connected to the collecting groove (7); a top cover (12) is provided on the top of the tank body (13); the water inlet pipe (11) passes through the top cover (12) and is connected to the inside of the tank body (13); a filtering assembly is provided in the tank body (13) so that the cutting fluid flowing back into the tank body (13) is filtered.

3. The silicon wafer cutting liquid feeding device according to claim 2, characterized in that: The filter assembly comprises a filter barrel (19), the filter barrel (19) being arranged in a tank body (13), the top of the tank body (13) being provided with two clamping grooves (17), the circumferential outer wall of the filter barrel (19) being located at the top and being fixedly connected with two symmetrically distributed T-shaped blocks, the T-shaped blocks passing through the clamping grooves (17) and moving along the groove direction of the clamping grooves (17), so that the filter barrel (19) is supported.

4. The silicon wafer cutting liquid feeding device according to claim 3, characterized in that: Two symmetrically distributed clamping blocks (14) are fixedly connected to the bottom of the top cover (12), and the clamping blocks (14) are inserted into the clamping grooves (17) so that the T-shaped blocks are blocked.

5. The silicon wafer cutting liquid feeding device according to claim 4, characterized in that: The upper surface of the top cover (12) is fixedly connected to a fixing frame (5), a motor is fixedly connected inside the fixing frame (5), one end of the motor output shaft passes through the top cover (12) and is fixedly connected to a transmission shaft (15), and the bottom end of the transmission shaft (15) is fixedly connected to a U-shaped scraper (16).

6. The silicon wafer cutting liquid feeding device according to claim 5, characterized in that: The U-shaped scraper (16) is located in the filter barrel (19) and scrapes the inner wall of the filter barrel (19).

7. The silicon wafer cutting liquid feeding device according to claim 2, characterized in that: The top cover (12) is fixed to the tank body (13) by means of bolts.

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