Double-cavity radiator for computer

Abstract

The utility model discloses a double-cavity radiator for computer, including base and circulating pipeline, the bottom wall of base fits with the heating element, the inside of base is provided with the cavity, the cavity is filled with the first condensing medium, the circulating pipeline is provided with a plurality of at intervals, the circulating pipeline is provided with closed loop flow channel, the first condensing medium is filled with the first condensing medium, and the second condensing medium is filled with the second condensing medium. The flow channel is filled with a second condensation medium, the circulating pipeline comprises an evaporation section extending into the cavity and a condensation section extending out of the base, and the peripheral wall of the condensation section is attached to the cooling fins; and when the temperature of the first condensing medium is increased, the second condensing medium in the evaporation section is heated, and the second condensing medium is driven to circularly flow from the evaporation section to the condensation section and the temperature of the first condensing medium is increased. The heat pipe can be a combination of two heat pipes (two-section self-circulation), so that the heat dissipation efficiency is lower, a power source does not need to be added, and the structure is stable.

Description

Technical Field

[0001] The utility model relates to the field of computer radiators, and particularly relates to a double-chamber radiator for a computer. Background Art

[0002] With the high performance, high integration and high density of computers and other electronic devices, their power consumption also shows an increasing trend. When electronic devices work for a long time, a large amount of heat will be generated. If the heat cannot be dissipated in time, the device will overheat, affecting its performance and even damaging the device. Therefore, heat dissipation is a very important issue in the design of electronic devices.

[0003] In the prior art, the fin size of the air-cooled radiator is limited by the computer case and the motherboard, and cannot be increased. In this case, the power consumption is limited. Moreover, the fins of the current air-cooled radiator have no air duct design. When the fan air flow blows through the fins during the operation of the radiator, the time for the air flow to pass through the fins is short, resulting in less heat being carried away and insufficient cooling efficiency. When higher cooling efficiency is required, the air-cooled radiator is less and less selected, and the problem of insufficient cooling efficiency becomes more and more prominent. Summary of the Utility Model

[0004] The main object of the utility model is to propose a double-chamber radiator for a computer, aiming to improve the existing radiator structure and thus enhance the heat dissipation effect.

[0005] To achieve the above object, the utility model proposes a double-chamber radiator for a computer, comprising:

[0006] A base, the bottom wall of the base is attached to the heating element, and a cavity is provided inside the base, and the cavity is filled with a first condensation medium;

[0007] A plurality of circulating pipes are provided and arranged at intervals. The circulating pipes are provided with a closed-loop flow channel, and the flow channel is filled with a second condensation medium.

[0008] The circulating pipe includes an evaporation section extending into the cavity and a condensation section extending out of the base, and the outer peripheral wall of the condensation section is attached to the heat dissipation fins.

[0009] When the temperature of the first condensation medium rises, the second condensation medium in the evaporation section is heated, and drives the second condensation medium to circulate from the evaporation section to the condensation section and equalize the temperature with the first condensation medium.

[0010] In actual design, the cavity of the base is filled with a first condensation medium, and its principle is similar to that of a bubble cold spring. It is equivalent to the part where the base contacts the heating element, conducting heat to the first condensation medium. Especially the setting of the copper column enables the base to achieve rapid heat exchange. At the same time, when the first condensation medium reaches a predetermined temperature, it will generate a one-way flow, that is, the thermal power moves away from the high temperature to the low temperature. The circulating pipeline performs heat replacement on the heat exchange part of the cavity, thereby effectively reducing the temperature of the cold bubble spring, and then realizing the circulation of the first condensation medium. At the same time, the second condensation medium in the circulating pipeline circulates from the evaporation section to the condensation section and is dissipated by the heat dissipation fins. It can be understood as a combination of two heat pipes (two self-circulating sections). Therefore, its heat dissipation efficiency is lower, and there is no need to add a power source, and the structure is stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is an exploded view of the present utility model;

[0012] Figure 2 is a cross-section of the present utility model Figure 1 ;

[0013] Figure 3 is a cross-section of the present utility model Figure 2 ;

[0014] Figure 4 is a three-dimensional schematic diagram of the present utility model.

[0015] In the figure, 1 is the base, 10 is the first condensation medium, 11 is the cavity, 2 is the circulating pipeline, 20 is the second condensation medium, 21 is the evaporation section, 22 is the condensation section, 3 is the heat dissipation fins, 41 is the heating cavity, 42 is the heat exchange cavity, 51 is the groove part, 52 is the screw through hole, and 6 is the copper column. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0017] It should be noted that if there are directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0018] In addition, if there are descriptions involving "first" or "second" in the embodiments of the present utility model, such descriptions of "first" or "second" are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments may be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0019] As Figures 1 to 4 shown, a dual-chamber radiator for a computer includes:

[0020] A base 1, the bottom wall of the base 1 is in contact with the heating element, a cavity 11 is provided inside the base 1, and the cavity 11 is filled with a first condensation medium 10;

[0021] A plurality of circulating pipes 2 are provided and arranged at intervals. The circulating pipes 2 are provided with a closed-loop flow channel, and the flow channel is filled with a second condensation medium 20.

[0022] The circulating pipe 2 includes an evaporation section 21 extending into the cavity 11 and a condensation section 22 extending out of the base 1. The outer peripheral wall of the condensation section 22 is in contact with the heat dissipation fins 3.

[0023] When the temperature of the first condensation medium 10 increases, the second condensation medium 20 in the evaporation section 21 is heated up, and drives the second condensation medium 20 to circulate from the evaporation section 21 towards the condensation section 22 and achieve the temperature with the first condensation medium 10.

[0024] In actual design, the cavity 11 of the base 1 is filled with the first condensation medium 10. Its principle is similar to a bubble cold spring. It is equivalent to the part of the base 1 in contact with the heating element, which conducts heat to the first condensation medium 10. Especially the setting of the copper column enables the base 1 to achieve rapid heat exchange. At the same time, when the first condensation medium 10 reaches a predetermined temperature, it will generate a one-way flow, that is, the thermal power moves away from the high temperature to the low temperature. And the circulating pipe 2 performs heat replacement on the heat exchange part of the cavity 11, thereby effectively reducing the temperature of the cold bubble spring, and then realizing the circulation of the first condensation medium 10. At the same time, the second condensation medium 20 of the circulating pipe 2 circulates from the evaporation section 21 towards the condensation section 22 and is dissipated by the heat dissipation fins 3. It can be understood as a combination of two heat pipes (two self-circulating sections). Therefore, its heat dissipation efficiency is lower, and there is no need to add a power source, and the structure is stable.

[0025] Specifically, a partition can also be provided in the middle of the cavity 11, fluid inlet holes and fluid outlet holes can be provided on both sides of the partition, and the fluid inlet holes and the fluid outlet holes can be set to have different inner diameters, so as to form a flow pressure difference, and further realize the self-flow of the first condensation medium 10. Of course, some valve structures can also be adopted to realize the self-flow of the first condensation medium 10.

[0026] Specifically, a two-phase heat pipe is provided inside the base 1. The two-phase heat pipe includes a heating chamber 41 and a heat exchange chamber 42 provided on the inner wall of the cavity 11. A one-way flow channel is provided between the heating chamber 41 and the heat exchange chamber 42. The first condensation medium 10 is a fluorinated liquid, and the first condensation medium 10 can circulate between the heating chamber 41 - the heat exchange chamber 42 - the heating chamber 41.

[0027] Among them, the fluorinated liquid has the characteristics of being insulating and non-conductive. Among them, the existing technology's Meite FMD50 can be adopted, and its boiling point is 50 degrees, so it has a relatively stable fluid circulation effect.

[0028] At the same time, the two-phase heat pipe is a prior art. The first condensation medium 10 can circulate between the heating chamber 41 - the vapor chamber - the heating chamber 41, thereby realizing rapid heat exchange with the heating element, and the fluid volume is larger, and its heat exchange effect is better than that of the existing ether.

[0029] Specifically, the one-way flow channel is a microporous sintered structure. For example, the heat pipe is composed of a sealed container, a capillary structure and a working fluid. To ensure that the heat pipe has high heat exchange performance, usually the outer shell is made of a material with high thermal conductivity, and the inner wall is attached with a wick around it. To meet the pressure resistance requirements, some heat pipes are internally designed with solid columns, sintered columns or sintered rings are formed by attaching a wick to the outer surface of the solid column.

[0030] In the embodiment of the present invention, the circulation pipeline 2 is a heat pipe or a hollow tube. That is, the heat pipe can also achieve the above-mentioned second heat exchange. Of course, the second condensation medium 20 that can be vaporized can also be used to achieve circulation in the hollow tube.

[0031] Specifically, the specific heat capacity of the second condensation medium 20 is greater than that of the first condensation medium 10. Therefore, heat exchange between the first condensation medium 10 and the second condensation medium 20 can be achieved. It can be understood that even if their boiling points are the same, the contact area with the heating element and the heat exchange efficiency are higher than those of a single copper plate, so faster heat exchange can be achieved.

[0032] In the embodiment of the present invention, the circulation pipeline 2 is a hollow copper tube welded integrally, thereby ensuring the sealing performance of the radiator.

[0033] In the embodiment of the present utility model, vertical groove portions 51 are provided on both sides of the middle of the heat dissipation fins 3, and screw through holes 52 are provided at the positions of the base 1 corresponding to the groove portions 51, thereby facilitating the installation and fixation of the base 1.

[0034] Specifically, the circulation pipeline 2 is in a "mouth" shape, so that the travel of the second condensation medium 20 is greater, thereby increasing the contact area with the heat dissipation fins 3 and achieving sufficient heat dissipation.

[0035] In the embodiment of the present utility model, a plurality of vertically arranged copper columns 6 are provided in the cavity 11, and the copper columns abut against the top wall of the cavity 11, thereby further increasing the contact area between the base 1 and the first condensation medium 10 and further improving the heat exchange efficiency.

[0036] The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made by using the content of the specification and drawings of the present utility model under the inventive concept of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. A dual-chamber radiator for a computer, characterized in that: include: A base, wherein the bottom wall of the base is in contact with the heating element, and a cavity is provided inside the base, and the cavity is filled with a first condensing medium; A circulation pipeline, wherein the circulation pipeline is provided in multiple and spaced-apart manner, the circulation pipeline is provided with a closed-loop flow channel, and the flow channel is filled with a second condensing medium, The circulation pipeline includes an evaporation section extending into the cavity and a condensation section extending out of the base, and the outer peripheral wall of the condensation section is in contact with the heat dissipation fins; When the temperature of the first condensing medium increases, the temperature of the second condensing medium in the evaporation section increases, and drives the second condensing medium to circulate from the evaporation section to the condensation section and achieve the same temperature as the first condensing medium.

2. The dual-chamber heat sink for a computer according to claim 1, characterized in that: A two-phase temperature averaging plate is provided inside the base, and the two-phase temperature averaging plate includes a heating chamber and a heat exchange chamber provided on the inner wall of the chamber, and a one-way flow channel is provided between the heating chamber and the heat exchange chamber. The first condensing medium is a fluorinated liquid, and the first condensing medium can circulate between the heating chamber-heat exchange chamber-heating chamber.

3. The dual-chamber heat sink for a computer as claimed in claim 2, characterized in that: The one-way flow channel is a microporous sintered structure.

4. The dual-chamber heat sink for a computer according to claim 1, characterized in that: The circulation pipeline is a heat pipe or a hollow pipe.

5. The dual-chamber heat sink for a computer according to claim 1, characterized in that: The specific heat capacity of the second condensing medium is greater than the specific heat capacity of the first condensing medium.

6. The dual-chamber heat sink for a computer as claimed in claim 1, characterized in that: The circulation pipeline is a hollow copper pipe welded in one piece.

7. The dual-chamber heat sink for a computer as claimed in claim 1, characterized in that: Vertically arranged grooves are provided on both sides of the middle of the heat dissipation fins, and screw holes are provided at positions of the base located at the grooves.

8. The dual-chamber heat sink for a computer as claimed in claim 1, characterized in that: The circulation pipeline is in a "mouth" shape.

9. The dual-chamber heat sink for a computer as claimed in claim 1, characterized in that: The cavity is provided with a plurality of vertically arranged copper pillars, and the copper pillars abut against the top wall of the cavity.

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