Chip clamp and chip detection equipment

Abstract

The utility model relates to a chip clamp and chip detection equipment. The chip clamp comprises a main body, a bearing plate and a plurality of fixing assemblies. A hollow accommodating cavity is formed in the main body; the bearing plate is arranged in the accommodating cavity; the bearing plate is used for bearing a chip; the plurality of fixing assemblies are arranged on the main body and surround the bearing plate; one end of the fixing assembly extends above the bearing plate and is used for fixing the chip. According to the chip clamp, the chip is fixed through the fixing assembly in a physical mode of applying pressure, compared with a mode of fixing through an adhesive conductive copper adhesive tape, the chip clamp can more conveniently and completely transfer the chip, the chip is conveniently and completely taken down for a next analysis step after a test is completed, and the test efficiency is improved. Therefore, the chip detection success rate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a chip fixture and a chip detection device. Background Art

[0002] In the technical field of semiconductor manufacturing, a chip fixture is usually a mechanical device for processing and testing integrated circuit chips, and is used to take out or place a chip from a specified position into a testing device for testing.

[0003] However, in a traditional chip fixture, in order to ensure that the chip is firmly adhered to the sample stage to prevent it from falling, the chip is usually fixed on the lower surface of the sample stage with the conductive copper tape facing down. Thus, it brings difficulties to the transfer after the chip defect location is completed. During the process of removing the chip from the sample stage, the chip is prone to cracking or breaking, so that the subsequent physical failure analysis cannot be continued, resulting in a decrease in the chip detection success rate.

[0004] Therefore, there is an urgent need for a chip fixture that can conveniently transfer the chip completely to improve the chip detection success rate. Summary of the Utility Model

[0005] Based on this, the embodiments of the present application provide a chip fixture and a chip detection device, which can at least conveniently transfer the chip completely.

[0006] According to some embodiments, the present application provides a chip fixture, which includes a main body, a carrier plate and a plurality of fixing components; a hollow accommodating cavity is provided in the main body; the carrier plate is arranged in the accommodating cavity; the carrier plate is used for carrying the chip; the plurality of fixing components are arranged on the main body and surround the carrier plate; one end of the fixing component extends above the carrier plate for fixing the chip.

[0007] In the above chip fixture, the carrier plate for carrying the chip is arranged in the accommodating cavity in the main body, the plurality of fixing components arranged on the main body surround the carrier plate, and one end of the fixing component extends above the carrier plate for fixing the chip. Thus, the chip is fixed by the physical method of applying pressure through the fixing component. Compared with the method of fixing with a sticky conductive copper tape, the chip fixture of the present application can transfer the chip more conveniently and completely, and is convenient to completely remove the chip for the next analysis step after the test is completed, thereby improving the chip detection success rate.

[0008] In some embodiments, the fixing component includes a fixing post and a pressing rod; the fixing post is arranged on the main body; one end of the pressing rod is movably connected to the fixing post; the other end of the pressing rod extends above the carrier plate for fixing the chip.

[0009] In some embodiments, a sliding groove is further provided on the main body, and the sliding groove extends in the direction towards the center of the bearing plate; the fixing post is located in the sliding groove and moves within the sliding groove.

[0010] In some embodiments, the width of one end of the pressure rod located above the bearing plate is smaller than the width of the other end of the pressure rod.

[0011] In some embodiments, the fixing post includes a fixing nut and an adjusting component; the pressure rod is located between the fixing nut and the adjusting component, and the adjusting component is used to adjust the height of the pressure rod.

[0012] In some embodiments, the bearing plate is made of a transparent material.

[0013] In some embodiments, the shape of the main body and the shape of the bearing plate are rectangular; the number of the plurality of fixing components is four, and the four fixing components are respectively located at the four corners of the main body.

[0014] In some embodiments, the shape of the bearing plate is square; the side length range of the bearing plate is 25 mm - 35 mm.

[0015] In some embodiments, the main body is made of a metal material.

[0016] According to some embodiments, the present application further provides a chip detection device, including the chip fixture in any of the above embodiments; the device further includes a sample stage, a probe, and a signal probe; the chip fixture is installed on the sample stage; one end of the probe is in contact with the chip fixed by the chip fixture; the signal probe is located below the sample stage and is used to detect the chip.

[0017] In the above chip detection device, the chip fixture is installed on the sample stage, one end of the probe is in contact with the chip fixed by the chip fixture, and the signal probe is located below the sample stage and is used to detect the chip. Since the chip in the chip fixture is fixed by a physical method of applying pressure through the fixing component, compared with the method of fixing by a sticky conductive copper tape, the chip can be more conveniently and completely transferred. Therefore, the chip detection device of the present application helps to completely remove the chip for the next analysis step after the test is completed, thereby improving the chip detection success rate. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of a chip detection device with a chip fixture in the prior art;

[0019] Figure 2 It is a schematic structural diagram of a chip fixture provided by an embodiment of the present invention;

[0020] Figure 3 It is a schematic structural diagram of a chip detection device provided by an embodiment of the present invention.

[0021] Description of reference numerals: 1. Main body; 11. Accommodating cavity; 12. Carrier plate; 13. Sliding groove; 2. Fixing assembly; 21. Fixing column; 211. Fixing nut; 212. Adjusting assembly; 22. Pressing rod; 3. Sample stage; 4. Probe; 5. Signal probe. Detailed implementation manners

[0022] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the understanding of the disclosure of the present utility model can be more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] In the case of using "including", "having", and "comprising" described herein, unless a clear limiting term is used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0025] In this application, unless otherwise clearly specified and limited, the terms such as "install", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0026] In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0027] Spatial relationship terms such as "under", "below", "beneath", "underneath", "above", "over", etc. can be used herein to describe the relationship of one element or feature shown in the figures with other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the attached figures is flipped, an element or feature described as "under other elements" or "beneath them" or "underneath them" will be oriented "over" the other elements or features. Thus, the exemplary terms "under" and "beneath" can include both the upper and lower orientations. Additionally, the device may also have other orientations (such as rotated 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0028] Embodiments of the utility model are described herein with reference to schematic illustrations that are ideal embodiments (and intermediate structures) of the utility model, and thus variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, embodiments of the utility model should not be limited to the particular shapes of regions shown herein, but include shape deviations due to, for example, manufacturing techniques.

[0029] In the field of semiconductor failure analysis, Emission Microscopy (EMMI), Optical Beam Induce Resistance Change (OBIRCH), and Thermal Radiation Microscopy are all commonly used tools for locating chip defect positions. Emission Microscopy locates defects by detecting photons generated by the recombination of electron-hole pairs. Optical Beam Induce Resistance Change locates defects by detecting abnormal resistance changes caused by a laser beam. Thermal Radiation Microscopy locates defects by detecting the thermal radiation from abnormal heating positions. The common feature of these tools is that a voltage or current needs to be applied to the chip during the detection process. Among them, Emission Microscopy excites the detected photons through the principle of electroluminescence, Thermal Radiation Microscopy detects thermal radiation by the way of current flowing through the chip to do work and generate heat, and the resistance change of Optical Beam Induce Resistance Change needs to be obtained by detecting the change of voltage and current. The above tools all need to use probes to pierce the corresponding positions of the chip to apply voltage or current, so chip fixtures are required to fix the chip to achieve chip defect detection.

[0030] The front side of the chips of most semiconductor power devices is the gate and the source, and the back side is the drain. In the defect location of these power devices, usually all three terminals of the gate, the source, and the drain need to be connected to the circuit. Generally, the adopted scheme is front-side detection of the chip. The source and the gate on the front side are pricked to the corresponding positions with probes, and the drain on the back side is led out by a conductive copper tape, and the conductive copper tape also plays a role in fixing the chip at the same time.

[0031] However, there is still a problem of difficult transfer for the chips after back thinning. As shown in the traditional chip detection equipment Figure 1 For the sake of ensuring that the chip is firmly pasted on the sample stage 3 to prevent it from falling, the chip is usually fixed on the lower side of the sample stage 3 with the front side facing down by a conductive copper tape. In this way, it brings difficulties to the transfer after the chip defect location is completed. During the process of removing the chip from the sample stage 3, the chip is prone to cracking or breaking, so that the subsequent physical failure analysis cannot be continued, resulting in a decrease in the chip detection success rate.

[0032] Moreover, generally, the chip can be safely removed from the conductive copper tape by dissolving the viscous substance with organic anhydrous ethanol. However, the above method requires soaking for a certain period of time. For some cases with relatively tight pasting, an ultrasonic cleaner is also needed to assist, resulting in an extension of the failure analysis time cycle. In addition, the conductive copper tape after soaking no longer has viscosity and cannot be reused, and the anhydrous ethanol used as a consumable increases the cost of chip detection.

[0033] Based on this, the present application provides a chip fixture.

[0034] Please refer to Figure 2 , the chip fixture includes a main body 1, a carrier plate 12 and a plurality of fixing components 2; there is a hollow accommodating cavity 11 inside the main body 1; the carrier plate 12 is arranged in the accommodating cavity 11; the carrier plate 12 is used for carrying the chip; the plurality of fixing components 2 are arranged on the main body 1 and surround the carrier plate 12; one end of the fixing component 2 extends above the carrier plate 12 for fixing the chip.

[0035] In the above chip fixture, the carrier plate 12 for carrying the chip is disposed in the accommodation cavity 11 within the main body 1, and a plurality of fixing components 2 provided on the main body 1 surround the carrier plate 12. One end of the fixing component 2 extends above the carrier plate 12 for fixing the chip. In this way, the chip is fixed by the physical method of applying pressure through the fixing component 2. Compared with the method of fixing by a sticky conductive copper tape, the chip fixture of the present application can more conveniently transfer the chip completely, facilitating the complete removal of the chip for the next analysis step after the test is completed, thereby improving the chip detection success rate. Moreover, compared with the method of removing the chip by soaking in absolute ethanol, the operation of the chip fixture of the present application is simple, the waiting period is shorter, and it can be reused. In addition, the chip fixture of the present application reduces the use of chemicals and can save costs.

[0036] In some embodiments, the main body 1 is made of a metal material. Due to the relatively large density of the metal material, it has a relatively large weight when having the same volume, thus having a certain stability and firmness, and can effectively increase the overall weight of the chip fixture. By using the metal material as the main body 1, the stability of the chip fixture can be improved, so as to ensure that when the chip fixture is placed on the sample stage 3, it will not shake due to too small a mass, ensuring that the chip fixture can stably support the chip in actual application and accurately perform tests and processing.

[0037] In some embodiments, the carrier plate 12 is made of a transparent material. Exemplarily, the carrier plate 12 can be made of transparent glass coated with an ITO film. Exemplarily, the carrier plate 12 can also be replaced with other materials, such as ordinary glass, transparent resin materials, etc. The carrier plate 12 made of a transparent material can achieve backside detection of signals. For the case where the chip is closer to the bottom, such as some defects in the backside metal of the chip, the implantation of the P-type doping region, etc., stronger signals can be received by backside detection, thereby improving the detection accuracy.

[0038] In some embodiments, the shape of the main body 1 and the shape of the carrier plate 12 are rectangular. It can be understood that when the shape of the main body 1 is rectangular, the hollow accommodation cavity 11 within the main body 1 is also rectangular, and the shape of the carrier plate 12 disposed in the accommodation cavity 11 can also be set to be rectangular, thereby improving the adaptability between the main body 1 and the carrier plate 12.

[0039] In some embodiments, the shape of the carrier plate 12 is square. In the embodiments where the shape of the carrier plate 12 is square, the side length range of the carrier plate 12 is 25 mm - 35 mm. For example, the side length of the carrier plate 12 is 25 mm, 30 mm, 35 mm, etc. In this way, the carrier plate 12 can adapt to chips of different sizes. Whether the chips are smaller or larger, they can be easily placed on the carrier plate 12 for detection. By flexibly designing within the side length range, the carrier plate 12 can meet the requirements of various sized chips and provide stable support, ensuring the safety and stability of the chips during operation, thereby improving work efficiency and operation convenience, and helping the chip fixture of the present application to become a versatile and multi-size applicable practical tool.

[0040] Exemplarily, in the embodiments where the shape of the main body 1 is rectangular, the number of the plurality of fixing components 2 is four, and the four fixing components 2 are respectively located at the four corners of the main body 1. The fixing components 2 are evenly distributed at the four corners of the main body 1, which helps to maintain the balance of the chip fixture and reduce the shaking and instability caused by imbalance. Moreover, the fixing components 2 located at the four corners can provide sufficient support and stability, ensuring that the chip fixture is not prone to tilt or move when placed on the sample stage 3, and guaranteeing the accuracy of testing and processing. On the other hand, arranging the fixing components 2 at the four corners of the main body 1 is beneficial for the operator to fix the fixture and quickly adjust the position of the fixture, improving work efficiency and operation convenience. In addition, the four fixing components 2 arranged at the four corners of the main body 1 can simultaneously fix the four directions of the chip, effectively increasing the overall structural strength and compressive capacity of the chip fixture, and ensuring that the chip fixture is not easily damaged by external impacts during use.

[0041] In some embodiments, the fixing component 2 includes a fixing post 21 and a pressing rod 22; the fixing post 21 is disposed on the main body 1; one end of the pressing rod 22 is movably connected to the fixing post 21; the other end of the pressing rod 22 extends above the carrier plate 12 for fixing the chip. In this way, the chip is fixed by the physical method of applying pressure through the pressing rod 22. Compared with the method of fixing by a conductive copper tape with adhesiveness, the chip fixture of the present application can more conveniently transfer the chip completely, facilitating the complete removal of the chip for the next analysis step after the test is completed, thereby increasing the chip detection success rate.

[0042] In some embodiments, one end of the pressing rod 22 can rotate around the fixed column 21. Exemplarily, by rotating the pressing rod 22, the operator can more accurately position and fix the chip at the desired position, ensuring a more precise docking between the chip and the detection device. Precise fixing of the chip can reduce misoperations, improve the safety and stability of the operation, and ensure the integrity of the chip during the detection process. Moreover, with the design of the rotatable pressing rod 22, the operator can flexibly adjust the angle of the pressing rod 22 to adapt to chips of different sizes and shapes, improving the flexibility and accuracy of positioning. For example, when fixing a chip with a smaller area, one end of the redundant pressing rod 22 can be rotated to an area outside the region directly above the carrier plate 12, and only the pressing rod 22 used for fixing the chip is retained above the carrier plate 12 to achieve more flexible fixing of chips of different sizes.

[0043] Exemplarily, when it is necessary to remove the chip, one end of the pressing rod 22 can be rotated to an area outside the region directly above the carrier plate 12, making it easier to disassemble the chip and improving the convenience and efficiency of the operation. Moreover, by rotating the pressing rod 22 to an area outside the region directly above the carrier plate 12, it is possible to avoid accidentally touching the chip or other components when disassembling the chip, effectively avoiding the risk of chip damage and improving the flexibility and convenience of the user during the operation.

[0044] In some embodiments, a sliding groove 13 is further provided on the main body 1, and the sliding groove 13 extends in the direction towards the center of the carrier plate 12; the fixed column 21 is located within the sliding groove 13 and moves within the sliding groove 13. In the embodiment where the fixing assembly 2 is located at the four corners of the main body 1, four sliding grooves 13 are provided on the main body 1, and the four fixed columns 21 are respectively located within the four sliding grooves 13, which can adapt to chips of different sizes.

[0045] In some embodiments, the width of one end of the pressing rod 22 located above the carrier plate 12 is smaller than the width of the other end of the pressing rod 22. That is to say, the end of the pressing rod 22 connected to the fixed column 21 is wider, so that the contact area between the pressing rod 22 and the fixed column 21 is larger, enabling the pressing rod 22 to be more firmly fixed. While the end of the pressing rod 22 located above the carrier plate 12 is narrower, which can reduce the contact area between the pressing rod 22 and the chip, avoid damaging the chip, and ensure that there is sufficient area for the probe to pierce the chip when fixing a smaller-sized chip.

[0046] Exemplarily, the width of the pressing rod 22 can gradually decrease along the direction from the fixed column 21 to the carrier plate 12. The gradually narrowing pressing rod 22 can achieve a more precise and uniform pressure distribution when applying pressure, ensuring that the chip on the carrier plate 12 is subjected to a uniform pressure, and avoiding damage caused by excessive local pressure. Moreover, the gradually narrowing pressing rod 22 can reduce the possibility of vibration and displacement, keep the chip on the carrier plate 12 stably fixed, and ensure the accuracy and stability of operations such as processing and testing.

[0047] In some embodiments, the pressing rod 22 is made of an organic polymer material. For example, the pressing rod 22 can be made of polyethylene, polypropylene, polystyrene, polyvinyl chloride (PVC), polyetheretherketone (PEEK), polyphenylene ether (PPE), polyethylene terephthalate (PET), polycarbonate, polysulfone, or polyimide. Since the polymer is transparent to infrared light, the pressing rod 22 made of an organic polymer material can achieve the front detection mode even when the fixture is inverted on the sample stage 3. Thus, the conversion between the front and back detections can be conveniently achieved, and the position of the defect in the vertical direction of the chip can be roughly determined by comparing the strengths of the signals in the two modes, thereby improving the detection accuracy.

[0048] Exemplarily, the bottom electrode of the chip to be fixed can also be made of a transparent conductive material. For example, the bottom electrode of the chip to be fixed can be made of indium tin oxide (ITO for short). Thus, while leading out the drain at the bottom of the chip, it is ensured that the signal can pass through the bottom electrode of the chip to be fixed. In the detection of EMMI, the light excited by the chip can pass through the bottom transparent electrode of the chip and reach the probe to be detected. Similarly, in the detection of OBIRCH, the laser can pass through the bottom transparent electrode of the chip and reach the chip, thereby causing a change in the chip temperature and enabling the detection to proceed smoothly. The signals of the entire bottom need to pass through the bottom transparent electrode of the chip, ensuring the uniformity of signal transmission and preventing false signals due to different transmittances.

[0049] In some embodiments, the fixing post 21 includes a fixing nut 211 and an adjusting assembly 212; the pressing rod 22 is located between the fixing nut 211 and the adjusting assembly 212, and the adjusting assembly 212 is used to adjust the height of the pressing rod 22. Exemplarily, by rotating the fixing nut 211, the height of the adjusting assembly 212 can be changed, thereby adjusting the height of the pressing rod 22. Also, by rotating the fixing nut 211, the pressure of the pressing rod 22 for fixing the chip can be accurately controlled, thereby reducing the risk of chip damage and displacement during the fixing process and improving safety and stability.

[0050] In some embodiments, the adjusting assembly 212 includes a spring with a stud, and a fixing nut 211 can be mounted on the stud. One end of the pressure lever 22 is sleeved on the stud, and the pressure lever 22 is located between the fixing nut 211 and the stud. The pressure provided by the spring can stably press the pressure lever 22 against the fixing nut 211. Exemplarily, by tightening the fixing nut 211, the fixing nut 211 compresses the spring and moves towards the bearing plate 12, thereby reducing the height of the pressure lever 22. Correspondingly, by loosening the fixing nut 211, the fixing nut 211 releases the spring and moves away from the bearing plate 12, thereby increasing the height of the pressure lever 22. Compared with the fixed pressure lever 22, the design of adjusting the height using the fixing nut 211 makes the adjustment more convenient and simple, reduces the labor intensity and technical requirements of the operator, and improves the convenience and efficiency of the operation.

[0051] Please refer to Figure 2 and Figure 3 for understanding. According to some embodiments, the present application further provides a chip detection device, including the chip fixture A in any of the above embodiments. Exemplarily, the chip detection device further includes a sample stage 3, a probe 4, and a signal probe 5; the chip fixture A is installed on the sample stage 3; one end of the probe 4 is in contact with the chip fixed by the chip fixture; the signal probe 5 is located below the sample stage 3 and is used to detect the chip.

[0052] In the above chip detection device, the chip fixture A is installed on the sample stage 3, one end of the probe 4 is in contact with the chip fixed by the chip fixture A, and the signal probe 5 is located below the sample stage 3 and is used to detect the chip. Since the chip is fixed in the chip fixture A by a physical method of applying pressure through the fixing component 2, compared with the method of fixing by a conductive copper tape with adhesiveness, the chip can be more conveniently transferred completely. Therefore, the chip detection device of the present application helps to completely remove the chip for the next analysis step after the test is completed, thereby improving the chip detection success rate. And, compared with the method of removing the chip by soaking in absolute ethanol, the operation of the chip fixture of the present application is simple, the waiting period is shorter, and it can be reused. In addition, the chip fixture of the present application reduces the use of chemicals and can save costs.

[0053] In some embodiments, the bearing plate is made of a transparent material. The bearing plate made of a transparent material can achieve backside detection of signals. For the case where the chip is closer to the bottom, such as some defects in the backside metal of the chip, the implantation of the P-type doping region, etc., stronger signals can be received by backside detection, thereby improving the detection accuracy.

[0054] Exemplarily, in the embodiment where the bearing plate is made of a transparent material, the chip fixture A can be normally installed on the top surface of the sample stage 3, or, as Figure 3As shown, the chip fixture A can be reversely installed on the sample stage 3. Since the carrier plate is made of a transparent material, even if the chip fixture is reversely installed on the sample stage 3, the carrier plate made of the transparent material can still achieve signal detection to realize the front detection of the chip.

[0055] In some embodiments, the pressing rod is made of an organic polymer material. Since the polymer is transparent to infrared light, the pressing rod made of the organic polymer material can also achieve the front detection method even if the fixture is reversely placed on the sample stage 3. In this way, the conversion between the front and back detections can be conveniently achieved, and the position of the defect in the vertical direction of the chip can be roughly judged by comparing the signal strengths of the two methods, thereby improving the detection accuracy.

[0056] Exemplarily, the bottom electrode of the chip to be detected can also be made of a transparent conductive material. For example, the bottom electrode of the chip to be fixed can be made of indium tin oxide (ITO for short). In this way, while leading out the drain at the bottom of the chip, it is ensured that the signal can pass through the bottom electrode of the chip to be fixed. In the EMMI detection, the light excited by the chip can pass through the bottom transparent electrode of the chip and reach the probe to be detected. Similarly, in the OBIRCH detection, the laser can pass through the bottom transparent electrode of the chip and reach the chip, thereby causing a change in the chip temperature to enable the detection to proceed smoothly. The signals of the entire bottom need to pass through the bottom transparent electrode of the chip, ensuring the uniformity of signal transmission and preventing false signals from appearing due to different transmittances.

[0057] In some embodiments, the main body is made of a metal material. Since the density of the metal material is relatively large, it has a relatively large weight when having the same volume, thus having a certain stability and firmness, and can effectively increase the overall weight of the chip fixture. By using the metal material as the main body, the stability of the chip fixture can be improved, so that when the chip fixture is placed on the sample stage 3, it will not shake due to too small a mass, ensuring that the chip fixture can stably support the chip during actual application and accurately perform testing and processing.

[0058] In some embodiments, the shape of the main body and the shape of the carrier plate are rectangular. It can be understood that when the shape of the main body is rectangular, the hollow accommodation cavity inside the main body is also rectangular, and the shape of the carrier plate arranged in the accommodation cavity can also be set to be rectangular, thereby improving the adaptability between the main body and the carrier plate.

[0059] In some embodiments, the shape of the carrier plate is square. In the embodiments where the shape of the carrier plate is square, the side length of the carrier plate ranges from 25 mm to 35 mm. For example, the side length of the carrier plate is 25 mm, 30 mm, 35 mm, etc. In this way, the carrier plate can adapt to chips of different sizes. Whether the chips are smaller or larger, they can be easily placed on the carrier plate for detection.

[0060] Exemplarily, in the embodiments where the shape of the main body is rectangular, the number of the plurality of fixing components is four, and the four fixing components are respectively located at the four corners of the main body. The fixing components are evenly distributed at the four corners of the main body, which helps to maintain the balance of the chip fixture and reduce the shaking and instability caused by imbalance.

[0061] In some embodiments, the fixing component includes a fixing post and a pressing rod; the fixing post is arranged on the main body; one end of the pressing rod is movably connected to the fixing post; the other end of the pressing rod extends above the carrier plate for fixing the chip. In this way, the chip is fixed by applying pressure through the pressing rod. Compared with the method of fixing with a sticky conductive copper tape, the chip fixture of the present application can more conveniently transfer the chip completely, facilitate the complete removal of the chip for the next analysis step after the test is completed, thereby improving the chip detection success rate.

[0062] In some embodiments, one end of the pressing rod can rotate around the fixing post. Exemplarily, by rotating the pressing rod, the operator can more accurately position and fix the chip at the required position, ensure the more precise docking of the chip with the detection device. Accurately fixing the chip can reduce misoperations, improve the safety and stability of the operation, and ensure the integrity of the chip during the detection process.

[0063] Exemplarily, when the chip needs to be removed, one end of the pressing rod can be rotated to an area outside the directly above of the carrier plate, making it easier to disassemble the chip and improving the convenience and efficiency of the operation.

[0064] In some embodiments, a sliding groove is further arranged on the main body, and the sliding groove extends towards the center of the carrier plate; the fixing post is located in the sliding groove and moves in the sliding groove. In the embodiments where the fixing components are located at the four corners of the main body, four sliding grooves are arranged on the main body, and the four fixing posts are respectively located in the four sliding grooves, which can adapt to chips of different sizes.

[0065] In some embodiments, the width of one end of the pressing rod located above the bearing plate is smaller than that of the other end of the pressing rod. That is to say, the end of the pressing rod connected to the fixing column is wider, so that the contact area between the pressing rod and the fixing column is larger, which can make the pressing rod more firm. And the end of the pressing rod located above the bearing plate is narrower, which can reduce the contact area between the pressing rod and the chip, avoid damaging the chip, and ensure that there is enough area for the probe 4 to pierce the chip when fixing a chip with a smaller size.

[0066] In some embodiments, the fixing column includes a fixing nut and an adjusting component; the pressing rod is located between the fixing nut and the adjusting component, and the adjusting component is used to adjust the height of the pressing rod. Exemplarily, by rotating the fixing nut, the height of the adjusting component can be changed, thereby adjusting the height of the pressing rod. Moreover, by rotating the fixing nut, the pressure of the pressing rod for fixing the chip can also be accurately controlled, thereby reducing the risk of damage and displacement of the chip during the fixing process and improving safety and stability.

[0067] In some embodiments, the adjusting component includes a spring with a stud, the fixing nut can be installed on the stud, one end of the pressing rod is sleeved on the stud, and the pressing rod is located between the fixing nut and the stud. The pressure provided by the spring can make the pressing rod stably abut against the fixing nut. Exemplarily, when the fixing nut is tightened, the fixing nut compresses the spring and moves towards the bearing plate, thereby reducing the height of the pressing rod. Correspondingly, when the fixing nut is loosened, the fixing nut releases the spring and moves away from the bearing plate, thereby raising the height of the pressing rod. Compared with the fixed pressing rod, the design of adjusting the height with a fixing nut makes the adjustment more convenient and simple, reduces the labor intensity and technical requirements of the operator, and improves the convenience and efficiency of the operation.

[0068] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0069] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A chip fixture, characterized in that: include: A main body, wherein the main body has a hollow accommodating cavity; A carrying plate, disposed in the accommodating cavity; The carrier plate is used to carry the chip; A plurality of fixing components are arranged on the main body and surround the carrier plate; one end of the fixing component extends above the carrier plate to fix the chip.

2. The chip holder according to claim 1, characterized in that: The fixing assembly includes a fixing column and a pressure rod; The fixing column is arranged on the main body; One end of the pressure rod is movably connected to the fixing column; the other end of the pressure rod extends above the carrying plate to fix the chip.

3. The chip holder according to claim 2, characterized in that: The main body is also provided with a sliding groove, which extends toward the center of the carrying plate; The fixing column is located in the sliding slot and moves in the sliding slot.

4. The chip holder according to claim 2, characterized in that: The width of one end of the pressure rod located above the bearing plate is smaller than the width of the other end of the pressure rod.

5. The chip holder according to claim 4, characterized in that: The fixing column includes a fixing nut and an adjusting assembly; The pressure rod is located between the fixing nut and the adjusting assembly, and the adjusting assembly is used to adjust the height of the pressure rod.

6. The chip holder according to claim 1, characterized in that: The carrying plate is made of transparent material.

7. The chip holder according to claim 1, characterized in that: The shape of the main body and the shape of the carrying plate are rectangular; The number of the plurality of fixing components is four, and the four fixing components are respectively located at the four corners of the main body.

8. The chip holder according to claim 7, characterized in that: The shape of the carrying plate is square; The side length of the bearing plate ranges from 25 mm to 35 mm.

9. The chip holder according to claim 1, characterized in that: The main body is made of metal material.

10. A chip detection device, characterized in that: The device comprises a chip fixture as claimed in any one of claims 1 to 9; the device further comprises: A sample stage, on which the chip fixture is mounted; A probe, one end of which contacts the chip fixed by the chip fixture; A signal probe is located below the sample stage and is used to detect the chip.

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