Silicon wafer sorting system

By designing a multi-stage heavy-media sorting and fine-grained silicon wafer sorting system, the problem of complex and high cost of silicon wafer waste treatment in the prior art is solved, and efficient silicon wafer sorting and recycling is achieved, which has the advantages of environmental protection and energy saving.

CN222984575UActive Publication Date: 2025-06-17WEIHAI HAIWANG HYDROCYCLONE
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Patent Information

Application Number
CN202421739450.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-23
Publication Date
2025-06-17
Estimated Expiration
2034-07-23

AI Technical Summary

Technical Problem

The prior art is complex in handling silicon wafer waste, and it is difficult to achieve efficient sorting and recycling.

Method used

A silicon wafer sorting system including a primary remediation sorting system, a secondary remediation sorting system and a fine-grain processing system was designed. Through multi-stage remediation sorting and fine-grain processing, efficient sorting and recycling of silicon wafers are achieved.

Benefits of technology

This system can achieve efficient silicon wafer sorting, reduce the difficulty and cost of subsequent processes, and is environmentally friendly and energy-saving, making it suitable for silicon wafer recycling.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of mineral separation, in particular to a silicon wafer separation system, which is characterized by comprising a primary dense medium separation system, a secondary dense medium separation system and a fine fraction processing system, discharging ports of the first-stage dense medium separation system are a primary silicon wafer product outlet, a first-stage magnetic tail water outlet, a first-stage heavy product outlet and a first-stage fine-fraction ore pulp outlet, and the first-stage heavy product outlet is connected with an inlet of the second-stage dense medium separation system. Outlets of the second-stage dense medium separation system are a secondary silicon wafer product outlet, a second-stage magnetic tail water outlet and an impurity product outlet respectively, and the first-stage magnetic tail water outlet, the second-stage magnetic tail water outlet and the first-stage fine fraction ore pulp outlet are connected with an inlet of the fine fraction treatment system respectively. And outlets of the fine fraction treatment system are a fine silt product outlet, a return water outlet and a fine particle product outlet. The device has the advantages of good separation effect, energy conservation, environmental protection, low recovery cost and the like.
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Description

Technical Field

[0001] The utility model relates to the technical field of mineral separation, and specifically relates to a silicon wafer sorting system. Background Art

[0002] As is well known, silicon wafers are an important material used in electronic manufacturing, also known as semiconductor silicon wafers. They are usually thin wafers made of single crystal silicon and can be used to manufacture many electronic products such as integrated circuits and solar panels. Silicon wafers can be said to be one of the most important materials in the modern electronic field.

[0003] Recycling silicon wafer waste is beneficial to reducing the adverse impact of waste on the environment. At the same time, it can save resources and improve resource utilization efficiency. For silicon wafer manufacturing enterprises, strengthening the utilization and recycling of silicon wafer waste can not only be environmentally friendly, but also reduce the manufacturing cost of the enterprise and improve the profitability of the enterprise.

[0004] Currently, chemical methods are often used to convert harmful substances into harmless substances or substances that are easy to handle. However, the direct treatment by chemical methods is complex in operation and high in cost. Adopting a new sorting system can enrich and purify raw materials, achieving the purpose of reducing the difficulty and cost of subsequent processes. Summary of the Invention

[0005] The purpose of the utility model is to solve the deficiencies of the above-mentioned existing technologies and provide a silicon wafer sorting system with good sorting effect, energy conservation and environmental protection, and low recycling cost.

[0006] The technical solution adopted by the utility model to solve its technical problems is as follows:

[0007] A silicon wafer sorting system, characterized in that the system includes a primary heavy medium sorting system, a secondary heavy medium sorting system and a fine particle treatment system. The discharge ports of the primary heavy medium sorting system are respectively a primary silicon wafer product outlet, a primary magnetic tail water outlet, a primary heavy product outlet and a primary fine particle pulp outlet. The product of the primary silicon wafer product outlet is the primary silicon wafer product. The primary heavy product outlet is connected to the inlet of the secondary heavy medium sorting system. The outlets of the secondary heavy medium sorting system are respectively a secondary silicon wafer product outlet, a secondary magnetic tail water outlet and an impurity product outlet. The primary magnetic tail water outlet, the secondary magnetic tail water outlet and the primary fine particle pulp outlet are respectively connected to the inlet of the fine particle treatment system. The product of the secondary silicon wafer product outlet is the secondary silicon wafer product. The product of the impurity product outlet is the impurity product. The outlets of the fine particle treatment system are a fine mud product outlet, a return water outlet and a fine particle product outlet. The product of the fine mud product outlet is the fine mud product. The product of the fine particle product outlet is the fine particle product.

[0008] The primary heavy medium separation system described in this utility model includes a crusher, a sizing screen, a primary mixing tank, a primary heavy medium cyclone, a primary No.1 pre-dense medium screen, a primary No.2 pre-dense medium screen, a primary shunt box, a primary No.1 vibrating dense medium screen, a primary No.2 vibrating dense medium screen, and a primary magnetic separator. The outlet of the crusher is connected to the inlet of the sizing screen. The oversize product outlet of the sizing screen is connected to the inlet of the primary mixing tank. The undersize product outlet of the sizing screen is the primary fine-grained pulp outlet. The outlet of the primary mixing tank is connected to the inlet of the primary heavy medium cyclone. The underflow outlet of the primary heavy medium cyclone is connected to the inlet of the primary No.1 pre-dense medium screen. The overflow outlet of the primary heavy medium cyclone is connected to the inlet of the primary No.2 pre-dense medium screen. The oversize outlet of the primary No.1 pre-dense medium screen is connected to the primary No.1 vibrating dense medium screen. The oversize product outlet of the primary No.1 vibrating dense medium screen is the primary heavy product outlet. The oversize outlet of the primary No.2 pre-dense medium screen is connected to the inlet of the primary No.2 vibrating dense medium screen. The oversize product of the primary No.2 vibrating dense medium screen is the primary silicon wafer product outlet. The undersize product outlet of the primary No.2 pre-dense medium screen is connected to the inlet of the primary shunt box. The dilute medium outlet of the primary shunt box, the undersize outlet of the primary No.1 vibrating dense medium screen, and the undersize outlet of the primary No.2 vibrating dense medium screen are connected to the inlet of the primary magnetic separator. The combined medium outlet of the primary shunt box, the undersize product outlet of the primary No.1 pre-dense medium screen, and the magnetic product outlet of the primary magnetic separator are respectively connected to the inlet of the primary mixing tank. The non-magnetic product outlet of the primary magnetic separator is the primary magnetic tail water outlet.

[0009] The secondary heavy medium separation system described in this utility model includes a secondary mixing tank, a secondary heavy medium cyclone, a secondary No.1 pre-dense medium screen, a secondary No.2 pre-dense medium screen, a secondary shunt box, a secondary No.1 vibrating dense medium screen, a secondary No.2 vibrating dense medium screen, and a secondary magnetic separator. The primary heavy product outlet of the primary heavy medium separation system is connected to the inlet of the secondary mixing tank. The outlet of the secondary mixing tank is connected to the inlet of the secondary heavy medium cyclone. The underflow outlet of the secondary heavy medium cyclone is connected to the inlet of the secondary No.1 pre-dense medium screen. The overflow outlet of the secondary heavy medium cyclone is connected to the inlet of the secondary No.2 pre-dense medium screen. The oversize outlet of the secondary No.1 pre-dense medium screen is connected to the secondary No.1 vibrating dense medium screen. The oversize product outlet of the secondary No.1 vibrating dense medium screen is the secondary heavy product outlet. The oversize outlet of the secondary No.2 pre-dense medium screen is connected to the inlet of the secondary No.2 vibrating dense medium screen. The oversize product of the secondary No.2 vibrating dense medium screen is the secondary silicon wafer product outlet. The undersize product outlet of the secondary No.2 pre-dense medium screen is connected to the inlet of the secondary shunt box. The dilute medium outlet of the secondary shunt box, the undersize outlet of the secondary No.1 vibrating dense medium screen, and the undersize outlet of the secondary No.2 vibrating dense medium screen are connected to the inlet of the secondary magnetic separator. The combined medium outlet of the secondary shunt box, the undersize product outlet of the secondary No.1 pre-dense medium screen, and the magnetic product outlet of the secondary magnetic separator are respectively connected to the inlet of the secondary mixing tank. The non-magnetic product outlet of the secondary magnetic separator is the secondary magnetic tail water outlet.

[0010] The fine - particle treatment system described in the utility model includes a thickening cyclone, a thickener, a dewatering screen, and a filter press. The first - stage magnetic tail water outlet, the second - stage magnetic tail water outlet, and the first - stage fine - particle pulp outlet are respectively connected to the inlet of the thickening cyclone. The underflow outlet of the thickening cyclone is connected to the inlet of the dewatering screen. The product on the screen of the dewatering screen is fine - grained product. The under - screen outlet of the dewatering screen is connected to the inlet of the thickening cyclone. The overflow outlet of the thickening cyclone is connected to the inlet of the thickener. The underflow outlet of the thickener is connected to the inlet of the filter press. The overflow outlet of the thickener and the filtrate outlet of the filter press are the return water outlets for recycling. The product at the filter cake outlet of the filter press is fine - mud product.

[0011] There are two under - screen outlets provided at the under - screen outlet of the first - stage No. 2 pre - desliming screen. One under - screen outlet is connected to the first - stage shunt box, and the other under - screen outlet is connected to the first - stage mixing barrel through the first - stage shunt pipe. In this way, a part of the under - screen product of the first - stage No. 2 pre - desliming screen enters the first - stage shunt box through the under - screen outlet, and the other part enters the first - stage mixing barrel through the first - stage shunt pipe.

[0012] There are two under - screen outlets provided at the under - screen outlet of the second - stage No. 2 pre - desliming screen. One under - screen outlet is connected to the second - stage shunt box, and the other under - screen outlet is connected to the second - stage mixing barrel through the second - stage shunt pipe. In this way, a part of the under - screen product of the second - stage No. 2 pre - desliming screen enters the second - stage shunt box through the under - screen outlet, and the other part enters the second - stage mixing barrel through the second - stage shunt pipe.

[0013] The upper limit of the particle size of the crushed product of the crusher described in the utility model is 3 - 15 mm.

[0014] The lower limit of the particle size of the sizing screen described in the utility model is usually 0.5 mm or 0.75 mm.

[0015] Compared with the existing ore - dressing system, the beneficial effects of the utility model are as follows: It has the advantages of good separation effect; no harmful agents are added, the return water can be directly used, and it is environmentally friendly; the degree of automation is high, and the separation process is easy to control; it has the advantages of good separation effect, energy conservation and environmental protection, and low recovery cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the utility model. DETAILED DESCRIPTION OF THE INVENTION

[0017] The following further describes the utility model in conjunction with the drawings:

[0018] As shown in the attached drawings, a silicon wafer sorting system, characterized in that the system includes a primary heavy medium sorting system 1, a secondary heavy medium sorting system 2 and a fine particle processing system 3. The discharge ports of the primary heavy medium sorting system 1 are respectively a primary silicon wafer product outlet, a primary magnetic tail water outlet, a primary heavy product outlet and a primary fine particle pulp outlet. The product of the primary silicon wafer product outlet is the primary silicon wafer product. The primary heavy product outlet is connected to the inlet of the secondary heavy medium sorting system 2. The outlets of the secondary heavy medium sorting system 2 are respectively a secondary silicon wafer product outlet, a secondary magnetic tail water outlet and an impurity product outlet. The primary magnetic tail water outlet, the secondary magnetic tail water outlet and the primary fine particle pulp outlet are respectively connected to the inlet of the fine particle processing system 3. The product of the secondary silicon wafer product outlet is the secondary silicon wafer product. The product of the impurity product outlet is the impurity product. The outlet of the fine particle processing system 3 is a fine mud product outlet, a return water outlet and a fine particle product outlet. The product of the fine mud product outlet is the fine mud product. The product of the fine particle product outlet is the fine particle product.

[0019] Furthermore, the primary heavy medium sorting system 1 includes a crusher 11, a sizing screen 12, a primary mixing tank 13, a primary heavy medium cyclone 14, a primary No. 1 pre-degreasing screen 15, a primary No. 2 pre-degreasing screen 16, a primary shunt box 17, a primary No. 1 vibrating degreasing screen 18, a primary No. 2 vibrating degreasing screen 19 and a primary magnetic separator 110. The outlet of the crusher 11 is connected to the inlet of the sizing screen 12. The oversize product outlet of the sizing screen 12 is connected to the inlet of the primary mixing tank 13. The undersize product outlet of the sizing screen 12 is the primary fine particle pulp outlet. The outlet of the primary mixing tank 13 is connected to the inlet of the primary heavy medium cyclone 14. The underflow outlet of the primary heavy medium cyclone 14 is connected to the inlet of the primary No. 1 pre-degreasing screen 15. The overflow outlet of the primary heavy medium cyclone 14 is connected to the inlet of the primary No. 2 pre-degreasing screen 16. The oversize outlet of the primary No. 1 pre-degreasing screen 15 is connected to the primary No. 1 vibrating degreasing screen 18. The oversize product outlet of the primary No. 1 vibrating degreasing screen 18 is the primary heavy product outlet. The oversize outlet of the primary No. 2 pre-degreasing screen 16 is connected to the inlet of the primary No. 2 vibrating degreasing screen 19. The oversize product of the primary No. 2 vibrating degreasing screen 19 is the primary silicon wafer product outlet. The undersize product outlet of the primary No. 2 pre-degreasing screen 16 is connected to the inlet of the primary shunt box 17. The dilute medium outlet of the primary shunt box 17, the undersize outlet of the primary No. 1 vibrating degreasing screen 18 and the undersize outlet of the primary No. 2 vibrating degreasing screen 19 are connected to the inlet of the primary magnetic separator 110. The combined medium outlet of the primary shunt box 17, the undersize product outlet of the primary No. 1 pre-degreasing screen 15 and the magnetic product outlet of the primary magnetic separator 110 are respectively connected to the inlet of the primary mixing tank 13. The non-magnetic product outlet of the primary magnetic separator 110 is the primary magnetic tail water outlet.

[0020] Further, the secondary dense medium separation system 2 includes a secondary mixing tank 21, a secondary dense medium cyclone 22, a first-stage secondary pre-dense medium screen 23, a second-stage secondary pre-dense medium screen 24, a secondary flow splitter box 25, a first-stage secondary vibrating dense medium screen 26, a second-stage secondary vibrating dense medium screen 27, and a secondary magnetic separator 28. The outlet of the heavy product of the primary dense medium separation system 1 is connected to the inlet of the secondary mixing tank 21. The outlet of the secondary mixing tank 21 is connected to the inlet of the secondary dense medium cyclone 22. The underflow outlet of the secondary dense medium cyclone 22 is connected to the inlet of the first-stage secondary pre-dense medium screen 23. The overflow outlet of the secondary dense medium cyclone 22 is connected to the inlet of the second-stage secondary pre-dense medium screen 24. The oversize outlet of the first-stage secondary pre-dense medium screen 23 is connected to the first-stage secondary vibrating dense medium screen 26. The oversize product outlet of the first-stage secondary vibrating dense medium screen 26 is the outlet of the secondary heavy product. The oversize outlet of the second-stage secondary pre-dense medium screen 24 is connected to the inlet of the second-stage secondary vibrating dense medium screen 27. The oversize product of the second-stage secondary vibrating dense medium screen 27 is the outlet of the secondary silicon wafer product. The undersize product outlet of the second-stage secondary pre-dense medium screen 24 is connected to the inlet of the secondary flow splitter box 25. The dilute medium outlet of the secondary flow splitter box 25, the undersize outlet of the first-stage secondary vibrating dense medium screen 26, and the undersize outlet of the second-stage secondary vibrating dense medium screen 27 are connected to the inlet of the secondary magnetic separator 28. The combined medium outlet of the secondary flow splitter box 25, the undersize product outlet of the first-stage secondary pre-dense medium screen 23, and the magnetic product outlet of the secondary magnetic separator 28 are respectively connected to the inlet of the secondary mixing tank 21. The non-magnetic product outlet of the secondary magnetic separator 28 is the outlet of the secondary magnetic tail water.

[0021] Further, the fine particle size treatment system 3 includes a thickening cyclone 31, a thickener 32, a dewatering screen 33, and a filter press 34. The primary magnetic tail water outlet, the secondary magnetic tail water outlet, and the primary fine particle size pulp outlet are respectively connected to the inlet of the thickening cyclone 31. The underflow outlet of the thickening cyclone 31 is connected to the inlet of the dewatering screen 33. The oversize on the dewatering screen 33 is the fine particle product. The undersize outlet of the dewatering screen 33 is connected to the inlet of the thickening cyclone 31. The overflow outlet of the thickening cyclone 31 is connected to the inlet of the thickener 32. The underflow outlet of the thickener 32 is connected to the inlet of the filter press 34. The overflow outlet of the thickener 32 and the filtrate outlet of the filter press 34 are the return water outlets for recycling. The product at the filter cake outlet of the filter press 34 is the fine mud product.

[0022] Further, there are two undersize outlets at the undersize outlet of the first-stage second pre-dense medium screen 16. One undersize outlet is connected to the first-stage flow splitter box 17, and the other undersize outlet is connected to the first-stage mixing tank 13 through a first-stage flow splitter pipe. In this way, a part of the undersize product of the first-stage second pre-dense medium screen 16 enters the first-stage flow splitter box 17 through the undersize outlet, and the other part enters the first-stage mixing tank 13 through the first-stage flow splitter pipe.

[0023] There are two under-screen outlets provided at the under-screen outlet of the second-stage No. 2 pre-dense-medium screen 24 of the utility model. One under-screen outlet is connected to the second-stage shunt box 25, and the other under-screen outlet is connected to the second-stage mixing barrel 21 through a second-stage shunt pipe. In this way, a part of the under-screen product of the second-stage No. 2 pre-dense-medium screen 24 enters the second-stage shunt box 25 through the under-screen outlet, and the other part enters the second-stage mixing barrel 21 through the second-stage shunt pipe.

[0024] Further, the upper limit of the particle size of the crushed product of the crusher 11 is 3 - 15 mm.

[0025] Further, the lower limit of the particle size of the sizing screen 12 is usually 0.5 mm or 0.75 mm.

[0026] During actual use, the feeding pressures of the first-stage heavy-medium cyclone 14 and the second-stage heavy-medium cyclone 22 are 0.12 - 0.30 MPa, the specific gravity of the suspension is 2.0 - 2.7 g / cm3, and the feeding pressure of the thickening cyclone 31 is 0.06 - 0.20 MPa; the underflow concentration of the thickening cyclone 31 is above 50%; the moisture content of the fine-particle product is less than 20%, the underflow concentration of the thickener 32 is not less than 20%; the moisture content of the fine-sludge product is less than 20%. Embodiment

[0027] The material is fed into the crusher 11 of the first-stage heavy medium separation system 1 and crushed to -8.00 mm. The material of -0.5 mm is screened out by the grading screen 12, and the material of 0.5 - 8.0 mm is fed into the first-stage mixing tank 13. A heavy medium suspension with a density of 2.30 g / cm3 is configured in the first-stage mixing tank 13. The material and the heavy medium suspension are fed into the first-stage heavy medium cyclone together by a pump for separation. The heavy products separated by the first-stage heavy medium cyclone 14 enter the first-stage No. 1 pre-dense medium screen 15 and the first-stage No. 1 vibrating dense medium screen 18 in sequence. The product on the screen of the first-stage No. 1 vibrating dense medium screen 18 is the first-stage heavy product. The light products separated by the first-stage heavy medium cyclone 14 enter the first-stage No. 2 pre-dense medium screen 16 and the first-stage No. 2 vibrating dense medium screen 19 in sequence. The product on the screen of the first-stage No. 2 vibrating dense medium screen 19 is the first-stage silicon wafer finished product. Part of the suspension is transported to the first-stage magnetic separator 110 by a pump for purification to obtain the first-stage qualified suspension and the first-stage magnetic tail water. The heavy product produced by the first-stage heavy medium system is fed into the second-stage mixing tank 21. A heavy medium suspension with a density of 2.40 g / cm3 is configured in the second-stage mixing tank 21. The material and the heavy medium suspension are fed into the second-stage heavy medium cyclone 22 together by a pump for separation. The heavy products separated by the second-stage heavy medium cyclone 22 enter the second-stage No. 1 pre-dense medium screen 23 and the second-stage No. 1 vibrating dense medium screen 26. The product on the screen of the second-stage No. 1 vibrating dense medium screen 26 is the impurity product. The light products separated by the second-stage heavy medium cyclone 22 enter the second-stage No. 2 pre-dense medium screen 24 and the second-stage No. 2 vibrating dense medium screen 27. The product on the screen of the second-stage No. 2 vibrating dense medium screen 27 is the second-stage silicon wafer finished product. Part of the suspension is transported to the second-stage magnetic separator 28 by a pump for purification to obtain the qualified suspension and the second-stage magnetic tail water. The first-stage magnetic tail water, the second-stage magnetic tail water, and the fine particle pulp are transported to the thickening cyclone 31 by a pump. The feeding pressure of the thickening cyclone 31 is 0.12 Mpa, the bottom concentration of the thickening cyclone 31 is 60%, and the bottom flow of the thickening cyclone 31 is fed into the dewatering screen 33. The moisture content of the fine particle product on the screen is 19%. The overflow of the thickening cyclone 31 is fed into the thickener 32. The bottom concentration of the thickener 32 is 30%. The bottom flow is transported to the filter press 34 by a pump. The moisture content of the filter cake fine mud product is 19.50%. The overflow of the thickener 32 and the filtrate of the filter press 34 are used as the return water for recycling.

[0028] For a certain silicon wafer material, the main impurity is the welding rod. The separation indexes obtained by processing with this silicon wafer separation system are shown in the following table.

[0029]

[0030] As can be seen from the above data, when using this silicon wafer sorting system to process a certain silicon wafer material, test indicators with a comprehensive silicon wafer product yield of 89.30% and an impurity removal rate of 100.00% can be obtained. In addition, this system also has the advantages of low operating cost, high automation degree, and little environmental pollution, and is suitable for subsequent popularization and application.

Claims

1. A silicon wafer sorting system, characterized in that The system comprises a primary heavy medium sorting system, a secondary heavy medium sorting system and a fine-grained processing system. The discharge ports of the primary heavy medium sorting system are respectively a primary silicon wafer product outlet, a primary magnetic tail water outlet, a primary heavy product outlet and a primary fine-grained ore pulp outlet. The product of the primary silicon wafer product outlet is a primary silicon wafer product. The primary heavy product outlet is connected to the inlet of the secondary heavy medium sorting system. The outlets of the secondary heavy medium sorting system are respectively a secondary silicon wafer product outlet, a secondary magnetic tail water outlet and an impurity product outlet. The primary magnetic tail water outlet, the secondary magnetic tail water outlet and the primary fine-grained ore pulp outlet are respectively connected to the inlet of the fine-grained processing system. The product of the secondary silicon wafer product outlet is a secondary silicon wafer product. The product of the impurity product outlet is an impurity product. The outlets of the fine-grained processing system are a fine mud product outlet, a return water outlet and a fine particle product outlet. The product of the fine mud product outlet is a fine mud product. The product of the fine particle product outlet is a fine particle product.

2. A silicon wafer sorting system according to claim 1, characterized in that The first-level heavy medium sorting system includes a crusher, a grading screen, a first-level mixing barrel, a first-level heavy medium cyclone, a first-level No. 1 pre-medium removal screen, a first-level No. 2 pre-medium removal screen, a first-level diverter box, a first-level No. 1 vibrating medium removal screen, a first-level No. 2 vibrating medium removal screen, and a first-level magnetic separator. The outlet of the crusher is connected to the inlet of the grading screen, the outlet of the grading screen for the product on the screen is connected to the inlet of the first-level mixing barrel, the outlet of the grading screen for the product under the screen is a first-level fine-grained ore pulp outlet, the outlet of the first-level mixing barrel is connected to the inlet of the first-level heavy medium cyclone, the underflow outlet of the first-level heavy medium cyclone is connected to the inlet of the first-level No. 1 pre-medium removal screen, the overflow outlet of the first-level heavy medium cyclone is connected to the inlet of the first-level No. 2 pre-medium removal screen, the outlet on the first-level No. 1 pre-medium removal screen is connected to the The first-level No. 1 vibrating de-mediation screen is connected, the on-screen product outlet of the first-level No. 1 vibrating de-mediation screen is the first-level heavy product outlet, the on-screen outlet of the first-level No. 2 pre-de-mediation screen is connected to the inlet of the first-level No. 2 vibrating de-mediation screen, the on-screen product of the first-level No. 2 vibrating de-mediation screen is the primary silicon wafer product outlet, the under-screen product outlet of the first-level No. 2 pre-de-mediation screen is connected to the inlet of the first-level diverter box, the dilute media outlet of the first-level diverter box, the under-screen outlet of the first-level No. 1 vibrating de-mediation screen, and the under-screen outlet of the first-level No. 2 vibrating de-mediation screen are connected to the inlet of the first-level magnetic separator, the combined media outlet of the first-level diverter box, the under-screen product outlet of the first-level No. 1 pre-de-mediation screen, and the magnetic product outlet of the first-level magnetic separator are respectively connected to the inlet of the first-level mixing barrel, and the non-magnetic product outlet of the first-level magnetic separator is the first-level magnetic tail water outlet.

3. A silicon wafer sorting system according to claim 1, characterized in that The secondary heavy medium separation system comprises a secondary mixing barrel, a secondary heavy medium cyclone, a secondary No. 1 pre-medium removal screen, a secondary No. 2 pre-medium removal screen, a secondary diverter box, a secondary No. 1 vibrating de-medium removal screen, a secondary No. 2 vibrating de-medium removal screen, and a secondary magnetic separator. The primary heavy product outlet of the primary heavy medium separation system is connected to the inlet of the secondary mixing barrel, the outlet of the secondary mixing barrel is connected to the inlet of the secondary heavy medium cyclone, the underflow outlet of the secondary heavy medium cyclone is connected to the inlet of the secondary No. 1 pre-medium removal screen, the overflow outlet of the secondary heavy medium cyclone is connected to the inlet of the secondary No. 2 pre-medium removal screen, the screen outlet of the secondary No. 1 pre-medium removal screen is connected to the secondary No. 1 vibrating de-medium removal screen, and the secondary No. 1 vibrating de-medium removal screen is connected to the secondary No. 1 vibrating de-medium removal screen. The on-screen product outlet is the secondary heavy product outlet, the on-screen outlet of the secondary No. 2 pre-media de-screen is connected to the inlet of the secondary No. 2 vibrating de-media screen, the on-screen product of the secondary No. 2 vibrating de-media screen is the secondary silicon wafer product outlet, the under-screen product outlet of the secondary No. 2 pre-media de-screen is connected to the inlet of the secondary diverter box, the dilute media outlet of the secondary diverter box, the under-screen outlet of the secondary No. 1 vibrating de-media screen, and the under-screen outlet of the secondary No. 2 vibrating de-media screen are connected to the inlet of the secondary magnetic separator, the combined media outlet of the secondary diverter box, the under-screen product outlet of the secondary No. 1 pre-media de-screen, and the magnetic product outlet of the secondary magnetic separator are respectively connected to the inlet of the secondary mixing barrel, and the non-magnetic product outlet of the secondary magnetic separator is the secondary magnetic tail water outlet.

4. A silicon wafer sorting system according to claim 1, characterized in that The fine particle processing system comprises a concentrating cyclone, a thickener, a dewatering screen and a filter press. The first-level magnetic tail water outlet, the second-level magnetic tail water outlet and the first-level fine particle slurry outlet are respectively connected to the inlet of the concentrating cyclone, the underflow outlet of the concentrating cyclone is connected to the inlet of the dewatering screen, the fine particle product is on the dewatering screen, the underflow outlet of the dewatering screen is connected to the inlet of the concentrating cyclone, the overflow outlet of the concentrating cyclone is connected to the inlet of the thickener, the underflow outlet of the thickener is connected to the inlet of the filter press, the overflow outlet of the thickener and the filtrate outlet of the filter press are backwater outlets for recycling, and the product of the filter cake outlet of the filter press is a fine mud product.

5. A silicon wafer sorting system according to claim 2, characterized in that The first-level No. 2 pre-media-removing screen has two under-screen outlets, one of which is connected to the first-level diverter box, and the other is connected to the first-level mixing barrel via the first-level diverter pipe. In this way, part of the under-screen product of the first-level No. 2 pre-media-removing screen enters the first-level diverter box through the under-screen outlet, and the other part enters the first-level mixing barrel through the first-level diverter pipe.

6. A silicon wafer sorting system according to claim 3, characterized in that The secondary No. 2 pre-de-mediation screen is provided with two under-screen outlets, one of which is connected to the secondary diverter box, and the other is connected to the secondary mixing barrel via the secondary diverter pipe. In this way, part of the under-screen product of the secondary No. 2 pre-de-mediation screen enters the secondary diverter box through the under-screen outlet, and the other part enters the secondary mixing barrel through the secondary diverter pipe.

7. A silicon wafer sorting system according to claim 2, characterized in that The upper limit of the particle size of the crushed product of the crusher is 3-15 mm.

8. A silicon wafer sorting system according to claim 2, characterized in that The lower limit of the grading sieve particle size is 0.5 mm or 0.75 mm.