Inflation cooling device of circuit board copper plating equipment

Abstract

The utility model provides an inflating and cooling device of circuit board copper plating equipment. The inflating and cooling device comprises a copper plating tank body, an inflating pump, a heat exchanger, a water storage tank, a temperature sensor and cooling water supply equipment, an air outlet of the blast pump is connected with an air inlet of the heat exchanger through a first air pipe, an air outlet of the heat exchanger is connected with an air inlet in the bottom of the copper plating tank body through a second air pipe, the temperature sensor is installed on the second air pipe, and a water outlet of the cooling water supply device is connected with a water inlet of the heat exchanger through a first water pipe. A water outlet of the heat exchanger is connected with a water inlet of the water storage tank through a second water pipe. Compared with the prior art, the device has the advantages that compressed gas firstly enters the heat exchange tubes from the gas distribution cavity of the shell, cooling water enters the heat exchange cavity of the shell to be in contact with the exteriors of the heat exchange tubes, the cooling water and the compressed gas are subjected to rapid geothermal exchange, the compressed gas enters the gas collection cavity after being cooled, and finally the compressed gas is conveyed to a copper plating tank body. The temperature sensor detects the temperature of the cooled compressed gas.

Description

Technical Field

[0001] The utility model relates to circuit board copper plating equipment, in particular to an air pumping cooling device for the circuit board copper plating equipment. Background Art

[0002] Copper plating of circuit boards can be divided into copper sinking, primary copper, and secondary copper. Copper sinking is the abbreviation of chemical copper plating, also called plated through hole. It refers to the deposition of a thin layer of chemical copper on the non-conductive hole wall substrate that has been drilled by chemical methods to serve as the base for the subsequent electroplated copper. Primary copper, also known as full-board electroplating, or board electroplating, is used to protect the thin chemical copper that has just been deposited, that is, to plate a layer of copper on the entire board surface and hole wall by electroplating, in order to increase the thickness of the copper layer on the board surface and hole wall to meet customer requirements. Secondary copper, also known as graphic electroplating, or graphic electroplating, is the process of protecting the parts of the circuit board that do not need to be electroplated with copper with a dry film after the image is transferred, and plating the exposed parts that need to be copper-plated with a sufficient thickness of copper, and then plating tin as an anti-corrosion agent.

[0003] The utility model patent document with announcement number CN202705535U discloses a circuit board copper electroplating device, which specifically includes a trough body, a titanium basket installed on two opposite side walls of the trough body for containing anode materials, and a floating target for fixing cathode materials. It also includes a filter water absorption box, an air pump and a nozzle arranged at the bottom of the trough body, and an air pump and a filter arranged outside the trough body. The filter water absorption box and the nozzle are arranged at the bottom of the trough body and are respectively connected to the filter, and the air pipe is connected to the air pump.

[0004] The compressed gas output by the air pump enters the copper plating tank through the air pipe, effectively circulates the copper plating tank solution, forms a turbulent state, and stirs the tank solution more evenly to avoid precipitation of the solution solution. However, the temperature of the gas will increase after being compressed by the air pump. The compressed gas output by the air pump directly delivered to the copper plating tank will increase the temperature of the solution in the tank, which is not conducive to the temperature control of the copper plating of the circuit board.

[0005] Therefore, how to cool the gas output by the air pump first and then transport it to the copper-plated tank body is a technical problem that needs to be urgently solved in this field. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide an air-pumping cooling device for circuit board copper plating equipment, wherein the gas output by the air pump is first cooled and then transported to the copper plating tank.

[0007] The utility model is implemented as follows: an air pumping cooling device for a circuit board copper plating device comprises:

[0008] Copper-plated tank, air pump, heat exchanger, water storage tank, temperature sensor and cooling water supply equipment;

[0009] The air outlet of the air pump is connected to the air inlet of the heat exchanger through a first air pipe. The air outlet of the heat exchanger is connected to the bottom air inlet of the copper plating tank body through a second air pipe. The temperature sensor is installed on the second air pipe. The water outlet of the cooling water supply device is connected to the water inlet of the heat exchanger through a first water pipe. The water outlet of the heat exchanger is connected to the water inlet of the water storage tank through a second water pipe;

[0010] The heat exchanger includes a shell, a left partition board, a right partition board and heat exchange tubes. The left partition board and the right partition board are both fixedly arranged in the inner cavity of the shell. The inner cavity of the shell is divided into an air distribution cavity, a heat exchange cavity and a gas collection cavity. The left partition board is provided with a left through hole, and the right partition board is provided with a right through hole. The left end of the heat exchange tube is connected to the left through hole, and the right end of the heat exchange tube is connected to the right through hole. There are multiple heat exchange tubes, left through holes and right through holes;

[0011] The air inlet of the heat exchanger is arranged in the air distribution cavity, the air outlet of the heat exchanger is arranged in the gas collection cavity, and the water inlet and the water outlet of the heat exchanger are both arranged in the heat exchange cavity.

[0012] Further, it further includes: a switch valve. The cooling water supply device is a tap water pipe, and the switch valve is installed on the first water pipe.

[0013] Further, it further includes: an electric control valve. The electric control valve is installed on the first water pipe, and the switch valve is an electromagnetic valve.

[0014] Further, it further includes: a hot water washing tank. The hot water washing tank is connected to the water storage tank through a third water pipe.

[0015] Further, it further includes: a check valve. The check valve is installed on the second air pipe.

[0016] The advantages of the present utility model are as follows: 1. The compressed gas coming out of the air pump enters the heat exchanger for cooling. The compressed gas first enters the interior of multiple heat exchange tubes in the air distribution cavity of the shell. The cooling water enters the heat exchange cavity of the shell and contacts the outside of multiple heat exchange tubes. The cooling water and the compressed gas conduct rapid heat exchange. After the compressed gas is cooled and temperature-reduced, it enters the gas collection cavity and is finally transported to the copper plating tank body. The temperature sensor detects the temperature of the compressed gas after cooling. While the compressed gas stirs the solution in the tank body, it effectively reduces the influence on the temperature of the solution in the tank body. 2. By changing the flow rate of the cooling water entering the heat exchanger through the electric control valve, the temperature of the cooled compressed gas can be adjusted. 3. After the water comes out of the heat exchanger, its temperature rises and enters the water storage tank for recycling and reuse, and is used for the hot water washing process in the production of circuit boards. Description of the Drawings

[0017] The present utility model will be further described below in conjunction with embodiments with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic structural diagram of an air injection cooling device for a circuit board copper plating device of the present utility model.

[0019] Figure 2 It is a schematic internal structure diagram of a heat exchanger in the present utility model.

[0020] Figure 3 is Figure 2 A cross-sectional view taken along the A-A direction of

[0021] Reference numerals: copper plating tank body 1; air injection pump 2; heat exchanger 3; housing 31; gas distribution cavity 311; heat exchange cavity 312; gas collection cavity 313; air inlet 314; air outlet 315; water inlet 316; water outlet 317; left partition 32; left through hole 321; right partition 33; right through hole 331; heat exchange tube 34; water storage tank 4; temperature sensor 5; cooling water supply device 6; first air pipe 7; second air pipe 8; check valve 81; first water pipe 9; switch valve 91; electric regulating valve 92; second water pipe 10; circuit board 11; plating overhead crane 12. Specific embodiments

[0022] The embodiment of the present utility model provides an air injection cooling device for a circuit board copper plating device, which overcomes the defect that the compressed gas output by the air injection pump is directly transported to the copper plating tank body, which will cause the temperature of the solution in the tank body to rise; it realizes that the gas output by the air injection pump is first cooled and then transported to the copper plating tank body. While the compressed gas stirs the solution in the tank body, it effectively reduces the influence on the temperature of the solution in the tank body.

[0023] The general idea of the technical solution of the embodiment of the present utility model is as follows:

[0024] The compressed gas coming out of the air injection pump is first cooled by the heat exchanger and then transported to the copper plating tank body. The inner cavity of the housing of the heat exchanger is divided into a gas distribution cavity, a heat exchange cavity, and a gas collection cavity. The compressed gas first enters the inside of a plurality of heat exchange tubes in the gas distribution cavity of the housing, and the cooling water enters the heat exchange cavity of the housing and contacts the outside of the plurality of heat exchange tubes. The cooling water and the compressed gas perform rapid heat exchange. After the compressed gas is cooled and its temperature drops, it enters the gas collection cavity and is finally transported to the copper plating tank body. It can be realized that the temperature of the cooled compressed gas is the same as the temperature of the solution in the tank body. While the compressed gas stirs the solution in the tank body, it does not change the temperature of the solution in the tank body.

[0025] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings of the specification and specific embodiments.

[0026] Refer to Figures 1 to 3 , a preferred embodiment of the present utility model.

[0027] An air injection and cooling device for a circuit board copper plating equipment, comprising:

[0028] A copper plating tank body 1, an air injection pump 2, a heat exchanger 3, a water storage tank 4, a temperature sensor 5 and a cooling water supply device 6;

[0029] The air outlet 315 of the air injection pump 2 is connected to the air inlet 314 of the heat exchanger 3 through a first air pipe 7, the air outlet 315 of the heat exchanger 3 is connected to the bottom air inlet 314 of the copper plating tank body 1 through a second air pipe 8, the temperature sensor 5 is installed on the second air pipe 8, the water outlet 317 of the cooling water supply device 6 is connected to the water inlet 316 of the heat exchanger 3 through a first water pipe 9, and the water outlet 317 of the heat exchanger 3 is connected to the water inlet 316 of the water storage tank 4 through a second water pipe 10;

[0030] The heat exchanger 3 includes a housing 31, a left partition 32, a right partition 33 and heat exchange tubes 34. The left partition 32 and the right partition 33 are both fixedly arranged in the inner cavity of the housing 31. The inner cavity of the housing 31 is divided into an air distribution cavity 311, a heat exchange cavity 312 and a gas collection cavity 313. The left partition 32 is provided with a left through hole 321, the right partition 33 is provided with a right through hole 331. The left end of the heat exchange tube 34 is connected to the left through hole 321, the right end of the heat exchange tube 34 is connected to the right through hole 331, and there are multiple heat exchange tubes 34, left through holes 321 and right through holes 331;

[0031] The air inlet 314 of the heat exchanger 3 is arranged in the air distribution cavity 311, the air outlet 315 of the heat exchanger 3 is arranged in the gas collection cavity 313, and the water inlet 316 and the water outlet 317 of the heat exchanger 3 are both arranged in the heat exchange cavity 312.

[0032] Compared with the background technology, the compressed gas coming out of the air injection pump 2 of the present utility model enters the heat exchanger 3 for cooling. The compressed gas first enters the interior of multiple heat exchange tubes 34 in the air distribution cavity 311 of the housing 31. The cooling water enters the heat exchange cavity 312 of the housing 31 and contacts the outside of multiple heat exchange tubes 34. The cooling water and the compressed gas perform rapid heat exchange. After the compressed gas is cooled and its temperature drops, it enters the gas collection cavity 313 and is finally transported to the copper plating tank body 1. The temperature sensor 5 detects the temperature of the compressed gas after cooling, and while the compressed gas stirs the solution in the tank body, it effectively reduces the influence on the temperature of the solution in the tank body.

[0033] The water inlet 316 and the water outlet 317 of the heat exchanger 3 are as Figure 2As shown in the figure, it is set diagonally to increase the flow path of water; multiple heat exchange tubes 34 are spaced apart, and cooling water enters the heat exchange chamber 312 of the housing 31 and covers the outside of the heat exchange tubes 34 to improve the cooling speed. The heat exchanger 3 can be made of metal materials. The temperature sensor 5 detects the temperature of the compressed gas after cooling and displays it on the display screen, facilitating the staff to understand the temperature of the compressed gas after cooling.

[0034] It further includes: a switching valve 91. The cooling water supply device 6 is a tap water pipe, and the switching valve 91 is installed on the first water pipe 9. The beneficial effect of this technical solution is that tap water is used to cool the compressed gas, with low cost;

[0035] It further includes: an electric control valve 92. The electric control valve 92 is installed on the first water pipe 9, and the switching valve 91 is a solenoid valve. The beneficial effect of this technical solution is that the flow rate of the cooling water entering the heat exchanger 3 is changed through the electric control valve 92, thereby adjusting the temperature of the compressed gas after cooling. It can achieve that the temperature of the compressed gas after cooling is the same as the temperature of the solution in the tank body. While the compressed gas stirs the solution in the tank body, the temperature of the solution in the tank body remains unchanged.

[0036] It further includes: a hot water washing tank (not shown), and the hot water washing tank is connected to the water storage tank 4 through a third water pipe. The beneficial effect of this technical solution is that it can achieve that the temperature of the compressed gas after cooling is the same as the temperature of the solution in the tank body. While the compressed gas stirs the solution in the tank body, the temperature of the solution in the tank body remains unchanged. The hot water washing tank is a product of the prior art, and reference can be made to the technical solution of the utility model patent document "A Post-treatment Device for a Printed Circuit Board Tin Immersion Line" with the publication number CN 102166573B.

[0037] It further includes: a one-way valve 81. The one-way valve 81 is installed on the second air pipe 8. The beneficial effect of this technical solution is that the compressed gas after cooling is transported to the copper plating tank body 1 through the one-way valve 81, and the one-way valve 81 prevents the solution in the copper plating tank body 1 from flowing back to the heat exchanger 3.

[0038] The working mode of the air injection cooling device of the printed circuit board copper plating equipment of the present utility model:

[0039] In the graphic electroplating process, the printed circuit board 11 is clamped by the existing graphic plating overhead crane 12 and immersed in the solution of the copper plating tank body 1. The air injection pump 2 is started, and the solenoid valve and the electric control valve 92 located on the first water pipe 9 are opened. Compressed gas and tap water both enter the heat exchanger 3. The compressed gas after cooling enters the copper plating tank body 1 to stir the solution in the tank body, preventing the chemical solution from precipitating. The water temperature rising after coming out of the heat exchanger 3 enters the water storage tank 4 for recycling and reuse, and is used for the hot water washing process in the production of printed circuit boards.

[0040] Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments we described are illustrative rather than used to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered by the scope protected by the claims of the present invention.

Claims

1. An air cooling device for a circuit board copper plating device, characterized in that: include: Copper-plated tank, air pump, heat exchanger, water storage tank, temperature sensor and cooling water supply equipment; The air outlet of the air pump is connected to the air inlet of the heat exchanger through a first air pipe, the air outlet of the heat exchanger is connected to the bottom air inlet of the copper-plated tank through a second air pipe, the temperature sensor is installed on the second air pipe, the water outlet of the cooling water supply device is connected to the water inlet of the heat exchanger through a first water pipe, and the water outlet of the heat exchanger is connected to the water inlet of the water storage tank through a second water pipe; The heat exchanger comprises a shell, a left partition, a right partition and a heat exchange tube. The left partition and the right partition are fixedly arranged in the inner cavity of the shell. The inner cavity of the shell is divided into a gas-distributing cavity, a heat exchange cavity and a gas collecting cavity. The left partition is provided with a left through hole, and the right partition is provided with a right through hole. The left end of the heat exchange tube is connected to the left through hole, and the right end of the heat exchange tube is connected to the right through hole. There are multiple heat exchange tubes, left through holes and right through holes. The air inlet of the heat exchanger is arranged in the air distribution cavity, the air outlet of the heat exchanger is arranged in the air collection cavity, and the water inlet and water outlet of the heat exchanger are both arranged in the heat exchange cavity.

2. The air cooling device for circuit board copper plating equipment according to claim 1, characterized in that: Also includes: Switch valve, the cooling water supply equipment is a tap water pipe, and the switch valve is installed on the first water pipe.

3. The air cooling device for circuit board copper plating equipment according to claim 2, characterized in that: Also includes: An electric regulating valve is installed on the first water pipe, and the switch valve is a solenoid valve.

4. The air cooling device for circuit board copper plating equipment according to claim 1, characterized in that: Also includes: A hot water washing tub is connected to the water storage tank via a third water pipe.

5. The air-pumping cooling device for circuit board copper plating equipment according to claim 1, characterized in that: Also includes: A one-way valve is installed on the second air pipe.

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