IGBT power module shell temperature measuring device

Abstract

The utility model discloses an IGBT power module shell temperature measuring device, and relates to the technical field of temperature detection. The utility model provides an IGBT power module shell temperature measuring device which comprises a heating box and a heat dissipation jig arranged in the heating box. The heat dissipation jig is used for arranging an IGBT power module. The heat dissipation jig is provided with at least one hole, the hole is used for inserting a thermocouple wire, and the end part, far away from the heat dissipation jig, of the thermocouple wire is connected with temperature measuring equipment; the system also comprises two source meters, and the two source meters are respectively connected with the I-GBT power module. The heating box can be heated to a preset temperature, one source meter is used for inputting a preset power supply to the IGBT power module, and the other source meter is used for measuring a voltage value of the IGBT power module at the preset temperature. According to the device, the voltage value and the shell temperature value of the IGBT power module under the preset temperature and the preset current are rapidly and efficiently measured in a heat transfer mode, so that the junction temperature of the IGBT power module can be obtained through subsequent calculation.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature detection, and more specifically, to a device for measuring the case temperature of an IGBT power module. Background Art

[0002] An Insulated Gate Bipolar Transistor (IGBT for short) is a composite fully controlled voltage-driven power semiconductor device composed of a Bipolar Junction Transistor (BJT for short) and a Metal Oxid Semiconductor (MOS for short). It combines the advantages of a field effect transistor and a giant transistor, has characteristics such as fast switching speed, high voltage resistance, and large current, and is suitable for application in high-power power electronic conversion devices. Currently, it has been widely used in fields such as electric vehicles and rail transit.

[0003] The junction temperature of an IGBT power module is an important factor for evaluating the safety and lifespan of the IGBT power module. To ensure that the IGBT power module can operate safely and reliably in these high-power application scenarios for a long time, it is necessary to estimate the junction temperature of the IGBT power module online. The IGBT power module itself has a limit on the maximum junction temperature. When the junction temperature of the IGBT power module exceeds this limit, the IGBT power module is at risk of reduced lifespan or even burnout. If the junction temperature can be estimated in real time, measures can be taken in advance for derating protection, thus ensuring the safe and reliable operation of the IGBT power module.

[0004] Since the junction temperature of the IGBT power module cannot be directly calculated, it is usually calculated from three parts: case temperature, thermal resistance, and power consumption. The case temperature is the temperature on the surface of the IGBT package, and the calculation of thermal resistance requires measurement using the double-interface method. The double-interface method needs to establish the relationship between the temperature sensitivity coefficient and temperature, that is, perform K coefficient measurement. The K coefficient is obtained from the ratio of the voltage value to the change value of the case temperature. Among them, the change value of the voltage can be measured by a source meter, but the chip temperature inside the IGBT power module affects the change value of the case temperature. After the IGBT module is packaged, the chip is wrapped by resin and a plastic shell, making it inconvenient to directly measure its temperature. Therefore, there is an urgent need for a device that can easily measure the case temperature of the IGBT power module to efficiently, conveniently, and accurately measure the change value of the case temperature of the IGBT power module, so as to facilitate the subsequent calculation of the junction temperature of the IGBT power module. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an IGBT power module shell temperature measuring device, which can quickly and efficiently measure the voltage value and shell temperature value of the IGBT power module under a preset temperature and a preset current by means of heat transfer, so as to facilitate the subsequent accurate calculation of the junction temperature of the IGBT power module.

[0006] The embodiment of the utility model is achieved as follows:

[0007] In one aspect of the utility model, a device for measuring shell temperature of an IGBT power module is provided, comprising a heating box and a heat dissipation fixture arranged in the heating box, the heat dissipation fixture being used to arrange the IGBT power module; the heat dissipation fixture is provided with at least one opening, the opening being used to insert a thermocouple wire, the end of the thermocouple wire away from the heat dissipation fixture is connected with a temperature measuring device, the temperature measuring device is used to measure the heat value transferred from the IGBT power module to the thermocouple wire; the device also comprises two source meters, the two source meters are respectively connected to the IGBT power module; the heating box can be heated to a preset temperature, one of the source meters is used to input a preset power supply to the IGBT power module, and the other source meter is used to measure the voltage value of the IGBT power module at a preset temperature.

[0008] Optionally, the heat dissipation fixture includes a groove, one end of the groove is connected to the opening, and the other end extends to the edge of the heat dissipation fixture to communicate with the outside, and the groove is used to clamp the thermocouple wire.

[0009] Optionally, when there are multiple openings, the multiple openings are evenly distributed on a surface of the heat dissipation fixture facing the IGBT power module.

[0010] Optionally, a mounting hole is provided on the surface of the heat dissipation fixture, and the heat dissipation substrate of the IGBT power module has a positioning hole. The mounting hole is coaxially arranged with the positioning hole, and the mounting hole is used to penetrate a fixing piece to fix the IGBT power module to the heat dissipation fixture.

[0011] Optionally, the mounting holes include a plurality of mounting holes, and the plurality of mounting holes are evenly distributed on a periphery of a side of the heat dissipation fixture facing the IGBT power module.

[0012] Optionally, a heat dissipation fin is provided on a side of the heat dissipation fixture facing away from the IGBT power module.

[0013] Optionally, there are multiple heat dissipation fins, and the multiple heat dissipation fins are arranged side by side and spaced apart from each other.

[0014] Optionally, a plurality of thin sheets are protruding from the surface of the heat dissipation fin.

[0015] Optionally, a plurality of thin sheets are radially arranged on the surface of the heat dissipation fins.

[0016] Optionally, the heat dissipation fixture is made of aluminum, or the heat dissipation fixture is made of copper, or the heat dissipation fixture is made of iron.

[0017] The beneficial effects of the present utility model include:

[0018] This application provides an IGBT power module case temperature measurement device, which includes a heating box and a heat dissipation fixture arranged in the heating box. The IGBT power module is to be arranged on the heat dissipation fixture; the heat dissipation fixture is provided with at least one opening for inserting a thermocouple wire. The end of the thermocouple wire away from the heat dissipation fixture is connected to a temperature measurement device, and the temperature measurement device can measure the current temperature of the IGBT power module through the thermocouple wire. The temperature measurement device is used to measure the heat value transferred from the IGBT power module to the thermocouple wire; it also includes two source meters, and the two source meters are respectively connected to the IGBT power module; the heating box can be heated to a preset temperature. One of the source meters is used to input a preset power supply to the IGBT power module, and the other source meter is used to measure the voltage value of the IGBT power module at the preset temperature. The K coefficient can be calculated by measuring the voltage change values and temperature differences at multiple temperatures. The K coefficient can be used to calculate the thermal resistance of the IGBT power module in the double-interface method, and then the junction temperature of the IGBT power module can be calculated. The above IGBT power module case temperature measurement device can quickly and efficiently measure the voltage value and case temperature value of the IGBT power module under the preset temperature and preset current through the heat transfer method, so as to calculate the junction temperature of the IGBT power module, which is convenient for subsequent calculation of the junction temperature of the IGBT power module. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic structural diagram of the IGBT power module case temperature measurement device provided by the embodiment of the present utility model;

[0021] Figure 2 It is a schematic structural diagram of the heat dissipation fixture of the IGBT power module case temperature measurement device provided by the embodiment of the present utility model;

[0022] Figure 3 It is a schematic diagram of heat transfer of the IGBT power module case temperature measurement device provided by the embodiment of the present utility model.

[0023] Icons: 100 - IGBT power module case temperature measurement device; 110 - heating box; 120 - heat dissipation fixture; 121 - opening; 122 - groove; 123 - mounting hole; 124 - heat dissipation fin; 130 - thermocouple wire; 200 - IGBT power module; 210 - heat dissipation substrate. Detailed implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Components of the embodiments of the present utility model described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0026] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is customarily placed during use. It is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0028] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0029] In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] Please refer to Figure 1 , this embodiment provides an IGBT power module case temperature measurement device 100, which includes a heating box 110 and a heat dissipation fixture 120 disposed in the heating box 110. The IGBT power module 200 is to be disposed on the heat dissipation fixture 120; the heat dissipation fixture 120 is provided with at least one opening 121 for inserting a thermocouple wire 130. The end of the thermocouple wire 130 away from the heat dissipation fixture 120 is connected to a temperature measurement device for measuring the heat value transferred from the IGBT power module 200 to the thermocouple wire 130; it also includes two source meters (not shown in the figure), and the two source meters are respectively connected to the IGBT power module 200; the heating box 110 can be heated to a preset temperature, and one of the source meters is used to input a preset power supply to the IGBT power module 200, and the other source meter is used to measure the voltage value of the IGBT power module 200 at the preset temperature.

[0031] Specifically, the present application provides an IGBT power module case temperature measurement device 100, which can quickly and conveniently measure the package surface temperature of the IGBT power module 200.

[0032] The junction temperature of the IGBT power thin film is calculated from the case temperature, thermal resistance, and power consumption. Among them, the existing thermal resistance can be measured by the double interface method. The measuring device is directly contacted with the radiator, and then the device and the radiator are contacted with thermal grease to obtain two sets of transient thermal impedance curves. By comparing the overlapping part and the different part of the two curves, the separation point can accurately reflect the junction-to-case thermal resistance value of the device. When measuring the resistance by the double interface method, it is necessary to establish the relationship between the temperature sensitivity coefficient and the temperature, that is, to measure the K coefficient. The K coefficient is obtained by the ratio of the voltage difference value to the case temperature change value. Therefore, in order to accurately calculate the K coefficient, we need to obtain accurate voltage difference values and case temperature change values.

[0033] In order to accurately measure the case temperature of the IGBT power module 200 and the K coefficient, and prepare for the subsequent calculation of the junction temperature, the IGBT power module case temperature measuring device 100 provided by this application includes a heating box 110 and a heat dissipation fixture 120 disposed in the heating box 110. The IGBT power module 200 is to be arranged on the heat dissipation fixture 120, and the heating box 110 is used to heat the IGBT power module 200 inside.

[0034] The heat dissipation fixture 120 is provided with at least one opening 121 for inserting a thermocouple wire 130. The end of the thermocouple wire 130 far from the heat dissipation fixture 120 is connected to a temperature measuring device, and the temperature measuring device can measure the current temperature of the heat dissipation fixture 120 through the thermocouple wire 130, that is, the case temperature value of the IGBT power module 200. The IGBT power module case temperature measuring device 100 also includes two source meters, which are respectively connected to the IGBT power module 200. One source meter is used to input a preset power supply to the IGBT power module 200, and the other is used to measure the voltage value of the current IGBT power module 200.

[0035] Exemplarily, in the actual measurement process, first, the internal temperature of the heating box 110 is heated to a first preset temperature, and a power supply is passed through the IGBT power module 200 by one source meter. Then, the first voltage value at this temperature and current is measured by the other source meter. Next, the internal temperature of the heating box 110 is heated from the first preset temperature to a second preset temperature, and a power supply is passed through the IGBT power module 200 by one source meter. Then, the second voltage value at this temperature and current is measured by the other source meter. Thus, the voltage difference between the first preset temperature and the second preset temperature is measured. At the same time, the case temperature difference of the IGBT power module 200 at the first preset temperature and the second preset temperature can also be accurately measured through the temperature measuring device and the thermocouple wire 130. The K coefficient can be calculated through the ratio of the voltage difference to the case temperature difference.

[0036] It should be noted that, first, this application does not impose any restrictions on the number of measurements in the actual measurement process, as long as it can ensure the accuracy of the ratio of the measured voltage value to the case temperature value. Preferably, in order to improve the measurement accuracy, measuring the voltage values at multiple preset temperatures and measuring the voltage values multiple times at each preset temperature can effectively improve the accuracy of the ratio of the finally measured voltage value to the case temperature difference, and thus improve the accuracy of the K coefficient.

[0037] Second, in order to quickly transfer the heat of the IGBT power module 200 to the heat dissipation fixture 120, in an implementable embodiment of the present application, the heat dissipation fixture 120 is made of a material with good heat transfer performance, which can better transfer the heat of the IGBT power module 200 to the thermocouple wire 130 in the heat dissipation fixture 120, thereby making the measurement result more accurate. For example, the heat dissipation fixture 120 is made of aluminum, or the heat dissipation fixture 120 is made of copper, or the heat dissipation fixture 120 is made of iron. Of course, in addition to the above materials, the heat dissipation fixture 120 can also be made of other alloy materials with good heat transfer performance.

[0038] The above IGBT power module case temperature measuring device 100 can quickly and efficiently measure the voltage value and case temperature value of the IGBT power module 200 under a preset temperature and a preset current through heat transfer, so as to calculate the junction temperature of the IGBT power module 200, facilitating the subsequent calculation of the junction temperature of the IGBT power module 200.

[0039] In an implementable embodiment of the present application, as Figure 2 shown, the heat dissipation fixture 120 includes a groove 122. One end of the groove 122 is connected to the opening 121 and the other end extends to the edge of the heat dissipation fixture 120 to communicate with the outside. The groove 122 is used to clamp the thermocouple wire 130.

[0040] Specifically, as Figure 2 shown, the heat dissipation fixture 120 is provided with a groove 122, and the groove 122 corresponds to the opening 121 one by one; one end of the groove 122 is connected to the opening 121 and the other end extends to the edge of the heat dissipation fixture 120. One end of the thermocouple wire 130 can be arranged in the opening 121, and the other end extends along the groove 122 to the outside of the heating box 110 to connect to the temperature measuring device. Through the setting of the groove 122, the wire body of the thermocouple wire 130 can be pressed in the groove 122, thereby preventing gaps from being generated when the heat dissipation substrate 210 of the IGBT power module 200 is attached to the upper surface of the heat dissipation fixture 120, avoiding heat dissipation, and improving the measurement accuracy of the case temperature. To prevent the thermocouple wire 130 from falling off at the opening 121, preferably, the end of the thermocouple wire 130 can also be adhered to the opening 121 with glue.

[0041] Exemplarily, when the opening 121 includes a plurality of openings, the plurality of openings 121 are evenly distributed on one surface of the heat dissipation fixture 120 facing the IGBT power module 200.

[0042] Specifically, when the opening 121 includes a plurality of openings, in order to measure the case temperature of different regions in the IGBT power module 200, the plurality of openings are evenly distributed on one surface of the heat dissipation fixture 120 facing the IGBT power module 200 to improve the accuracy of the measurement result.

[0043] For example, in a specific embodiment of the present application, as Figure 2 shown, there are three opening holes 121, and the three opening holes 121 are respectively arranged in the middle and opposite two sides of the surface of the heat dissipation fixture 120 facing the IGBT power module 200. It should be noted that the present application does not impose any limitation on the number of the opening holes 121, and can be adjusted according to the specific number of chips in the IGBT power module 200, as long as the temperature of each chip can be measured.

[0044] In an implementable manner of the present application, as Figure 2 shown, the surface of the heat dissipation fixture 120 is provided with mounting holes 123, and the heat dissipation substrate 210 of the IGBT power module 200 has positioning holes. The mounting holes 123 and the positioning holes are coaxially arranged, and the mounting holes 123 are used for passing through fixing members to fixedly connect the IGBT power module 200 and the heat dissipation fixture 120.

[0045] Specifically, in order to improve the connection stability between the IGBT power module 200 and the heat dissipation fixture 120 and prevent the IGBT power module 200 from slipping off the top of the heat dissipation fixture 120, the surface of the heat dissipation fixture 120 is provided with mounting holes 123, and the heat dissipation substrate 210 of the IGBT power module 200 has positioning holes. The positioning holes and the mounting holes 123 can coaxially pass through fixing members to fixedly connect the IGBT power module 200 and the heat dissipation fixture 120, thereby improving the temperature measurement reliability of the IGBT power module 200 case temperature test device.

[0046] Preferably, the fixing member is a screw, and the heat dissipation substrate 210 of the IGBT power module 200 and the heat dissipation fixture 120 are screwed together through the screw. The heat dissipation substrate 210 of the IGBT power module 200 can be tightly attached to the upper surface of the heat dissipation fixture 120 under the influence of the screw stress, further improving the efficiency of the IGBT power module 200 transferring heat energy to the heat dissipation fixture 120 and improving the accuracy of the case temperature measurement.

[0047] Preferably, in order to further improve the efficiency of the IGBT power module 200 transferring heat energy to the heat dissipation fixture 120, the heat dissipation substrate 210 is selected to be made of copper. Copper has good thermal conductivity and can transfer the heat of the chips of the IGBT power module 200 to the heat dissipation substrate 210.

[0048] Preferably, in order to further improve the connection stability between the IGBT power module 200 and the heat dissipation fixture 120, there are multiple mounting holes 123, and the multiple mounting holes 123 are evenly distributed on the periphery of the surface of the heat dissipation fixture 120 facing the IGBT power module 200.

[0049] In a specific implementation manner of the present application, as Figure 2As shown, there are four mounting holes 123, and the four mounting holes 123 are respectively arranged at the four corners of the side of the heat dissipation fixture 120 facing the IGBT power module 200.

[0050] In an implementable manner of the present application, as Figure 2 shown, heat dissipation fins 124 are provided on the side of the heat dissipation fixture 120 facing away from the IGBT power module 200.

[0051] Specifically, as Figure 2 shown, in order to further improve the heat dissipation efficiency of the heat dissipation fixture 120, heat dissipation fins 124 are provided on the side of the heat dissipation fixture 120 facing away from the IGBT power module 200, which can effectively avoid the influence of the heat of the heating box 110 on the case temperature.

[0052] Preferably, in order to further improve the heat dissipation efficiency of the heat dissipation fixture 120, there are multiple heat dissipation fins 124, and the multiple heat dissipation fins 124 are arranged side by side and spaced from each other.

[0053] Exemplarily, a plurality of thin sheets (not shown in the figure) are convexly provided on the surface of the heat dissipation fin 124. Through the arrangement of the thin sheets, the heat dissipation surface area of the heat dissipation fixture 120 is increased, and the heat dissipation efficiency of the heat dissipation fixture 120 is further improved. Moreover, since the IGBT power module 200 is arranged above the heat dissipation fixture 120, the chip heat of the IGBT power module 200 is transferred from top to bottom. Therefore, the arrangement of the heat dissipation fins 124 and the thin sheets can reduce heat loss.

[0054] Due to the complex internal structure of the IGBT power module 200, the same physical layer contains multiple materials, and the temperatures of each chip in the IGBT power module 200 are different due to position differences, and it is conducted through three-dimensional paths in the horizontal and vertical directions. Therefore, the isothermal surface formed by heat conduction is an irregular curved surface. In order to measure the virtual junction temperature inside the power module, as Figure 3 shown, the heat conduction of the junction temperature measured in the embodiment of the present application is simplified to a one-dimensional route from the internal chip of the IGBT power module 200 to the heat dissipation substrate 210 and the heat dissipation fixture 120. The heat generated by the internal chip of the IGBT power module 200 is transferred from the heat dissipation substrate 210 to the heat dissipation fixture 120, and finally measured by a thermocouple wire 130 through a temperature measuring instrument.

[0055] Optionally, the multiple thin sheets are radially arranged on the surface of the heat dissipation fin 124 to improve the heat dissipation uniformity and further reduce the heat loss.

[0056] The above are only optional embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

[0057] In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. To avoid unnecessary repetition, the present utility model will not separately describe various possible combination methods.

Claims

1. An IGBT power module shell temperature measuring device, characterized in that: The invention comprises a heating box (110) and a heat dissipation fixture (120) arranged in the heating box (110), wherein the heat dissipation fixture (120) is used to arrange an IGBT power module (200); the heat dissipation fixture (120) is provided with at least one opening (121), wherein the opening (121) is used to insert a thermocouple wire (130), wherein the end of the thermocouple wire (130) away from the heat dissipation fixture (120) is connected to a temperature measuring device, wherein the temperature measuring device is used to measure the heat value transferred from the IGBT power module (200) to the thermocouple wire (130); and further comprises two source meters, wherein the two source meters are respectively connected to the IGBT power module (200); the heating box (110) can be heated to a preset temperature, wherein one of the source meters is used to input a preset power supply to the IGBT power module (200), and the other of the source meters is used to measure the voltage value of the IGBT power module (200) at the preset temperature.

2. The IGBT power module shell temperature measuring device according to claim 1, characterized in that: The heat dissipation fixture (120) comprises a groove (122), one end of the groove (122) is connected to the opening (121), and the other end extends to the edge of the heat dissipation fixture (120) to communicate with the outside, and the groove (122) is used to clamp the thermocouple wire (130).

3. The IGBT power module shell temperature measuring device according to claim 1 or 2, characterized in that: When the opening (121) comprises a plurality of openings, the plurality of openings (121) are evenly distributed on a surface of one side of the heat dissipation fixture (120) facing the IGBT power module (200).

4. The IGBT power module case temperature measuring device according to claim 1, characterized in that: The surface of the heat dissipation fixture (120) is provided with a mounting hole (123); the heat dissipation substrate (210) of the IGBT power module (200) has a positioning hole; the mounting hole (123) is coaxially arranged with the positioning hole; the mounting hole (123) is used to penetrate a fixing piece to fix the IGBT power module (200) to the heat dissipation fixture (120).

5. The IGBT power module case temperature measuring device according to claim 4, characterized in that: The mounting holes (123) include a plurality of mounting holes (123), and the plurality of mounting holes (123) are evenly distributed on the periphery of a side of the heat dissipation fixture (120) facing the IGBT power module (200).

6. The IGBT power module case temperature measuring device according to claim 1, characterized in that: A heat dissipation fin (124) is provided on a side of the heat dissipation fixture (120) facing away from the IGBT power module (200).

7. The IGBT power module case temperature measuring device according to claim 6, characterized in that: The heat dissipation fins (124) are multiple, and the multiple heat dissipation fins (124) are arranged side by side and spaced apart from each other.

8. The IGBT power module shell temperature measuring device according to claim 6 or 7, characterized in that: A plurality of thin sheets are protruding from the surface of the heat dissipation fin (124).

9. The IGBT power module case temperature measuring device according to claim 8, characterized in that: A plurality of the thin sheets are radially arranged on the surface of the heat dissipation fins (124).

10. The IGBT power module case temperature measuring device according to claim 1, characterized in that: The heat dissipation jig (120) is made of aluminum, or the heat dissipation jig (120) is made of copper, or the heat dissipation jig (120) is made of iron.

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