Tin liquid nozzle device of wave soldering furnace
By designing a wave soldering furnace tin liquid nozzle device made of titanium alloy material, including a height adjustment baffle and a filter, the problems of excessive tin slag and poor adaptability in the existing wave soldering technology are solved, and the welding quality is improved and the scope of application is expanded.
Patent Information
- Application Number
- CN202421931108.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-11
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-11
AI Technical Summary
The existing wave soldering technology generates a large amount of tin slag during the welding process, affecting the welding quality and production environment. At the same time, it has poor adaptability to PCB board products of different sizes and specifications, and is difficult to debug.
A wave soldering furnace tin liquid nozzle device is designed, made of titanium alloy material, with height adjustment baffles on both sides, and a filter mesh is installed in the nozzle main body, and the front and rear baffles can be adjusted up and down, and the width of the nozzle main body is optimized and shortened to reduce the contact area between tin liquid and air.
It significantly reduces the generation of tin slag, improves welding quality, has a wide range of application, is easy to debug, and can accurately match PCB board products of different sizes and specifications.
Smart Images
Figure CN222985905U_ABST
Abstract
Description
Technical Field:
[0001] The utility model relates to the technical field of wave soldering manufacturing of electronic products, and specifically relates to a wave soldering furnace tin liquid nozzle device with reasonable structure, wide application range, which can significantly reduce solder dross and improve welding quality. Background Art:
[0002] Wave soldering is a widely used welding method in the electronic assembly industry for fixing electronic components on printed circuit boards (PCBs). However, a large amount of solder dross is generated during the wave soldering process, which not only wastes materials but also affects the welding quality and production environment. One of the reasons for the generation of solder dross is that the tin liquid is in contact with air for a long time, resulting in oxidation and the generation of solder dross. In addition, the existing wave soldering has poor adaptability to PCB products of different sizes and specifications. In actual welding, one-third of the tin liquid does not contact the PCB. Moreover, the heights of the front and rear baffles of the existing wave soldering tin liquid nozzle are fixed and non-adjustable, unable to match the welding area of the PCB, making debugging difficult. Summary of the Invention:
[0003] The utility model aims at the defects and deficiencies existing in the prior art, and provides a wave soldering furnace tin liquid nozzle device with reasonable structure, wide application range, which can significantly reduce solder dross and improve welding quality.
[0004] The utility model is achieved by the following measures:
[0005] A wave soldering furnace tin liquid nozzle device is provided with a wave soldering tin liquid nozzle main body. It is characterized in that the wave soldering tin liquid nozzle main body is made of titanium alloy material. Height adjustment baffles are respectively arranged on the inner walls on both sides of the wave soldering tin liquid nozzle main body. Strip-shaped slot holes are opened on the height adjustment baffles, and the height adjustment baffles are fixedly connected to the inner wall of the wave soldering tin liquid nozzle main body through screws and the strip-shaped slot holes. A horizontally placed filter screen is arranged inside the wave soldering tin liquid nozzle main body.
[0006] The filter screen of the utility model is placed in the middle of the wave soldering tin liquid nozzle main body, and the aperture range of the filter screen is 3 mm to 5 mm, so as to achieve the purpose of delaying the flow rate of the tin liquid.
[0007] The width range of the wave soldering tin liquid nozzle main body of the utility model is 60 mm to 100 mm, so as to effectively reduce the contact area between the tin liquid and air and reduce the generation of solder dross.
[0008] When the utility model is in operation, since the nozzle body is made of titanium alloy material, it has good heat resistance and oxidation resistance, meeting the requirements of the tin bath nozzle; a front baffle and a rear baffle that can be adjusted up and down are added inside the nozzle body. Both the front baffle and the rear baffle are arranged along the length direction of the nozzle body. The baffle and the filter screen are fixed to the inner wall of the nozzle body with M5 stainless steel screws, and the screw fixing holes of the front and rear baffles are strip-shaped grooves to facilitate the up and down adjustment of the baffles. The filter screen is fixed in the middle of the nozzle and is fixed with M5 screws to slow down the flow rate of the tin bath; in the utility model, the overall width of the nozzle body is optimized and shortened by at least 10 cm compared with the original nozzle, so as to reduce the contact area between the tin bath and air and the number of times the tin bath contacts air, thereby reducing tin dross; through the up and down adjustment of the front baffle and the rear baffle of the nozzle, the welding area between the tin bath and the PCB circuit board can be accurately matched, improving the utilization rate of the tin bath and reducing tin dross; finally, by adding a filter screen to the nozzle body, the impact force of the tin bath is reduced, effectively slowing down the flow rate of the tin bath and improving the welding quality.
[0009] Compared with the prior art, the utility model has remarkable advantages such as reasonable structure, convenient adjustment, and wide applicability. Brief Description of the Drawings:
[0010] Attached Figure 1 is a schematic structural view of the utility model.
[0011] Attached Figure 2 is a top view of the utility model.
[0012] Reference Numerals: Wave soldering tin bath nozzle body 1, baffle 2, strip-shaped slot hole 3, filter screen 4, strip-shaped groove 5, filter screen fixing screw hole 6. Detailed Description of the Invention:
[0013] The following will further describe the utility model with reference to the drawings and embodiments.
[0014] As shown in the attached Figure 1 figure, the utility model provides a wave soldering furnace tin bath nozzle device, which is provided with a wave soldering tin bath nozzle body 1. The wave soldering tin bath nozzle body 1 is made of titanium alloy material. Height adjustment baffles 2 are respectively arranged on the inner walls on both sides of the wave soldering tin bath nozzle body 1. Strip-shaped slot holes 3 are opened on the height adjustment baffles 2. The height adjustment baffles 2 are fixedly connected to the inner wall of the wave soldering tin bath nozzle body 1 through screws and the strip-shaped slot holes 3. A horizontally placed filter screen 4 is arranged inside the wave soldering tin bath nozzle body 1.
[0015] The filter screen 4 of the utility model is placed in the middle of the wave soldering tin bath nozzle body 1, and the aperture range of the filter screen is 3 mm to 5 mm to achieve the purpose of slowing down the flow rate of the tin bath.
[0016] The width range of the wave soldering flux nozzle body 1 of the present utility model is from 60 mm to 100 mm, so as to effectively reduce the contact area between the solder flux and air and reduce the generation of solder dross.
[0017] Embodiment:
[0018] This example provides a wave soldering furnace solder flux nozzle device, which is provided with a wave soldering flux nozzle body 1. The wave soldering flux nozzle body 1 is made of titanium alloy material. Height adjustment baffles 2 are respectively arranged on the inner walls on both sides of the wave soldering flux nozzle body 1. Strip-shaped slot holes 3 are opened on the height adjustment baffles 2. The height adjustment baffles 2 are fixedly connected to the inner wall of the wave soldering flux nozzle body 1 through screws and the strip-shaped slot holes 3. A strip-shaped slot 5 corresponding to the strip-shaped slot hole 3 is opened on the side wall of the wave soldering flux nozzle body. A horizontally placed filter screen 4 is arranged in the wave soldering flux nozzle body 1; the filter screen 4 is placed in the middle of the wave soldering flux nozzle body 1, and the aperture range of the filter screen is from 3 mm to 5 mm, so as to achieve the purpose of delaying the flow rate of the solder flux;
[0019] The width range of the wave soldering flux nozzle body 1 of this example is from 60 mm to 100 mm, so as to effectively reduce the contact area between the solder flux and air and reduce the generation of solder dross.
[0020] During the operation of this example, since the nozzle body is made of titanium alloy material, it has good heat resistance and oxidation resistance and meets the requirements of the solder flux nozzle; front baffles and rear baffles that can be adjusted up and down are added inside the nozzle body. The front baffles and rear baffles are both arranged along the length direction of the nozzle body. The baffles and the filter screen are fixed to the inner wall of the nozzle body with M5 stainless steel screws, and the screw fixing holes of the front and rear baffles adopt strip-shaped slot holes 3 to facilitate the up and down adjustment of the baffles. The filter screen is fixed in the middle of the nozzle and fixed with M5 screws to delay the flow rate of the solder flux; in the present utility model, the overall width of the nozzle body 1 is optimized and shortened by at least 10 cm compared with the original nozzle, so as to reduce the contact area between the solder flux and air and the number of times the solder flux contacts air, thereby reducing solder dross; the front and rear baffles of the nozzle can be adjusted up and down to accurately match the welding area of the solder flux and the PCB circuit board, improve the utilization rate of the solder flux, and reduce solder dross; finally, by adding the filter screen 4 to the nozzle body 1, the impact force of the solder flux is reduced, the flow rate of the solder flux is effectively delayed, and the welding quality is improved.
[0021] Compared with the prior art, the present utility model has remarkable advantages such as reasonable structure, convenient adjustment, and wide applicability.
Claims
1. A wave soldering furnace tin liquid nozzle device, provided with a wave soldering tin liquid nozzle body, characterized in that: The wave soldering liquid nozzle body is made of titanium alloy material, and height adjustment baffles are respectively arranged on the inner walls on both sides of the wave soldering liquid nozzle body. The height adjustment baffles are provided with strip slots, and the height adjustment baffles are fixedly connected to the inner wall of the wave soldering liquid nozzle body through screws and the strip slots. A horizontally placed filter screen is arranged in the wave soldering liquid nozzle body.
2. A wave soldering furnace tin liquid nozzle device according to claim 1, characterized in that: The filter is placed in the middle of the wave soldering liquid nozzle body, and the filter aperture range is 3mm to 5mm, so as to achieve the purpose of slowing down the flow speed of the tin liquid.
3. A wave soldering furnace tin liquid nozzle device according to claim 1, characterized in that: The width of the wave soldering liquid nozzle body ranges from 60 mm to 100 mm, so as to effectively reduce the contact area between the tin liquid and the air and reduce the generation of tin slag.