Gantry electroplating shunting device

Abstract

The utility model discloses a gantry electroplating shunting device. The device comprises a flying bar; the number of the clamps is multiple, the multiple clamps are arranged on the flying bar, the clamps clamp PCBs, and the PCBs are located in the middle of the flying bar; the splitter plates are arranged at the two ends of the flying bar, each splitter plate comprises a transverse plate and a vertical plate, each vertical plate is connected with one end of the corresponding transverse plate, the vertical plates are perpendicular to the transverse plates, the splitter plates are of an L-shaped structure, the transverse plates are clamped by at least one clamp, and the vertical plates abut against the PCBs. The splitter plate is arranged to be of the L-shaped structure, so that the action area of the clamp and the splitter plate is prolonged, it can be guaranteed that the splitter plate abuts against the PCB, meanwhile, it can be guaranteed that the splitter plate is clamped by the clamp, the structure is simple, operation is easy and convenient, the splitter effect is enhanced, and copper plating uniformity is improved.

Description

Technical Field

[0001] This application relates to the technical field of PCB board production, and particularly to a gantry electroplating shunt device. Background Art

[0002] Since traditional gantry electroplating lines are still used in various PCB manufacturers (gradually being replaced by VCP), the PCBs in the high electroplating areas at both ends of the gantry electroplating line are prone to having a copper thickness exceeding the average copper thickness. In response to this, the industry shunts by clamping vertical strips on the clips near the production boards on both sides of the flying bar, and clamping horizontal strips on other clips to avoid blank plating. However, when producing boards of different sizes, the distances between the clips on both sides and the production board are inconsistent, resulting in gaps between the vertical strips and the production board, which affects the uniformity of copper plating. Utility Model Content

[0003] This application aims to at least solve one of the technical problems existing in the prior art. For this reason, this application proposes a gantry electroplating shunt device, which can not only ensure that the shunt plate is in contact with the PCB board, but also ensure that the clip clamps the shunt plate, with a simple structure, convenient operation, enhanced shunt effect, and improved uniformity of copper plating.

[0004] The gantry electroplating shunt device according to an embodiment of this application includes: a flying bar; a plurality of clips arranged on the flying bar, the clips holding a PCB board, and the PCB board being located in the middle of the flying bar; a shunt plate arranged at both ends of the flying bar, the shunt plate including a horizontal plate and a vertical plate, the vertical plate being connected to one end of the horizontal plate, and the vertical plate being perpendicular to the horizontal plate, so that the shunt plate has an L-shaped structure, and at least one clip clamps the horizontal plate, so that the vertical plate is in contact with the PCB board.

[0005] The gantry electroplating shunt device according to an embodiment of this application has at least the following beneficial effects: During gantry electroplating, the PCB board is clamped and fixed on the flying bar, the shunt plate is located at both ends of the flying bar, and the horizontal plate of the shunt plate is fixed by the clip, while the vertical plate of the shunt plate is in contact with the PCB board. By setting the shunt plate to have an L-shaped structure, the contact area between the clip and the shunt plate is extended, which can not only ensure that the shunt plate is in contact with the PCB board, but also ensure that the clip clamps the shunt plate, with a simple structure, convenient operation, enhanced shunt effect, and improved uniformity of copper plating.

[0006] In the gantry electroplating shunt device according to an embodiment of this application, the vertical plate includes a first vertical portion and a second vertical portion, the first vertical portion is connected to the horizontal plate, and the second vertical portion is slidably arranged with the first vertical portion, so that the vertical plate has a telescopic structure.

[0007] For the gantry electroplating shunt device according to an embodiment of the present application, the first vertical portion is provided with a fixing hole, the second vertical portion is provided with an elongated hole, and the fixing hole and the elongated hole are connected by a fastener.

[0008] For the gantry electroplating shunt device according to an embodiment of the present application, there are two fixing holes vertically arranged.

[0009] For the gantry electroplating shunt device according to an embodiment of the present application, the cross plate is clamped by two of the clips.

[0010] For the gantry electroplating shunt device according to an embodiment of the present application, the vertical plate is made of stainless steel material.

[0011] For the gantry electroplating shunt device according to an embodiment of the present application, the flying bar includes a cross beam and a copper row, the copper row is arranged below the cross beam, the copper row is connected to the cross beam, and the clip is arranged on the copper row.

[0012] For the gantry electroplating shunt device according to an embodiment of the present application, the clamping head of the clip is provided with a rubber sleeve.

[0013] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is a schematic structural diagram of the gantry electroplating shunt device according to an embodiment of the present application;

[0016] Figure 2 It is a first schematic structural diagram of the shunt plate in the gantry electroplating shunt device according to an embodiment of the present application;

[0017] Figure 3 It is a second schematic structural diagram of the shunt plate in the gantry electroplating shunt device according to an embodiment of the present application.

[0018] Description of the reference numerals:

[0019] Flying bar 100; cross beam 110; copper busbar 120; hook 130; clip 200; PCB board 210; shunt plate 300; horizontal plate 310; vertical plate 320; first vertical part 330; second vertical part 340; fixing hole 350; long hole 360; fastener 370. Detailed implementation mode

[0020] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0021] In the description of the present application, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0022] In the description of the present application, the meaning of several is one or more, the meaning of multiple is more than two, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0023] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation, connection and connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0024] The following combines Figures 1 to 3 , and makes a detailed description of the gantry electroplating shunt device of the present application.

[0025] Refer to Figures 1 to 3, an embodiment of the present application provides a gantry electroplating shunt device, including: a flying bar 100; a plurality of clips 200 arranged on the flying bar 100. The clips 200 hold a PCB board 210, and the PCB board 210 is located in the middle of the flying bar 100; a shunt plate 300 is arranged at both ends of the flying bar 100. The shunt plate 300 includes a horizontal plate 310 and a vertical plate 320. The vertical plate 320 is connected to one end of the horizontal plate 310, and the vertical plate 320 is perpendicular to the horizontal plate 310, so that the shunt plate 300 has an L-shaped structure. At least one clip 200 holds the horizontal plate 310, so that the vertical plate 320 abuts against the PCB board 210.

[0026] During gantry electroplating, the PCB board 210 is fixed on the flying bar 100 by clamping. The shunt plate 300 is located at both ends of the flying bar 100, and the horizontal plate 310 of the shunt plate 300 is fixed by the clip 200, while the vertical plate 320 of the shunt plate 300 abuts against the PCB board 210. By setting the shunt plate 300 to an L-shaped structure, the acting area between the clip 200 and the shunt plate 300 is extended, which can not only ensure the abutment between the shunt plate 300 and the PCB board 210, but also ensure that the clip 200 clamps the shunt plate 300. The structure is simple, the operation is convenient, the shunt effect is enhanced, and the uniformity of copper plating is improved.

[0027] Among them, the vertical plate 320 is made of stainless steel material. Specifically, the vertical plate 320 is made of 316 stainless steel material. By making the vertical plate 320 of stainless steel material, when the copper layer on the vertical plate 320 reaches a certain thickness, the vertical plate 320 can be centrally placed and the copper layer can be stripped off, and then returned for repeated use, realizing the recycling of resources, reducing production costs, and meeting the requirements of sustainable development.

[0028] Refer to Figures 1 to 3 , in this embodiment, the vertical plate 320 includes a first vertical portion 330 and a second vertical portion 340. The first vertical portion 330 is connected to the horizontal plate 310, and the second vertical portion 340 is slidably arranged with the first vertical portion 330, so that the vertical plate 320 has a telescopic structure. By slidably arranging the first vertical portion 330 and the second vertical portion 340, the vertical plate 320 has a telescopic structure, so that the length of the vertical plate 320 can be adjusted, which can better meet the requirements of PCB electroplating with different lengths and improve the shunt effect.

[0029] Specifically, the first vertical portion 330 is provided with fixing holes 350, and the second vertical portion 340 is provided with elongated holes 360. The fixing holes 350 and the elongated holes 360 are connected by fasteners 370. Among them, the fasteners 370 are set as screws. By rotating the screws, the first vertical portion 330 and the second vertical portion 340 can be loosened, the positions of the first vertical portion 330 and the second vertical portion 340 can be adjusted, and then the screws are rotated to fix the positions of the first vertical portion 330 and the second vertical portion 340. By adopting the above structure, it is convenient to realize the length adjustment of the vertical plate 320, the structure is simple, and the work efficiency is improved. Further, there are two fixing holes 350 arranged vertically, which can improve the connection stability and enhance the safety and reliability of the equipment.

[0030] It should be noted that the first vertical portion 330 can also be provided with a slide rail, then the second vertical portion 340 is provided with a chute, and the slide rail and the chute are connected in cooperation and locked by a locking member, so as to realize the sliding and fixing between the first vertical portion 330 and the second vertical portion 340.

[0031] For the sliding setting between the first vertical portion 330 and the second vertical portion 340, those skilled in the art can make a reasonable choice according to the actual situation, and this application does not limit this.

[0032] In this embodiment, the horizontal plate 310 is clamped by two clips 200, so that the vertical plate 320 is not easily detached and deformed during the production process, avoiding the scrapping caused by the overlap of the vertical plate 320 and the PCB board 210, and reducing the production cost.

[0033] Refer to Figure 1 , in some embodiments of the present application, the flying bar 100 includes a cross beam 110 and a copper bar 120. The copper bar 120 is arranged below the cross beam 110, the copper bar 120 is connected to the cross beam 110, and the clips 200 are arranged on the copper bar 120. Specifically, hooks 130 are arranged at both ends of the cross beam 110, and the hooks 130 are used to connect with external components, and both ends of the copper bar 120 are fixedly connected to the hooks 130. By providing the hooks 130, it is not only convenient to fix the flying bar 100, but also beneficial to the installation of the copper bar 120. The structure is simple and the operation is convenient. It can be imagined that the clamping heads of the clips 200 are provided with anti-slip patterns, which is beneficial to improving the clamping degree of the clips 200 and enhancing the stability and reliability of the equipment. Further, the clamping heads of the clips 200 are provided with rubber sleeves. By providing the rubber sleeves, it can prevent the clips 200 from scratching the PCB board 210 and ensure the product quality.

[0034] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0035] The embodiments of the present application have been described in detail above in conjunction with the accompanying drawings. However, the present application is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present application within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. Gantry electroplating diversion device, characterized in that, include: Flying Ba; A plurality of clips are provided, wherein the plurality of clips are arranged on the flybar, and the clips hold a PCB board, and the PCB board is located in the middle of the flybar; The diverter plate is arranged at both ends of the flybar, and the diverter plate includes a horizontal plate and a vertical plate. The vertical plate is connected to one end of the horizontal plate, and the vertical plate is vertically arranged to the horizontal plate, so that the diverter plate has an L-shaped structure. At least one of the clips clamps the horizontal plate so that the vertical plate abuts against the PCB board.

2. The gantry electroplating diversion device according to claim 1, characterized in that: The vertical plate includes a first vertical portion and a second vertical portion, the first vertical portion is connected to the horizontal plate, and the second vertical portion is slidably arranged with the first vertical portion, so that the vertical plate is a telescopic structure.

3. The gantry electroplating diversion device according to claim 2, characterized in that: The first vertical portion is provided with a fixing hole, and the second vertical portion is provided with an elongated hole, and the fixing hole and the elongated hole are connected by a fastener.

4. The gantry electroplating diversion device according to claim 3 is characterized in that: The fixing holes are two vertically arranged.

5. The gantry electroplating diversion device according to claim 1, characterized in that: The transverse plate is clamped by two clamps.

6. The gantry electroplating diversion device according to claim 5, characterized in that: The vertical plate is made of stainless steel.

7. The gantry electroplating diversion device according to claim 1, characterized in that: The flying bar comprises a crossbeam and a copper bar, wherein the copper bar is arranged below the crossbeam, the copper bar is connected to the crossbeam, and the clip is arranged on the copper bar.

8. The gantry electroplating diversion device according to claim 7, characterized in that: The clamping head of the clamp is provided with a rubber sleeve.

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