Defect detection device

Abstract

The utility model discloses a defect detection device which comprises a sealing box and a detection mechanism, the front end face of the sealing box is provided with a box door, the rear end face of the sealing box is provided with a plurality of mounting holes, the top of the sealing box is provided with a plurality of wire holes, and the top of the sealing box is provided with a display. According to the utility model, the upper laser source and the lower laser source in the detection mechanism can generate laser beams, so that the laser beams can be utilized to detect the defects of the front surface and the back surface of the wafer at the same time without overturning, the defect detection speed and efficiency are greatly improved, and the detection mechanism and the wafer can be sealed through the sealing box, so that the detection efficiency is improved. Therefore, the accuracy of the detection result is prevented from being influenced by the interference of external light to related optical detection elements when the defect detection is carried out on the wafer.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer detection, and particularly relates to a defect detection device. Background Technique

[0002] A wafer is the basic material for semiconductor manufacturing. It is a circular silicon wafer on which various components of an integrated circuit are fabricated. To ensure the quality and reliability of the semiconductor production process, by testing and inspecting the wafers, potential manufacturing defects, errors, or faults can be detected, so as to correct them in time or eliminate unqualified products, thereby improving the production efficiency and quality level of semiconductor devices.

[0003] Currently, there are some wafer defect detection devices on the market that can use optical technology to detect patterns, structures, and defects on wafers. For example, a wafer defect detection device is disclosed on the Chinese Patent Network, with a publication number of CN217059906U. This detection device can observe the characteristics of the wafer surface through an optical detector and detect defects or abnormalities therein. However, there are some defects and deficiencies to be improved: (1) It can only detect the front side of the wafer. When it is necessary to detect the back side of the wafer, the wafer needs to be flipped, and it is difficult to detect the front and back sides of the wafer simultaneously, thus reducing the detection speed and efficiency; (2) The optical detection element and the wafer are both exposed. During detection, external light is likely to interfere with the optical detection element, thus affecting the accuracy of the detection result. Therefore, in view of the above problems, it is of great significance to provide a defect detection device according to the present utility model. Summary of the Utility Model

[0004] The utility model provides a defect detection device. The upper laser source and the lower laser source in the detection mechanism can generate laser beams, so as to simultaneously detect defects on the front and back sides of the wafer by using the laser beams without flipping, thereby greatly improving the speed and efficiency of defect detection; the detection mechanism and the wafer can be sealed by a sealed box to avoid external light interfering with relevant optical detection elements during wafer defect detection and affecting the accuracy of the detection result. In summary, the problems in the background technique are solved.

[0005] To solve the above technical problems, the present utility model is realized through the following technical solutions:

[0006] A defect detection device of the present utility model includes a sealed box and a detection mechanism. A box door is installed on the front end face of the sealed box, several mounting holes are opened on the rear end face thereof, and several wire holes are opened on the top of the sealed box. A display is installed on the top of the sealed box;

[0007] The detection mechanism includes a mounting plate which is located inside the sealed box. A number of mounting rods are fixedly connected to the rear end face of the mounting plate. External threads are engraved on the rod bodies of the mounting rods, and mounting nuts that match the external threads are threadedly connected to the rod bodies of the mounting rods. A detection frame is arranged on the front side of the mounting plate. A number of fixing blocks are fixedly connected between the rear end face of the detection frame and the front end face of the mounting plate. An upper laser source and a lower laser source are respectively installed at the top and bottom of the detection frame. An upper detector and a lower detector are respectively installed on the front end faces of the upper laser source and the lower laser source. The upper laser source, the lower laser source, the upper detector, the lower detector and the display are all electrically connected by wires. The wires pass through wire holes. A clamping assembly is arranged on the front side of the detection frame;

[0008] The clamping assembly includes a clamping frame which is fixedly connected to the front end face of the detection frame and is located between the upper laser source and the lower laser source. Through holes are formed on both sides of the clamping frame. Pull rods are inserted into the through holes. A pull ring is fixedly connected to one end of the pull rod, and a clamping block is fixedly connected to the other end. A spring is wound around the rod body of the pull rod. The two ends of the spring are respectively fixedly connected to the side walls of the clamping frame and the clamping block.

[0009] Further, the front face of the clamping block is C-shaped, and a layer of buffer pad is arranged on the inner wall surface of the clamping block.

[0010] Further, upper adjustment holes and lower adjustment holes are respectively formed on the surface of the detection frame. The upper adjustment holes and the lower adjustment holes are respectively located above and below the clamping frame. An upper adjustment assembly and a lower adjustment assembly are respectively arranged above and below the clamping frame. The upper adjustment assembly and the lower adjustment assembly respectively include an upper lens and a lower lens. Upper adjustment rods and lower adjustment rods are respectively fixedly connected to the outer wall edges of the upper lens and the lower lens. The rod diameters of the upper adjustment rods and the lower adjustment rods are equal to the hole diameters of the upper adjustment holes and the lower adjustment holes. External threads are engraved on their rod bodies. Limit blocks are fixedly connected to the rod bodies of the upper adjustment rods and the lower adjustment rods. Positioning nuts that match the external threads are threadedly connected to the rod bodies of the upper adjustment rods and the lower adjustment rods.

[0011] Further, the number of the mounting rods is the same as the number of the mounting holes, the rod diameters of the mounting rods are equal to the hole diameters of the mounting holes, and the centers of each mounting rod and each mounting hole correspond one by one.

[0012] Further, a handle is installed on the front end face of the box door, and an observation port is formed on the box door. An observation window is installed in the observation port.

[0013] Further, feet are fixedly connected to the four corners at the bottom of the sealed box. A layer of anti-abrasion pad is arranged on the bottom surface of each foot.

[0014] The utility model has the following beneficial effects compared with the prior art:

[0015] (1) When the detection device in the utility model is in use, the upper laser source and the lower laser source in the detection mechanism can generate laser beams, so as to use the laser beams to detect defects on the front and back of the wafer simultaneously without flipping, thus greatly improving the speed and efficiency of defect detection;

[0016] (2) When the detection device in the utility model is in use, the detection mechanism and the wafer can be sealed by the sealed box to avoid interference of external light on relevant optical detection elements during defect detection of the wafer, thereby affecting the accuracy of the detection result;

[0017] (3) When the detection device in the utility model is in use, the upper adjusting component and the lower adjusting component can drive the upper lens and the lower lens to deflect respectively, so as to realize multi-angle detection of the wafer by the detection mechanism;

[0018] (4) When the detection device in the utility model is in use, the mounting plate together with the entire detection mechanism can be fixedly installed in the sealed box by tightening the mounting nut. When a fault occurs in the relevant optical detection elements in the detection mechanism, the detection mechanism can be taken out of the sealed box by unscrewing the mounting nut, so as to facilitate the maintenance and replacement of the corresponding elements.

[0019] Of course, it is not necessary for any product implementing the utility model to achieve all the above advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0021] Figure 1 is a three-dimensional structural schematic diagram of a defect detection device of the utility model;

[0022] Figure 2 is a three-dimensional structural schematic diagram of the sealed box in the utility model;

[0023] Figure 3 is a bottom structural schematic diagram of the sealed box in the utility model;

[0024] Figure 4 is a three-dimensional structural schematic diagram of the detection mechanism in the utility model;

[0025] Figure 5 is a side view of the detection mechanism in the utility model;

[0026] Figure 6 This is a schematic three-dimensional structure diagram of the clamping block in the present utility model;

[0027] Figure 7 This is a schematic three-dimensional structure diagram of the upper adjusting component and the lower adjusting component in the present utility model.

[0028] In the drawings, the list of components represented by each reference numeral is as follows:

[0029] 1. Sealing box; 2. Box door; 3. Mounting hole; 4. Wire hole; 5. Display; 6. Mounting plate; 7. Mounting rod; 8. Mounting nut; 9. Detection frame; 10. Fixed block; 11. Upper laser source; 12. Lower laser source; 13. Upper detector; 14. Lower detector; 15. Clamping frame; 16. Through hole; 17. Pull rod; 18. Pull ring; 19. Clamping block; 20. Spring; 21. Buffer pad; 22. Upper adjusting hole; 23. Lower adjusting hole; 24. Upper lens; 25. Lower lens; 26. Upper adjusting rod; 27. Lower adjusting rod; 28. Limit block; 29. Positioning nut; 30. Handle; 31. Observation window; 32. Foot pad; 33. Anti-abrasion pad. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0031] In the description of the present utility model, it should be understood that the terms "relative", "one end", "inside", "transverse", "end", "both ends", "both sides", "front", "one end face", "the other end face", etc. indicating the orientation or positional relationship are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0032] Please refer to Figure 1-7As shown in the figure, a defect detection device of the present utility model includes a sealed box 1 and a detection mechanism. A box door 2 is installed on the front end face of the sealed box 1. The box door 2 is rotatably installed on the sealed box 1 through a hinge structure. The sealed box 1 can be sealed by rotating the box door 2 to prevent external light from interfering with relevant optical detection components during the defect detection of the wafer, thus affecting the accuracy of the detection result. A plurality of mounting holes 3 are provided on the rear end face of the sealed box 1, and a plurality of wire holes 4 are provided on the top of the sealed box 1. A display 5 is installed on the top of the sealed box 1;

[0033] The detection mechanism includes a mounting plate 6. The mounting plate 6 is located inside the sealed box 1. A plurality of mounting rods 7 are fixedly connected to the rear end face thereof. External threads are engraved on the rod bodies of the mounting rods 7, and mounting nuts 8 that match the external threads are threadedly connected to the rod bodies of the mounting rods 7. A detection frame 9 is arranged on the front side of the mounting plate 6. A plurality of fixing blocks 10 are fixedly connected between the rear end face of the detection frame 9 and the front end face of the mounting plate 6. An upper laser source 11 and a lower laser source 12 are respectively installed on the top and bottom of the detection frame 9. The upper laser source 11 and the lower laser source 12 can be semiconductor lasers available on the market. Laser beams can be generated by the upper laser source 11 and the lower laser source 12, so as to simultaneously detect defects on the front and back surfaces of the wafer by using the laser beams without flipping, thus greatly improving the speed and efficiency of defect detection. Upper detectors 13 and lower detectors 14 are respectively installed on the front end faces of the upper laser source 11 and the lower laser source 12. The upper detectors 13 and the lower detectors 14 can be photodiodes available on the market. The upper laser source 11, the lower laser source 12, the upper detectors 13, the lower detectors 14 and the display 5 are all electrically connected through wires. The wires pass through the wire holes 4. A data processing unit is integrated inside the display 5, which is responsible for receiving the signals obtained from the upper detectors 13 and the lower detectors 14 and processing and analyzing the signals through algorithms to identify defects and abnormalities on the wafer surface. A clamping assembly is arranged on the front side of the detection frame 9;

[0034] The clamping assembly includes a clamping frame 15. The clamping frame 15 is fixedly connected to the front end face of the detection frame 9 and is located between the upper laser source 11 and the lower laser source 12. Through holes 16 are provided on both sides of the clamping frame 15. A pull rod 17 is inserted into the through holes 16. One end of the pull rod 17 is fixedly connected with a pull ring 18, and the other end is fixedly connected with a clamping block 19. A spring 20 is wound around the rod body of the pull rod 17. The two ends of the spring 20 are respectively fixedly connected to the side walls of the clamping frame 15 and the clamping block 19. The pull rod 17 can be pulled by the pull ring 18 to drive the clamping block 19 to move outward. When the pull ring 18 is released, the pull rod 17 will drive the clamping block 19 to move toward the middle direction under the elastic reset action of the spring 20. At this time, the wafer can be clamped and fixed by the clamping block 19.

[0035] Among them, the front surface of the clamping block 19 is C-shaped, and a layer of buffer pad 21 is provided on the inner wall surface of the clamping block 19. The buffer pad 21 can be made of rubber pad material and is fixed to the inner wall of the clamping block 19 by means such as glue. When clamping and fixing the wafer, the edges of the wafer can be respectively attached to the inner walls of the two clamping blocks 19 on both sides. At this time, the buffer pad 21 can play a buffering role to avoid collision and wear caused by the contact between the edge of the wafer and the inner wall of the clamping block 19.

[0036] Among them, upper adjustment holes 22 and lower adjustment holes 23 are respectively formed on the surface of the detection frame 9. The upper adjustment hole 22 and the lower adjustment hole 23 are respectively located above and below the clamping frame 15. An upper adjustment component and a lower adjustment component are respectively provided above and below the clamping frame 15. The upper adjustment component and the lower adjustment component respectively include an upper lens 24 and a lower lens 25. The upper lens 24 and the lower lens 25 can be used to adjust and focus the laser beam so as to accurately scan and image the surface of the wafer. Upper adjustment rods 26 and lower adjustment rods 27 are respectively fixedly connected to the outer wall edges of the upper lens 24 and the lower lens 25. The rod diameters of the upper adjustment rod 26 and the lower adjustment rod 27 are equal to the hole diameters of the upper adjustment hole 22 and the lower adjustment hole 23, and external threads are engraved on their rod bodies. Limit blocks 28 are fixedly connected to the rod bodies of the upper adjustment rod 26 and the lower adjustment rod 27, and positioning nuts 29 that match their external threads are threadedly connected to the rod bodies of the upper adjustment rod 26 and the lower adjustment rod 27. The upper adjustment rod 26 and the lower adjustment rod 27 can be respectively aligned and inserted into the upper adjustment hole 22 and the lower adjustment hole 23. By rotating the upper adjustment rod 26 and the lower adjustment rod 27, the upper lens 24 and the lower lens 25 can be respectively driven to deflect, so as to realize multi-angle detection of the wafer by the detection mechanism. When the angle adjustment is completed, the positioning nuts 29 can be tightened. At this time, through the mutual cooperation of the positioning nuts 29 and the limit blocks 28, the upper adjustment rod 26 and the lower adjustment rod 27 can be clamped and fixed to fix the angles of the upper lens 24 and the lower lens 25.

[0037] Among them, the number of the mounting rods 7 is the same as the number of the mounting holes 3, the rod diameter of the mounting rods 7 is equal to the hole diameter of the mounting holes 3, and the center of each mounting rod 7 corresponds to the center of each mounting hole 3 one by one. Each mounting rod 7 can be respectively aligned and inserted into the corresponding mounting hole 3. At this time, by tightening the mounting nuts 8, the mounting plate 6 together with the entire detection mechanism can be fixedly installed in the sealing box 1. When a relevant optical detection element in the detection mechanism fails, by unscrewing the mounting nuts 8, the detection mechanism can be taken out of the sealing box 1 to facilitate the repair and replacement of the corresponding element.

[0038] Among them, a handle 30 is installed on the front end face of the cabinet door 2, and an observation port is opened on the cabinet door 2. An observation window 31 is installed in the observation port. The observation window 31 is made of transparent glass material and can be fixedly installed in the observation port by means of glue or the like. When the cabinet door 2 is closed, the interior of the sealed box 1 can be observed through the observation window 31 so as to keep track of the wafer detection situation in real time.

[0039] Among them, at the four corners of the bottom of the sealed box 1, feet 32 are fixedly connected. Through the feet 32, the sealed box 1 can be supported, and the bottom of the sealed box 1 can be lifted off a contact surface such as a tabletop, thereby preventing accumulated water or stains on the contact surface from adhering to the bottom of the sealed box 1. A wear-resistant pad 33 is provided on the bottom surface of each foot 32. The wear-resistant pad 33 can be made of materials such as rubber pads and is fixed to the bottom of the foot 32 by means of glue or the like. When the foot 32 supports the sealed box 1, the wear-resistant pad 33 can play a role in wear protection to avoid abrasion caused by the long-term direct contact between the bottom of the foot 32 and the contact surface.

[0040] The circuits, electronic components, and chip modules involved in the present utility model are all prior arts, which can be fully realized by those skilled in the art without further elaboration. The content protected by the present utility model does not involve improvements to software and methods either.

[0041] The standard parts used in the application documents can be purchased from the market. All the components in the application documents can be customized according to the descriptions in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art. The electrical components mentioned in this article are all electrically connected to the external main controller and the 220V mains power supply, and the main controller can be a conventional known device such as the LED lamp body for control.

[0042] The working principle of the present utility model is:

[0043] When the utility model is in use, first open the box door, and place the wafer to be defect-detected into the sealed box. When placing it, pull the pull rods 17 on both sides of the clamping frame 15 through the pull ring 18 to drive the clamping blocks 19 to move outward. When the edges of the wafer are respectively attached to the inner walls of the clamping blocks 19 on both sides, release the pull ring 18. At this time, the pull rods 17 will drive the clamping blocks 19 to move toward the middle direction under the elastic reset action of the spring 20, so that the wafer can be clamped and fixed by the clamping blocks 19. When it is necessary to detect the defects of the wafer, close the box door, and emit laser beams to the front and back of the wafer through the upper laser source 11 and the lower laser source 12 respectively. After the laser beams are emitted from the upper laser source 11 and the lower laser source 12, they are respectively focused and irradiated on the wafer surface through the upper lens 24 and the lower lens 25, and a small light spot is formed on the front and back of the wafer at the same time. When there are defects on the wafer surface, it will cause the reflection and scattering of the laser beam, so that the signal reflected from the surface defect will change, becoming weaker or scattered, while the laser signal reflected from the normal surface is stronger. At this time, the upper detector 13 and the lower detector 14 can simultaneously receive the laser signals reflected from the front and back of the wafer and convert them into electrical signals. The electrical signals can be transmitted to the display 5 through wires. The display 5 is internally integrated with a data processing unit, which is responsible for receiving the signals obtained from the upper detector 13 and the lower detector 14, and processing and analyzing the signals through algorithms to identify the defects and abnormalities on the wafer surface. By rotating the upper adjusting rod 26 and the lower adjusting rod 27, the upper lens 24 and the lower lens 25 can be respectively driven to deflect, so as to realize multi-angle detection of the wafer by the detection mechanism. When the entire defect detection work is completed, the wafer can be taken out of the sealed box 1.

[0044] The preferred embodiments of the utility model disclosed above are only used to help illustrate the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the utility model, so that those skilled in the relevant technical field can understand and utilize the utility model well. The utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A defect detection device, characterized in that: It comprises a sealed box and a detection mechanism, wherein a box door is installed on the front end surface of the sealed box, a plurality of mounting holes are opened on the rear end surface thereof, a plurality of wire holes are opened on the top of the sealed box, and a display is installed on the top of the sealed box; The detection mechanism comprises a mounting plate, the mounting plate is located in the sealed box, a plurality of mounting rods are fixedly connected to the rear end face of the mounting plate, the rod body of the mounting rod is engraved with external threads, and the rod body of the mounting rod is threadedly connected with a mounting nut matched with the external threads, a detection frame is arranged on the front side of the mounting plate, a plurality of fixing blocks are fixedly connected between the rear end face of the detection frame and the front end face of the mounting plate, an upper laser source and a lower laser source are respectively installed on the top and bottom of the detection frame, an upper detector and a lower detector are respectively installed on the front end faces of the upper laser source and the lower laser source, the upper laser source, the lower laser source, the upper detector, the lower detector and the display are all electrically connected through wires, the wires pass through the wire holes, and a clamping assembly is arranged on the front side of the detection frame; The clamping assembly includes a clamping frame, which is fixedly connected to the front end surface of the detection frame and is located between the upper laser source and the lower laser source. Through holes are opened on both sides of the clamping frame, and a pull rod is inserted into the through hole. One end of the pull rod is fixedly connected to a pull ring, and the other end is fixedly connected to a clamping block. The rod body of the pull rod is wrapped with a spring, and the two ends of the spring are respectively fixedly connected to the side walls of the clamping frame and the clamping block.

2. A defect detection device according to claim 1, characterized in that: The front side of the clamping block is C-shaped, and a layer of buffer pad is arranged on the inner wall surface of the clamping block.

3. A defect detection device according to claim 1, characterized in that: The detection frame is provided with an upper adjustment hole and a lower adjustment hole on its surface, and the upper adjustment hole and the lower adjustment hole are respectively located above and below the clamping frame, and an upper adjustment component and a lower adjustment component are respectively arranged above and below the clamping frame, and the upper adjustment component and the lower adjustment component respectively include an upper lens and a lower lens, and an upper adjustment rod and a lower adjustment rod are respectively fixedly connected to the edge outer walls of the upper lens and the lower lens, and the rod diameters of the upper adjustment rod and the lower adjustment rod are equal to the aperture diameters of the upper adjustment hole and the lower adjustment hole, and their rod shafts are both engraved with external threads, and the rod shafts of the upper adjustment rod and the lower adjustment rod are both fixedly connected to a limiting block, and the rod shafts of the upper adjustment rod and the lower adjustment rod are both threadedly connected with positioning nuts matching with their external threads.

4. A defect detection device according to claim 1, characterized in that: The number of the mounting rods is the same as the number of the mounting holes, the rod diameter is equal to the hole diameter of the mounting hole, and the center of each mounting rod corresponds to the center of each mounting hole one by one.

5. A defect detection device according to claim 1, characterized in that: A handle is installed on the front end surface of the box door, and an observation port is opened on the box door, and an observation window is installed in the observation port.

6. A defect detection device according to claim 1, characterized in that: The four corners of the bottom of the sealing box are fixedly connected with pads, and the bottom surface of each of the pads is provided with a layer of anti-wear pad.

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