Chip conveying device of semiconductor conveying cavity

Abstract

The utility model discloses a wafer conveying device of a semiconductor conveying cavity, which comprises a conveying platform and a conveying cavity arranged in the conveying platform, a rotating disc is arranged on one side of the conveying platform, a first motor is connected to the bottom of the rotating disc, a hydraulic cylinder is connected to the bottom of the first motor, and three supporting plates are symmetrically connected to the top of the rotating disc at equal intervals. The supporting plate can move into the conveying cavity under the cooperation effect of the first motor and the hydraulic cylinder, two supporting rods are symmetrically and movably connected into the conveying cavity, the supporting plate is located between the two supporting rods, and the two supporting rods are used for jointly supporting a wafer. A control assembly is further arranged in the conveying platform and used for controlling the two supporting rods to move away from each other to be separated from the wafer. By means of the structure, the control assembly enables the supporting rods to move to the two sides of the wafer, the wafer can be conveyed to the outer side of the conveying platform under the cooperation effect of the hydraulic cylinder and the first motor, wafer conveying work is completed, the structure is simple, and wafer conveying work is flexible and efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production devices, and particularly relates to a wafer transfer device for a semiconductor transfer cavity. Background Art

[0002] In the process of semiconductor production, a transfer cavity is a key device for realizing the transfer of wafer chips (or other semiconductor material chips) between different process steps.

[0003] To improve production efficiency, most wafer picking and placing operations in the existing semiconductor processing industry are performed by a manipulator for automatic wafer transfer. However, since the large tray carrying multiple small-sized wafers is relatively heavy, when the manipulator extends into the reaction chamber for wafer picking and placing operations, the manipulator's cantilever is long, its rigidity is poor, and its load-bearing capacity is insufficient, unable to meet the requirement of carrying a large-capacity tray for wafer transfer. Even if it can barely carry the tray, it will seriously affect the wafer transfer accuracy of the manipulator and greatly reduce the service life of the manipulator. Therefore, those skilled in the art provide a wafer transfer device for a semiconductor transfer cavity to solve the problems raised in the above background art. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer transfer device for a semiconductor transfer cavity. The turntable can move into the interior of the transfer cavity and then lift up the wafer under the combined action of the first motor and the hydraulic cylinder. The set control component enables the support rods to move to both sides of the wafer, and under the combined action of the hydraulic cylinder and the first motor, the wafer can be transferred to the outside of the transfer platform to complete the wafer transfer work. The structure is simple, and the wafer transfer work is flexible and efficient.

[0005] To achieve the above purpose, a wafer transfer device for a semiconductor transfer cavity is provided, which includes a transfer platform and a transfer cavity arranged inside the transfer platform. A turntable is arranged on one side of the transfer platform. The bottom of the turntable is connected with a first motor, and the bottom of the first motor is connected with a hydraulic cylinder. Three support plates are symmetrically connected to the top of the turntable at equal intervals. The support plates can move into the interior of the transfer cavity under the combined action of the first motor and the hydraulic cylinder. Two support rods are symmetrically and movably connected inside the transfer cavity. The support plates are located between the two support rods. The two support rods are used to jointly support the wafer, and a control component is further arranged inside the transfer platform to control the two support rods to move away from each other and separate from the wafer.

[0006] According to the wafer transfer device of a semiconductor transfer cavity, the control component includes an installation cavity arranged inside the transfer platform, a bidirectional lead screw and a guide rod symmetrically arranged inside the installation cavity, and a second motor fixedly connected inside the transfer platform. One end of the bidirectional lead screw is rotatably connected to the inner wall of the installation cavity, and the other end is fixedly connected to the output shaft of the second motor. Both ends of the guide rod are fixedly connected to the inner wall of the installation cavity. One end of the two support rods is symmetrically threaded outside the bidirectional lead screw, and the other end is slidably connected to the guide rod.

[0007] According to the wafer transfer device of a semiconductor transfer cavity, anti-slip pads are fixedly connected to the tops of the support plates.

[0008] According to the wafer transfer device of a semiconductor transfer cavity, a fixed seat is fixedly connected to the bottom of the hydraulic cylinder.

[0009] According to the wafer transfer device of a semiconductor transfer cavity, protective pads are fixedly connected to the tops of the support rods.

[0010] According to the wafer transfer device of a semiconductor transfer cavity, the first motor, the second motor and the hydraulic cylinder are all electrically connected to an external control device.

[0011] The present utility model has the following beneficial effects:

[0012] Compared with the prior art, in the wafer transfer device of a semiconductor transfer cavity, the turntable can move into the transfer cavity and then lift the wafer upward under the combined action of the first motor and the hydraulic cylinder. The arranged control component enables the support rods to move to both sides of the wafer. Under the combined action of the hydraulic cylinder and the first motor, the wafer can be transferred to the outside of the transfer platform to complete the wafer transfer work. The structure is simple, and the wafer transfer work is flexible and efficient.

[0013] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present utility model will be further described below with reference to the drawings and embodiments;

[0015] Figure 1 It is the first overall structural schematic diagram of the wafer transfer device of a semiconductor transfer cavity of the present utility model;

[0016] Figure 2 It is the second overall structural schematic diagram of the wafer transfer device of a semiconductor transfer cavity of the present utility model;

[0017] Figure 3 It is the first internal sectional structural schematic diagram of the transfer platform of the wafer transfer device of a semiconductor transfer cavity of the present utility model;

[0018] Figure 4 Schematic diagram of the second internal structure of the transfer platform of the wafer transfer device of a semiconductor transfer cavity of the present utility model;

[0019] Figure 5 For a wafer transfer device of a semiconductor transfer cavity of the present utility model Figure 3 Enlarged structure diagram at position A.

[0020] Legend description:

[0021] 1. Transfer platform; 2. Transfer cavity; 3. Turntable; 4. First motor; 5. Hydraulic cylinder; 6. Fixed seat; 7. Support plate; 8. Anti-slip pad; 9. Installation cavity; 10. Bidirectional lead screw; 11. Guide rod; 12. Protective pad; 13. Second motor; 14. Support rod. Specific embodiments

[0022] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The role of the drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be understood as a limitation on the protection scope of the present utility model.

[0023] Refer to Figure 1 , Figure 2 and Figure 3 , an embodiment of a wafer transfer device of a semiconductor transfer cavity of the present utility model includes a transfer platform 1 and a transfer cavity 2 provided inside the transfer platform 1. A turntable 3 is provided on one side of the transfer platform 1. The bottom of the turntable 3 is connected to a first motor 4, and the bottom of the first motor 4 is further connected to a hydraulic cylinder 5, ensuring the stable rotation and up-and-down movement of the turntable 3. Three support plates 7 are evenly distributed and connected to the top of the turntable 3. Under the coordinated action of the first motor 4 and the hydraulic cylinder 5, the support plates 7 can accurately move into the transfer cavity 2. Two support rods 14 are symmetrically provided inside the transfer cavity 2. When the support plates 7 move into the transfer cavity 2, they are located between the two support rods 14. The two support rods 14 jointly support the wafer. A control component is also provided inside the transfer platform 1. The control component controls the two support rods 14 to move away from each other so that they can be separated from the wafer;

[0024] Specifically, the operation of the first motor 4 drives the turntable 3 to rotate. The rotating turntable 3 drives the pallet 7 to move below the transfer chamber 2. The hydraulic cylinder 5 operates to push the turntable 3 on the first motor 4 upward. The upward moving turntable 3 can better drive the pallet 7 to move upward to contact the bottom of the wafer on the support rod 14, separating the wafer from the support rod 14. The control component moves the support rod 14 to both sides of the wafer. Under the combined action of the hydraulic cylinder 5 and the first motor 4, the wafer can be transferred to the outside of the transfer platform 1 to complete the wafer transfer work. The structure is simple, and the wafer transfer work is flexible and efficient.

[0025] Refer to Figure 4 Figure 5 , the control component includes an installation cavity 9, a bidirectional lead screw 10, guide rods 11, a second motor 13 and support rods 14. The installation cavity 9 is opened inside the transfer platform 1. The bidirectional lead screw 10 and the guide rods 11 are symmetrically arranged inside the installation cavity 9, and the second motor 13 is fixedly connected to the inside of the transfer platform 1. One end of the bidirectional lead screw 10 is rotatably connected to the inner wall of the installation cavity 9, and the other end is fixedly connected to the output shaft of the second motor 13. Both ends of the guide rod 11 are fixedly connected to the inner wall of the installation cavity 9. One end of the two support rods 14 is symmetrically threadedly connected to the outside of the bidirectional lead screw 10, and the other end is slidably connected to the guide rod 11;

[0026] Specifically, after the pallet 7 lifts the wafer upward, the second motor 13 operates to drive the bidirectional lead screw 10 to rotate. The rotating bidirectional lead screw 10 can realize the separation movement of the support rods 14. When the support rods 14 move to both sides of the transfer chamber 2, it is convenient for the pallet 7 to move downward to drive the wafer to move below the transfer chamber 2.

[0027] Refer to Figure 1 , Figure 2 and Figure 4 , anti-slip pads 8 are fixedly connected to the top of the pallet 7 to increase the friction and prevent the wafer on the pallet 7 from sliding.

[0028] Refer to Figure 1 and Figure 2 , a fixed seat 6 is fixedly connected to the bottom of the hydraulic cylinder 5. The fixed seat 6 can be fixedly installed on the installation surface to ensure the stability of the movement of the turntable 3.

[0029] Refer to Figure 5 , protective pads 12 are fixedly connected to the top of the support rods 14 to protect the wafer from being damaged by the support rods 14.

[0030] The first motor 4, the second motor 13 and the hydraulic cylinder 5 are all electrically connected to an external control device, which is convenient for controlling the operation of the first motor 4, the second motor 13 and the hydraulic cylinder 5 and realizing automatic operation.

[0031] Working principle: The operation of the first motor 4 drives the turntable 3 to rotate. The rotating turntable 3 drives the support plate 7 to move to the lower part of the transfer cavity 2. The operation of the hydraulic cylinder 5 pushes the turntable 3 on the first motor 4 to move upward. Through the upward moving turntable 3, the support plate 7 can be better driven to move upward to contact the bottom of the wafer on the support rod 14, so that the wafer is separated from the support rod 14. After the support plate 7 lifts the wafer upward, the second motor 13 operates to drive the bidirectional lead screw 10 to rotate. The rotating bidirectional lead screw 10 can realize the separation movement of the support rod 14. The support rod 14 moves to both sides of the wafer. Under the combined action of the hydraulic cylinder 5 and the first motor 4, the wafer can be transferred to the outside of the transfer platform 1 to complete the wafer transfer work. The structure is simple, and the wafer transfer work is flexible and efficient.

[0032] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art in the said technical field, various changes can also be made without departing from the purpose of the present invention.

Claims

1. A film conveying device for a semiconductor conveying chamber, characterized in that: The invention comprises a conveying platform (1) and a conveying chamber (2) arranged inside the conveying platform (1), a turntable (3) is arranged on one side of the conveying platform (1), a first motor (4) is connected to the bottom of the turntable (3), a hydraulic cylinder (5) is connected to the bottom of the first motor (4), three support plates (7) are symmetrically connected to the top of the turntable (3), the support plates (7) can be moved to the inside of the conveying chamber (2) under the cooperation of the first motor (4) and the hydraulic cylinder (5), two support rods (14) are symmetrically and movably connected inside the conveying chamber (2), the support plate (7) is located between the two support rods (14), the two support rods (14) are used to jointly support a wafer, and a control component is also arranged inside the conveying platform (1) for controlling the two support rods (14) to move away from each other and separate from the wafer.

2. The wafer transfer device of a semiconductor transfer chamber according to claim 1, characterized in that: The control assembly comprises a mounting cavity (9) arranged inside the conveying platform (1), a bidirectional screw rod (10) and a guide rod (11) symmetrically arranged inside the mounting cavity (9), and a second motor (13) fixedly connected inside the conveying platform (1), one end of the bidirectional screw rod (10) being rotatably connected to the inner wall of the mounting cavity (9), and the other end being fixedly connected to the output shaft of the second motor (13), both ends of the guide rod (11) being fixedly connected to the inner wall of the mounting cavity (9), one end of the two support rods (14) being symmetrically threadedly connected to the outside of the bidirectional screw rod (10), and the other ends being slidably connected to the guide rod (11).

3. The wafer transfer device of a semiconductor transfer chamber according to claim 2, characterized in that: The top of each of the support plates (7) is fixedly connected with an anti-slip pad (8).

4. The wafer transfer device of a semiconductor transfer chamber according to claim 3, characterized in that: A fixing seat (6) is fixedly connected to the bottom of the hydraulic cylinder (5).

5. The wafer transfer device of a semiconductor transfer chamber according to claim 4, characterized in that: The tops of the support rods (14) are fixedly connected with protection pads (12).

6. The wafer transfer device of a semiconductor transfer chamber according to claim 1, characterized in that: The first motor (4), the second motor (13) and the hydraulic cylinder (5) are all electrically connected to external control equipment.

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