Pin outgoing line structure for improving tombstone effect of 0603 packaging device

Abstract

The utility model relates to the technical field of PCB (printed circuit board) design, and discloses a pin wire outlet structure for improving a tombstone effect of a 0603 packaging device, which comprises a 0603 packaging main body applied to a substrate, the 0603 packaging main body comprises a first bonding pad and a second bonding pad, a first wire and a second wire are led out of the first bonding pad in opposite directions, and the first wire and the second wire are arranged in parallel. A third wire and a fourth wire which are opposite in direction are led out from the second bonding pad, the wire width of the first wire is the same as the wire width of the third wire, and the wire width of the second wire is the same as the wire width of the fourth wire. According to the utility model, the wires are led out from the upper and lower sides of the first bonding pad and the second bonding pad at the same time, and the widths of the wires in the corresponding directions of the first bonding pad and the second bonding pad are consistent, so that the uniform distribution of heat in the welding process is ensured, the stress tolerance is increased, the occurrence of the tombstone effect is reduced, and the welding firmness of 0603 devices is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB design, and more specifically, to a pin lead-out structure for improving the tombstoning effect of 0603 package devices. Background Art

[0002] A printed circuit board (PCB) is also known as a printed wiring board, which is an important part of the physical support and signal transmission of electronic products. With the continuous development of electronic technology, the iteration and update of products are extremely rapid, and automated and intelligent products are becoming increasingly popular. People's requirements for the functions of electronic products are getting higher and higher, and electronic components are getting smaller and smaller. In particular, 0603 package type devices have been widely used in circuit boards due to their small size, and a large number of them are used in each circuit board. However, the packaging yield rate of existing 0603 package type devices is low, and it is extremely urgent to improve the welding yield rate of 0603 package type devices.

[0003] In substrate design, usually, the connections of capacitors and resistors in 0603 packages are relatively arbitrary, and designers often randomly select the trace width according to the network type (such as ground network, power network or ordinary signal network). The connections of the ground network or power network usually use thick traces, while the connections of ordinary signals use thin traces. In the same 0603 package device, the trace widths and directions of different pins may vary greatly. For example, the connection of a power or ground pin is connected in one direction, two directions or three directions through a thick trace, while another pin is connected with a thin trace, and the connection directions and thicknesses of the left and right pins are inconsistent.

[0004] When two pins of a 0603 package device are welded with a wiring method where the trace widths and connection directions are different, the heat absorbed and dissipated by the thick and thin traces is inconsistent, which will cause uneven stress distribution during the welding process. The welding stress is too large, and the small pins of the 0603 package device will deform due to being unable to withstand the uneven stress, forming a tombstoning phenomenon. That is, one end of the component is pulled up, and the other end still adheres to the substrate. The uneven distribution of welding stress and the tombstoning phenomenon directly lead to a significant increase in the welding defect rate of 0603 package devices, thereby affecting the production efficiency and yield rate of products. Summary of the Utility Model

[0005] In order to overcome the problem that the connection directions and trace widths of the left and right pins of the existing 0603 package device are inconsistent, which will cause uneven stress distribution during welding, and then form a tombstoning phenomenon, and directly lead to a low welding yield rate, the utility model provides a pin lead-out structure for improving the tombstoning effect of 0603 package devices.

[0006] The technical solution of the present utility model is described as follows:

[0007] A pin lead-out structure for improving the tombstoning effect of 0603 package devices, including a 0603 package body applied to a substrate. The 0603 package body includes a first pad and a second pad. The first pad leads out a first trace and a second trace in opposite directions, and the second pad leads out a third trace and a fourth trace in opposite directions. The line width of the first trace is the same as that of the third trace, and the line width of the second trace is the same as that of the fourth trace.

[0008] In the present utility model according to the above solution, both the first pad and the second pad are rectangular pads.

[0009] In the present utility model according to the above solution, the first pad leads out the first trace upward along the short side direction and leads out the second trace downward, and the second pad leads out the third trace upward along the short side direction and leads out the fourth trace downward.

[0010] In the present utility model according to the above solution, the line width of the first trace is the same as or different from that of the second trace.

[0011] In the present utility model according to the above solution, the line width of the first trace is greater than half of the width of the first pad and not greater than the width of the first pad.

[0012] In the present utility model according to the above solution, the line width of the second trace is greater than half of the width of the second pad and not greater than the width of the second pad.

[0013] In the present utility model according to the above solution, the distance between the first trace and the third trace is not less than 10 mil.

[0014] In the present utility model according to the above solution, the distance between the second trace and the fourth trace is not less than 10 mil.

[0015] In the present utility model according to the above solution, the beneficial effect is that by leading out traces on both the upper and lower sides of the first pad and the second pad and making the line widths of the traces corresponding to the first pad and the first pad in the corresponding direction consistent, the uniform distribution of heat during the welding process is ensured, the stress tolerance is increased while the occurrence of the tombstoning effect is reduced, and the welding firmness of the 0603 device is ensured. Description of the Drawings

[0016] Figure 1 It is a structural schematic diagram of the present utility model.

[0017] In the figures, the respective reference numerals are as follows:

[0018] 1. Substrate; 2. First pad; 21. First trace; 22. Second trace; 3. Second pad; 31. Third trace; 32. Fourth trace. Detailed implementation mode

[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0020] It should be noted that the terms "including" and "having" and any variations thereof in the description and claims of the present utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices. Terms such as "arranged" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. The orientations or positions indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "bottom", etc. are based on the orientations or positions shown in the drawings, and are only for the convenience of description and cannot be construed as a limitation to the technical solution of the present application.

[0021] It should be noted that when the two pins of a 0603 package device are welded using a wiring method with different trace widths and inconsistent trace connection directions, the heat absorbed and dissipated by the thick and thin traces is inconsistent, which will cause uneven stress distribution during the welding process. The welding stress is too large, and the small pins of the 0603 package device will deform due to being unable to withstand the uneven stress, forming the tombstone phenomenon. That is, one end of the component is pulled up, and the other end still adheres to the substrate. The uneven distribution of welding stress and the tombstone phenomenon directly lead to a significant increase in the welding defect rate of the 0603 package device, thereby affecting the production efficiency and yield of the product.

[0022] As Figure 1 shown, this embodiment provides a pin lead-out structure for improving the tombstone effect of 0603 package devices. By optimizing the pad and trace layout, uniform heat distribution and effective current conduction during the welding process are achieved, thereby reducing the occurrence of the tombstone effect.

[0023] Specifically, by simultaneously leading out traces on the upper and lower sides of the first pad 2 and the second pad 3, and making the widths of the traces in the corresponding directions of the first pad 2 and the first pad 2 the same, the uniform distribution of heat during the soldering process is ensured, the stress tolerance is increased while the occurrence of tombstoning effect is reduced, and the soldering firmness of the 0603 device is ensured.

[0024] Specifically, it includes a 0603 package body applied to the substrate 1. The 0603 package body includes a first pad 2 and a second pad 3. The first pad 2 leads out a first trace 21 and a second trace 22 in opposite directions. The second pad 3 leads out a third trace 31 and a fourth trace 32 in opposite directions. The width of the first trace 21 is the same as the width of the third trace 31, and the width of the second trace 22 is the same as the width of the fourth trace 32. The symmetrical layout of the traces of the first pad 2 and the second pad 3 helps to achieve uniform heat distribution during the soldering process, reduce stress concentration caused by temperature gradient, and thus avoid the occurrence of tombstoning phenomenon.

[0025] In one embodiment, both the first pad 2 and the second pad 3 are rectangular pads. Rectangular pads have better directionality and symmetry when leading out traces, which is beneficial to reducing mutual interference between traces, while increasing the soldering contact area and enhancing the soldering strength.

[0026] The first pad 2 leads out the first trace 21 upward along the short side direction and leads out the second trace 22 downward. The second pad 3 leads out the third trace 31 upward along the short side direction and leads out the fourth trace 32 downward.

[0027] The layout method of the first pad 2 and the second pad 3 helps to balance the heat distribution on both sides of the first pad 2 and the second pad 3. During the soldering process, heat usually spreads faster along the long side direction of the pad, while the short side direction is relatively slower. By leading out traces along the short side direction, the propagation path of heat on the pad can be more effectively controlled, and stress concentration caused by excessive temperature gradient can be reduced.

[0028] In one embodiment, the width of the first trace 21 is the same as the width of the second trace 22. Traces with equal widths help to achieve more uniform heat distribution and current conduction during the soldering process, thereby reducing the non-uniformity of soldering stress and reducing the risk of tombstoning effect. All traces can also be fabricated using unified process parameters, simplifying the manufacturing process.

[0029] In one embodiment, the width of the first trace 21 is different from the width of the second trace 22. Different trace widths are beneficial to optimizing circuit performance, such as improving signal integrity, reducing crosstalk, or meeting specific current transmission requirements.

[0030] In one embodiment, the line width of the first trace 21 is greater than half of the width of the first pad 2 , and the line width of the first trace 21 is not greater than the width of the first pad 2 .

[0031] The line width of the second trace 22 is greater than half of the width of the second pad 3 , and the line width of the second trace 22 is not greater than the width of the second pad 3 .

[0032] The line width of the first trace 21 and the line width of the second trace 22 are both greater than half the width of the first pad 2, in order to ensure that the trace has sufficient width to carry current and heat while maintaining good contact between the trace and the pad. During the welding process, the trace can more effectively disperse and absorb heat, reducing the problem of uneven stress distribution.

[0033] The line width of the first routing line 21 and the line width of the second routing line 22 are not greater than the width of the first pad 2, so as to avoid excessive occupation of board space by the routing lines, resulting in excessive wiring density and unnecessary interference with other components.

[0034] In one embodiment, the spacing between the first routing line 21 and the third routing line 31 is not less than 10 mils. The spacing between the second routing line 22 and the fourth routing line 32 is not less than 10 mils. Sufficient spacing between routing lines can reduce electrical coupling between routing lines, reduce crosstalk and noise interference, and thus ensure signal integrity and stability. The spacing of 10 mils is a relatively safe and economical spacing choice.

[0035] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0036] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A pin-out structure for improving the tombstone effect of a 0603 packaged device, characterized in that: It includes a 0603 package body applied to a substrate, the 0603 package body includes a first solder pad and a second solder pad, the first solder pad leads to a first routing line and a second routing line in opposite directions, the second solder pad leads to a third routing line and a fourth routing line in opposite directions, the line width of the first routing line is the same as the line width of the third routing line, and the line width of the second routing line is the same as the line width of the fourth routing line.

2. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to claim 1, characterized in that: The first pad and the second pad are both rectangular pads.

3. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to claim 2, characterized in that: The first pad leads out the first routing line upwards along the short side direction, and leads out the second routing line downwards, and the second pad leads out the third routing line upwards along the short side direction, and leads out the fourth routing line downwards.

4. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to any one of claims 1 to 3, characterized in that: The line width of the first routing line is the same as the line width of the second routing line, or the line width of the first routing line is different from the line width of the second routing line.

5. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to any one of claims 1 to 3, characterized in that: The line width of the first routing line is greater than half of the width of the first pad, and the line width of the first routing line is not greater than the width of the first pad.

6. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to claim 1, characterized in that: The line width of the second routing line is greater than half of the width of the second pad, and the line width of the second routing line is not greater than the width of the second pad.

7. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to claim 1, characterized in that: The spacing between the first routing line and the third routing line is not less than 10 mil.

8. A pin-out structure for improving the tombstone effect of a 0603 packaged device according to claim 1, characterized in that: The spacing between the second routing line and the fourth routing line is not less than 10 mil.

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