Inverter module and energy storage power supply

Abstract

The utility model relates to the technical field of energy storage equipment, and particularly discloses an inversion module and an energy storage power supply. The inversion module comprises a circuit board, an air duct shell and at least two radiators, and the at least two radiators are arranged on the circuit board at intervals; the air channel shell is a rigid piece, the air channel shell covers the at least two radiators, the air channel shell covers at least part of the circuit board, a heat dissipation air channel is formed between the air channel shell and the circuit board so that air can flow through the at least two radiators, and the air channel shell is fixedly connected with the at least two radiators. According to the inverter module, the radiator and the circuit board are connected into a whole through the air duct shell, so that the radiator, the air duct shell and the circuit board are not prone to shaking relatively, the air duct shell can form a heat dissipation air duct to dissipate heat of the circuit board and can also provide support for the radiator, the structural strength of the inverter module is improved, and therefore the multifunctionality of the air duct shell is improved.

Description

Technical Field

[0001] This application relates to the technical field of energy storage devices, and particularly to an inverter module and an energy storage power supply. Background Art

[0002] When the inverter module in the energy storage power supply works, a large amount of heat is generated by the components therein, and a heat dissipation air duct needs to be constructed to perform air cooling on these components. In the related art, the heat dissipation air duct is constructed by air duct paper, and the air duct paper is a flexible part, which has the problems of weak structural strength and single functionality. Summary of the Utility Model

[0003] In view of this, this application provides an inverter module, which can improve the versatility of the air duct housing in the inverter module.

[0004] An embodiment of this application provides an inverter module, which is applied to an energy storage power supply. The inverter module includes: a circuit board, an air duct housing, and at least two radiators. The at least two radiators are spaced apart and arranged on the circuit board; the air duct housing is a rigid part, the air duct housing covers the at least two radiators, the air duct housing covers at least a part of the circuit board, and is configured to form a heat dissipation air duct with the circuit board for air flow to flow through the at least two radiators, and the air duct housing is fixedly connected to the at least two radiators.

[0005] In the above air duct structure, on the one hand, when the air flow passes through the heat dissipation air duct, it can contact the circuit board and the radiator to dissipate heat from the circuit board and the radiator; on the other hand, the radiator is respectively connected to the circuit board and the air duct housing, so that the air duct housing connects the radiator and the circuit board into a whole, making it difficult for the radiator to shake relative to the air duct housing and the circuit board, improving the structural strength of the inverter module, and reducing the situation of energy storage power supply failure caused by the shaking of the radiator when the energy storage power supply vibrates. The air duct housing can not only form a heat dissipation air duct to dissipate heat from the circuit board, but also provide support for the radiator to improve the structural strength of the radiator, thereby improving the versatility of the air duct housing.

[0006] In at least one embodiment, one side of each radiator away from the circuit board is fixedly connected to the air duct housing.

[0007] In the above embodiment, compared with the side of the radiator arranged on the circuit board, the side of the radiator away from the circuit board is farther away from the circuit board. By fixedly connecting the side of the radiator away from the circuit board to the air duct housing, the radiator is connected to the circuit board as a whole through the air duct housing, making it difficult for the side of the radiator away from the circuit board to shake relative to the circuit board, improving the assembly stability of the inverter module; in addition, the side of the radiator away from the circuit board is not easily interfered by the circuit board, which is convenient for fixing to the air duct housing.

[0008] In at least one embodiment, a boss is provided on the inner wall of the air duct housing. The boss abuts against one side of at least one radiator facing away from the circuit board, so that a heat dissipation gap for air flow to pass through is formed at an interval between the inner wall of the air duct housing and one side of the radiator facing away from the circuit board.

[0009] In the above embodiment, by abutting the radiator with the boss, a force can be applied to the radiator in the direction towards the circuit board, so that the radiator is not easily shaken in the direction towards the circuit board, and the installation stability of the circuit board is improved. The boss is also beneficial to maintaining an interval between the inner wall of the air duct housing and one side of the radiator facing away from the circuit board, so that the air flow can pass through the heat dissipation gap to contact one side of the radiator facing away from the circuit board, increasing the contact area between the radiator and the air flow and improving the heat dissipation effect.

[0010] In at least one embodiment, the air duct housing is provided with a first connection hole, the first connection hole penetrates through the boss, and the radiator is provided with a second connection hole corresponding to the first connection hole. The first connection hole and the second connection hole are for a connecting member to pass through.

[0011] In the above embodiment, the arrangement of the first connection hole and the second connection hole facilitates the connecting member to pass through the first connection hole and the second connection hole to fix the radiator to the air duct housing, and is also beneficial to the disassembly of the radiator from the air duct housing. The first connection hole is arranged at the boss, which is beneficial to increasing the depth of the first connection hole, thereby facilitating the enhancement of the structural strength of the first connection hole.

[0012] In at least one embodiment, a fixing bracket is provided on the outer wall of the air duct housing, and the fixing bracket is configured to be fixedly connected to the functional device of the circuit board.

[0013] In the above embodiment, by fixedly connecting the fixing bracket to the functional device of the circuit board, the integrity of the circuit board and the air duct housing can be further improved, the fixing stability of the functional device can be improved, and the failure problem of the functional device caused by vibration can be reduced.

[0014] In at least one embodiment, the air duct housing protrudes towards the circuit board to form a wind guiding portion, and the wind guiding portion is located in the heat dissipation air duct and guides at least part of the air flow in the heat dissipation air duct to flow through the surface of the circuit board.

[0015] In the above embodiment, by protruding towards the circuit board, the wind guiding portion is convenient for guiding the air flow towards the direction close to the surface of the circuit board, so that the air flow is easy to flow through the surface of the circuit board to dissipate heat from the circuit board.

[0016] In at least one embodiment, a notch is formed in the side wall of the air duct housing, and the notch communicates the inside and the outside of the heat dissipation air duct.

[0017] In the above embodiments, a part of the air flow in the heat dissipation air duct can flow to the outside of the heat dissipation air duct through the notch, so that the circuit board and functional devices located outside the heat dissipation air duct can dissipate heat through the air flow.

[0018] In at least one embodiment, the air duct housing further includes a flow splitting portion located in the heat dissipation air duct. The flow splitting portion is provided with at least two intersecting flow splitting surfaces, and the at least two flow splitting surfaces guide the air flow in the heat dissipation air duct to flow in different directions.

[0019] In the above embodiments, the two flow splitting surfaces are beneficial to splitting the air flow entering the heat dissipation air duct into two parts, so that the two parts of the air flow flow in different directions, thereby improving the fluidity of the air flow at different positions in the heat dissipation air duct, and also facilitating the full contact of the air flow with at least two radiators, improving the heat dissipation effect and efficiency.

[0020] In at least one embodiment, the air duct housing is provided with a wire bundling portion located outside the heat dissipation air duct, and the wire bundling portion is used to fix the wire harness of the energy storage power supply.

[0021] In the above embodiments, the wire harness of the energy storage power supply can be fixed to the air duct housing through the wire bundling portion, so that the wire harness is not easily entangled, and the integrity of the energy storage power supply wire harness and the air duct housing is improved.

[0022] An embodiment of the present application further provides an energy storage power supply, including a housing, a battery pack, and the inverter module in any of the above embodiments. The battery pack and the inverter module are both arranged in the housing, and the inverter module is arranged on the battery pack.

[0023] In the above energy storage power supply, the radiator and the circuit board are connected as a whole through the air duct housing, which improves the structural strength of the inverter module, reduces the situation of energy storage power supply failure caused by the shaking of the radiator when the energy storage power supply vibrates, and is beneficial to the heat dissipation of the inverter module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope.

[0025] Figure 1 It is a three-dimensional schematic diagram of the energy storage power supply in an embodiment of the present application.

[0026] Figure 2 It is an exploded view of the energy storage power supply in an embodiment of the present application.

[0027] Figure 3 It is a three-dimensional view of the inverter module and the fan in an embodiment of the present application.

[0028] Figure 4This is a side view of the inverter module in an embodiment of the present application.

[0029] Figure 5 This is a perspective view of the air duct housing at an angle in an embodiment of the present application.

[0030] Figure 6 This is a perspective view of the air duct housing at another angle in an embodiment of the present application.

[0031] Figure 7 This is a cross-sectional view of the inverter module in an embodiment of the present application.

[0032] Figure 8 is Figure 2 an enlarged view of part VIII in

[0033] Description of Main Component Symbols

[0034] 1000 - Energy storage power supply, 100 - Inverter module, 10 - Circuit board

[0035] 20 - Air duct housing, 21 - Top wall, 22 - Side wall

[0036] 221 - Notch, 222 - Fixed groove, 23 - Air duct cavity

[0037] 231 - Opening, 24 - Boss, 25 - First connection hole

[0038] 26 - Air guiding part, 27 - Shunt part, 271 - Shunt surface

[0039] 28 - Fixed bracket, 29 - Wire bundling part, 291 - Wire bundling groove

[0040] 292 - Buckle, 30 - Radiator, 31 - Second connection hole

[0041] 40 - Heat dissipation air duct, 41 - Air inlet, 42 - Air outlet

[0042] 50 - Functional device, 51 - MOS transistor, 60 - Connecting piece

[0043] 70 - Heat dissipation gap, 200 - Housing, 201 - Air supply port

[0044] 300 - Battery pack, 400 - Fan Detailed Implementation Manner

[0045] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0047] When the inverter module in the energy storage power supply is working, a large amount of heat will be generated by the components therein, and a heat dissipation air duct needs to be constructed to cool these components by air. In the related art, the heat dissipation air duct is constructed by air duct paper, and the air duct paper is a flexible part, which has the problems of weak structural strength and single functionality.

[0048] An embodiment of the present application provides an inverter module, which is applied to an energy storage power supply. The inverter module includes: a circuit board, an air duct housing, and at least two radiators. The at least two radiators are arranged at intervals on the circuit board; the air duct housing is a rigid part, and the air duct housing covers the at least two radiators. The air duct housing covers at least a part of the circuit board and is configured to form a heat dissipation air duct with the circuit board for air flow to flow through the at least two radiators, and the air duct housing is fixedly connected to the at least two radiators.

[0049] In the above air duct structure, on the one hand, when the air flow passes through the heat dissipation air duct, it can contact the circuit board and the radiator to dissipate heat from the circuit board and the radiator; on the other hand, the radiator is respectively connected to the circuit board and the air duct housing, so that the air duct housing connects the radiator and the circuit board into a whole, making it difficult for the radiator to shake relatively with the air duct housing and the circuit board, improving the structural strength of the inverter module, and reducing the situation of energy storage power supply failure caused by the radiator shaking when the energy storage power supply vibrates. The air duct housing can not only form a heat dissipation air duct to dissipate heat from the circuit board, but also provide support for the radiator to improve the structural strength of the radiator, thereby improving the versatility of the air duct housing.

[0050] The following will describe in detail some embodiments of the present application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0051] Refer to Figures 1 to 3 , an embodiment of the present application provides an inverter module 100 and an energy storage power supply 1000. The energy storage power supply 1000 includes an inverter module 100, a housing 200, and a battery pack 300. The battery pack 300 and the inverter module 100 are both arranged in the housing 200, and the inverter module 100 is arranged on the battery pack 300. The energy storage power supply 1000 can be a household or industrial and commercial energy storage power supply, or a portable mobile power supply.

[0052] Refer to Figures 2 to 4, in some embodiments, the inverter module 100 includes a circuit board 10, an air duct housing 20, and at least two heat sinks 30. The at least two heat sinks 30 are spaced apart and disposed on the circuit board 10. The air duct housing 20 is a rigid member. Here, the "rigid member" can be understood as being relative to flexible members such as air duct paper. The rigid member can be relatively hard components such as plastic parts and metal parts, so as to improve the structural strength of the air duct housing 20.

[0053] The air duct housing 20 covers the at least two heat sinks 30, and the air duct housing 20 covers at least a part of the circuit board 10 and is configured to form a heat dissipation air duct 40 between the air duct housing 20 and the circuit board 10 for air flow to pass through the at least two heat sinks 30. The air duct housing 20 is fixedly connected to the at least two heat sinks 30.

[0054] On the one hand, when the air flow passes through the heat dissipation air duct 40, it can contact the circuit board 10 and the heat sink 30 to dissipate heat from the circuit board 10 and the heat sink 30. On the other hand, the heat sinks 30 are respectively connected to the circuit board 10 and the air duct housing 20, so that the air duct housing 20 connects the heat sinks 30 and the circuit board 10 into a whole, making it difficult for the heat sinks 30 to shake relative to the air duct housing 20 and the circuit board 10, improving the structural strength of the inverter module 100, and reducing the situation of the energy storage power supply 1000 failing due to the heat sink 30 shaking when the energy storage power supply 1000 vibrates. The air duct housing 20 can not only form the heat dissipation air duct 40 to dissipate heat from the circuit board 10, but also provide support for the heat sinks 30 to improve the structural strength of the heat sinks 30, thereby improving the versatility of the air duct housing 20.

[0055] Refer to Figure 3 And Figure 4 , in some embodiments, a plurality of functional devices 50 are provided on the circuit board 10, and some of the plurality of functional devices 50 are located in the heat dissipation air duct 40, and the functional devices 50 in the heat dissipation air duct 40 are dissipated by the air flow and the heat sink 30. Exemplarily, the functional devices 50 include devices such as capacitors and inductors.

[0056] Refer to Figures 2 to 4, in some embodiments, a MOS transistor 51 (Metal-Oxide-Semiconductor Field-Effect Transistor) is disposed on a circuit board 10. The MOS transistor 51 is soldered to the circuit board 10 through pins. A heat sink 30 is soldered to the circuit board 10, and the MOS transistor is attached to the heat sink 30, thereby transferring the heat generated by the MOS transistor to the heat sink 30 to achieve rapid heat dissipation. During the transportation and use of the entire energy storage power supply 1000, it is inevitable to encounter bumpy vibration scenarios. During the vibration of the entire energy storage power supply 1000, due to the large volume and weight of the heat sink 30, the heat sink 30 will shake due to vibration and will cause the MOS transistor 51 to shake. During the vibration, the pins will break, resulting in the failure of the MOS transistor 51 and further affecting the normal operation of the entire machine. By fixing the heat sink 30 to the air duct housing 20, the heat sink 30 is fixed to the circuit board 10 through the air duct housing 20, that is: the air duct housing 20 can provide partial support for the heat sink 30 to reduce the vibration force on the MOS transistor 51, so that the pins of the MOS transistor 51 are not easily damaged.

[0057] Refer to Figure 4 , Figure 5 and Figure 6 , in some embodiments, the air duct housing 20 includes a top wall 21 and two side walls 22 connected to each other. The two side walls 22 are located on opposite sides of the top wall 21. The top wall 21 is the wall surface of the air duct housing 20 away from the circuit board 10, and the side walls 22 are connected between the top wall 21 and the circuit board 10. The top wall 21 and the two side walls 22 enclose an air duct cavity 23. The air duct cavity 23 has an opening 231. Through the opening 231, the functional device 50 on the circuit board 10 is covered, and a heat dissipation air duct 40 is formed by enclosing with the circuit board 10. An air inlet 41 and an air outlet 42 are formed between the air duct housing 20 and the circuit board 10. The air inlet 41 and the air outlet 42 are disposed opposite to each other and are respectively communicated with the heat dissipation air duct 40, so that the air flow can enter the heat dissipation air duct 40 from the air inlet 41 and be discharged from the air outlet 42.

[0058] In some embodiments, the air duct housing 20 is fixed to the circuit board 10 by screws, or the air duct housing 20 is fixed to the circuit board 10 by glue to improve the connection stability between the air duct housing 20 and the circuit board 10. In some embodiments, the air duct housing 20 can be disposed at an interval from the circuit board 10 and fixed to the functional device 50 on the circuit board 10.

[0059] Refer to Figure 3 and Figure 7, in some embodiments, one side of each radiator 30 away from the circuit board 10 is fixedly connected to the air duct housing 20. Exemplarily, one side of the radiator 30 away from the circuit board 10 is fixedly connected to the top wall 21 of the air duct housing 20. The side of the radiator 30 away from the circuit board 10 is the top of the radiator 30, and the side disposed on the circuit board 10 is the bottom of the radiator 30. Here, "top" and "bottom" are relative to Figure 7 the angle shown in

[0060] Relative to the side of the radiator 30 disposed on the circuit board 10, the side of the radiator 30 away from the circuit board 10 is farther from the circuit board 10. By fixedly connecting the side of the radiator 30 away from the circuit board 10 to the air duct housing 20, the radiator 30 is connected to the circuit board 10 as a whole through the air duct housing 20, so that the side of the radiator 30 away from the circuit board 10 is not easily shaken relative to the circuit board 10, improving the assembly stability of the inverter module 100; in addition, the side of the radiator 30 away from the circuit board 10 is not easily interfered by the circuit board 10, facilitating the fixation with the air duct housing 20.

[0061] Refer to Figure 4 , Figure 6 and Figure 7 , in some embodiments, a boss 24 is provided on the inner wall of the air duct housing 20. The boss 24 abuts against at least one side of the radiator 30 facing away from the circuit board 10, so that a heat dissipation gap 70 for the air flow to pass through is formed at an interval between the inner wall of the air duct housing 20 and the side of the radiator 30 facing away from the circuit board 10.

[0062] Exemplarily, the inner wall of the air duct housing 20 refers to the wall surface of the top wall 21 of the air duct housing 20 for forming the heat dissipation air duct 40.

[0063] By abutting the radiator 30 with the boss 24, a force in the direction towards the circuit board 10 can be applied to the radiator 30, so that the radiator 30 is not easily shaken in the direction towards the circuit board 10, improving the installation stability of the circuit board 10. The boss 24 is also beneficial to maintaining an interval between the inner wall of the air duct housing 20 and the side of the radiator 30 facing away from the circuit board 10, so that the air flow can pass through the heat dissipation gap 70 to contact the side of the radiator 30 facing away from the circuit board 10, increasing the contact area between the radiator 30 and the air flow and improving the heat dissipation effect.

[0064] Refer to Figures 6 to 8 , in some embodiments, the air duct housing 20 is provided with a first connection hole 25. The first connection hole 25 penetrates through the boss 24. The radiator 30 is provided with a second connection hole 31 corresponding to the first connection hole 25. The first connection hole 25 and the second connection hole 31 are for a connecting member 60 to pass through.

[0065] The provision of the first connection hole 25 and the second connection hole 31 facilitates the insertion of the connecting member 60 through the first connection hole 25 and the second connection hole 31 to fix the radiator 30 to the air duct housing 20, and also facilitates the disassembly of the radiator 30 from the air duct housing 20. The first connection hole 25 is provided at the boss 24, which is conducive to increasing the depth of the first connection hole 25, thereby facilitating the enhancement of the structural strength of the first connection hole 25.

[0066] In some embodiments, the connecting member 60 is a screw. By the detachable cooperation of the screw with the first connection hole 25 and the second connection hole 31, the assembly of the air duct housing 20 and the radiator 30 is facilitated.

[0067] In some embodiments, a plurality of first connection holes 25 are provided, and a plurality of second connection holes 31 are provided. Each radiator 30 is connected to the air duct housing 20 by more than one connecting member 60 to improve the connection stability.

[0068] Refer to Figure 3 and Figure 7 , in some embodiments, the air duct housing 20 protrudes towards the circuit board 10 to form a wind guiding portion 26. The wind guiding portion 26 is located in the heat dissipation air duct 40 and guides at least part of the air flow in the heat dissipation air duct 40 to flow through the surface of the circuit board 10. By protruding towards the circuit board 10, the wind guiding portion 26 facilitates guiding the air flow towards the direction close to the surface of the circuit board 10, so that the air flow can easily flow through the surface of the circuit board 10 to dissipate heat from the circuit board 10.

[0069] In some embodiments, the wind guiding portion 26 is located on one side of the air outlet 42, and the wind guiding portion 26 is connected to the top wall 21. When the air flow flows from the heat dissipation air duct 40 to the air outlet 42, it can flow towards the circuit board 10 along the air guiding opening, making it easy for the air flow to contact the functional devices 50 on the circuit board 10.

[0070] Refer to Figure 3 and Figure 7 , in some embodiments, a notch 221 is formed in the side wall 22 of the air duct housing 20. The notch 221 communicates the inside of the heat dissipation air duct 40 with the outside of the heat dissipation air duct 40. Part of the air flow in the heat dissipation air duct 40 can flow out of the heat dissipation air duct 40 through the notch 221, so that the circuit board 10 and the functional devices 50 located outside the heat dissipation air duct 40 can be cooled by the air flow.

[0071] In some embodiments, two radiators 30 are provided. The two radiators 30 are spaced apart along a direction perpendicular to the air inlet 41 towards the air outlet 42. Part of the air flow can pass between the two radiators 30 to fully contact the radiators 30 and improve the heat dissipation effect.

[0072] Understandably, in other embodiments, the radiator 30 may also be provided with three, four, etc. The specific number can be designed in combination with the space size of the heat dissipation air duct 40 and the heat dissipation requirements.

[0073] Refer to Figure 6 and Figure 7 , in some embodiments, the air duct housing 20 further includes a flow splitting portion 27. The flow splitting portion 27 is located in the heat dissipation air duct 40. The flow splitting portion 27 is provided with at least two intersecting flow splitting surfaces 271, and the at least two flow splitting surfaces 271 guide the air flow in the heat dissipation air duct 40 to flow in different directions.

[0074] The two flow splitting surfaces 271 are beneficial to splitting the air flow entering the heat dissipation air duct 40 into two parts, so that the two parts of the air flow flow in different directions, thereby improving the fluidity of the air flow at different positions in the heat dissipation air duct 40, and also facilitating the full contact between the air flow and at least two radiators 30, improving the heat dissipation effect and heat dissipation efficiency.

[0075] In some embodiments, the flow splitting portion 27 is arranged between at least two radiators 30. There are two flow splitting surfaces 271. One of the flow splitting surfaces 271 is inclined towards at least one of the radiators 30, and the other flow splitting surface 271 is inclined towards at least another radiator 30, so that the air flow entering the heat dissipation air duct 40 can flow to different radiators 30 through splitting, improving the heat dissipation uniformity and heat dissipation efficiency.

[0076] Refer to Figure 6 and Figure 7 , in some embodiments, the flow splitting portion 27 is arranged on the top wall 21 of the air duct housing 20 and forms a gap with the circuit board 10 for the air flow to flow through the circuit board 10 to dissipate heat from the circuit board 10 and the functional devices 50 on the circuit board 10.

[0077] Refer to Figure 3 and Figure 6 , in some embodiments, a fixing bracket 28 is arranged on the outer wall of the air duct housing 20. The fixing bracket 28 is configured to be fixedly connected to the functional devices 50 of the circuit board 10. Exemplarily, the fixing bracket 28 is arranged on the side wall 22 of the air duct housing 20 and is fixedly connected to the functional devices 50 by glue.

[0078] By fixedly connecting the fixing bracket 28 to the functional devices 50 of the circuit board 10, the integrity of the circuit board 10 and the air duct housing 20 can be further improved, the fixing stability of the functional devices 50 can be improved, and the failure problem of the functional devices 50 caused by vibration can be reduced.

[0079] Refer to Figure 2 and Figure 5, in some embodiments, the air duct housing 20 is provided with a wire bundling portion 29. The wire bundling portion 29 is located outside the heat dissipation air duct 40 and is used to fix the wire harness of the energy storage power supply 1000. The wire harness of the energy storage power supply 1000 can be fixed to the air duct housing 20 through the wire bundling portion 29, so that the wire harness is not easily entangled, and the integrity of the wire harness of the energy storage power supply 1000 and the air duct housing 20 is improved.

[0080] Exemplarily, the wire bundling portion 29 includes a wire bundling groove 291 and a buckle 292. The wire bundling groove 291 is arranged on the outer wall of the air duct housing 20 and is used to accommodate the wire harness. The "outer wall" is the wall surface of the air duct housing 20 facing away from the inside of the heat dissipation air duct 40. The extending direction of the wire bundling groove 291 can be set according to the extending direction of the wire harness. For example, part of the wire bundling groove 291 is arranged on the top wall 21 of the air duct housing 20, and part is arranged on the side wall 22 of the air duct housing 20. The buckle 292 is used to fix the wire harness in the wire bundling groove 291, so that the wire harness is not easily separated from the wire bundling groove 291.

[0081] Refer to Figure 2 , in some embodiments, the side wall 22 of the air duct housing 20 is provided with a fixing groove 222, and the fixing position is used to fix the antenna circuit board (not shown in the figure) of the energy storage power supply 1000. The arrangement of the fixing groove 222 facilitates the installation and fixation of the antenna board, which is beneficial to improving the integration degree of the inverter module 100.

[0082] Refer to Figure 1 And Figure 2 , in some embodiments, the housing 200 has an air supply port 201 and an air discharge port (not shown in the figure) arranged oppositely. The outside air flow enters the housing 200 through the air supply port 201. Part of the air flow entering the housing 200 enters the heat dissipation air duct 40 from the air inlet 41, then is discharged from the air outlet 42 outside the heat dissipation air duct 40, and finally is discharged to the outside from the air discharge port, so as to realize the heat dissipation of the inverter module 100.

[0083] Refer to Figure 1 And Figure 2 , the energy storage power supply 1000 further includes a fan 400. The fan 400 is arranged at the air inlet 41 of the air duct housing 20 and is used to introduce the outside air flow into it. The top of the fan 400 is fixedly connected to the top wall 21 of the air duct housing 20, and the bottom of the fan 400 is fixed to the battery pack 300. Exemplarily, the fan 400 is fixedly connected to the top wall 21 of the air duct housing 20 and the battery pack 300 through back glue, or the fan 400 is fixedly connected to the top wall 21 of the air duct housing 20 and the battery pack 300 through screws. The orientation or positional relationship indicated by "top", "bottom", etc. here is based on the orientation or positional relationship shown in the drawings.

[0084] By fixedly connecting the fan 400 to the air duct housing 20 and the battery pack 300, it is beneficial to improve the installation stability of the fan 400, and the inverter module 100 can also be fixed to the battery pack 300 through the fan 400, thereby improving the connection stability among the battery pack 300, the fan 400 and the inverter module 100.

[0085] In addition, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present application, rather than to limit the present application. As long as appropriate changes and variations made to the above embodiments fall within the scope of the spirit of the present application, they are within the disclosure scope of the present application.

Claims

1. An inverter module, applied to energy storage power supply, characterized in that: The inverter module comprises: Circuit boards; At least two heat sinks are spaced apart from each other on the circuit board; The air duct shell is a rigid part, and the air duct shell covers at least two of the heat sinks, and the air duct shell covers at least part of the circuit board, and is constructed to form a heat dissipation air duct between the air duct shell and the circuit board so that airflow can flow through at least two of the heat sinks, and the air duct shell is fixedly connected to at least two of the heat sinks; the inner wall of the air duct shell is provided with a boss, and the boss presses against the side of at least one of the heat sinks away from the circuit board, so that the inner wall of the air duct shell and the side of the heat sink away from the circuit board are spaced apart to form a heat dissipation gap for airflow to flow through.

2. The inverter module according to claim 1, characterized in that: A side of each heat sink away from the circuit board is fixedly connected to the air duct shell.

3. The inverter module according to claim 1, characterized in that: The air duct shell is provided with a first connection hole, and the first connection hole passes through the boss. The radiator is provided with a second connection hole corresponding to the first connection hole, and the first connection hole and the second connection hole are provided for connecting members to pass through.

4. The inverter module according to any one of claims 1 to 3, characterized in that: The outer wall of the air duct housing is provided with a fixing bracket, and the fixing bracket is configured to be fixedly connected to the functional components of the circuit board.

5. The inverter module according to any one of claims 1 to 3, characterized in that: The air duct shell protrudes toward the circuit board to form an air guide portion, which is located in the heat dissipation air duct and guides at least part of the airflow in the heat dissipation air duct to flow through the surface of the circuit board.

6. The inverter module according to any one of claims 1 to 3, characterized in that: A notch is formed on the side wall of the air duct shell, and the notch connects the inside of the heat dissipation air duct with the outside of the heat dissipation air duct.

7. The inverter module according to any one of claims 1 to 3, characterized in that: The air duct shell further includes a flow divider, which is located in the heat dissipation air duct. The flow divider is provided with at least two intersecting flow divider surfaces, and at least two of the flow divider surfaces guide the airflow in the heat dissipation air duct to flow in different directions.

8. The inverter module according to any one of claims 1 to 3, characterized in that: The air duct shell is provided with a wire harness portion, which is located outside the heat dissipation air duct and is used to fix the wire harness of the energy storage power supply.

9. An energy storage power supply, characterized in that: It comprises a shell, a battery pack and an inverter module as claimed in any one of claims 1 to 8, wherein the battery pack and the inverter module are both arranged in the shell, and the inverter module is arranged on the battery pack.

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