Surface-mounted aluminum electrolytic capacitor

Abstract

The utility model discloses a surface-mounted aluminum electrolytic capacitor, which relates to the technical field of capacitors and comprises a base provided with a radiating component. The heat dissipation assembly comprises upper heat dissipation holes, the upper heat dissipation holes are formed in the upper position of the surface of the base in a circumferential array mode, lower heat dissipation holes are formed in the lower position of the surface of the base in a circumferential array mode, and through holes are formed in the surface of the supporting plate in a circumferential array mode. The capacitor body is installed in the base, and the capacitor body is limited and buffered through the rubber limiting strips. And heat generated by the capacitor body is discharged from the upper heat dissipation holes, the lower heat dissipation holes and the through holes, so that long-time operation of the capacitor body is ensured. The connecting block is connected with the circuit board, so that the contact area is increased, the base and the circuit board can be better connected, the vibration frequency of the circuit board and the vibration frequency of the connecting pins are guaranteed to be the same, pulling of the connecting pins is reduced, and damage is avoided. Electrolyte possibly leaked from the capacitor body is absorbed through the water absorption pad, a circuit board is prevented from being damaged, and use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a patch type aluminum electrolytic capacitor. Background Technique

[0002] Electrolytic capacitors usually use metal foil (aluminum) as the positive electrode, and the insulating oxide layer (aluminum oxide / niobium pentoxide) of the metal foil as the dielectric. Electrolytic capacitors are divided into aluminum electrolytic capacitors and niobium electrolytic capacitors according to their positive electrodes. The negative electrode of the aluminum electrolytic capacitor is composed of thin paper / thin film or electrolyte polymer impregnated with electrolyte solution (liquid electrolyte).

[0003] After retrieval, the existing public patent number is: CN202021479642.1, and the public patent name is: A highly reliable patch type aluminum electrolytic capacitor, which solves the problem that the pins of the existing patch type aluminum electrolytic capacitor are prone to breakage during the vibration of the working environment. The capacitor includes a capacitor body, two pins connected to the bottom of the capacitor, and a base arranged at the bottom of the capacitor body. The base is provided with lead holes matching the pins, and the lower surface of the base is provided with lead grooves matching the lead holes. One end of the lead groove is communicated with the lead hole, and the pins pass through the lead holes and are arranged in the lead grooves. The upper surface of the base is provided with positioning grooves, the lead holes are located in the positioning grooves, and a tightening ring is arranged on the side wall of the positioning groove. The bottom of the capacitor body is embedded in the positioning groove, and the tightening ring is sleeved outside the capacitor body. This application can keep the vibration amplitude and frequency of the capacitor body and the circuit board consistent under vibration conditions, and avoid breaking the pins.

[0004] However, there is no heat dissipation treatment at the connection between the above capacitor and the base, which is not conducive to the use of the capacitor; and the leakage of the electrolyte in the capacitor will cause corrosion of the PCB board. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] In view of the deficiencies of the prior art, the utility model provides a patch type aluminum electrolytic capacitor, which solves the problems of inconvenient heat dissipation of the capacitor and leakage and corrosion of the circuit board.

[0007] (2) Technical Solutions

[0008] To achieve the above purposes, the utility model is realized through the following technical solutions: A patch type aluminum electrolytic capacitor, including: a base, a capacitor body is arranged on the base, lead grooves are opened on both sides of the base, connection pins electrically connected to the capacitor body penetrate through the lead grooves, a limiting groove is opened on the upper surface of the base, and a cavity is opened at the bottom of the base; a support plate is fixedly connected to the bottom of the limiting groove, the capacitor body is arranged on the upper surface of the support plate, and a heat dissipation component is arranged on the base;

[0009] The heat dissipation component includes upper heat dissipation holes, which are circumferentially arranged at the upper position of the base surface. Lower heat dissipation holes are circumferentially arranged at the lower position of the base surface. Through holes are circumferentially arranged on the surface of the support plate.

[0010] Preferably, the upper heat dissipation holes are arranged above the support plate, the lower heat dissipation holes are arranged below the support plate, and the number of the upper heat dissipation holes is the same as that of the lower heat dissipation holes.

[0011] Preferably, a connecting block is fixedly connected to the bottom of the base, a water absorption pad is arranged at the bottom of the cavity, and the diameter of the water absorption pad is the same as that of the cavity.

[0012] Preferably, a current limiting groove is formed on the upper surface of the support plate, and communication holes are circumferentially arranged on the current limiting groove.

[0013] Preferably, rounded corners are formed on the current limiting groove, and the communication holes are communicated with the cavity.

[0014] Preferably, rubber limiting strips are circumferentially arranged in the limiting groove, the rubber limiting strips are attached to the capacitor body, and the length of the rubber limiting strips is the same as the depth of the limiting groove.

[0015] Preferably, the lower heat dissipation holes are arranged above the water absorption pad, and the water absorption pad is filled with water absorption cotton.

[0016] Beneficial effects

[0017] The utility model provides a surface-mounted aluminum electrolytic capacitor, which has at least the following beneficial effects compared with the prior art:

[0018] The capacitor body is installed in the base, and the capacitor body is limited and buffered by the rubber limiting strips. The heat generated by the capacitor body is discharged from the upper heat dissipation holes, the lower heat dissipation holes and the through holes, ensuring the long-term operation of the capacitor body. The connection block is connected to the circuit board, increasing the contact area, enabling better connection between the base and the circuit board, ensuring the same vibration frequency of the circuit board and the connection pins, reducing the pulling force on the connection pins, and avoiding damage. The water absorption pad absorbs the electrolyte that may leak from the capacitor body, avoiding damage to the circuit board and facilitating use. Description of the drawings

[0019] Figure 1 It is a schematic structural diagram of the utility model;

[0020] Figure 2 It is a schematic structural diagram of the water absorption pad of the utility model;

[0021] Figure 3 It is a schematic structural diagram of the interior of the base of the utility model;

[0022] Figure 4This is a schematic structural diagram of the utility model.

[0023] In the figure: 1, base; 2, capacitor body; 3, connection pin; 4, lead slot; 5, connection block; 6, limit slot; 7, support plate; 8, cavity; 9, rubber limit strip; 10, heat dissipation component; 1001, upper heat dissipation hole; 1002, lower heat dissipation hole; 1003, through hole; 11, current limiting slot; 12, communication hole; 13, rounded corner; 14, water absorption pad. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1:

[0026] Please refer to Figures 1-4 , the present utility model provides a technical solution: a base 1, a capacitor body 2 is arranged on the base 1, lead slots 4 are opened on both sides of the base 1, connection pins 3 electrically connected to the capacitor body 2 penetrate through the lead slots 4, a limit slot 6 is opened on the upper surface of the base 1, and a cavity 8 is opened at the bottom of the base 1; a support plate 7 is fixedly connected to the bottom of the limit slot 6, the capacitor body 2 is arranged on the upper surface of the support plate 7, and a heat dissipation component 10 is arranged on the base 1; the heat dissipation component 10 includes an upper heat dissipation hole 1001, the upper heat dissipation hole 1001 is arranged in a circumferential array at a position above the surface of the base 1, lower heat dissipation holes 1002 are arranged in a circumferential array at a position below the surface of the base 1, and through holes 1003 are arranged in a circumferential array on the surface of the support plate 7.

[0027] Analysis of the above content: The heat generated by the capacitor body 2 is discharged from the upper heat dissipation hole 1001, preventing heat from accumulating at the connection between the base 1 and the capacitor body 2. The heat at the bottom of the capacitor body 2 enters the cavity 8 through the through hole 1003 and is discharged through the lower heat dissipation hole 1002, preventing heat from accumulating between the capacitor body 2 and the support plate 7, improving the heat dissipation effect of the capacitor body 2 and facilitating use. The capacitor body 2 is supported by the support plate 7, and mounting holes matching the connection pins 3 are opened on the support plate 7. The heat generated by the capacitor body 2 is discharged from the upper heat dissipation hole 1001, the lower heat dissipation hole 1002, and the through hole 1003, ensuring the long-term operation of the capacitor body 2.

[0028] Embodiment 2:

[0029] Please refer to Figures 1-4, the present utility model provides a technical solution based on Embodiment 1: The upper heat dissipation holes 1001 are arranged above the support plate 7, the lower heat dissipation holes 1002 are arranged below the support plate 7, and the number of the upper heat dissipation holes 1001 is the same as that of the lower heat dissipation holes 1002.

[0030] Analysis of the above content: The heat on the surface of the capacitor body 2 is dissipated through the upper heat dissipation holes 1001, and the heat at the bottom of the capacitor body 2 is dissipated through the lower heat dissipation holes 1002 and the through holes 1003. Both the upper heat dissipation holes 1001 and the lower heat dissipation holes 1002 penetrate the surface of the base 1 and are in contact with the air to improve the heat dissipation effect.

[0031] Embodiment 3:

[0032] Please refer to Figures 1-4 , the present utility model provides a technical solution based on Embodiment 1: A connecting block 5 is fixedly connected to the bottom of the base 1, a water absorption pad 14 is arranged at the bottom of the cavity 8, and the diameter of the water absorption pad 14 is the same as that of the cavity 8. The lower heat dissipation holes 1002 are arranged above the water absorption pad 14, and the water absorption pad 14 is filled with absorbent cotton.

[0033] Analysis of the above content: The base 1 is connected to the circuit board through the connecting block 5, so that the base 1 and the circuit board move synchronously, thereby avoiding the pulling of the connecting pins 3 caused by the asynchronous vibration of the circuit board and the capacitor body 2, and preventing the connecting pins 3 from falling off the circuit board.

[0034] Embodiment 4:

[0035] Please refer to Figures 1-4 , the present utility model provides a technical solution based on Embodiment 1: A current limiting groove 11 is formed on the upper surface of the support plate 7, and communication holes 12 are circumferentially arranged on the current limiting groove 11.

[0036] Analysis of the above content: The leaked electrolyte is drained through the current limiting groove 11, and the electrolyte flows out along the communication holes 12 and is absorbed by the water absorption pad 14 to avoid corrosion and damage to the circuit board. The base 1 is connected to the circuit board through the connecting block 5, increasing the contact area, enabling better connection between the base 1 and the circuit board, ensuring the same vibration frequency of the circuit board and the connecting pins 3, reducing the pulling on the connecting pins 3, and avoiding damage. The water absorption pad 14 absorbs the electrolyte that may leak from the capacitor body 2, avoiding damage to the circuit board and facilitating use.

[0037] Embodiment 5:

[0038] Please refer to Figures 1-4 , the present utility model provides a technical solution based on Embodiment 1: A fillet 13 is formed on the current limiting groove 11, and the communication holes 12 are communicated with the cavity 8.

[0039] Analysis of the above content: The rounded corner 13 facilitates the inflow of the electrolyte into the current-limiting groove 11, avoiding the residue of the electrolyte on the surface of the support plate 7.

[0040] Embodiment Six:

[0041] Please refer to Figures 1-4 , based on Embodiment One, the present utility model provides a technical solution: Rubber limiting strips 9 are arranged in a circumferential array in the limiting groove 6. The rubber limiting strips 9 are arranged in contact with the capacitor body 2, and the length of the rubber limiting strips 9 is the same as the depth of the limiting groove 6.

[0042] Analysis of the above content: The capacitor body 2 is squeezed and limited by the rubber limiting strips 9, and the rubber limiting strips 9 can also buffer the capacitor body 2. To reduce the vibration suffered by the capacitor body 2 during operation, so as to prevent the damage of the capacitor body 2. The capacitor body 2 is installed in the base 1, and the capacitor body 2 is limited and buffered by the rubber limiting strips 9.

[0043] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0044] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A chip aluminum electrolytic capacitor, characterized in that: include: A base (1), wherein a capacitor body (2) is arranged on the base (1), lead grooves (4) are provided on both sides of the base (1), and connecting pins (3) electrically connected to the capacitor body (2) are penetrated in the lead grooves (4), a limiting groove (6) is provided on the upper surface of the base (1), and a cavity (8) is provided at the bottom of the base (1); a support plate (7) is fixedly connected to the bottom of the limiting groove (6), and the capacitor body (2) is arranged on the upper surface of the support plate (7); and a heat dissipation component (10) is provided on the base (1); The heat dissipation assembly (10) comprises upper heat dissipation holes (1001), the upper heat dissipation holes (1001) are arranged in a circular array on the upper surface of the base (1), the lower heat dissipation holes (1002) are arranged in a circular array on the lower surface of the base (1), and the support plate (7) has through holes (1003) arranged in a circular array on the surface.

2. A chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: The upper heat dissipation holes (1001) are arranged above the support plate (7), and the lower heat dissipation holes (1002) are arranged below the support plate (7), and the number of the upper heat dissipation holes (1001) and the lower heat dissipation holes (1002) is the same.

3. The chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: A connecting block (5) is fixedly connected to the bottom of the base (1), and a water-absorbing pad (14) is arranged at the bottom of the cavity (8); the diameter of the water-absorbing pad (14) is the same as the diameter of the cavity (8).

4. The chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: A limited flow groove (11) is provided on the upper surface of the support plate (7), and a connecting hole (12) is arranged in a circumferential array on the limited flow groove (11).

5. A chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: The flow limiting groove (11) is provided with a rounded corner (13). The communication hole (12) is in communication with the cavity (8).

6. The chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: The inner circumference array of the limiting groove (6) is provided with rubber limiting strips (9), the rubber limiting strips (9) are arranged in close contact with the capacitor body (2), and the length of the rubber limiting strips (9) is the same as the depth of the limiting groove (6).

7. The chip-type aluminum electrolytic capacitor according to claim 3, characterized in that: The lower heat dissipation hole (1002) is arranged above the water absorbent pad (14), and the water absorbent pad (14) is filled with water absorbent cotton.

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