Cooling device for silicon wafer cutting

Abstract

The utility model provides a cooling device for silicon wafer cutting, which relates to the technical field of silicon wafer processing, and comprises a cutting table and a cutting line, the surface of the cutting table is provided with a groove, the bottom of the inner wall of the groove is fixedly connected with a positioning frame, the side surface of the positioning frame is provided with a rotating handle, one side of the rotating handle is fixedly connected with a threaded rod, and the threaded rod is fixedly connected with the cutting line. The other side of the threaded rod is movably connected with a clamp, a fan is fixedly installed at the top of the clamp, a rotating handle is rotated to enable the clamps on the two sides to be close to each other to clamp and fix a silicon wafer, and the fan installed at the top of the clamp can blow off cooling liquid and chippings adhering to the top of the silicon wafer after cutting is completed. The water pump pumps cooling liquid in the liquid storage bin to the spray head to spray out the cooling liquid, spraying cooling is conducted on the silicon wafer cutting position, when the cutting position changes, the driving motor drives the lead screw to rotate to enable the movable block to move on the surface of the movable block, and the situation that the cooling liquid cannot be sprayed for cooling in time when the cutting position changes is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice processing, in particular to a cooling device for silicon slice cutting. Background Art

[0002] The cooling device is an indispensable accessory in the silicon wafer cutting process. The coolant cools and lubricates the steel wire through the cooling device. The purpose is to reduce the heat generated by the friction between the steel wire and the silicon wafer, and clean the silicon powder wrapped on the surface of the steel wire and the silicon powder mixed between the silicon wafers, so as to improve the lubrication effect of the steel wire, ensure the cutting speed of the steel wire, and also reduce the wire breakage rate.

[0003] After the silicon wafer is cut, cutting fluid, debris and other substances will adhere to its surface. Since there are allergic substances in the cutting fluid, people need to wear gloves to remove it, which reduces the practicality of the device. In addition, during the cutting process of the silicon wafer, the cutting position gradually changes, but the cooling device is usually fixed in place with bolts, which limits the spray angle of the coolant and cannot fully spray and cool the silicon wafer. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that after the silicon wafer is cut, personnel need to wear gloves to remove it, which reduces the practicality of the device. In addition, during the cutting process of the silicon wafer, the spray angle of the coolant is limited and the silicon wafer cannot be fully sprayed and cooled. A cooling device for silicon wafer cutting is proposed.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a cooling device for silicon wafer cutting, comprising a cutting table and a cutting line, the surface of the cutting table is provided with a groove, the top of the inner wall of the groove is provided with a mounting groove, the top of the cutting table is fixedly provided with a liquid storage tank, the top of the inner wall of the groove is fixedly connected with a mounting plate, the bottom of the inner wall of the groove is fixedly connected with two positioning frames, a turning handle is provided on the side of the positioning frame, one side of the turning handle is fixedly connected with a threaded rod, the surface of the threaded rod is threadedly connected to the inner wall of the positioning frame, one side of the outer wall of the positioning frame is fixedly connected with a guide rod, the other side of the threaded rod is movably connected with a clamp, the rear end of the clamp is fixedly connected with a slider, the slider is slidably installed on the surface of the guide rod, the top of the clamp is fixedly provided with a fan, one side of the mounting plate is fixedly provided with a water pump, and the surface of the cutting table is fixedly provided with a driving motor.

[0006] Preferably, a baffle is fixedly mounted on the bottom of the inner wall of the groove, the baffle is located at the rear end of the positioning frame, and the fan is in a tilted state.

[0007] Preferably, a liquid guide pipe is fixedly connected to the bottom of the liquid storage bin. One end of the liquid guide pipe is fixedly connected to the water pumping end of the water pump. The water outlet end of the water pump is fixedly connected to a connecting hose. One end of the connecting hose is fixedly connected to a delivery cylinder, and the delivery cylinder is of a hollow structure.

[0008] Preferably, a stabilizing sleeve is fixedly connected to the bottom of the delivery cylinder. A fixed pipe is arranged inside the stabilizing sleeve, and a spray head is fixedly connected to the bottom of the fixed pipe.

[0009] Preferably, the fixed pipe penetrates through the inside of the stabilizing sleeve, and the top end of the fixed pipe is located inside the delivery cylinder.

[0010] Preferably, a lead screw is fixedly connected to the output shaft of the driving motor. The other end of the lead screw is movably connected to the inner wall of the installation groove. An active block is arranged inside the installation groove. A connecting block is fixedly connected to the bottom of the active block, and the bottom of the connecting block is fixedly connected to the top of the delivery cylinder.

[0011] Preferably, the width of the active block fits the width of the installation groove, and the inner wall of the active block is threadedly connected to the surface of the lead screw.

[0012] Compared with the prior art, the advantages and positive effects of the present utility model are as follows.

[0013] 1. In the present utility model, by rotating the handle, the clamps on both sides move closer to each other, facilitating the clamping and fixing of the silicon wafer. The blower installed on the top of the clamp can blow off the coolant and debris adhering to the top of the silicon wafer after cutting, facilitating personnel to take it. The baffle is located at the rear end of the silicon wafer, preventing the blown debris from splashing.

[0014] 2. In the present utility model, the water pump pumps the coolant inside the liquid storage bin to the spray head for spraying, cooling the cutting position of the silicon wafer by spraying. When the cutting position changes, the driving motor drives the lead screw to rotate, causing the active block to move on its surface, thereby driving the position of the spray head to change, increasing the spraying angle of the spray head, and avoiding the situation where the coolant cannot be sprayed in time for cooling when the cutting position changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional structural schematic diagram of the cutting table of a cooling device for silicon wafer cutting proposed by the present utility model;

[0016] Figure 2 is a schematic diagram of the water pump installation structure of a cooling device for silicon wafer cutting proposed by the present utility model;

[0017] Figure 3 is a schematic diagram of the internal top view structure of the installation groove of a cooling device for silicon wafer cutting proposed by the present utility model;

[0018] Figure 4 The side view partial sectional structure diagram of the cutting table of a cooling device for wafer cutting is proposed for the present utility model.

[0019] Legend: 1. Cutting table; 101. Groove; 102. Installation groove; 11. Cutting wire; 12. Baffle; 13. Liquid storage bin; 131. Liquid guide pipe; 14. Installation plate; 2. Positioning frame; 21. Rotating handle; 22. Threaded rod; 23. Guide rod; 3. Clamp; 31. Slide block; 4. Fan; 5. Water pump; 51. Connecting hose; 52. Delivery cylinder; 6. Driving motor; 61. Lead screw; 62. Movable block; 63. Connecting block; 7. Stable sleeve; 71. Fixed pipe; 72. Sprayer. Detailed implementation manners

[0020] In order to more clearly understand the above objects, features and advantages of the present utility model, the present utility model will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the limitations of the specific embodiments disclosed in the following specification.

[0022] Embodiment 1

[0023] As Figures 1 - 4 shown, the present utility model provides a technical solution: a cooling device for wafer cutting, including a cutting table 1 and a cutting wire 11. A groove 101 is formed on the surface of the cutting table 1, and an installation groove 102 is formed on the top inner wall of the groove 101. A liquid storage bin 13 is fixedly installed on the top of the cutting table 1. The top inner wall of the groove 101 is fixedly connected with an installation plate 14. Two positioning frames 2 are fixedly connected to the bottom inner wall of the groove 101. A rotating handle 21 is provided on the side of the positioning frame 2. One side of the rotating handle 21 is fixedly connected with a threaded rod 22. The surface of the threaded rod 22 is threadedly connected with the inner wall of the positioning frame 2. One side of the outer wall of the positioning frame 2 is fixedly connected with a guide rod 23. The other side of the threaded rod 22 is movably connected with a clamp 3. The rear end of the clamp 3 is fixedly connected with a slide block 31. The slide block 31 is slidably installed on the surface of the guide rod 23. A fan 4 is fixedly installed on the top of the clamp 3. A water pump 5 is fixedly installed on one side of the installation plate 14. A driving motor 6 is fixedly installed on the surface of the cutting table 1. A baffle 12 is fixedly installed on the bottom inner wall of the groove 101. The baffle 12 is located at the rear end of the positioning frame 2. The fan 4 is in an inclined state.

[0024] In this embodiment, the silicon wafer is placed on one side of the fixture 3. By rotating the handle 21, the threaded rod 22 is driven to rotate. The threaded rod 22 rotates inside the positioning frame 2 and moves towards one end of the silicon wafer. Moreover, the slider 31 on the side of the fixture 3 slides on the surface of the guide rod 23, and the two side fixtures 3 move inwards to clamp and fix the silicon wafer. The cutting wire 11 is heated and rotated to cut the silicon wafer. After the cutting is completed, by starting the blower 4, the debris and coolant on the top of the silicon wafer are blown off, and it can be taken off without personnel wearing gloves. The baffle 12 can block the blown debris to prevent the debris from splashing everywhere.

[0025] Embodiment 2

[0026] As Figures 1 - 4 shown, a liquid guide pipe 131 is fixedly connected to the bottom of the liquid storage bin 13. One end of the liquid guide pipe 131 is fixedly connected to the water pumping end of the water pump 5. The water outlet end of the water pump 5 is fixedly connected with a connecting hose 51. One end of the connecting hose 51 is fixedly connected with a delivery cylinder 52. The delivery cylinder 52 is of a hollow structure. A stabilizing sleeve 7 is fixedly connected to the bottom of the delivery cylinder 52. A fixed pipe 71 is arranged inside the stabilizing sleeve 7. A spray head 72 is fixedly connected to the bottom of the fixed pipe 71. The fixed pipe 71 penetrates through the inside of the stabilizing sleeve 7, and the top end of the fixed pipe 71 is located inside the delivery cylinder 52. The output shaft of the driving motor 6 is fixedly connected with a lead screw 61. The other end of the lead screw 61 is movably connected with the inner wall of the installation groove 102. An active block 62 is arranged inside the installation groove 102. The bottom of the active block 62 is fixedly connected with an adapter block 63. The bottom of the adapter block 63 is fixedly connected with the top of the delivery cylinder 52. The width of the active block 62 fits the width of the installation groove 102, and the inner wall of the active block 62 is threadedly connected with the surface of the lead screw 61.

[0027] In this embodiment, a relatively high temperature is generated during the cutting of the silicon wafer. By adding coolant into the liquid storage bin 13, starting the water pump 5 to pump the coolant towards the connecting hose 51 and flowing towards the fixed pipe 71 to be sprayed out through the spray head 72, the cutting position of the silicon wafer is sprayed and cooled. The fixed pipe 71 is installed inside the stabilizing sleeve 7, which can support the fixed pipe 71 to prevent the fixed pipe 71 and the spray head 72 from shaking. When the cutting position of the silicon wafer changes, start the driving motor 6 to drive the lead screw 61 to rotate, and the active block 62 moves on the surface of the rotating lead screw 61. The delivery cylinder 52 is driven to move through the adapter block 63, so that the position of the spray head 72 is adjusted and adjusted according to the cutting position of the silicon wafer, improving the overall cooling effect during the cutting of the silicon wafer.

[0028] Working principle of this embodiment: Place the silicon wafer on one side of the fixture 3. Rotate the turning handles 21 on both sides to move the fixtures 3 on both sides inward to clamp and fix the silicon wafer. Heat up and rotate the cutting wire 11 to cut the silicon wafer. During the cutting process of the silicon wafer, a relatively high temperature is generated. Add coolant into the liquid storage bin 13, start the water pump 5 to pump the coolant to the nozzle 72 for spraying, and spray and cool the cutting position of the silicon wafer. When the cutting position of the silicon wafer changes, start the driving motor 6 to drive the lead screw 61 to rotate, and the movable block 62 moves on the surface of the rotating lead screw 61. Drive the nozzle 72 to move through the connecting block 63 to adjust its position, and adjust according to the cutting position of the silicon wafer. After cutting is completed, start the fan 4 to blow off the debris and coolant on the top of the silicon wafer, and it can be removed without personnel wearing gloves.

[0029] The above are only the preferred embodiments of the present invention, and are not limitations to the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A cooling device for silicon wafer cutting, comprising a cutting table (1) and a cutting line (11), characterized in that: The surface of the cutting table (1) is provided with a groove (101), the inner wall top of the groove (101) is provided with a mounting groove (102), a liquid storage tank (13) is fixedly installed on the top of the cutting table (1), a mounting plate (14) is fixedly connected to the inner wall top of the groove (101), two positioning frames (2) are fixedly connected to the inner wall bottom of the groove (101), a turning handle (21) is provided on the side of the positioning frame (2), a threaded rod (22) is fixedly connected to one side of the turning handle (21), and the threaded rod (22) is fixedly connected to the inner wall bottom of the groove (101). The surface of the positioning frame (2) is threadedly connected to the inner wall of the positioning frame (2); a guide rod (23) is fixedly connected to one side of the outer wall of the positioning frame (2); a clamp (3) is movably connected to the other side of the threaded rod (22); a slider (31) is fixedly connected to the rear end of the clamp (3); the slider (31) is slidably mounted on the surface of the guide rod (23); a fan (4) is fixedly mounted on the top of the clamp (3); a water pump (5) is fixedly mounted on one side of the mounting plate (14); and a drive motor (6) is fixedly mounted on the surface of the cutting table (1).

2. A cooling device for silicon wafer cutting according to claim 1, characterized in that: A baffle (12) is fixedly mounted on the bottom of the inner wall of the groove (101); the baffle (12) is located at the rear end of the positioning frame (2); and the fan (4) is in an inclined state.

3. The cooling device for silicon wafer cutting according to claim 1, characterized in that: The bottom of the liquid storage bin (13) is fixedly connected to a liquid guide tube (131), one end of the liquid guide tube (131) is fixedly connected to the water pump end of the water pump (5), the water outlet end of the water pump (5) is fixedly connected to a connecting hose (51), one end of the connecting hose (51) is fixedly connected to a conveying cylinder (52), and the conveying cylinder (52) is a hollow structure.

4. The cooling device for silicon wafer cutting according to claim 3, characterized in that: The bottom of the conveying cylinder (52) is fixedly connected to a stabilizing sleeve (7), a fixing pipe (71) is provided inside the stabilizing sleeve (7), and the bottom of the fixing pipe (71) is fixedly connected to a nozzle (72).

5. The cooling device for silicon wafer cutting according to claim 4, characterized in that: The fixing tube (71) passes through the interior of the stabilizing sleeve (7), and the top end of the fixing tube (71) is located inside the conveying tube (52).

6. The cooling device for silicon wafer cutting according to claim 1, characterized in that: The output shaft of the driving motor (6) is fixedly connected to a screw rod (61), the other end of the screw rod (61) is movably connected to the inner wall of the mounting groove (102), a movable block (62) is provided inside the mounting groove (102), the bottom of the movable block (62) is fixedly connected to a connecting block (63), and the bottom of the connecting block (63) is fixedly connected to the top of the conveying cylinder (52).

7. The cooling device for silicon wafer cutting according to claim 6, characterized in that: The width of the movable block (62) matches the width of the mounting groove (102), and the inner wall of the movable block (62) is threadedly connected to the surface of the screw rod (61).

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