Infrared temperature measuring device outputting 0-10V

Abstract

The utility model relates to the technical field of infrared temperature measurement, and discloses an infrared temperature measurement device outputting 0-10V, which comprises a voltage conversion circuit, a voltage amplification circuit, a CPU circuit and an infrared temperature measurement probe, the voltage conversion circuit is respectively connected with the CPU circuit and the infrared temperature measurement probe, the CPU circuit is connected with the infrared temperature measurement probe and the voltage amplification circuit, and the voltage amplification circuit is connected with the voltage conversion circuit. The voltage amplification circuit is further connected with a power supply, the power supply is connected with the voltage conversion circuit, and the device has the advantages of being simple in structure and convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared temperature measurement, specifically, an infrared temperature measurement device that outputs 0-10V. Background Art

[0002] Infrared temperature measurement is a technology based on the theory of thermal radiation. The temperature of an object is related to the energy radiated by its own surface. The higher the surface temperature of the object, the greater the radiated energy. It uses the relationship between infrared radiation and the temperature of an object to measure the surface temperature of the object. The infrared sensor measures the surface temperature of the object. The advantage of infrared temperature measurement technology is that it does not come into contact with the object to be measured, so it will not cause damage or pollution to the object to be measured, and because of its wide operating temperature range, it can be measured in environments such as high temperature, low temperature, and dark places.

[0003] The 0-10V analog voltage is a relatively common transmission signal in industry and belongs to control using voltage signals. Compared with current control, voltage control is easier to understand and apply because voltage is more common in our daily life. The 0-10V voltage signal can also be directly connected to certain voltage devices to achieve control and feedback. Content of the Utility Model

[0004] The purpose of the utility model is to provide an infrared temperature measurement device that outputs 0-10V, which has the characteristics of simple structure and convenient use.

[0005] The utility model is realized by the following technical solutions: an infrared temperature measurement device that outputs 0-10V, including a voltage conversion circuit, a voltage amplification circuit, a CPU circuit, and an infrared temperature measurement probe. The voltage conversion circuit is respectively connected to the CPU circuit and the infrared temperature measurement probe. The CPU circuit is connected to the infrared temperature measurement probe and the voltage amplification circuit. The voltage amplification circuit is also connected to a power supply, and the power supply is connected to the voltage conversion circuit.

[0006] To better realize the infrared temperature measurement device that outputs 0-10V of the utility model, the following structural settings are particularly adopted: the voltage conversion circuit adopts a 12v to 3.3v DC conversion circuit.

[0007] To further better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following setting structure is specifically adopted: The voltage conversion circuit includes a voltage conversion chip U1, a capacitor C1, and a capacitor C2. The input terminal (pin 3) of the voltage conversion chip U1 is connected to the power supply (the power supply has two terminals, VIP and VIN, where the VIN terminal is grounded and the VIP terminal is connected to the input terminal of U1) and is grounded through the capacitor C1. The ground terminal (pin 1) of the voltage conversion chip U1 is grounded. The output terminal (pin 2, outputting 3.3V DC) of the voltage conversion chip U1 is connected to the CPU circuit and the infrared temperature measurement probe (VDD pin), and the output terminal (pin 2) of the voltage conversion chip U1 is also grounded through the capacitor C2.

[0008] To further better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following setting structure is specifically adopted: The CPU circuit includes a CPU chip U3 and a capacitor C3. The VDD pins (pins 1 and 17) and the VDDA pin (pin 5) of the CPU chip U3 are connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VDDA pin is also grounded through the capacitor C3. The PA4 / DAC1 pin (pin 10) of the CPU chip U3 is connected to the voltage amplification circuit (one end of the resistor R4). The PA9 pin (pin 19), PA10 pin (pin 20) of the CPU chip U3 are connected to the infrared temperature measurement probe (SCL pin and SDA pin). The RST pin (pin 4), SWCLK pin (pin 24), and SWDIO pin (pin 23) of the CPU chip U3 are all left unconnected. The remaining pins of the CPU chip U3 are all grounded

[0009] That is, the VDD pins (pin 1 and pin 17) and VDDA pin (pin 5) of the CPU chip U3 are connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VDDA pin (pin 5) is also grounded through the capacitor C3. The PF0 / OSC_NI pin (pin 2) and PF1 / OSC_OUT pin (pin 3) of the CPU chip U3 are connected together and grounded. The PA0 pin (pin 6), PA1 pin (pin 7), PA2 pin (pin 8), and PA3 pin (pin 9) of the CPU chip U3 are connected together and grounded. The PA4 / DAC1 pin (pin 10) of the CPU chip U3 is connected to the voltage amplification circuit (one end of the resistor R4). The PA5 pin (pin 11), PA6 pin (pin 12), PA7 pin (pin 13), PB0 pin (pin 14), PB1 pin (pin 15), and PB2 pin (pin 16) of the CPU chip U3 are connected together and grounded. The PA8 pin (pin 18) of the CPU chip U3 is grounded. The PA11 pin (pin 21) and PA12 pin (pin 22) of the CPU chip U3 are connected together and grounded. The PB8 pin (pin 32), BOOT0 pin (pin 31), PB7 pin (pin 30), PB6 pin (pin 29), PB5 pin (pin 28), PB4 pin (pin 27), PB3 pin (pin 26), and PA15 pin (pin 25) of the CPU chip U3 are all grounded. The RST pin (pin 4), SWCLK pin (pin 24), and SWDIO pin (pin 23) of the CPU chip U3 are all left unconnected. The PA9 pin (pin 19) and PA10 pin (pin 20) of the CPU chip U3 are connected to the infrared temperature measurement probe.

[0010] Furthermore, to better implement the infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following specific structural settings are particularly adopted: The SDA pin (pin 2) and SCL pin (pin 1) of the infrared temperature measurement probe are connected to the CPU circuit (the PA10 pin and PA9 pin of the CPU chip U3 respectively). The VDD pin (pin 3) of the infrared temperature measurement probe is connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VSS pin (pin 4) of the infrared temperature measurement probe is grounded.

[0011] To better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following structural settings are specifically adopted: The voltage amplification circuit includes an amplifier chip U4, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C4, and a capacitor C5. The non-inverting input terminal (pin 3) of the amplifier chip U4 is connected to the CPU circuit (PA4 / DAC1 pin of the CPU chip U3) through the resistor R4. The positive power supply terminal (pin 5) of the amplifier chip U4 is connected to a 12V power supply and grounded through the capacitor C5. A resistor R1 is connected between the inverting input terminal (pin 4) and the output terminal (pin 1) of the amplifier chip U4. The inverting input terminal (pin 4) of the amplifier chip U4 is also grounded through the resistor R2. The negative power supply terminal (pin 2) of the amplifier chip U4 is grounded. The output terminal (pin 1) of the amplifier chip U4 is connected out through the resistor R3 to form the output voltage of the infrared temperature measurement device. There are two terminals at the output voltage, namely the VOP terminal and the VON+ terminal. The VOP terminal is connected to the resistor R3, and the VON+ terminal is grounded.

[0012] Compared with the prior art, the present utility model has the following advantages and beneficial effects:

[0013] (1) The present utility model can achieve non-contact temperature measurement, has a wide range of application scenarios, plays an important role in industrial manufacturing, safety monitoring, medical diagnosis, logistics transportation and other fields, and provides a reliable temperature detection means for related industries.

[0014] (2) The present utility model adopts a 0 - 10v analog output, which is a commonly used analog control method. The 0 - 10v analog output has good stability, reliability and high precision, so it has been widely used in the field of industrial control.

[0015] (3) The present utility model outputs a voltage of 0 - 10V according to the change of temperature, and is very simple to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the principle block diagram of the present utility model.

[0017] Figure 2 is a typical circuit schematic diagram of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The present utility model will be further described in detail below with reference to the embodiments, but the embodiments of the present utility model are not limited thereto.

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model.

[0020] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, relational terms such as "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the term "and / or" in the present application is only a description of the associated relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone.

[0021] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0022] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more, and "a plurality of bits" means two or more bits, unless otherwise specifically defined.

[0023] In the description of the present application, it should also be noted that, unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0024] It should be noted that, in some embodiments, the MOS transistors or MOSFETs in the circuit can be replaced by other transistors that implement the same type of function. For example, MOS transistors can be replaced by bipolar transistors, silicon carbide (SiC) transistors, gallium nitride (GaN) transistors, cubic indium phosphide (InP) transistors, gallium arsenide (GaAs) transistors, field effect transistors (FETs), junction field effect transistors (JFETs), heterojunction bipolar transistors (HBTs), or insulated gate bipolar transistors (IGBTs). Therefore, the MOS transistor structure in the above examples should not be construed as a limitation to the present application.

[0025] An electronic device can be a device including a circuit or apparatus with semiconductor devices, such as a mobile phone, a computer, a television, a communication device, etc. The implementation principle and the technical effects generated by the electronic device provided in the embodiments of the present application are the same as those of the following high data stream transmission interface structure circuit embodiments. For the sake of brief description, for the parts not mentioned in the electronic device embodiments, reference can be made to the corresponding content in the high data stream transmission interface structure circuit embodiments.

[0026] Furthermore, in each embodiment of the present application, the various functional modules can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.

[0027] Alternatively, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present invention are generated in whole or in part.

[0028] In this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, principle, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, principle, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, principle, article or device comprising the said element.

[0029] Embodiment 1:

[0030] The utility model designs an infrared temperature measuring device with an output of 0 - 10V, which has the characteristics of simple structure and convenient use. Combined with Figure 1 , Figure 2 as shown, it includes a voltage conversion circuit, a voltage amplification circuit, a CPU circuit and an infrared temperature measuring probe. The voltage conversion circuit is respectively connected to the CPU circuit and the infrared temperature measuring probe. The CPU circuit is connected to the infrared temperature measuring probe and the voltage amplification circuit. The voltage amplification circuit is also connected to a power supply, and the power supply is connected to the voltage conversion circuit.

[0031] The power supply uses 12V, and the voltage conversion circuit converts the 12V voltage into 3.3V to supply power to the CPU chip and the infrared temperature measuring probe.

[0032] The 12V power supply also directly supplies power to the voltage amplification circuit.

[0033] The infrared temperature measuring probe measures the temperature value of the point heat source through infrared.

[0034] The CPU circuit reads the temperature value through the I2C line and outputs a corresponding voltage value (0 - 2.5V) according to the temperature value.

[0035] The voltage amplification circuit amplifies the (0 - 2.5V) voltage four times to output (0 - 10V).

[0036] Embodiment 2:

[0037] This embodiment is a further optimization based on the above embodiment. The same parts as the previous technical solution will not be described herein again. As Figure 1 , Figure 2 shown, in order to better implement the infrared temperature measuring device with an output of 0 - 10V described in the utility model, the following setting structure is particularly adopted: the voltage conversion circuit adopts a DC conversion circuit of 12V to 3.3V.

[0038] Embodiment 3:

[0039] This embodiment is further optimized on the basis of any of the above embodiments. The same parts as the foregoing technical solutions will not be described herein again. As Figure 1 、 Figure 2 shown, in order to better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following setting structure is particularly adopted: The voltage conversion circuit includes a voltage conversion chip U1, a capacitor C1, and a capacitor C2. The input terminal (pin 3) of the voltage conversion chip U1 is connected to the power supply (the power supply has two terminals, VIP and VIN. The VIN terminal is grounded, and the VIP terminal is connected to the input terminal of U1) and grounded through the capacitor C1. The ground terminal (pin 1) of the voltage conversion chip U1 is grounded. The output terminal (pin 2, outputting 3.3V DC) of the voltage conversion chip U1 is connected to the CPU circuit and the infrared temperature measurement probe (VDD pin), and the output terminal (pin 2) of the voltage conversion chip U1 is also grounded through the capacitor C2.

[0040] Embodiment 4:

[0041] This embodiment is further optimized on the basis of any of the above embodiments. The same parts as the foregoing technical solutions will not be described herein again. As Figure 1 、 Figure 2 shown, in order to better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following setting structure is particularly adopted: The CPU circuit includes a CPU chip U3 and a capacitor C3. The VDD pins (pins 1 and 17) and the VDDA pin (pin 5) of the CPU chip U3 are connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VDDA pin is also grounded through the capacitor C3. The PA4 / DAC1 pin (pin 10) of the CPU chip U3 is connected to the voltage amplification circuit (one end of the resistor R4). The PA9 pin (pin 19) and the PA10 pin (pin 20) of the CPU chip U3 are connected to the infrared temperature measurement probe (SCL pin and SDA pin). The RST pin (pin 4), the SWCLK pin (pin 24), and the SWDIO pin (pin 23) of the CPU chip U3 are all left unconnected. The remaining pins of the CPU chip U3 are all grounded.

[0042] After U3 reads the temperature data through I2C, it outputs a voltage Vout;

[0043] That is, the VDD pins (pin 1 and pin 17) and VDDA pin (pin 5) of the CPU chip U3 are connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VDDA pin (pin 5) is also grounded through the capacitor C3. The PF0 / OSC_NI pin (pin 2) and PF1 / OSC_OUT pin (pin 3) of the CPU chip U3 are connected together and grounded. The PA0 pin (pin 6), PA1 pin (pin 7), PA2 pin (pin 8), and PA3 pin (pin 9) of the CPU chip U3 are connected together and grounded. The PA4 / DAC1 pin (pin 10) of the CPU chip U3 is connected to the voltage amplification circuit (one end of the resistor R4). The PA5 pin (pin 11), PA6 pin (pin 12), PA7 pin (pin 13), PB0 pin (pin 14), PB1 pin (pin 15), and PB2 pin (pin 16) of the CPU chip U3 are connected together and grounded. The PA8 pin (pin 18) of the CPU chip U3 is grounded. The PA11 pin (pin 21) and PA12 pin (pin 22) of the CPU chip U3 are connected together and grounded. The PB8 pin (pin 32), BOOT0 pin (pin 31), PB7 pin (pin 30), PB6 pin (pin 29), PB5 pin (pin 28), PB4 pin (pin 27), PB3 pin (pin 26), and PA15 pin (pin 25) of the CPU chip U3 are all grounded. The RST pin (pin 4), SWCLK pin (pin 24), and SWDIO pin (pin 23) of the CPU chip U3 are all left unconnected. The PA9 pin (pin 19) and PA10 pin (pin 20) of the CPU chip U3 are connected to the infrared temperature measurement probe.

[0044] Embodiment 5:

[0045] This embodiment is further optimized on the basis of any of the above embodiments. The same parts as the foregoing technical solutions will not be described herein again. As Figure 1 , Figure 2 shown, in order to better implement an infrared temperature measurement device that outputs 0 - 10V described in the present utility model, the following setting structure is particularly adopted: The SDA pin (pin 2) and SCL pin (pin 1) of the infrared temperature measurement probe are connected to the CPU circuit (the PA10 pin and PA9 pin of the CPU chip U3 respectively). The VDD pin (pin 3) of the infrared temperature measurement probe is connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1). The VSS pin (pin 4) of the infrared temperature measurement probe is grounded.

[0046] Embodiment 6:

[0047] This embodiment is further optimized on the basis of any of the above embodiments. The same parts as the foregoing technical solutions will not be described herein again. As Figure 1 , Figure 2As shown in the figure, in order to better implement an infrared temperature measurement device that outputs 0 - 10V, the following specific structural settings are adopted: The voltage amplification circuit includes an amplifier chip U4, resistors R1, R2, R3, R4, capacitors C4, C5. The non-inverting input terminal (pin 3) of the amplifier chip U4 is connected to the CPU circuit (PA4 / DAC1 pin of the CPU chip U3) through the resistor R4. The positive power supply terminal (pin 5) of the amplifier chip U4 is connected to a 12V power supply and grounded through the capacitor C5. A resistor R1 is connected between the inverting input terminal (pin 4) and the output terminal (pin 1) of the amplifier chip U4. The inverting input terminal (pin 4) of the amplifier chip U4 is also grounded through the resistor R2. The negative power supply terminal (pin 2) of the amplifier chip U4 is grounded. The output terminal (pin 1) of the amplifier chip U4 is connected through the resistor R3 to form the output voltage of the infrared temperature measurement device. There are two terminals at the output voltage, namely the VOP terminal and the VON terminal. The VOP terminal is connected to the resistor R3, and the VON terminal is grounded.

[0048] U4 amplifies the voltage signal (Vout) by four times.

[0049] Embodiment 7:

[0050] An infrared temperature measurement device that outputs 0 - 10V has the characteristics of simple structure and convenient use. Combined with Figure 1 、 Figure 2 shown in the figure, it includes

[0051] A power supply composed of the VIP terminal and the VIN terminal;

[0052] A 12v - to - 3.3v voltage conversion circuit composed of a voltage conversion chip U1, capacitors C1, C2;

[0053] A voltage amplification circuit composed of an amplifier chip U4, resistors R1, R2, R3, R4, capacitors C4, C5;

[0054] An output voltage composed of the VOP terminal and the VON terminal;

[0055] A CPU circuit and an infrared temperature measurement probe (U2) composed of a CPU chip U3 and a capacitor C3.

[0056] Among them, the input terminal (pin 3) of the voltage conversion chip U1 is connected to the power supply (the power supply has two terminals, VIP and VIN. The VIN terminal is grounded, and the VIP terminal is connected to the input terminal of U1) and grounded through the capacitor C1. The ground terminal (pin 1) of the voltage conversion chip U1 is grounded. The output terminal (pin 2, outputting 3.3V DC) of the voltage conversion chip U1 is connected to the VDD pins (pin 1 and pin 17) and the VDDA pin (pin 5) of the CPU chip U3. The VDDA pin (pin 5) is also grounded through the capacitor C3. The output terminal of the voltage conversion chip U1 is also connected to the VDD pin of the infrared temperature measurement probe. The output terminal (pin 2) of the voltage conversion chip U1 is also grounded through the capacitor C2.

[0057] The PF0 / OSC_NI pin (pin 2) and the PF1 / OSC_OUT pin (pin 3) of the CPU chip U3 are connected together and grounded. The PA0 pin (pin 6), PA1 pin (pin 7), PA2 pin (pin 8), and PA3 pin (pin 9) of the CPU chip U3 are connected together and grounded. The PA4 / DAC1 pin (pin 10) of the CPU chip U3 is connected to the non-inverting input terminal (pin 3) of the amplifier chip U4 through the resistor R4. The PA5 pin (pin 11), PA6 pin (pin 12), PA7 pin (pin 13), PB0 pin (pin 14), PB1 pin (pin 15), and PB2 pin (pin 16) of the CPU chip U3 are connected together and grounded. The PA8 pin (pin 18) of the CPU chip U3 is grounded. The PA11 pin (pin 21) and PA12 pin (pin 22) of the CPU chip U3 are connected together and grounded. The PB8 pin (pin 32), BOOT0 pin (pin 31), PB7 pin (pin 30), PB6 pin (pin 29), PB5 pin (pin 28), PB4 pin (pin 27), PB3 pin (pin 26), and PA15 pin (pin 25) of the CPU chip U3 are all grounded. The RST pin (pin 4), SWCLK pin (pin 24), and SWDIO pin (pin 23) of the CPU chip U3 are all left unconnected. The PA9 pin (pin 19) of the CPU chip U3 is connected to the SCL terminal of the infrared temperature measurement probe, and the PA10 pin (pin 20) is connected to the SDA terminal of the infrared temperature measurement probe. The VDD pin (pin 3) of the infrared temperature measurement probe is connected to the voltage conversion circuit (the output terminal of the voltage conversion chip U1), and the VSS pin (pin 4) of the infrared temperature measurement probe is grounded.

[0058] The positive power supply terminal (pin 5) of the amplifier chip U4 is connected to the 12V power supply and grounded through the capacitor C5. A resistor R1 is connected between the inverting input terminal (pin 4) and the output terminal (pin 1) of the amplifier chip U4. The inverting input terminal (pin 4) of the amplifier chip U4 is also grounded through the resistor R2. The negative power supply terminal (pin 2) of the amplifier chip U4 is grounded. The output terminal (pin 1) of the amplifier chip U4 is connected through the resistor R3 to form the output voltage of the infrared temperature measurement device. There are two terminals at the output voltage, namely the VOP terminal and the VON+ terminal. The VOP terminal is connected to the resistor R3, and the VON+ terminal is grounded.

[0059] Preferably, when this embodiment is implemented, each component can refer to and use components with the following parameters.

[0060]

[0061]

[0062] The power supply uses 12V, and the voltage conversion circuit converts the 12V voltage into 3.3V to supply power to the CPU chip and the infrared temperature measurement probe.

[0063] The 12V power supply also directly supplies power to the voltage amplification circuit.

[0064] The infrared temperature measurement probe measures the temperature value of the point heat source through infrared rays.

[0065] The CPU circuit reads the temperature value through the I2C line and outputs a corresponding voltage value (0 - 2.5V) according to the temperature value.

[0066] The voltage amplification circuit amplifies the (0 - 2.5V) voltage by four times to (0 - 10V) for output.

[0067] The above is only a preferred embodiment of the present invention, and does not impose any form of limitation on the present invention. Any simple modification or equivalent change made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. An infrared temperature measuring device with an output of 0-10V, characterized in that: It includes a voltage conversion circuit, a voltage amplification circuit, a CPU circuit and an infrared temperature measuring probe. The voltage conversion circuit is connected to the CPU circuit and the infrared temperature measuring probe respectively, the CPU circuit is connected to the infrared temperature measuring probe and the voltage amplification circuit, the voltage amplification circuit is also connected to a power supply, and the power supply is connected to the voltage conversion circuit.

2. The infrared temperature measuring device with an output of 0-10V according to claim 1, characterized in that: The voltage conversion circuit adopts a 12V to 3.3V DC conversion circuit.

3. The infrared temperature measuring device with an output of 0-10V according to claim 2, characterized in that: The voltage conversion circuit includes a voltage conversion chip U1, a capacitor C1, and a capacitor C2. The input end of the voltage conversion chip U1 is connected to a power supply and is grounded through the capacitor C1. The ground end of the voltage conversion chip U1 is grounded. The output end of the voltage conversion chip U1 is connected to a CPU circuit and an infrared temperature measuring probe, and the output end of the voltage conversion chip U1 is also grounded through the capacitor C2.

4. The infrared temperature measuring device with an output of 0-10V according to claim 1, characterized in that: The CPU circuit includes a CPU chip U3 and a capacitor C3. The VDD pin and VDDA pin of the CPU chip U3 are connected to the voltage conversion circuit. The VDDA pin is also grounded through the capacitor C3. The PA4 / DAC1 pin of the CPU chip U3 is connected to the voltage amplification circuit. The PA9 pin and PA10 pin of the CPU chip U3 are connected to the infrared temperature measuring probe. The RST pin, SWCLK pin and SWDIO pin of the CPU chip U3 are all unconnected, and the remaining pins of the CPU chip U3 are all grounded.

5. An infrared temperature measuring device with an output of 0-10V according to claim 1, 2, 3 or 4, characterized in that: The SDA pin and the SCL pin of the infrared temperature measuring probe are connected to the CPU circuit, the VDD pin of the infrared temperature measuring probe is connected to the voltage conversion circuit, and the VSS pin of the infrared temperature measuring probe is grounded.

6. An infrared temperature measuring device with an output of 0-10V according to claim 1, 2, 3 or 4, characterized in that: The voltage amplification circuit includes an amplifier chip U4, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C4, and a capacitor C5. The in-phase input terminal of the amplifier chip U4 is connected to the CPU circuit through the resistor R4, the positive power supply terminal of the amplifier chip U4 is connected to the 12V power supply and is grounded through the capacitor C5, the resistor R1 is connected between the inverting input terminal and the output terminal of the amplifier chip U4, the inverting input terminal of the amplifier chip U4 is also grounded through the resistor R2, the negative power supply terminal of the amplifier chip U4 is grounded, and the output terminal of the amplifier chip U4 is connected through the resistor R3 to form the output voltage of the infrared temperature measuring device.

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