Planet carrier structure beneficial to sintering and welding

Abstract

The utility model provides a planet carrier structure beneficial to sintering and welding, and belongs to the technical field of planet carrier structures. Comprising a lower disc body and a plurality of supporting plates arranged at the top of the lower disc body, an upper disc body is arranged at the tops of the supporting plates, the tops of the supporting plates and the bottom of the upper disc body are fixed in a sintering and welding mode, welding flux holes are formed in the upper disc body, welding grooves formed in the tops of the supporting plates are formed in the bottom of the upper disc body, and welding flux runners communicated with the welding flux holes are formed in the tops in the welding grooves. And an arc-shaped raised line is arranged at the bottom in the solder runner. The area of a welding surface is increased, welding flux is placed in the welding flux holes, the welding flux is melted during high-temperature sintering, the welding flux rapidly flows through the welding flux flow channel to cover the whole surface, the welding flux can cover the whole welding surface in a short time, and the welding flux is diffused and bonded to enable the bottom of the upper disc body and the top of the supporting plate to be combined. The integral structure with certain strength and performance is achieved, the sintering welding area between the upper disc body and the supporting plate of the planet carrier is guaranteed, and the welding strength is improved.

Description

Technical Field

[0001] The utility model provides a planet carrier structure which is beneficial to sintering welding, belonging to the technical field of planet carrier structures. Background Technique

[0002] The planet carrier is one of the main components of the planetary gear transmission device. The planet wheel shaft or bearing is installed on the planet carrier. There are three forms of the welded planet carrier structure, namely the double-side plate integral welded planet carrier, the double-side plate separated welded planet carrier, and the single-side plate welded planet carrier.

[0003] The existing welded planet carrier structure can basically meet the use requirements, but there are still certain defects: when sintering and welding between the bottom of the upper disc body of the planet carrier and the bottom of the support plate, in order to improve the sintering welding strength, the general method is to increase the area of the welding surface, but this is very likely to increase the situation that the solder does not cover the entire welding surface, and instead, the welding strength will decrease. Based on this, the utility model provides a planet carrier structure which is beneficial to sintering welding. Content of the Utility Model

[0004] The technical problem solved by the utility model is that increasing the area of the welding surface is likely to increase the situation that the solder does not cover the entire welding surface, and instead, the welding strength will decrease.

[0005] In order to solve the technical problem, the technical solution provided by the utility model is: a planet carrier structure which is beneficial to sintering welding, including a lower disc body, a plurality of support plates arranged on the top of the lower disc body, an upper disc body is arranged on the top of the support plates, the top of the support plates is fixedly connected with the bottom of the upper disc body by sintering welding, solder holes are arranged on the upper disc body, welding grooves placed on the top of the support plates are arranged at the bottom of the upper disc body, solder flow channels communicated with the solder holes are arranged at the inner top of the welding grooves, and arc-shaped convex strips are arranged at the inner bottom of the solder flow channels.

[0006] Further, two solder flow channels are arranged, and the two solder flow channels are in an outward V shape.

[0007] Further, the minimum clearance distance between the arc-shaped convex strip and the solder flow channel is 2-4mm.

[0008] Further, welding protrusions matched with the welding grooves are arranged on the top of the support plates, and the depth of the welding grooves is 0.03-0.07mm.

[0009] Further, limiting protrusions placed outside the solder flow channels are arranged at the bottom of the upper disc body, and limiting grooves matched with the limiting protrusions are arranged on the top of the support plates.

[0010] The beneficial effects of the utility model:

[0011] Increase the area of the welding surface. By placing solder in the solder holes, when sintered at high temperature, the solder melts and quickly flows through the solder channels to cover the entire surface. This is conducive to the solder covering the entire welding surface in a short time. The solder diffuses and bonds to combine the bottom of the upper disc body with the top of the support plate, achieving an integral structure with certain strength and performance, ensuring the sintered welding area between the upper disc body and the support plate of the planet carrier, and improving the welding strength. Brief Description of the Drawings

[0012] Figure 1 It is a plan view of the present utility model.

[0013] Figure 2 It is a partial plan view of the present utility model.

[0014] Figure 3 It is a partial cross-sectional view at the solder channel of the present utility model.

[0015] 1. Support plate; 2. Upper disc body; 3. Solder hole; 4. Solder channel; 5. Arc-shaped rib; 6. Limit protrusion; 7. Welding groove. Detailed Embodiment

[0016] The present utility model will be further described below with reference to the drawings.

[0017] According to the attached Figure 1 , 2 , as shown in Fig. 3: The present utility model provides a planet carrier structure conducive to sintered welding, including a lower disc body and a plurality of support plates 1 arranged on the top of the lower disc body. The top of the support plate 1 is provided with an upper disc body 2. The top of the support plate 1 and the bottom of the upper disc body 2 are fixed by sintered welding. The upper disc body 2 is provided with solder holes 3. The bottom of the upper disc body 2 is provided with a welding groove 7 placed on the top of the support plate 1. The inner top of the welding groove 7 is provided with a solder channel 4 communicating with the solder holes 3. There are two solder channels 4, and the two solder channels 4 are in an outer eight-shaped pattern. The inner bottom of the solder channel 4 is provided with an arc-shaped rib 5. The minimum clearance distance between the arc-shaped rib 5 and the solder channel 4 is 2 - 4 mm. Solder is placed in the solder holes 3. When sintered at high temperature, the solder melts and quickly flows through the solder channel 4 to cover the entire surface. The solder diffuses and bonds to combine the bottom of the upper disc body 2 with the top of the support plate 1.

[0018] According to the attached Figure 3 , as shown: The top of the support plate 1 is provided with a welding protrusion matching the welding groove 7. The depth of the welding groove 7 is 0.03 - 0.07 mm. The bottom of the upper disc body 2 is provided with a limit protrusion 6 placed outside the solder channel 4. The top of the support plate 1 is provided with a limit groove matching the limit protrusion 6. When splicing the support plate 1 with the welding groove 7, by placing the limit protrusion 6 in the welding groove 7 and making the limit protrusion 6 insert into the limit groove, the support plate 1 can be accurately spliced to the bottom of the upper disc body 2.

[0019] Principle of the utility model

[0020] During use, by matching the support plate 1 with the welding groove 7, the limiting protrusion 6, and the welding groove 7, the support plate 1 can be accurately spliced at the bottom of the upper disc body 2, effectively preventing the welding position from being misaligned and inaccurate when the support plate 1 and the upper disc body 2 are sintered and welded together. By placing solder in the solder hole 3, when sintered at high temperature, the solder melts and quickly flows through the solder flow channel 4 to cover the entire surface, which is beneficial for the solder to cover the entire welding surface in a short time. The solder diffuses and bonds to combine the bottom of the upper disc body 2 with the top of the support plate 1, achieving an integral structure with certain strength and performance, ensuring the sintering and welding area between the upper disc body 2 and the support plate 1 of the planet carrier, and improving the welding strength.

[0021] The above describes the utility model and its implementation manners. Such description is not restrictive. What is shown in the drawings is only one of the implementation manners of the utility model, and the actual structure is not limited thereto. In short, if those of ordinary skill in the art are inspired by it and, without departing from the creative purpose of the utility model, design similar structural manners and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the utility model.

Claims

1. A planetary frame structure that is convenient for sintering and welding, comprising a lower disk body, a plurality of support plates (1) arranged on the top of the lower disk body, an upper disk body (2) being arranged on the top of the support plates (1), characterized in that: The top of the support plate (1) and the bottom of the upper disk body (2) are fixed by sintering and welding, the upper disk body (2) is provided with a solder hole (3), the bottom of the upper disk body (2) is provided with a welding groove (7) placed on the top of the support plate (1), the top of the welding groove (7) is provided with a solder flow channel (4) connected to the solder hole (3), and the bottom of the solder flow channel (4) is provided with an arc-shaped convex strip (5).

2. A planetary carrier structure that is conducive to sintering welding according to claim 1, characterized in that: Two solder flow channels (4) are provided, and the two solder flow channels (4) are in an outward-facing "X" shape.

3. The planetary carrier structure that is conducive to sintering welding according to claim 1, characterized in that: The minimum gap distance between the arc-shaped convex strip (5) and the solder flow channel (4) is 2-4 mm.

4. The planetary carrier structure that is advantageous for sintering welding according to claim 1, characterized in that: The top of the support plate (1) is provided with a welding protrusion matching the welding groove (7), and the depth of the welding groove (7) is 0.03-0.07 mm.

5. The planetary carrier structure that is conducive to sintering welding according to claim 1, characterized in that: The bottom of the upper disk body (2) is provided with a limiting protrusion (6) disposed outside the solder flow channel (4), and the top of the support plate (1) is provided with a limiting groove matching the limiting protrusion (6).

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