Wafer thickness measuring device

Abstract

The utility model discloses a wafer thickness measuring device which comprises a first driving assembly, a tray, a thickness measuring instrument, a driving structure used for driving the thickness measuring instrument to move and a mounting rack, the first driving assembly is mounted on the mounting rack, and an output shaft of the first driving assembly penetrates through the mounting rack to be connected with the tray. The tray is mounted on the mounting frame to drive the tray to rotate, the driving structure is mounted on the mounting frame, and the thickness measuring instrument is connected with the driving structure to be suspended above the tray. According to the utility model, by adopting a non-contact measurement mode, the problem that the surface of the wafer is possibly scratched or damaged in a traditional contact measurement method can be effectively avoided, errors caused by manual operation are reduced, and the consistency and reliability of measurement are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thickness measurement, in particular to a wafer thickness measurement device. Background Art

[0002] The thickness of a wafer is an important inspection index in the semiconductor field. During the polishing process of the wafer, it is necessary to inspect the thickness of the wafer. Currently, when inspecting the thickness, a single wafer is placed in a height gauge, and the contact point of a micrometer is used to contact the wafer to measure the height of the wafer. Since the contact point of the micrometer contacts the wafer, different operating methods of the operator can easily leave scratches on the wafer surface, easily cause scratches and damages on the wafer surface, resulting in defective wafers. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is that currently, when inspecting the thickness, a single wafer is placed in a height gauge, which easily leaves scratches on the wafer surface, easily causes scratches and damages on the wafer surface, resulting in defective wafers.

[0004] To solve the above technical problem, the utility model provides a wafer thickness measurement device, which includes a first driving component, a tray, a thickness measuring instrument, a driving structure for driving the movement of the thickness measuring instrument, and a mounting rack. The first driving component is installed on the mounting rack, and the output shaft of the first driving component passes through the mounting rack and is connected to the tray to drive the tray to rotate. The driving structure is installed on the mounting rack, and the thickness measuring instrument is connected to the driving structure to be suspended above the tray.

[0005] Further, the driving structure includes a second driving component and a third driving component. One side of the second driving component is installed on the mounting rack, and the other side of the second driving component is connected to one side of the third driving component to drive the third driving component to move in a first direction. The other side of the third driving component is connected to the thickness measuring instrument to drive the thickness measuring instrument to move in a second direction. The first direction and the second direction are perpendicularly arranged.

[0006] Further, the second driving component includes a first driving member, a first guide rail, and a first slider. The first slider is slidably installed on the first guide rail, and the third driving component is installed on the first slider. The first driving member is connected to the first slider to drive the first slider to slide along the length direction of the first guide rail.

[0007] Further, the third driving assembly includes a first connecting frame, a second slider, a second guide rail, a driving shaft, a locking piece and a second connecting frame, the first connecting frame is connected to the second driving assembly, the second guide rail is installed on the first connecting frame, the second slider is slidably installed on the second guide rail, the driving shaft is arranged perpendicular to the sliding direction of the second slider, and the driving shaft passes through the second guide rail and is connected to the second slider to drive the second slider to slide by rotating the driving shaft, the locking piece passes through the second guide rail and is connected to the second slider to lock the second slider, the second connecting frame is connected to the second slider, and the thickness measuring instrument is installed on the second connecting frame.

[0008] Furthermore, the first driving assembly includes a second driving member, and the second driving member passes through the mounting frame and is connected to the tray.

[0009] Furthermore, the tray includes a chassis and a protective cover, the protective cover is installed on the chassis, and the protective cover and the chassis enclose a containing space for placing the ceramic plate, and the containing space is open on a side facing the thickness measuring instrument.

[0010] Furthermore, the chassis includes a main body and a raised portion, wherein the raised portion is connected to the main body and surrounds a peripheral side of the main body to form a groove structure.

[0011] Furthermore, the protective cover includes a first branch, a second branch and a third branch connected in sequence, the first branch is connected to the raised portion, the second branch is vertically arranged to the first branch, the second branch is vertically arranged to the third branch, and the projection portion of the groove structure in the second direction overlaps with the third branch.

[0012] Furthermore, the protective cover has a notch to form a feed inlet of the accommodating space.

[0013] Furthermore, the mounting frame includes a first bracket, a second bracket and a foot cup, the first bracket is mounted on the second bracket, the foot cup is mounted on a side of the second bracket away from the first bracket, the first drive assembly is connected to the second bracket, and the drive structure is connected to the first bracket.

[0014] Compared with the prior art, the wafer thickness measuring device of the utility model has the following beneficial effects:

[0015] The embodiment of the utility model can effectively avoid the problem of wafer surface scratches or damages that may occur in traditional contact measurement methods by adopting a non-contact measurement method, reduce errors caused by human operation, and improve the consistency and reliability of measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a wafer thickness measuring device provided by an embodiment of the present utility model;

[0017] Figure 2 is a schematic structural diagram of a driving structure and a thickness measuring instrument provided by an embodiment of the present utility model;

[0018] Figure 3 is a schematic structural diagram of a tray provided by an embodiment of the present utility model;

[0019] In the figure, 1 is a first driving assembly; 11 is a second driving member; 2 is a tray; 21 is a chassis; 211 is a main body part; 212 is a convex part; 22 is a protective cover; 221 is a first branch; 222 is a second branch; 223 is a third branch; 3 is a thickness measuring instrument; 4 is a driving structure; 41 is a second driving assembly; 411 is a first driving member; 412 is a first guide rail; 413 is a first slider; 42 is a third driving assembly; 421 is a first connecting frame; 422 is a second slider; 423 is a second guide rail; 424 is a driving shaft; 425 is a locking member; 426 is a second connecting frame; 5 is a mounting frame; 51 is a first bracket; 52 is a second bracket; 53 is a foot cup. Detailed implementation manners

[0020] The following combines the accompanying drawings and embodiments to further describe in detail the specific implementation manners of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0021] As Figure 1 shown, the present utility model provides a wafer thickness measuring device, including a first driving assembly 1, a tray 2, a thickness measuring instrument 3, a driving structure 4 for driving the thickness measuring instrument 3 to move, and a mounting frame 5. The first driving assembly 1 is installed on the mounting frame 5, and the output shaft of the first driving assembly 1 passes through the mounting frame 5 and is connected to the tray 2 to drive the tray 2 to rotate. The driving structure 4 is installed on the mounting frame 5, and the thickness measuring instrument 3 is connected to the driving structure 4 to be suspended above the tray 2.

[0022] The first driving assembly 1 in this embodiment is used to drive the tray 2 to rotate, so that the wafers placed on the tray 2 can be sequentially moved to the designated positions for measurement. The thickness measuring instrument 3 can be an optical measurement or laser interference measurement device, etc., to avoid damage caused by directly contacting the wafer surface. The driving structure 4 is used to drive the thickness measuring instrument 3 to move along a predetermined trajectory to ensure that the thickness measuring instrument 3 can move smoothly and accurately above the tray 2 for focusing. In this embodiment, by automatically driving the rotation of the tray 2 and the movement of the thickness measuring instrument 3, the light spot of the thickness measuring instrument 3 reaches the wafer, so as to measure the thickness of the wafer.

[0023] Based on the above structure, by adopting a non-contact measurement method, it is possible to effectively avoid the problems of wafer surface scratches or damages that may occur in traditional contact measurement methods, reduce the errors caused by manual operations, and improve the consistency and reliability of measurement.

[0024] As Figure 2 shown, the driving structure 4 includes a second driving component 41 and a third driving component 42. One side of the second driving component 41 is mounted on the mounting bracket 5, and the other side of the second driving component 41 is connected to one side of the third driving component 42 to drive the third driving component 42 to move along the first direction. The other side of the third driving component 42 is connected to the thickness measuring instrument 3 to drive the thickness measuring instrument 3 to move along the second direction. The first direction and the second direction are perpendicularly arranged.

[0025] In this embodiment, through the combination of the second driving component 41 and the third driving component 42, the thickness measuring instrument 3 can freely move in two mutually perpendicular directions, so that more accurate focus adjustment can be achieved. When the wafer is placed on the tray 2, the second driving component 41 drives the third driving component 42 to move along the X-axis direction (i.e., the first direction), and the third driving component 42 further drives the thickness measuring instrument 3 to move along the Y-axis direction (i.e., the second direction) to adjust the focus. By controlling the tray 2 to rotate at a specified angle through the first driving component 1, the light spot of the thickness measuring instrument 3 reaches the wafer, thereby measuring the thickness of the wafer.

[0026] Furthermore, the second driving component 41 includes a first driving member 411, a first guide rail 412, and a first slider 413. The first slider 413 is slidably mounted on the first guide rail 412, and the third driving component 42 is mounted on the first slider 413. The first driving member 411 is connected to the first slider 413 to drive the first slider 413 to slide along the length direction of the first guide rail 412.

[0027] Based on the above structure, driven by the first driving member 411, the first slider 413 slides along the first guide rail 412 and drives the third driving component 42 to move along the first direction. At the same time, the third driving component 42 itself can also drive the thickness measuring instrument 3 to move along the second direction perpendicular to the first direction. Through the combination of the second driving component 41 and the third driving component 42, the thickness measuring instrument 3 can freely move in two mutually perpendicular directions.

[0028] Further, the third driving component 42 includes a first connecting frame 421, a second slider 422, a second guide rail 423, a driving shaft 424, a locking member 425, and a second connecting frame 426. The first connecting frame 421 is connected to the second driving component 41. The second guide rail 423 is installed on the first connecting frame 421, providing a guiding path for the second slider 422 to ensure its smooth movement along a predetermined direction. The second slider 422 is slidably installed on the second guide rail 423. The driving shaft 424 is arranged perpendicular to the sliding direction of the second slider 422, and the driving shaft 424 passes through the second guide rail 423 and is connected to the second slider 422 to drive the second slider 422 to slide by rotating the driving shaft 424. The locking member 425 passes through the second guide rail 423 and is connected to the second slider 422 to lock the second slider 422. The second connecting frame 426 is connected to the second slider 422, and the thickness gauge 3 is installed on the second connecting frame 426. In this embodiment, the linear displacement of the second slider 422 can be controlled by rotating the driving shaft 424, and the second slider 422 can be fixed when the slider does not need to move by the locking member 425, increasing the stability of the system.

[0029] Further, the first driving component 1 includes a second driving member 11. The second driving member 11 passes through the mounting frame 5 and is connected to the tray 2 for directly driving the tray 2 to rotate. When the second driving member 11 is started, its output shaft rotates, drives the tray 2 to rotate together through the connection with the tray 2, and the wafer placed on the tray 2 can be brought to a specified position for thickness measurement by rotating the tray 2. The second driving member 11 in this embodiment adopts a servo motor to achieve automatic operation and reduce the error caused by human intervention.

[0030] As Figure 3 shown, the tray 2 includes a chassis 21 and a protective cover 22. The chassis 21 is used to carry and support the wafer. The protective cover 22 is installed on the chassis 21, and the protective cover 22 and the chassis 21 enclose a receiving space for placing the ceramic disc, preventing the ceramic disc from hitting the thickness gauge 3 when it is vertically picked up. The side of the receiving space facing the thickness gauge 3 is open, facilitating the probe of the thickness gauge 3 to measure the thickness of the wafer in this space.

[0031] When the tray 2 rotates driven by the first driving component 1, different positions of the wafer will sequentially pass under the thickness gauge 3, performing non-contact thickness measurement on different positions of the wafer and thickness measurement on different wafers, which not only improves the measurement accuracy and efficiency but also effectively protects the wafer from damage.

[0032] Furthermore, the chassis 21 includes a main body 211 and a raised portion 212. The raised portion 212 is connected to the main body 211 and surrounds the peripheral side of the main body 211 to form a groove structure for fixing and positioning the ceramic disk. The groove structure can effectively fix the position of the ceramic disk and prevent the ceramic disk from moving during the rotation or measurement of the tray 2.

[0033] Furthermore, the protective cover 22 includes a first branch 221, a second branch 222 and a third branch 223 which are connected in sequence. The first branch 221 is connected to the protrusion 212 for fixing the protective cover 22. The second branch 222 is vertically arranged with the first branch 221 to constitute the side of the protective cover 22. The second branch 222 and the third branch 223 are vertically arranged to constitute the top surface of the protective cover 22, and the projection part of the groove structure in the second direction overlaps with the third branch 223. When the chip is placed on the chassis 21, the protective cover 22 can not only better protect the edge of the chip from being affected by external factors, but also prevent the ceramic disk from being picked up vertically and hitting the thickness measuring instrument 3.

[0034] Furthermore, the protective cover 22 has a notch to form a feed port of the accommodating space, which is convenient for the operator to place the wafer on the tray 2. Similarly, the notch is also an exit for the wafer to be taken out of the tray 2, which is convenient for taking out the wafer after the operation is completed, so that the operator can easily put in or take out the wafer, simplifying the operation process.

[0035] Furthermore, the mounting frame 5 includes a first bracket 51, a second bracket 52 and a foot cup 53. The first bracket 51 is installed on the second bracket 52, and the foot cup 53 is installed on the side of the second bracket 52 away from the first bracket 51, for supporting the entire mounting frame 5 and adjusting the horizontality. The first drive component 1 is connected to the second bracket 52, ensuring the stability of the first drive component 1 during operation, thereby ensuring the smooth rotation of the tray 2. The second drive component 41 is connected to the first bracket 51, ensuring the stability of the second drive component 41 during operation, thereby ensuring the smooth movement of the thickness measuring instrument 3.

[0036] In summary, the embodiment of the utility model provides a wafer thickness measuring device, which can effectively avoid the problem of wafer surface scratches or damage that may occur in traditional contact measurement methods by adopting a non-contact measurement method, reduce errors caused by human operation, and improve the consistency and reliability of measurement.

[0037] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A wafer thickness measuring device, characterized in that: The invention comprises a first driving component, a tray, a thickness measuring instrument, a driving structure for driving the thickness measuring instrument to move, and a mounting frame, wherein the first driving component is mounted on the mounting frame, the output shaft of the first driving component passes through the mounting frame and is connected to the tray to drive the tray to rotate, the driving structure is mounted on the mounting frame, and the thickness measuring instrument is connected to the driving structure to be suspended above the tray.

2. The wafer thickness measuring device according to claim 1, characterized in that: The driving structure includes a second driving component and a third driving component, one side of the second driving component is installed on the mounting frame, and the other side of the second driving component is connected to one side of the third driving component to drive the third driving component to move along a first direction, and the other side of the third driving component is connected to the thickness measuring instrument to drive the thickness measuring instrument to move along a second direction, and the first direction is perpendicular to the second direction.

3. The wafer thickness measuring device according to claim 2, characterized in that: The second driving component includes a first driving member, a first guide rail and a first slider, the first slider is slidably installed on the first guide rail, and the third driving component is installed on the first slider, the first driving member is connected to the first slider to drive the first slider to slide along the length direction of the first guide rail.

4. The wafer thickness measuring device according to claim 2, characterized in that: The third driving assembly includes a first connecting frame, a second slider, a second guide rail, a driving shaft, a locking piece and a second connecting frame. The first connecting frame is connected to the second driving assembly, the second guide rail is installed on the first connecting frame, the second slider is slidably installed on the second guide rail, the driving shaft is arranged perpendicular to the sliding direction of the second slider, and the driving shaft passes through the second guide rail and is connected to the second slider to drive the second slider to slide by rotating the driving shaft, the locking piece passes through the second guide rail and is connected to the second slider to lock the second slider, the second connecting frame is connected to the second slider, and the thickness measuring instrument is installed on the second connecting frame.

5. The wafer thickness measuring device according to claim 1, characterized in that: The first driving assembly includes a second driving member, and the second driving member passes through the mounting frame and is connected to the tray.

6. The wafer thickness measuring device according to claim 2, characterized in that: The tray includes a chassis and a protective cover, wherein the protective cover is installed on the chassis, and the protective cover and the chassis enclose a containing space for placing the ceramic plate, and the containing space is open on one side facing the thickness measuring instrument.

7. The wafer thickness measuring device according to claim 6, characterized in that: The chassis includes a main body and a raised portion, wherein the raised portion is connected to the main body and surrounds the peripheral side of the main body to form a groove structure.

8. The wafer thickness measuring device according to claim 7, characterized in that: The protective cover includes a first branch, a second branch and a third branch connected in sequence, the first branch is connected to the raised portion, the second branch is vertically arranged with the first branch, the second branch is vertically arranged with the third branch, and the projection portion of the groove structure in the second direction overlaps with the third branch.

9. The wafer thickness measuring device according to claim 6, characterized in that: The protective cover has a notch to form a feed inlet of the accommodating space.

10. The wafer thickness measuring device according to claim 1, characterized in that: The mounting frame includes a first bracket, a second bracket and a foot cup, the first bracket is mounted on the second bracket, the foot cup is mounted on a side of the second bracket away from the first bracket, the first drive assembly is connected to the second bracket, and the drive structure is connected to the first bracket.

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