Shunt with enhanced mechanical performance and circuit board assembly

Abstract

The utility model discloses a shunt and a circuit board assembly with enhanced mechanical performance, the shunt comprises a resistor body, a first electrode, a second electrode and a positioning structure, the positioning structure comprises a diversion pressing rivet column arranged on the first electrode, and a positioning convex column arranged on the first electrode and / or the second electrode, wherein the flow guide pressing rivet column and the positioning convex column are respectively used for being inserted into corresponding hole positions on a circuit board and are welded on the circuit board. In the embodiment provided by the utility model, the positioning convex columns and the flow guide pressing rivet columns are welded on the circuit board through tin soldering after being inserted into the corresponding hole sites on the circuit board, and the shunt can be firmly locked on the circuit board through the connecting structure, so that the effect of consuming the stress at the joint of the shunt and the circuit board is achieved, and the service life of the shunt is prolonged. Therefore, the connection firmness and reliability of the diverter and the circuit board are improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, and particularly to a shunt and a circuit board assembly with enhanced mechanical properties. Background Art

[0002] In the existing circuit board assembly, the shunt usually connects its electrodes and the PCB board by screwing, so as to realize the loading of the shunt. However, this connection method has insufficient reliability and cannot adapt to high-vibration environments such as automobiles and military industries, resulting in insufficient reliability of the circuit board assembly and even inability to pass reliability tests such as impact, vibration, and drop. Summary of the Utility Model

[0003] The utility model aims to provide a shunt and a circuit board assembly with enhanced mechanical properties.

[0004] To solve the above technical problems, the utility model provides a shunt with enhanced mechanical properties, including:

[0005] A resistor body;

[0006] A first electrode and a second electrode, the first electrode and the second electrode are respectively arranged on two opposite end sides of the resistor body and are respectively connected to the resistor body; and,

[0007] A positioning structure, including a diversion riveting column arranged on the first electrode and positioning convex columns arranged on the first electrode and / or the second electrode, wherein the diversion riveting column and the positioning convex columns are respectively used for being inserted into corresponding holes on the circuit board and welded to the circuit board.

[0008] Optionally, the positioning structure further includes a screw hole opened on the second electrode, and the screw hole is correspondingly arranged with the hole on the circuit board so that the second electrode is screwed to the circuit board.

[0009] Optionally, two positioning convex columns are provided, and the two positioning convex columns include a first convex column arranged on the first electrode and a second convex column arranged on the second electrode.

[0010] Optionally, the first convex column is formed by stamping the first electrode, so that a first groove is correspondingly formed on the other side of the first electrode opposite to the first convex column, and the second convex column is formed by stamping the second electrode, so that a second groove is correspondingly formed on the other side of the second electrode opposite to the second convex column.

[0011] Optionally, the thickness of the first electrode is H1, the height of the first stud is h1, and h1 is less than or equal to 0.9H1; and / or, the thickness of the second electrode is H2, the height of the second stud is h2, and h2 is less than or equal to 0.9H2.

[0012] Optionally, the resistor body is an alloy resistor.

[0013] Optionally, the materials of the first electrode and the second electrode are both brass.

[0014] To solve the above technical problems, the present utility model provides a circuit board assembly, including:

[0015] A circuit board, on which a plurality of hole positions are provided; and,

[0016] The shunt with enhanced mechanical properties as described above.

[0017] Optionally, the plurality of hole positions include a first through hole corresponding to the flow guiding riveting post and a second through hole corresponding to the positioning stud. The inner diameter of the first through hole is D, and the inner diameter of the second through hole is d. D is greater than or equal to 2.5d and less than or equal to 4d.

[0018] Optionally, the minimum inner diameter of the second through hole is greater than the maximum outer diameter of the positioning stud.

[0019] The technical solution provided by the present utility model has the following advantages:

[0020] The shunt with enhanced mechanical properties provided by the present utility model includes a resistor body, a first electrode, a second electrode, and a positioning structure. The positioning structure includes a flow guiding riveting post provided on the first electrode and a positioning stud provided on the first electrode and / or the second electrode. The flow guiding riveting post and the positioning stud are respectively used for being inserted into corresponding hole positions on the circuit board and welded to the circuit board. In the embodiment provided by the present utility model, after the positioning stud and the flow guiding riveting post are inserted into the corresponding hole positions on the circuit board, they are welded to the circuit board by soldering. This connection structure can firmly lock the shunt on the circuit board, achieving the effect of consuming the stress at the connection between the shunt and the circuit board, thereby improving the firmness and reliability of the connection between the shunt and the circuit board. Description of the Drawings

[0021] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Schematic diagram of a structure of an embodiment of the circuit board assembly provided by the present utility model;

[0023] Figure 2 is Figure 1 the top view of the shunt in

[0024] Figure 3 is Figure 2 the front view of the shunt in

[0025] Figure 4 is Figure 1 the top view of the circuit board in

[0026] Explanation of reference numerals:

[0027] 100 - Circuit board assembly; 10 - Shunt; 11 - First electrode; 12 - Second electrode; 13 - Resistor body; 14 - Conductive riveting post; 15 - Positioning stud; 16 - Screw hole; 151 - First stud; 152 - Second stud; 153 - First groove; 154 - Second groove; 20 - Circuit board; 21 - First through hole; 22 - Second through hole. Detailed implementation manners

[0028] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Hereinafter, the present utility model will be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to be used to describe a specific order or sequence.

[0030] Please refer to Figure 1 , the present utility model provides a circuit board assembly 100. It includes a circuit board 20 and a shunt 10 welded to the circuit board 20. The shunt 10 includes a resistor body 13 and a first electrode 11 and a second electrode 12 respectively disposed on opposite ends of the resistor body 13. The first electrode 11 and the second electrode 12 should be reliably electrically connected to the circuit board 20 respectively. It can be understood that the resistor body 13 is usually a sheet-shaped alloy resistor, which can specifically be a manganese copper alloy, a nickel chromium alloy, etc., so as to have good mechanical strength and heat dissipation performance. The materials of the first electrode 11 and the second electrode 12 are usually brass or copper with good electrical conductivity. In this embodiment, the first electrode 11 and the second electrode 12 are preferably brass, so as to have good electrical conductivity while having sufficient mechanical strength and good workability.

[0031] Further, please refer to Figure 2 and Figure 3 , the present utility model further provides a shunt 10, and the shunt 10 further includes a positioning structure disposed on the first electrode 11 and the second electrode 12. The positioning structure includes a diversion riveting post 14 disposed on the first electrode 11 and a positioning post 15 disposed on the first electrode 11 and / or the second electrode 12. The diversion riveting post 14 and the positioning post 15 are respectively used for being inserted into corresponding holes on the circuit board 20 and welded to the circuit board 20. In this embodiment, the diversion riveting post 14 generally has a larger outer diameter and height than the positioning post 15. In addition to mechanically connecting the first electrode 11 and the circuit board 20, it also plays a role in diversion.

[0032] In this embodiment, after the positioning post 15 and the diversion riveting post 14 are inserted into corresponding holes on the circuit board 20, they are welded to the circuit board 20 by soldering. This connection structure can firmly lock the shunt 10 on the circuit board 20 through the cooperation of the diversion riveting post 14 and the positioning post 15, achieving the effect of consuming the stress at the connection between the shunt 10 and the circuit board 20, thereby improving the firmness and reliability of the connection between the shunt 10 and the circuit board 20. Compared with the prior art in which the shunt 10 and the circuit board 20 are connected by screwing, the connection method provided by the present utility model is more stable and reliable, and the mechanical connection performance is effectively enhanced, thereby increasing the reliability and durability of the shunt 10 and the circuit board assembly 100.

[0033] Please continue to refer to Figure 4 , multiple holes are provided on the circuit board 20. Among them, the multiple holes include a first through hole 21 corresponding to the diversion riveting post 14 and a second through hole 22 corresponding to the positioning post 15. The inner diameter of the first through hole 21 is D, and the inner diameter of the second through hole 22 is d. D is greater than or equal to 2.5d and less than or equal to 4d. It can be understood that the size of the positioning post 15 should not be too small, otherwise the effect of significantly improving the mechanical connection strength between the shunt 10 and the circuit board 20 cannot be achieved, and its size should not be too large, otherwise it will affect the diversion between the diversion riveting post 14 and the circuit board 20. Therefore, in a preferred embodiment, D is greater than or equal to 2.5d and less than or equal to 4d, so that while the positioning post 15 enhances the connection strength between the shunt 10 and the circuit board 20, its size is reasonably set and does not affect the smooth diversion between the first electrode 11 or the second electrode 12 and the circuit board 20.

[0034] Furthermore, the minimum inner diameter of the second through hole 22 is greater than the maximum outer diameter of the positioning stud 15. In this embodiment, the second through hole 22 and the positioning stud 15 are in clearance fit, so that there is a sufficient tolerance rate for the positioning connection between the shunt 10 and the circuit board 20, thereby improving the assembly efficiency of the circuit board assembly 100. It can be understood that after welding, the solder should fill the gap between the second through hole 22 and the positioning stud 15.

[0035] Furthermore, a screw hole 16 is provided on the second electrode 12, and the screw hole 16 is correspondingly arranged with the hole position on the circuit board 20, so that the second electrode 12 is screwed to the circuit board 20. In this way, a reliable mechanical connection and current conduction between the second electrode 12 and the circuit board 20 are achieved, and at the same time, the assembly efficiency between the shunt 10 and the circuit board 20 is improved.

[0036] Based on the above embodiments, please continue to refer to Figure 2 and Figure 3 , two positioning studs 15 are provided, and the two positioning studs 15 include a first stud 151 provided on the first electrode 11 and a second stud 152 provided on the second electrode 12. In this embodiment, through the cooperation of the first stud 151 and the second stud 152, the mechanical connection strength between the first electrode 11 and the second electrode 12 and the circuit board 20 is synchronously enhanced.

[0037] Furthermore, the flow guiding riveting post 14 is riveted to the first electrode 11. The first stud 151 is formed by stamping the first electrode 11, so that a first groove 153 is correspondingly formed on the other side of the first electrode 11 opposite to the first stud 151. The second stud 152 is formed by stamping the second electrode 12, so that a second groove 154 is correspondingly formed on the other side of the second electrode 12 opposite to the second stud 152. In this embodiment, the positioning stud 15 is formed in the die forming stage of the shunt 10 by stamping, and the production time and production cost of the shunt 10 are basically not increased on the premise of forming the first stud 151 and the second stud 152.

[0038] Based on the previous embodiment, it can be understood that the sizes of the first stud 151 and the second stud 152 should not be too large so as not to have an adverse impact on the strength of the first electrode 11 and the second electrode 12 themselves. Therefore, in a preferred embodiment, please refer to Figure 3, the thickness of the first electrode 11 is H1, and the height of the first convex post 151 is h1, where h1 is less than or equal to 0.9H1; and / or, the thickness of the second electrode 12 is H2, and the height of the second convex post 152 is h2, where h2 is less than or equal to 0.9H2. In this way, while ensuring an increase in the mechanical connection strength between the shunt 10 and the circuit board 20 by the positioning convex posts 15, the adverse effects of the stamping process on the strength of the first electrode 11 and the second electrode 12 themselves are avoided.

[0039] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art can make other different forms of changes or variations without making creative efforts, and all of them should fall within the scope of protection of the present invention.

Claims

1. A shunt with enhanced mechanical properties, characterized in that: include: Resistor; A first electrode and a second electrode, wherein the first electrode and the second electrode are respectively disposed at two opposite ends of the resistor and are respectively connected to the resistor; as well as, The positioning structure includes a guide pressure rivet column arranged on the first electrode, and a positioning protrusion arranged on the first electrode and / or the second electrode, wherein the guide pressure rivet column and the positioning protrusion are respectively used to be inserted into corresponding holes on a circuit board and welded to the circuit board.

2. The mechanically enhanced shunt according to claim 1, characterized in that: The positioning structure further includes a screw hole formed on the second electrode, and the screw hole is arranged corresponding to a hole position on the circuit board, so that the second electrode is screwed to the circuit board.

3. The mechanically enhanced shunt according to claim 2, characterized in that: Two positioning protrusions are provided, and the two positioning protrusions include a first protrusion provided on the first electrode and a second protrusion provided on the second electrode.

4. The mechanically enhanced shunt according to claim 3, characterized in that: The first convex column is stamped by the first electrode so that the first electrode has a first groove formed on the other side opposite to the first convex column, and the second convex column is stamped by the second electrode so that the second electrode has a second groove formed on the other side opposite to the second convex column.

5. The mechanically enhanced shunt according to claim 4, characterized in that: The thickness of the first electrode is H1, the height of the first convex column is h1, and h1 is less than or equal to 0.9H1; and / or the thickness of the second electrode is H2, the height of the second convex column is h2, and h2 is less than or equal to 0.9H2.

6. The mechanically enhanced shunt according to any one of claims 1 to 5, characterized in that: The resistor is an alloy resistor.

7. The mechanically enhanced shunt according to any one of claims 1 to 5, characterized in that: The first electrode and the second electrode are both made of brass.

8. A circuit board assembly, characterized in that: include: A circuit board having a plurality of holes; and A mechanically enhanced flow diverter as claimed in any one of claims 1 to 7.

9. The circuit board assembly according to claim 8, wherein: The plurality of hole positions include a first through hole corresponding to the guide rivet column and a second through hole corresponding to the positioning boss. The inner diameter of the first through hole is D, and the inner diameter of the second through hole is d. D is greater than or equal to 2.5d and less than or equal to 4d.

10. The circuit board assembly according to claim 9, wherein: The minimum inner diameter of the second through hole is greater than the maximum outer diameter of the positioning boss.

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