Printed circuit board and electronic equipment

Abstract

The utility model provides a printed circuit board and electronic equipment, and relates to the technical field of printed circuit boards. In the application, the laminated structure comprises a top layer structure, a bottom layer structure and at least one layer of intermediate layer structure, and the at least one layer of intermediate layer structure at least comprises a layer of grounding layer structure. A differential pin of the first differential device is connected with a first differential signal line in the first blind hole, and the first blind hole extends to the grounding layer structure from the position where the differential pin of the first differential device on the top layer structure is located. A differential pin of the second differential device is connected with a second differential signal line in the second blind hole, and the second blind hole extends to the grounding layer structure from the position where the differential pin of the second differential device on the top layer structure is located. Wherein the second differential signal line and the first differential signal line are connected in the grounding layer structure. On the basis of the content, the problem that in the prior art, the integration layout difficulty of the printed circuit board is relatively large can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and more particularly, to a printed circuit board and an electronic device. Background Art

[0002] In the design of PCB (printed circuit board), for the design of the AD / DA (analog-to-digital conversion / digital-to-analog conversion) circuit part of the common RFSOC (radio frequency direct sampling transceiver module), generally, differential signals are routed on the TOP (PCB top) layer, surrounded by ground, uniformly drilled through holes, the spacing between each AD / DA is increased, and a shielding cover is designed, etc. In this way, interference between each other can be isolated, normal signal transmission can be ensured, and spurious signals can be reduced. However, through research by the inventor, it is found that such a design is very difficult to implement on a relatively dense PCB or a PCB with a relatively large balun. That is to say, there is a problem that the integrated layout difficulty of the printed circuit board is relatively large. Summary of the Utility Model

[0003] In view of this, the purpose of the present application is to provide a printed circuit board and an electronic device to improve the problem of relatively large integrated layout difficulty of the printed circuit board existing in the prior art.

[0004] To achieve the above object, the present application adopts the following technical solutions:

[0005] A printed circuit board, comprising:

[0006] A stacked structure, wherein the stacked structure includes a top layer structure, a bottom layer structure, and at least one intermediate layer structure located between the top layer structure and the bottom layer structure, and the at least one intermediate layer structure includes at least one ground layer structure;

[0007] A first differential device, wherein the first differential device is disposed on a surface of the top layer structure away from the intermediate layer structure, the differential pins of the first differential device are connected to a first differential signal line in a first blind via, and the first blind via extends from a position of the differential pins of the first differential device on the top layer structure to the ground layer structure;

[0008] A second differential device, wherein the second differential device is disposed on a surface of the top layer structure away from the intermediate layer structure, the differential pins of the second differential device are connected to a second differential signal line in a second blind via, and the second blind via extends from a position of the differential pins of the second differential device on the top layer structure to the ground layer structure;

[0009] Among them, the second differential signal line is connected to the first differential signal line in the grounding layer structure, so that differential signals are transmitted between the first differential device and the second differential device through the first differential signal line and the second differential signal line.

[0010] In a preferred option of the present application, in the above printed circuit board, the intermediate layer structure includes multiple layers of target layer structures and multiple layers of dielectric layer structures arranged alternately;

[0011] Among them, the multiple layers of target layer structures include a grounding layer structure and a signal trace layer structure. The signal lines in the signal trace layer structure are used to transmit signals other than the differential signals, and the dielectric layer structure is used to provide insulation isolation for the traces in different target layer structures.

[0012] In a preferred option of the present application, in the above printed circuit board, the intermediate layer structure includes:

[0013] The first dielectric layer structure, where the first dielectric layer structure is located on the side of the top layer structure close to the bottom layer structure;

[0014] The first grounding layer structure, where the first grounding layer structure is located on the side of the first dielectric layer structure close to the bottom layer structure. The first blind via extends from the position of the differential pin of the first differential device on the top layer structure to the first grounding layer structure. The second blind via extends from the position of the differential pin of the second differential device on the top layer structure to the first grounding layer structure, and the second differential signal line is connected to the first differential signal line in the first grounding layer structure;

[0015] The second dielectric layer structure, where the second dielectric layer structure is located on the side of the first grounding layer structure close to the bottom layer structure;

[0016] The first signal trace layer structure, where the first signal trace layer structure is located on the side of the second dielectric layer structure close to the bottom layer structure;

[0017] The third dielectric layer structure, where the third dielectric layer structure is located on the side of the first signal trace layer structure close to the bottom layer structure;

[0018] The mth grounding layer structure, where the mth grounding layer structure is located on the side of the third dielectric layer structure close to the bottom layer structure;

[0019] The (n - 1)th dielectric layer structure, where the (n - 1)th dielectric layer structure is located on the side of the mth grounding layer structure close to the bottom layer structure;

[0020] The signal trace layer structure of the m-th layer, wherein the signal trace layer structure of the m-th layer is located on one side of the (n - 1)-th layer dielectric layer structure close to the bottom structure;

[0021] The n-th layer dielectric layer structure, wherein the n-th layer dielectric layer structure is located on one side of the m-th layer signal trace layer structure close to the bottom structure.

[0022] In a preferred choice of the present application, in the above printed circuit board, n is greater than or equal to 5;

[0023] Among them, the top structure, the first layer dielectric layer structure, the second layer dielectric layer structure, the (n - 1)-th layer dielectric layer structure, the n-th layer dielectric layer structure and the bottom structure belong to high-frequency material structures, and other dielectric layer structures other than the top structure, the first layer dielectric layer structure, the second layer dielectric layer structure, the (n - 1)-th layer dielectric layer structure, the n-th layer dielectric layer structure and the bottom structure belong to medium-frequency material structures.

[0024] In a preferred choice of the present application, in the above printed circuit board, the substrate material corresponding to the high-frequency material structure includes ROGERS 4350B, and the substrate material corresponding to the medium-frequency material structure includes TU-872.

[0025] In a preferred choice of the present application, in the above printed circuit board, the differential signal transmitted between the first differential device and the second differential device belongs to a high-frequency signal, the top structure, each layer dielectric layer structure and the bottom structure belong to high-frequency material structures, and the substrate material corresponding to the high-frequency material structure includes ROGERS 4350B.

[0026] In a preferred choice of the present application, in the above printed circuit board, the differential signal transmitted between the first differential device and the second differential device belongs to a medium-frequency signal, the top structure, each layer dielectric layer structure and the bottom structure belong to medium-frequency material structures, and the substrate material corresponding to the medium-frequency material structure includes TU-872.

[0027] In a preferred choice of the present application, in the above printed circuit board, the first differential device belongs to a field programmable gate array, and the second differential device belongs to a balun device.

[0028] In a preferred choice of the present application, in the above printed circuit board, the printed circuit board further includes:

[0029] A shielding cover, wherein the shielding cover is arranged in cooperation with the balun device, and the shielding cover is used for physically shielding and isolating the balun device.

[0030] Based on the above, the present application further provides an electronic device, and the electronic device includes the above-mentioned printed circuit board.

[0031] In the printed circuit board and the electronic device provided by the present application, the stacked structure includes a top layer structure, a bottom layer structure, and at least one intermediate layer structure, and at least one intermediate layer structure includes at least one ground layer structure. The differential pins of the first differential device are connected to the first differential signal lines in the first blind vias, and the first blind vias extend from the positions of the differential pins of the first differential device on the top layer structure to the ground layer structure. The differential pins of the second differential device are connected to the second differential signal lines in the second blind vias, and the second blind vias extend from the positions of the differential pins of the second differential device on the top layer structure to the ground layer structure. Among them, the second differential signal lines are connected to the first differential signal lines in the ground layer structure. Based on the above, since the routing layout of the differential signal lines is carried out inside the stacked structure, the layout of the top layer structure can be more simplified. Therefore, compared with the conventional technical solution of routing the differential signal lines on the top layer structure, it is convenient to perform an integrated layout of the printed circuit board, thereby improving the problem that the integrated layout of the printed circuit board in the prior art is relatively difficult. Description of the Drawings

[0032] To make the above objects, features, and advantages of the present application more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows.

[0033] Figure 1 It is a schematic structural diagram of the printed circuit board provided by the embodiment of the present application.

[0034] Figure 2 It is another schematic structural diagram of the printed circuit board provided by the embodiment of the present application.

[0035] Reference Signs: 100 - Stacked Structure, 110 - Top Layer Structure, 130 - Bottom Layer Structure, 150 - Intermediate Layer Structure, 151 - Ground Layer Structure, 153 - Signal Routing Layer Structure, 155 - Dielectric Layer Structure, 171 - First Blind Via, 173 - Second Blind Via, 175 - Through Hole, 200 - First Differential Device, 300 - Second Differential Device. Detailed Embodiments

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Usually, the components of the embodiments of the present application described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0037] Accordingly, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0038] As Figure 1 shown, an embodiment of the present application provides a printed circuit board. Among them, the printed circuit board may include a stacked structure 100, a first differential device 200, and a second differential device 300.

[0039] Specifically, the stacked structure 100 includes a top layer structure 110, a bottom layer structure 130, and at least one intermediate layer structure 150 located between the top layer structure 110 and the bottom layer structure 130, and the at least one intermediate layer structure 150 at least includes a ground layer structure 151. The first differential device 200 is disposed on a surface of the top layer structure 110 away from the intermediate layer structure 150. The differential pins of the first differential device 200 are connected to the first differential signal lines in the first blind vias 171, and the first blind vias 171 extend from the positions of the differential pins of the first differential device 200 on the top layer structure 110 to the ground layer structure 151. The second differential device 300 is disposed on a surface of the top layer structure 110 away from the intermediate layer structure 150. The differential pins of the second differential device 300 are connected to the second differential signal lines in the second blind vias 173, and the second blind vias 173 extend from the positions of the differential pins of the second differential device 300 on the top layer structure 110 to the ground layer structure 151. The second differential signal lines are connected to the first differential signal lines in the ground layer structure 151, so that differential signals are transmitted between the first differential device 200 and the second differential device 300 through the first differential signal lines and the second differential signal lines.

[0040] Based on the above, since the routing layout of the differential signal lines is carried out inside the stacked structure 100, the layout of the top layer structure 110 can be made more convenient. Therefore, compared with the conventional technical solution of routing the differential signal lines on the top layer structure 110, it is convenient to perform an integrated layout of the printed circuit board, thereby improving the problem that the difficulty of the integrated layout of the printed circuit board in the prior art is relatively large.

[0041] In addition, for the first blind vias 171 and the second blind vias 173, they can be first-order blind vias, or arc chamfering and uniform hole layout can be performed to reduce transmission loss and interference.

[0042] In a first aspect, it should be noted that the specific composition of the stacked structure 100 is not limited and can be selected according to actual requirements. For example, in an alternative embodiment, in order to ensure that the stacked structure 100 can provide a relatively reliable and comprehensive signal transmission function, in the stacked structure 100, in combination with Figure 2 , the intermediate layer structure 150 may include multiple layers of target layer structures and multiple layers of dielectric layer structures 155 arranged alternately. For example, in the direction from the top layer structure 110 to the bottom layer structure 130, a first layer of target layer structure, a first layer of dielectric layer structure 155, a second layer of target layer structure, a second layer of dielectric layer structure 155, a third layer of dielectric layer structure 155, and a third layer of target layer structure, etc. may be sequentially distributed.

[0043] Among them, the multiple layers of target layer structures include a ground layer structure 151 and a signal trace layer structure 153 (for example, the first layer of target layer structure may be the ground layer structure 151, the second layer of target layer structure may be the signal trace layer structure 153, and the third layer of target layer structure may be the ground layer structure 151. In this way, the cyclic and alternating configuration makes the adjacent layer structure of each signal trace layer structure 153 belong to the ground layer structure 151, thereby realizing a reliable grounding layout). The signal lines in the signal trace layer structure 153 are used to transmit signals other than the differential signals (for example, to realize the connection between the first differential device 200 and the storage device, so that the first differential device 200 can perform data reading and writing operations on the storage device (correspondingly, at the positions of the read / write pins of the first differential device 200, the stacked structure 100 may also have corresponding vias 175, so that the signal lines in the vias 175 can be connected to the signal lines in the signal trace layer structure 153, thereby realizing the connection with other devices, such as the connection with this storage device, etc.). This storage device may be DDR (Double Data Rate Memory) or Flash (Flash Memory), etc.), and the dielectric layer structure 155 is used to provide an insulation isolation function for the traces in different target layer structures.

[0044] It can be understood that the specific composition of the intermediate layer structure 150 is not limited and can be selected according to actual requirements. For example, in an alternative embodiment, in order to reduce the overall manufacturing cost and manufacturing difficulty of the printed circuit board, the intermediate layer structure 150 may include a first layer of dielectric layer structure 155, a first layer of ground layer structure 151, a second layer of dielectric layer structure 155, a first layer of signal trace layer structure 153, a third layer of dielectric layer structure 155, an mth layer of ground layer structure 151, an (n - 1)th layer of dielectric layer structure 155, an mth layer of signal trace layer structure 153, and an nth layer of dielectric layer structure 155.

[0045] Specifically, the first dielectric layer structure 155 is located on the top layer structure 110 on the side close to the bottom layer structure 130. The first ground layer structure 151 is located on the first dielectric layer structure 155 on the side close to the bottom layer structure 130. The first blind via 171 extends from the position of the differential pins of the first differential device 200 on the top layer structure 110 to the first ground layer structure 151. The second blind via 173 extends from the position of the differential pins of the second differential device 300 on the top layer structure 110 to the first ground layer structure 151, and the second differential signal line is connected to the first differential signal line in the first ground layer structure 151. The second dielectric layer structure 155 is located on the first ground layer structure 151 on the side close to the bottom layer structure 130. The first signal trace layer structure 153 is located on the second dielectric layer structure 155 on the side close to the bottom layer structure 130. The third dielectric layer structure 155 is located on the first signal trace layer structure 153 on the side close to the bottom layer structure 130. The m-th ground layer structure 151 is located on the third dielectric layer structure 155 on the side close to the bottom layer structure 130. The (n - 1)-th dielectric layer structure 155 is located on the m-th ground layer structure 151 on the side close to the bottom layer structure 130. The m-th signal trace layer structure 153 is located on the (n - 1)-th dielectric layer structure 155 on the side close to the bottom layer structure 130. The n-th dielectric layer structure 155 is located on the m-th signal trace layer structure 153 on the side close to the bottom layer structure 130.

[0046] That is to say, in the direction from the top layer structure 110 to the bottom layer structure 130, the first dielectric layer structure 155, the first ground layer structure 151, the second dielectric layer structure 155, the first signal trace layer structure 153, the third dielectric layer structure 155, the m-th ground layer structure 151, the (n - 1)-th dielectric layer structure 155, the m-th signal trace layer structure 153 and the n-th dielectric layer structure 155 are distributed in sequence.

[0047] It can be understood that the specific quantities of the dielectric layer structure 155, the ground layer structure 151, and the signal trace layer structure 153 are not limited. For example, n is greater than or equal to 5, and the value of m is determined according to the above configuration. Among them, the top layer structure 110, the first layer dielectric layer structure 155, the second layer dielectric layer structure 155, the (n - 1)th layer dielectric layer structure 155, the nth layer dielectric layer structure 155, and the bottom layer structure 130 belong to high-frequency material structures. The other dielectric layer structures 155 other than the top layer structure 110, the first layer dielectric layer structure 155, the second layer dielectric layer structure 155, the (n - 1)th layer dielectric layer structure 155, the nth layer dielectric layer structure 155, and the bottom layer structure 130 belong to medium-frequency material structures.

[0048] That is to say, the top three layers and the bottom three layers can be high-frequency material structures, and the middle dielectric layer structure 155 can be a medium-frequency material structure. Based on this, since high-frequency materials have a low dielectric constant (Dk) and a low dielectric loss factor (Df), which helps to reduce the transmission loss and delay of high-frequency signals. Using these materials for the top and bottom layers can ensure the transmission quality of high-frequency signals and reduce signal attenuation and reflection. In addition, since medium-frequency materials usually have a higher dielectric constant and a higher dielectric loss, using medium-frequency materials in the middle layer can, to a certain extent, reduce the impact on high-frequency signals and also have good performance in the processing of medium-frequency signals.

[0049] It can be understood that in an alternative embodiment, the substrate material corresponding to the high-frequency material structure may include ROGERS 4350B, and in other embodiments, other materials may also be used. The substrate material corresponding to the medium-frequency material structure may include TU-872 (Taiyo Yuden), and in other embodiments, other materials may also be used.

[0050] It can be understood that in an alternative embodiment, corresponding settings can also be made according to the characteristics of the transmitted differential signal. For example, the differential signal transmitted between the first differential device 200 and the second differential device 300 belongs to a high-frequency signal, the top layer structure 110, each dielectric layer structure 155, and the bottom layer structure 130 belong to high-frequency material structures, and the substrate material corresponding to the high-frequency material structure includes ROGERS 4350B. Or, in other embodiments, the corresponding substrate material can also include Taoyao TU933+, Panasonic Mgetron-7, etc. Another example is that the differential signal transmitted between the first differential device 200 and the second differential device 300 belongs to an intermediate-frequency signal, the top layer structure 110, each dielectric layer structure 155, and the bottom layer structure 130 belong to intermediate-frequency material structures, and the substrate material corresponding to the intermediate-frequency material structure includes TU-872. Or, in other embodiments, the corresponding substrate material can also include Shengyi 7935, Panasonic Mgetron-4, etc.

[0051] In the second aspect, it should be noted that the specific type of the first differential device 200 is not limited, as long as it is a device capable of processing differential signals. For example, in an alternative embodiment, the first differential device 200 belongs to a field programmable gate array.

[0052] In the third aspect, it should be noted that the specific type of the second differential device 300 is not limited, as long as it is a device capable of processing differential signals. For example, in an alternative embodiment, the second differential device 300 belongs to a balun device.

[0053] Exemplarily, in a specific application scenario, the balun device can perform single-ended to differential processing on the received analog signal to form a corresponding differential signal, and then transmit the differential signal to the field programmable gate array for processing.

[0054] In the fourth aspect, on the basis of the above example, the printed circuit board may further include a shielding cover. Wherein, the shielding cover is cooperatively arranged with the balun device (i.e., the second differential device 300), so that the shielding cover can be used to perform physical shielding and isolation processing on the balun device. It should be noted that since the differential signal lines are arranged inside the stacked structure 100, the setting of the shielding cover can be more convenient, and a complete shielding cover layout can be performed outside the top layer structure 110, thereby ensuring effective isolation between balun devices when there are multiple balun devices.

[0055] The embodiments of the present application further provide an electronic device, wherein the electronic device may include the above-mentioned printed circuit board. It can be understood that in different application scenarios, the electronic device may further include other components. For example, when the electronic device belongs to a radio frequency device, the electronic device may further include a radio frequency signal acquisition component, an analog-to-digital converter, a digital-to-analog converter, etc.

[0056] In summary, in the printed circuit board and the electronic device provided by the present application, the stacked structure 100 includes a top layer structure 110, a bottom layer structure 130, and at least one intermediate layer structure 150. At least one intermediate layer structure 150 includes at least one ground layer structure 151. The differential pins of the first differential device 200 are connected to the first differential signal lines in the first blind via 171, and the first blind via 171 extends from the position of the differential pins of the first differential device 200 on the top layer structure 110 to the ground layer structure 151. The differential pins of the second differential device 300 are connected to the second differential signal lines in the second blind via 173, and the second blind via 173 extends from the position of the differential pins of the second differential device 300 on the top layer structure 110 to the ground layer structure 151. Among them, the second differential signal lines are connected to the first differential signal lines in the ground layer structure 151. Based on the above, since the routing layout of the differential signal lines is performed inside the stacked structure 100, the layout of the top layer structure 110 can be more simplified. Therefore, compared with the conventional technical solution of routing the differential signal lines on the top layer structure 110, it is convenient to perform an integrated layout of the printed circuit board, thereby improving the problem that the integrated layout of the printed circuit board in the prior art is relatively difficult.

[0057] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A printed circuit board, characterized in that: include: A stacked structure, wherein the stacked structure comprises a top layer structure, a bottom layer structure and at least one intermediate layer structure between the top layer structure and the bottom layer structure, and the at least one intermediate layer structure comprises at least one ground layer structure; A first differential device, wherein the first differential device is arranged on a side of the top structure away from the middle structure, a differential pin of the first differential device is connected to a first differential signal line in a first blind hole, and the first blind hole extends from a position on the top structure where the differential pin of the first differential device is located to the ground layer structure; A second differential device, wherein the second differential device is arranged on a side of the top structure away from the middle layer structure, a differential pin of the second differential device is connected to a second differential signal line in a second blind hole, and the second blind hole extends from a position on the top structure where the differential pin of the second differential device is located to the ground layer structure; The second differential signal line is connected to the first differential signal line in the ground layer structure, so that the first differential device and the second differential device transmit differential signals through the first differential signal line and the second differential signal line.

2. The printed circuit board according to claim 1, characterized in that: The intermediate layer structure includes a multi-layer target layer structure and a multi-layer medium layer structure that are alternately arranged; Among them, the multi-layer target layer structure includes a ground layer structure and a signal routing layer structure, the signal lines in the signal routing layer structure are used to transmit signals other than the differential signal, and the dielectric layer structure is used to provide insulation isolation function for routings in different target layer structures.

3. The printed circuit board according to claim 2, characterized in that: The intermediate layer structure comprises: A first dielectric layer structure, wherein the first dielectric layer structure is located on a side of the top structure close to the bottom structure; A first ground layer structure, wherein the first ground layer structure is located on one side of the first dielectric layer structure close to the bottom layer structure, the first blind hole extends from the position where the differential pin of the first differential device is located on the top layer structure to the first ground layer structure, the second blind hole extends from the position where the differential pin of the second differential device is located on the top layer structure to the first ground layer structure, and the second differential signal line is connected to the first differential signal line in the first ground layer structure; A second dielectric layer structure, wherein the second dielectric layer structure is located on a side of the first ground layer structure close to the bottom layer structure; A first signal wiring layer structure, wherein the first signal wiring layer structure is located on a side of the second dielectric layer structure close to the bottom layer structure; A third dielectric layer structure, wherein the third dielectric layer structure is located on a side of the first signal routing layer structure close to the bottom layer structure; An m-th ground layer structure, wherein the m-th ground layer structure is located on a side of the third dielectric layer structure close to the bottom layer structure; An n-1th dielectric layer structure, wherein the n-1th dielectric layer structure is located on a side of the mth ground layer structure close to the bottom layer structure; An m-th signal routing layer structure, wherein the m-th signal routing layer structure is located on a side of the n-1-th dielectric layer structure close to the bottom layer structure; An nth dielectric layer structure, wherein the nth dielectric layer structure is located on a side of the mth signal routing layer structure close to the bottom layer structure.

4. The printed circuit board according to claim 3, characterized in that: n is greater than or equal to 5; Among them, the top layer structure, the first layer dielectric layer structure, the second layer dielectric layer structure, the n-1th layer dielectric layer structure, the nth layer dielectric layer structure and the bottom layer structure are high-frequency material structures, and other dielectric layer structures except the top layer structure, the first layer dielectric layer structure, the second layer dielectric layer structure, the n-1th layer dielectric layer structure, the nth layer dielectric layer structure and the bottom layer structure are medium-frequency material structures.

5. The printed circuit board according to claim 4, characterized in that: The substrate material corresponding to the high-frequency material structure includes ROGERS 4350B, and the substrate material corresponding to the medium-frequency material structure includes TU-872.

6. The printed circuit board according to claim 3, characterized in that: The differential signal transmitted between the first differential device and the second differential device is a high-frequency signal, the top layer structure, each dielectric layer structure and the bottom layer structure are high-frequency material structures, and the substrate material corresponding to the high-frequency material structure includes ROGERS 4350B.

7. The printed circuit board according to claim 3, characterized in that: The differential signal transmitted between the first differential device and the second differential device is an intermediate frequency signal, the top layer structure, each dielectric layer structure and the bottom layer structure are intermediate frequency material structures, and the substrate material corresponding to the intermediate frequency material structure includes TU-872.

8. The printed circuit board according to any one of claims 1 to 7, characterized in that: The first differential device is a field programmable gate array, and the second differential device is a balun device.

9. The printed circuit board according to claim 8, characterized in that: The printed circuit board also includes: A shielding cover, wherein the shielding cover is arranged in cooperation with the balun device, and the shielding cover is used to perform physical shielding and isolation processing on the balun device.

10. An electronic device, characterized in that: The electronic device comprises the printed circuit board according to any one of claims 1 to 9.

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