Chip high-temperature-resistant circulation disc

Abstract

The utility model discloses a high temperature resistant chip circulation disc, which relates to the technical field of chip processing, and comprises a circulation disc, the left side and the right side of the circulation disc are respectively and fixedly connected with a handle, the front side and the rear side of the circulation disc are respectively provided with a clamping groove, and the front side of the circulation disc is provided with a plurality of groups of storage grooves. A plurality of sets of storage grooves are formed in the circulation disc, positive cross-shaped columns and back cross-shaped columns are arranged in the multiple sets of storage grooves correspondingly, a plurality of rectangular grooves A are transversely formed in the back face of the circulation disc, a plurality of rectangular grooves B are vertically formed in the back face of the circulation disc, and the rectangular grooves A and the rectangular grooves B are arranged in a staggered mode. The plurality of storage grooves are internally provided with positive cross-shaped columns and back cross-shaped columns respectively, so that on one hand, large-batch placement of chips can be improved, and on the other hand, when the back surface of the other circulation disc covers the circulation disc with the chips, the back cross-shaped columns abut against the back surface of the other circulation disc, shaking during carrying is prevented, and the service life of the circulation disc is prolonged. And the handles on the left and right sides of the circulation disc are convenient for workers to carry.

Description

Technical Field

[0001] The utility model relates to the technical field of chip storage, and more specifically, it relates to a chip high-temperature resistant turnover tray. Background Art

[0002] The turnover tray, also known as the transfer tray, is mainly used to place multiple chips in the turnover tray for unified transportation or storage, enabling them to be transferred between various processing operations and playing a protective role for the chips;

[0003] A chip automatic negative pressure adsorption fixing structure disclosed in a Chinese patent with the publication number CN220595581U has the following technical key points: providing a chip automatic negative pressure adsorption fixing structure that can press and protect the chip to prevent the chip from tipping over and being damaged during movement. A chip automatic negative pressure adsorption fixing structure includes a base, an air pump, a connecting pipe, a vacuum suction cup, a chip turnover tray, etc. An air pump is connected to the front side of the right part of the base, a connecting pipe is connected between the left side of the air pump and the front side of the middle part of the base, a vacuum suction cup is connected to the inner bottom of the base, and a chip turnover tray is clamped inside the base. By rotating the fitting cover plate to fit with the base, under the action of the elastic sheet, the pressing pad presses and protects the chip, and the positioning member rotates to fix and limit the fitting cover plate, which can achieve the effect of pressing and protecting the chip to prevent the chip from tipping over and being damaged during movement;

[0004] In the above solution, the cooperation of the fitting cover plate, the base and the elastic sheet solves the operation of pressing and protecting the chip placed on the turnover tray to prevent the chip from tipping over during movement. Due to the settings of the air pump, the vacuum suction cup and the connecting pipe in the above solution, the production cost is high, and it is not convenient to stack the chips during storage. Therefore, a new solution needs to be proposed to solve this problem. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the purpose of the present utility model is to provide a chip high-temperature resistant turnover tray. The above technical purpose of the present utility model is achieved through the following technical solutions: The chip high-temperature resistant turnover tray includes a turnover tray. Handles are respectively fixedly connected to the left and right sides of the turnover tray. Card slots are respectively opened on the front and rear sides of the turnover tray. Multiple storage slots are opened on the turnover tray. The multiple storage slots are divided into a front side and a back side. Positive cross columns are respectively arranged in the fronts of the multiple storage slots on the front side, and back cross columns are respectively arranged in the backs of the multiple storage slots on the back side. Multiple A rectangular slots are horizontally opened on the back of the turnover tray, and multiple B rectangular slots are vertically opened on the back of the turnover tray. The multiple A rectangular slots and the multiple B rectangular slots are arranged in an alternating manner. First reinforcing ribs are respectively arranged between the multiple A rectangular slots, and second reinforcing ribs are respectively arranged between the multiple B rectangular slots.

[0006] By adopting the above technical solution, handles are fixedly connected to the left and right sides of the transfer tray respectively, which facilitates the staff to carry the chips on the transfer tray. Moreover, through the A rectangular groove and the B rectangular groove on the back of the transfer tray, the back of the transfer tray is in a honeycomb shape, thereby improving the overall rigidity of the transfer tray and reducing the overall weight of the transfer tray, which is convenient for subsequent handling.

[0007] The present utility model is further configured as follows: the inner side of the storage groove opened on the transfer tray is trapezoidally arranged, the height of the front of the storage groove is higher than the height of the positive cross column, and the height of the back of the storage groove is lower than the height of the back cross column.

[0008] The present utility model is further configured as follows: the difference between the front of the storage groove and the positive cross column is 0.55 mm, and the difference between the back of the storage groove and the back cross column is 0.25 mm.

[0009] By adopting the above technical solution, the chips can be fully placed in the storage groove, making the chips parallel to the plane of the storage groove, and the chips will not leak out.

[0010] The present utility model is further configured as follows: the A rectangular groove is a long rectangular shape, the B rectangular groove is a short rectangular shape, and the handle is an L shape.

[0011] By adopting the above technical solution, it is convenient for the staff to hold the handle to carry the whole transfer tray.

[0012] The present utility model is further configured as follows: the card slot is concave. The flatness of the outer shape of the transfer tray is less than or equal to 0.3 mm. The flatness of the storage groove opened on the transfer tray is less than or equal to 0.1 mm.

[0013] The length of the A rectangular groove is 0.1 mm more than the length of the B rectangular groove, and the width of the A rectangular groove is 0.3 mm less than the width of the B rectangular groove.

[0014] In summary, the present utility model has the following beneficial effects:

[0015] 1. By opening a plurality of storage grooves on the transfer tray and respectively arranging positive cross columns in the plurality of storage grooves, on the one hand, it can improve the placement of a large number of chips, and at the same time, the positive cross column can serve as a positioning reference when the staff places the chips. On the other hand, when the back of another transfer tray is covered on the transfer tray with the chips placed, the positive cross column abuts against the back cross column on the other transfer tray, so that the chips do not contact the storage groove. Even when the transfer tray is slightly bent, it cannot cause damage to the chips, and it can prevent shaking during handling. Moreover, a plurality of transfer trays with chips placed can be stacked, and the handles on the left and right sides of the transfer tray facilitate the staff to carry.

[0016] 2. Multiple A rectangular grooves and B rectangular grooves are staggered on the back of the rotating disk, and the first reinforcing rib and the second reinforcing rib are provided to form a honeycomb shape on the back of the rotating disk. On the one hand, when the rotating disk is carried by the staff, the weight is reduced while the overall rigidity of the rotating disk is not affected. On the other hand, the anti-deformation ability and load-bearing capacity of the rotating disk are improved, and it is not easy to deform. Description of the Drawings

[0017] Figure 1 It is a front two-dimensional schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 It is a back two-dimensional schematic diagram of the overall structure of the present utility model;

[0019] Figure 3 It is a front three-dimensional view of the overall structure of the present utility model;

[0020] Figure 4 It is a back three-dimensional view of the overall structure of the present utility model;

[0021] Figure 5 It is a side three-dimensional view of the rotating disk and handle structure of the present utility model;

[0022] Figure 6 It is a side three-dimensional view of the rotating disk and card slot structure of the present utility model.

[0023] In the figure: 1. Rotating disk; 2. Positive cross column; 3. Storage groove; 4. Handle; 5. A rectangular groove; 6. B rectangular groove; 7. Card slot; 8. Back cross column. Detailed Embodiment

[0024] The following combines the drawings and embodiments to describe the present utility model in detail.

[0025] For the embodiments of the present utility model, please refer to Figures 1 to 6, Chip high-temperature resistant transfer tray, including transfer tray 1. On the left and right sides of transfer tray 1, there are respectively fixedly connected handles 4. On the front and back sides of transfer tray 1, there are respectively provided card slots 7. On transfer tray 1, multiple storage slots 3 are opened. The multiple storage slots 3 are divided into the front and the back. In the multiple storage slots 3 on the front, there are respectively provided positive cross columns 2. In the multiple storage slots 3 on the back, there are respectively provided back cross columns 8. On the back of transfer tray 1, multiple A rectangular grooves 5 are horizontally opened, and multiple B rectangular grooves 6 are vertically opened on the back of transfer tray 1. The multiple A rectangular grooves 5 and the multiple B rectangular grooves 6 are arranged in a staggered manner. Between the multiple A rectangular grooves 5, there are respectively provided first reinforcing ribs, and between the multiple B rectangular grooves 6, there are respectively provided second reinforcing ribs. In this embodiment, transfer tray 1 is integrally made of PPO material through an injection molding process. The PPO material can play an insulating role, and has rigidity, is not easily corroded and is high-temperature resistant. Specifically, it can withstand temperatures above one hundred and fifty degrees. This not only improves the service life of transfer tray 1, but also meets the environmental requirements for the transfer of chips in the oven.

[0026] The following discloses the shape and height of storage slot 3. Please refer to Figures 1 to 3 , The inner side of the storage slot 3 opened on transfer tray 1 is trapezoid-shaped. The height of the front of storage slot 3 is higher than the height of positive cross column 2. The difference between the front of storage slot 3 and positive cross column 2 is 0.55 mm. The height of the back of storage slot 3 is lower than the height of back cross column 8. The difference between the back of storage slot 3 and back cross column 8 is 0.25 mm. In this embodiment, the setting of storage slot 3 is to facilitate the placement of chips, and positive cross column 2 serves as a reference for positioning. It can not only quickly and accurately place the chips according to the position of positive cross column 2, but also improve the stability of chip placement when another transfer tray 1 contacts the chips, reducing the shaking phenomenon during the handling of the transfer tray.

[0027] The following discloses the shape and size of A rectangular groove 5 and B rectangular groove 6. Please refer to Figure 4, the A rectangular groove 5 is set as a long rectangle, and the B rectangular groove 6 is set as a short rectangle. The length of the A rectangular groove 5 is more than 0.1mm longer than the length of the B rectangular groove 6, and the width of the A rectangular groove 5 is less than 0.3mm wider than the width of the B rectangular groove 6. In this embodiment, the A rectangular groove 5 is set as a long rectangle and the B rectangular groove 6 is set as a short rectangle. The long rectangle setting is that the length of the A rectangular groove 5 is longer and the width is shorter. On the contrary, the short rectangle setting is that the length of the B rectangular groove 6 is shorter and the width is longer. The A rectangular groove 5, that is, the long rectangle setting, is to maintain rigidity in the horizontal direction and resist deformation caused by external collision when placing the chip; secondly, the B rectangular groove 6, that is, the short rectangle setting, is to bear the weight of the chip and the pressure of the overall stacking, while reducing the material of the overall structure and reducing the production cost. On the one hand, multiple B rectangular grooves 6 are to reduce weight, reduce the weight of the staff in carrying the flow turntable 1, and will not destroy the overall rigidity of the flow turntable 1. On the other hand, multiple grooves can form a honeycomb shape, so that the flow turntable 1 is evenly stressed, reduce stress concentration, improve the anti-deformation ability and bearing capacity, and is not easy to deform.

[0028] The following discloses the structure of the handle 4 and the arrangement of the card slot 7, please refer to Figures 1 to 6 The handle 4 is L-shaped and the slot 7 is concave. In the present embodiment, the handle 4 is for the convenience of the staff to take or carry the stacked flow turntables 1 and improve the carrying efficiency. The slot 7 is provided to facilitate the stacking of multiple flow turntables 1 and the identification of the flow turntables 1 when they are placed. The flow turntables 1 can be quickly stacked in sequence according to the orientation of the slot 7.

[0029] The heights of the flow turntable 1 and the storage tank 3 are disclosed below. Please refer to Figure 1 and Figure 3 , the flatness of the outer shape of the flow disk 1 is less than or equal to 0.3 mm, and the flatness of the storage slot 3 provided in the flow disk 1 is less than or equal to 0.1 mm. In this embodiment, when the chip is placed on the storage slot 3, the chip and the storage slot 3 can be made into an integral plane, which is convenient for placing the back of another flow disk 1 later, so as to abut the chip and reduce the occupied area of ​​the flow disk 1.

[0030] Working principle: When the staff has completed the chip production through the equipment, the completed chips can be placed in the storage slots 3 in sequence and supported by the cross columns 2. When the completed chips have filled up the multiple storage slots 3 opened by the flow tray 1, another flow tray 1 can be placed with its back facing the front of the flow tray 1 where the chips are placed, so that the back cross columns 8 on the back of the flow tray 1 are in contact with the support of the cross columns 2, thereby realizing the stacking of multiple flow trays 1 and being able to suspend the chips under the support of the back cross columns 8 and the cross columns 2. Not only can the chips be limited and the occupied area can be reduced at the same time, but also the multiple flow trays 1 can be transported by the handles 4 during the transportation process, thereby improving the transportation efficiency.

[0031] The above are only the preferred embodiments of the present utility model. The protection scope of the present utility model is not limited to the above embodiments. Any technical solutions falling within the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present utility model should also be regarded as within the protection scope of the present utility model.

Claims

1. A high temperature resistant chip flow tray, comprising a flow tray (1), characterized in that: The left and right sides of the flow disk (1) are respectively fixedly connected with handles (4); the front and rear sides of the flow disk (1) are respectively provided with card slots (7); the flow disk (1) is provided with a plurality of groups of storage slots (3); the plurality of groups of storage slots (3) are divided into a front side and a back side; the front sides of the plurality of groups of storage slots (3) are respectively provided with a right cross column (2); the back sides of the plurality of groups of storage slots (3) are respectively provided with a back cross column (8); the back side of the flow disk (1) is provided with a plurality of A rectangular slots (5) in the horizontal direction; the back side of the flow disk (1) is provided with a plurality of B rectangular slots (6) in the vertical direction; the plurality of A rectangular slots (5) and the plurality of B rectangular slots (6) are arranged in a staggered manner; first reinforcing ribs are respectively provided between the plurality of A rectangular slots (5); and second reinforcing ribs are respectively provided between the plurality of B rectangular slots (6).

2. The high temperature resistant chip flow tray according to claim 1, characterized in that: The inner side of the storage groove (3) opened on the flow turntable (1) is arranged in a trapezoidal shape, the height of the front side of the storage groove (3) is higher than the height of the right cross column (2), and the height of the back side of the storage groove (3) is lower than the height of the back cross column (8).

3. The high temperature resistant chip flow tray according to claim 2, characterized in that: The difference between the front face of the storage groove (3) and the positive cross column (2) is 0.55 mm, and the difference between the back face of the storage groove (3) and the back cross column (8) is 0.25 mm.

4. The high temperature resistant chip flow tray according to claim 1, characterized in that: The A rectangular groove (5) is in the shape of a long rectangle, and the B rectangular groove (6) is in the shape of a short rectangle.

5. The high temperature resistant chip flow tray according to claim 1, characterized in that: The handle (4) is arranged in an L shape.

6. The high temperature resistant chip flow tray according to claim 1, characterized in that: The card slot (7) is concave.

7. The high temperature resistant chip flow tray according to claim 1, characterized in that: The flatness of the outer shape of the flow turntable (1) is less than or equal to 0.3 mm.

8. The high temperature resistant chip flow tray according to claim 2, characterized in that: The flatness of the storage groove (3) provided on the flow turntable (1) is less than or equal to 0.1 mm.

9. The high temperature resistant chip flow tray according to claim 4, characterized in that: The length of the A rectangular groove (5) is greater than 0.1 mm than the length of the B rectangular groove (6), and the width of the A rectangular groove (5) is less than 0.3 mm than the width of the B rectangular groove (6).

Images