High-precision chip test module
By using a combination of a fine-tuning platform and a suction nozzle height measurement column in the high-precision chip test module, the problem of high position accuracy requirements during the test process is solved, and more accurate and reliable chip detection is achieved.
Patent Information
- Application Number
- CN202421831765.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-31
AI Technical Summary
During the high-precision chip testing process, due to the extremely high relative position accuracy requirements of the suction nozzle of the pick-up chip and the PCB test board of the test station, the test pins and the chip pins may be poorly contacted or the pressure measurement is uneven, which affects the detection accuracy.
A high-precision chip testing module is designed, and the positions of X, Y, θ and Z directions are adjusted and calibrated by using a fine-tuning platform, and combined with the nozzle height measurement column to ensure the precise distance control between the nozzle main body and the chip to be tested.
It improves the accuracy and repeatability of the test position, reduces errors caused by position changes, and ensures accurate detection of high-precision chips.
Smart Images
Figure CN222979731U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor test and sorting, in particular to a high-precision chip test module. Background Art
[0002] A high-precision chip is an integrated circuit specifically used for processing high-precision signals, and its characteristics are as follows: it can accurately measure and control tiny signals, and its precision is usually between a dozen digits and a hundred digits, which can meet application scenarios with extremely high precision requirements; it usually has characteristics such as high speed, low noise, and low power consumption, which can ensure the stability and reliability of the system; it can work normally in a complex electromagnetic environment and has a high anti-interference ability, etc.
[0003] When performing high-precision testing on high-precision chips, a high-precision chip test module is usually used. Its design and functions are usually optimized for specific requirements of chip testing. The high-precision chip test module has many characteristics, such as adopting advanced positioning technology, combining multi-path suppression and differential positioning technology to achieve high-precision position positioning; the high-precision chip test module usually has multi-axis movement ability and can move freely in three-dimensional space to achieve precise testing of different parts and angles of the chip, etc., which can better perform high-precision testing on high-precision chips.
[0004] Currently, when testing high-precision chips, the chip needs to be placed on the probe table of the test module first to ensure that the chip is firmly fixed. Then the probe table automatically transports the chip to the test position for testing. After the test is completed, the chips that do not meet the requirements can be screened out according to the test results.
[0005] During the testing process, due to the extremely high relative position accuracy requirement between the nozzle for picking up the chip and the PCB test board of the test station, when the position accuracy exceeds the tolerance, it is easy to cause poor contact between the test needle and the chip pin, or uneven pressure during the pressure test, resulting in abnormal test data, thus affecting the detection of high-precision chips. Summary of the Utility Model
[0006] Based on this, the purpose of the present utility model is to provide a high-precision chip test module to solve the technical problem that due to the extremely high relative position accuracy requirement between the nozzle for picking up the chip and the PCB test board of the test station, when the position accuracy exceeds the tolerance, it is easy to cause poor contact between the test needle and the chip pin, or uneven pressure during the pressure test, resulting in abnormal test data, thus affecting the detection of high-precision chips.
[0007] To achieve the above object, the present utility model provides the following technical solution: A high-precision chip testing module, including a base, a sliding bottom plate is slidably connected to the top of the base, a column main body is fixedly connected to the top of the sliding bottom plate, a fine adjustment platform is fixedly connected to the top of the column main body, a second connecting member is fixedly connected to the top of the fine adjustment platform, a third connecting member is fixedly connected to the top of the second connecting member, a fourth connecting member is fixedly connected to the top of the third connecting member, a testing seat is arranged inside the fourth connecting member, a nozzle main body is installed on the top of the fourth connecting member, and a nozzle height measuring column is fixedly connected to the top of the base.
[0008] By adopting the above technical solution, the positions in the X, Y, θ, and Z directions can be adjusted and calibrated through the fine adjustment platform, with high integration. Moreover, the micrometer is used to adjust the X, Y positions and angles of the fine adjustment platform, improving the adjustment accuracy. Linear continuous fine adjustment can be performed before and during the test. At the same time, the setting of the nozzle height measuring column helps to ensure the precise distance control between the nozzle main body and the chip to be tested during the test, and can also improve the repeatability of the position of the nozzle main body during each test, reducing the error caused by position changes, and facilitating better testing of high-precision chips.
[0009] The present utility model is further configured such that a set of slide rails is fixedly connected to the top of the base, a slider that fits with the slide rails is slidably connected to the outer surface of the slide rails, and the sliding bottom plate is fixedly connected to the top of the slider.
[0010] By adopting the above technical solution, the slider slides on the slide rails, thereby adjusting the position of the sliding bottom plate on the base. Therefore, the device can be used better. At the same time, the connection in the form of slide rails makes the disassembly, installation, and debugging of the device more convenient.
[0011] The present utility model is further configured such that a first connecting member is fixedly connected to the top of the base, a set of first limiting blocks is fixedly connected to the side of the first connecting member close to the sliding bottom plate, a second connecting block is fixedly connected to the end of the base away from the first connecting member, and a set of second limiting blocks is fixedly connected to the side of the second connecting block close to the sliding bottom plate.
[0012] By adopting the above technical solution, the first limiting block and the second limiting block are respectively located on both sides of the sliding bottom plate, playing a limiting role. It limits the moving range of the sliding bottom plate on the base, preventing the sliding bottom plate from undergoing excessive displacement due to external forces during the test, thereby ensuring the stability and accuracy of the test.
[0013] The present utility model is further configured such that a first connecting block is movably connected to the top of the base, a cylinder is disposed on the top of the first connecting block, and the first connecting block and the second connecting block are connected by a hinge.
[0014] By adopting the above technical solution, the first connecting block and the second connecting block are connected by a hinge, so that the cylinder can be driven to rotate, and thus the test module can be used better.
[0015] The present utility model is further configured such that a solenoid valve is connected to one side of the base through a second connecting plate, and a set of air pipe connectors is disposed on the outer surface of the solenoid valve.
[0016] By adopting the above technical solution, the solenoid valve has the characteristics of rapid response, can complete the opening and closing of the air path in a short time, and at the same time enables the solenoid valve to precisely adjust the flow rate and pressure of the gas by controlling the on-off of the air path, providing a stable gas source for chip testing.
[0017] The present utility model is further configured such that a first connecting plate is fixedly connected to the top of the base, and a positioning plunger is installed on the first connecting plate.
[0018] By adopting the above technical solution, the position of the chip or other components to be tested can be precisely fixed during the test through the positioning plunger, and the positioning plunger has a good repeated positioning function, which can ensure that the components to be tested are in the same position each time during multiple tests, thereby improving the repeatability and consistency of the test.
[0019] The present utility model is further configured such that a position sensor is installed on the surface of the first connecting block.
[0020] By adopting the above technical solution, the position sensor can accurately detect whether the component to be tested or the test tool reaches the predetermined position, and the position sensor can provide position information to the control system in real time, enabling the control system to respond quickly and adjust the test process.
[0021] In summary, the present utility model mainly has the following beneficial effects:
[0022] The present utility model can adjust and calibrate the positions in the X, Y, θ, and Z directions through the fine-tuning platform, with high integration. The fine-tuning platform uses micrometers to adjust the X, Y positions and angles, improving the adjustment accuracy. Linear continuous fine-tuning can be performed before and during the test. At the same time, the setting of the nozzle height measuring column helps to ensure the precise distance control between the nozzle body and the chip to be tested during the test, and can also improve the repeatability of the nozzle body position during each test, reducing the error caused by position changes, and facilitating the better testing of high-precision chips. Description of the Drawings
[0023] Figure 1 is a three-dimensional structure schematic diagram of the present utility model;
[0024] Figure 2 For the present utility model Figure 1 is a three-dimensional structure schematic diagram from another perspective in the present utility model;
[0025] Figure 3 is a detailed structure diagram of the test seat of the present utility model;
[0026] Figure 4 is a partial schematic diagram of the three-dimensional structure of the present utility model;
[0027] Figure 5 is a partial detailed diagram of the three-dimensional structure of the present utility model.
[0028] In the figure: 1, base; 2, sliding bottom plate; 3, slide rail; 4, slider; 5, first connecting piece; 6, nozzle height measuring column; 7, fine adjustment platform; 8, second connecting piece; 9, third connecting piece; 10, fourth connecting piece; 11, test seat; 12, nozzle body; 13, column body; 14, first connecting plate; 15, positioning plunger; 16, first connecting block; 17, cylinder; 18, first limiting block; 19, in-place sensor; 20, second connecting plate; 21, solenoid valve; 22, air pipe joint; 23, second limiting block; 24, second connecting block. Specific embodiments
[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as limiting the present utility model.
[0030] Next, according to the overall structure of the present utility model, its embodiments will be described.
[0031] A high-precision chip test module, as Figures 1-5 shown, includes a base 1. A set of slide rails 3 are fixedly connected to the top of the base 1. The outer surface of the slide rail 3 is slidably connected with a slider 4 that fits the slide rail 3, so that the slider 4 slides on the outer surface of the slide rail 3. And a sliding bottom plate 2 is fixedly connected to the top of the slider 4. Therefore, the sliding bottom plate 2 can be synchronously driven to slide on the top of the base 1. At the same time, the connection in the form of the slide rail 3 and the slider 4 makes the disassembly, installation and debugging of the device more convenient.
[0032] Subsequently, a column main body 13 is fixedly connected to the top of the sliding base plate 2. The top of the column main body 13 is fixedly connected to a fine adjustment platform 7. The top of the fine adjustment platform 7 is fixedly connected to a second connecting member 8. The top of the second connecting member 8 is fixedly connected to a third connecting member 9. The top of the third connecting member 9 is fixedly connected to a fourth connecting member 10. A test seat 11 is arranged inside the fourth connecting member 10. A nozzle main body 12 is installed on the top of the fourth connecting member 10. The positions in the X, Y, θ, and Z directions can be adjusted and calibrated through the fine adjustment platform 7. The integration degree is high. Moreover, the micrometer is used to adjust the X, Y positions and angles of the fine adjustment platform 7, which improves the adjustment accuracy. Linear continuous fine adjustment can be performed before and during the test. A nozzle height measuring column 6 is fixedly connected to the top of the base 1, which helps to ensure the precise distance control between the nozzle main body 12 and the chip to be tested during the test, and can also improve the repeatability of the position of the nozzle main body 12 during each test, reduce the error caused by position changes, and facilitate the better testing of high-precision chips.
[0033] Furthermore, a first connecting member 5 is fixedly connected to the top of the base 1. A group of first limiting blocks 18 are fixedly connected to the side of the first connecting member 5 close to the sliding base plate 2. A second connecting block 24 is fixedly connected to the end of the top of the base 1 far from the first connecting member 5. A group of second limiting blocks 23 are fixedly connected to the side of the second connecting block 24 close to the sliding base plate 2. The first limiting blocks 18 and the second limiting blocks 23 can limit the sliding base plate 2, restricting its movement range on the base 1 and ensuring the stability and accuracy of the test.
[0034] Among them, a first connecting block 16 is movably connected to the top of the base 1. A cylinder 17 is arranged on the top of the first connecting block 16. And a position sensor 19 is installed on the surface of the first connecting block 16. Through the position sensor 19, it can accurately detect whether the element or test tool to be tested reaches the predetermined position, and can also provide position information to the control system in real time, enabling the control system to respond quickly and adjust the test process. At the same time, the first connecting block 16 and the second connecting block 24 are connected by a hinge, so that the first connecting block 16 and the cylinder 17 can rotate on one side of the second connecting block 24.
[0035] In this embodiment, a solenoid valve 21 is connected to one side of the base 1 through a second connecting plate 20. A set of air pipe connectors 22 are arranged on the outer surface of the solenoid valve 21. The solenoid valve 21 can open and close the air circuit in a short time, so as to accurately adjust the flow rate and pressure of the gas, providing a stable gas source for chip testing. At the same time, a first connecting plate 14 is fixedly connected to the top of the base 1, and a positioning plunger 15 is installed on the first connecting plate 14. Therefore, during the test, the position of the chip or other components to be tested can be accurately fixed. Moreover, the positioning plunger 15 has a good repeated positioning function, which can ensure that the component to be tested is in the same position every time during multiple tests, thereby improving the repeatability and consistency of the test.
[0036] Working principle: According to the calibration of the nozzle position, the test module is divided into two states: the nozzle height calibration mode and the normal test mode. When calibrating the nozzle height, the cylinder 17 needs to retract, then manually flip the cylinder 17 part, and then move the column body 13 to the position of the second limit block 23. After pressing down the nozzle body 12, check the height of each nozzle body 12 and perform debugging to control the deviation of the height of all nozzle bodies 12 from the preset value within ±0.01 mm. When adjusting the test seat 11, the column body 13 can be moved to the position of the first limit block 18, then manually flip and close the cylinder 17 part, the cylinder 17 moves out, and the in-place sensor 19 lights up. By adjusting the X, Y fine-tuning platform 7 and the micrometer for rotating angle, the calibrated nozzle body 12 and the test seat 11 are debugged in place. Finally, the test seat 11 and the fourth connecting piece 10 are installed on the third connecting piece 9. Or during the test, if it is necessary to finely adjust the position of the PCB test board, the above method can also be used for adjustment. The fine-tuning result can be immediately verified by pressing down for testing. With this structure, the accuracy of the test position can be guaranteed.
[0037] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and do not limit the present invention. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations without creative contributions to the embodiments according to needs, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.
Claims
1. A high-precision chip testing module, comprising a base (1), the top of the base (1) being slidably connected to a sliding bottom plate (2), characterized in that: The top of the sliding base plate (2) is fixedly connected to a column body (13), the top of the column body (13) is fixedly connected to a fine-tuning platform (7), the top of the fine-tuning platform (7) is fixedly connected to a second connecting piece (8), the top of the second connecting piece (8) is fixedly connected to a third connecting piece (9), the top of the third connecting piece (9) is fixedly connected to a fourth connecting piece (10), a test seat (11) is arranged in the fourth connecting piece (10), a nozzle body (12) is installed on the top of the fourth connecting piece (10), and the top of the base (1) is fixedly connected to a nozzle height measuring column (6).
2. The high-precision chip test module according to claim 1, characterized in that: A group of slide rails (3) are fixedly connected to the top of the base (1); a slider (4) matching the slide rails (3) is slidably connected to the outer surface of the slide rails (3); and the top of the slider (4) is fixedly connected to the sliding base plate (2).
3. The high-precision chip test module according to claim 1, characterized in that: The top of the base (1) is fixedly connected to a first connecting member (5), a side of the first connecting member (5) close to the sliding bottom plate (2) is fixedly connected to a group of first limiting blocks (18), the top of the base (1) is fixedly connected to an end away from the first connecting member (5) and a second connecting block (24), and a side of the second connecting block (24) close to the sliding bottom plate (2) is fixedly connected to a group of second limiting blocks (23).
4. The high-precision chip test module according to claim 3, characterized in that: The top of the base (1) is movably connected to a first connection block (16), a cylinder (17) is arranged on the top of the first connection block (16), and the first connection block (16) and the second connection block (24) are connected via a hinge.
5. The high-precision chip testing module according to claim 1, characterized in that: One side of the base (1) is connected to a solenoid valve (21) via a second connecting plate (20), and a group of air pipe joints (22) are provided on the outer surface of the solenoid valve (21).
6. The high-precision chip testing module according to claim 1, characterized in that: A first connecting plate (14) is fixedly connected to the top of the base (1), and a positioning plunger (15) is installed on the first connecting plate (14).
7. The high-precision chip test module according to claim 4, characterized in that: A position sensor (19) is mounted on the surface of the first connecting block (16).