Heat dissipation structure of electronic component

Abstract

The utility model provides an electronic component heat dissipation structure, which relates to the technical field of electronic components and comprises a heat dissipation structure shell, a temperature display screen is mounted on the front surface of the heat dissipation structure shell, a mounting plate is mounted at the bottom of the heat dissipation structure shell, and a fixing plate is mounted at the bottom of the mounting plate along the edge surface. Heat dissipation holes are formed in the side face of the heat dissipation structure shell, an alarm is installed at the position, close to the top of the heat dissipation holes, of one side face of the heat dissipation structure shell, a heat dissipation cover is installed at the top of the heat dissipation structure shell, an adsorption magnet is installed at the top of the heat dissipation cover, and a rectifying cylinder is installed on the back face of the heat dissipation structure shell; a dustproof net is installed at one end of the rectifying cylinder, noise generated by airflow during heat dissipation is reduced, the temperature of electronic components can be detected, and real-time alarming is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a heat dissipation structure for electronic components. Background Art

[0002] Electronic components are usually installed in a machine to help the machine form a complete circuit, so that the machine can work. When the electronic components are working, if the operating power of the machine is high, its temperature will also rise synchronously;

[0003] However, when the existing heat dissipation structure for electronic components dissipates heat, as the power increases, the rotation speed of its fan will also increase synchronously, resulting in a large noise caused by the impact of air flow, and the temperature cannot be detected, so that the user cannot observe the current temperature well. Therefore, we propose a heat dissipation structure for electronic components. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art. However, when the existing heat dissipation structure for electronic components dissipates heat, as the power increases, the rotation speed of its fan will also increase synchronously, resulting in a large noise caused by the impact of air flow, and the temperature cannot be detected, so that the user cannot observe the current temperature well.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A heat dissipation structure for electronic components, including a heat dissipation structure housing. A temperature display screen is installed on the front surface of the heat dissipation structure housing. An installation plate is installed at the bottom of the heat dissipation structure housing. Fixing plates are installed along the edge surface at the bottom of the installation plate. Heat dissipation holes are formed on the side surface of the heat dissipation structure housing. An alarm is installed on one side surface of the heat dissipation structure housing near the top of the heat dissipation holes. A heat dissipation cover is installed on the top of the heat dissipation structure housing. An adsorption magnet is installed on the top of the heat dissipation cover. A rectifying cylinder is installed on the back surface of the heat dissipation structure housing. A dust-proof net is installed at one end of the rectifying cylinder. A rectifying plate is installed on the inner side surface of the rectifying cylinder. An installation flange is installed at the end of the rectifying cylinder far from the dust-proof net. A fan is installed inside the installation flange. A temperature detection sensor is installed on the inner top surface of the heat dissipation structure housing. A cross bar is installed on the inner top surface of the heat dissipation structure housing near one side of the temperature detection sensor.

[0007] As a preferred scheme of the utility model, the heat dissipation structure housing is made of copper material, and the temperature display screen is electrically connected to the temperature detection sensor.

[0008] The technical effect of adopting the above further scheme is: The heat dissipation efficiency is increased by the heat dissipation structure housing assisting in heat dissipation.

[0009] As a preferred solution of the present utility model, the mounting plate is welded to the heat dissipation structure housing, the bottom surface shape of the mounting plate is customized according to the shape of the object to be installed, four fixing plates are symmetrically installed at equal intervals, and fixing holes are provided on the surface of the fixing plates.

[0010] The technical effect of adopting the above further solution is that the heat dissipation structure is installed through the mounting plate, which is convenient for disassembly and maintenance.

[0011] As a preferred solution of the present utility model, two heat dissipation holes are symmetrically provided, the alarm is electrically connected to the temperature detection sensor, a groove is provided on the surface of the heat dissipation cover, four adsorption magnets are symmetrically installed at equal intervals, and a cavity is formed between the heat dissipation cover and the heat dissipation structure housing.

[0012] As a preferred solution of the present utility model, the rectifying cylinder is fixed to the heat dissipation structure housing by bolts through a mounting flange, and the rectifying cylinder penetrates through the heat dissipation structure housing and extends to the outside thereof.

[0013] As a preferred solution of the present utility model, the dust-proof net is screwed and fixed to the rectifying cylinder, and honeycomb-shaped holes are provided on the surfaces of both the dust-proof net and the rectifying plate.

[0014] The technical effect of adopting the above further solution is that dust is prevented by the dust-proof net, reducing the entry of dust.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] In the present utility model, through the design of the rectifying structure and the temperature detection structure, by providing the temperature display screen, alarm, rectifying cylinder, rectifying plate and temperature detection sensor, the noise generated by the airflow during heat dissipation is reduced, and the temperature of the electronic components can be detected and an alarm can be given in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front structure schematic diagram of a heat dissipation structure for electronic components provided by the present utility model;

[0018] Figure 2 It is a partial structure schematic diagram of a heat dissipation structure for electronic components provided by the present utility model;

[0019] Figure 3 It is a rectifying structure schematic diagram of a heat dissipation structure for electronic components provided by the present utility model;

[0020] Figure 4 It is an internal structure schematic diagram of the heat dissipation structure housing of a heat dissipation structure for electronic components provided by the present utility model.

[0021] Legend: 1. Heat dissipation structure housing; 2. Temperature display screen; 3. Mounting plate; 4. Fixing plate; 5. Heat dissipation holes; 6. Alarm; 7. Heat dissipation cover; 701. Adsorption magnet; 8. Rectifying cylinder; 9. Dust-proof net; 10. Rectifying plate; 11. Mounting flange; 12. Fan; 13. Temperature detection sensor; 14. Cross bar. Detailed implementation manners

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant. Several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] Embodiment 1

[0027] As Figures 1-4As shown in the figure, the present utility model provides a technical solution: an electronic component heat dissipation structure, including a heat dissipation structure housing 1. A temperature display screen 2 is installed on the front of the heat dissipation structure housing 1. A mounting plate 3 is installed at the bottom of the heat dissipation structure housing 1. A fixing plate 4 is installed along the edge surface at the bottom of the mounting plate 3. Heat dissipation holes 5 are provided on the side surface of the heat dissipation structure housing 1. An alarm 6 is installed on one side surface of the heat dissipation structure housing 1 near the top of the heat dissipation holes 5. A heat dissipation cover 7 is installed on the top of the heat dissipation structure housing 1. Adsorption magnets 701 are installed on the top of the heat dissipation cover 7. Every two adsorption magnets form a group, and the two adsorption magnets are on the same straight line. A rectifying cylinder 8 is installed on the back of the heat dissipation structure housing 1. A dust-proof net 9 is installed at one end of the rectifying cylinder 8. A rectifying plate 10 is installed on the inner side surface of the rectifying cylinder 8. An installation flange 11 is installed at the end of the rectifying cylinder 8 away from the dust-proof net 9. A fan 12 is installed inside the installation flange 11. The drive motor of the fan 12 is installed in a supporting manner when installing the fan 12. A temperature detection sensor 13 is installed on the inner top surface of the heat dissipation structure housing 1. The temperature detection sensor 13 selects an IR80 infrared temperature sensor. The highest threshold temperature of the temperature detection sensor 13 is adjusted according to the user's needs. A cross bar 14 is installed on the inner top surface of the heat dissipation structure housing 1 near one side of the temperature detection sensor 13. The cross bar 14 is made of iron material.

[0028] Embodiment 2

[0029] As Figures 1-4 shown in the figure, the heat dissipation structure housing 1 is made of copper material, with good heat dissipation effect. The temperature display screen 2 is electrically connected to the temperature detection sensor 13. The mounting plate 3 is welded to the heat dissipation structure housing 1. The bottom surface shape of the mounting plate 3 is customized according to the shape of the installation object, which is convenient for disassembly and maintenance. Four fixing plates 4 are symmetrically installed at equal intervals. Fixing holes are provided on the surface of the fixing plate 4, making it more stable after installation. Two heat dissipation holes 5 are symmetrically provided. The alarm 6 is electrically connected to the temperature detection sensor 13. A groove is provided on the surface of the heat dissipation cover 7, which is convenient for lifting the heat dissipation cover 7. Four adsorption magnets 701 are symmetrically installed at equal intervals to increase the adsorption. A cavity is formed between the heat dissipation cover 7 and the heat dissipation structure housing 1. The rectifying cylinder 8 is fixed to the heat dissipation structure housing 1 through the installation flange 11 using bolts. The rectifying cylinder 8 penetrates through the heat dissipation structure housing 1 and extends to its outside. The dust-proof net 9 is screwed and fixed to the rectifying cylinder 8. Honeycomb-shaped holes are provided on the surfaces of both the dust-proof net 9 and the rectifying plate 10.

[0030] The working process of the present utility model: When using a heat dissipation structure for electronic components to conduct heat dissipation work, first install the heat dissipation structure on the electronic components through the mounting plate 3, and then start the fan 12 to extract heat from the heat dissipation structure housing 1 and transfer it out. When the hot air flow exits, the rectifying plate 10 will rectify the air flow, making the air flow uniform when it enters the rectifying cylinder 8. The rectifying cylinder 8 reduces the collision of the air flow with the external air during transmission. When it exits the dust-proof net 9, it is rectified again, making the noise smaller when the air flow exits the heat dissipation structure housing 1. Moreover, when the temperature rises, the temperature detection sensor 13 will detect the temperature inside the heat dissipation structure housing 1 in real time and transmit it to the temperature display screen 2 for display. When the temperature is higher than its detection threshold, an electrical signal is transmitted to the alarm 6, causing the alarm 6 to sound for warning. At this time, the user can open the heat dissipation cover 7 to increase the heat dissipation space. Using this heat dissipation structure for electronic components to conduct heat dissipation work reduces the noise generated by the air flow during heat dissipation and can detect the temperature of the electronic components and give an alarm in real time.

[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An electronic component heat dissipation structure, comprising a heat dissipation structure housing (1), characterized in that: A temperature display screen (2) is installed on the front of the heat dissipation structure shell (1), a mounting plate (3) is installed on the bottom of the heat dissipation structure shell (1), a fixing plate (4) is installed on the bottom of the mounting plate (3) along the edge surface, a heat dissipation hole (5) is opened on the side of the heat dissipation structure shell (1), an alarm (6) is installed on one side of the heat dissipation structure shell (1) near the top of the heat dissipation hole (5), a heat dissipation cover (7) is installed on the top of the heat dissipation cover (7), and an adsorption magnet (701) is installed on the top of the heat dissipation cover (7). A rectifier cylinder (8) is installed on the back of the shell (1), a dust screen (9) is installed on one end of the rectifier cylinder (8), a rectifier plate (10) is installed on the inner side of the rectifier cylinder (8), a mounting flange (11) is installed on the end of the rectifier cylinder (8) away from the dust screen (9), a fan (12) is installed on the inner side of the mounting flange (11), a temperature detection sensor (13) is installed on the inner top surface of the heat dissipation structure shell (1), and a cross bar (14) is installed on the inner top surface of the heat dissipation structure shell (1) on the side close to the temperature detection sensor (13).

2. The electronic component heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure housing (1) is made of copper material, and the temperature display screen (2) is electrically connected to the temperature detection sensor (13).

3. The electronic component heat dissipation structure according to claim 1, characterized in that: The mounting plate (3) is welded on the heat dissipation structure housing (1); the bottom surface shape of the mounting plate (3) is customized according to the shape of the object to be mounted; four fixing plates (4) are symmetrically mounted at equal distances; fixing holes are provided on the surface of the fixing plates (4).

4. The electronic component heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes (5) are symmetrically provided with two holes, the alarm (6) is electrically connected to the temperature detection sensor (13), a groove is provided on the surface of the heat dissipation cover (7), four adsorption magnets (701) are symmetrically installed at equal distances, and a cavity is formed between the heat dissipation cover (7) and the heat dissipation structure housing (1).

5. The electronic component heat dissipation structure according to claim 1, characterized in that: The rectifier tube (8) is fixed to the heat dissipation structure shell (1) by means of bolts via a mounting flange (11); the rectifier tube (8) penetrates the heat dissipation structure shell (1) and extends to the outside thereof.

6. The electronic component heat dissipation structure according to claim 1, characterized in that: The dustproof net (9) is screwed and fixed on the rectifying cylinder (8), and the surfaces of the dustproof net (9) and the rectifying plate (10) are provided with honeycomb holes.

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