Automatic wafer unloading device
By designing the automatic wafer drop device and using industrial robots to perform automated operations, the problems of traditional manual dropping are solved, and the efficient and low-damage wafer drop process is achieved.
Patent Information
- Application Number
- CN202421838175.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-31
AI Technical Summary
Traditional wafer bottoming relies on manual operation, resulting in inefficiency, easy collection of wrong chips and scratching the wafer surface, affecting wafer quality and increasing costs.
An automatic wafer dropping device is designed, including a loading mechanism, a disassembly mechanism, a discharge mechanism and a dropping mechanism, and an automated operation is used for four-axis and five-axis industrial robots to accurately disassemble and collect wafers.
It improves the efficiency of the wafer under the wafer, reduces damage to the wafer, reduces production costs, and improves the quality of the wafer.
Smart Images
Figure CN222995368U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automation, in particular to a wafer automatic unloading device. Background Art
[0002] Unloading the wafer that has completed production from the fixture is called wafer unloading. In semiconductor production, the wafer unloading process is one of the bottlenecks in the entire production process. Subsequent processes such as cleaning and inspection can only be carried out after the wafer is unloaded.
[0003] However, traditional wafer unloading is done manually, resulting in low unloading efficiency; and manual unloading easily leads to problems such as incorrect wafer collection and scratching of the wafer surface, affecting the wafer quality and increasing costs. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a wafer automatic unloading device to solve the problems of low wafer unloading efficiency, easy incorrect wafer collection by manual labor and scratching of the wafer surface in the prior art, and improve the wafer unloading efficiency and wafer quality.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A wafer automatic unloading device for removing a wafer from a fixture. The fixture includes an upper wafer and a lower wafer, and the upper wafer and the lower wafer are connected by screws. The wafer is placed between the upper wafer and the lower wafer, and the device includes:
[0007] A loading mechanism, which includes a storage component and a loading manipulator. The storage component can store a plurality of the fixtures; the loading manipulator is arranged on the periphery of the storage component, and the loading manipulator can move in the X-axis direction, Y-axis direction and Z-axis direction and rotate around the Z-axis direction to clamp any one of the fixtures;
[0008] A disassembly mechanism, which includes a disassembly table and a disassembly manipulator. The disassembly manipulator is set as a four-axis industrial robot. The loading manipulator can place the fixture on the disassembly table, and the disassembly manipulator can disassemble the screws on the fixture;
[0009] An unloading mechanism, which includes a receiving component and an unloading manipulator. The unloading manipulator can move in the X-axis direction, Y-axis direction and Z-axis direction to move the upper wafer and the lower wafer from the disassembly table to the receiving component;
[0010] A wafer unloading mechanism, which includes a wafer receiving component and a wafer unloading manipulator. The wafer unloading manipulator is set as a five-axis industrial robot to move the wafer from the disassembly table to the wafer receiving component.
[0011] As an alternative technical solution of the wafer automatic unloading device, the disassembly manipulator is arranged on the periphery of the disassembly table. The disassembly table includes a fixing plate which can rotate around the Z-axis direction. Four fixing stations are arranged on the fixing plate. The fixing stations are arranged in a hole shape for fixing the fixture. The rotation of the fixing plate can drive any one of the fixing stations to stay at the disassembly station to disassemble the screw.
[0012] As an alternative technical solution of the wafer automatic unloading device, a clamping member is arranged at the fixing station. The clamping member can move in a direction close to or away from the fixture to fix or release the fixture.
[0013] As an alternative technical solution of the wafer automatic unloading device, the disassembly table further includes a loading stage and an unloading stage. The loading stage and the unloading stage are respectively arranged on the adjacent sides of the disassembly station and are oppositely arranged with two of the fixing stations. Both the loading stage and the unloading stage can rotate around the Z-axis direction to adjust the placing direction of the fixture.
[0014] As an alternative technical solution of the wafer automatic unloading device, both the loading stage and the unloading stage are provided with adsorbing members for fixing the fixture.
[0015] As an alternative technical solution of the wafer automatic unloading device, a positioning mechanism is arranged above the disassembly station and the unloading stage. The positioning mechanism includes a shooting member which can respectively collect the precise positions of the screw and the wafer.
[0016] As an alternative technical solution of the wafer automatic unloading device, the wafer automatic unloading device includes a control mechanism which is in communication connection with the loading mechanism, the disassembly mechanism, the unloading mechanism, the wafer unloading mechanism and the positioning mechanism.
[0017] As an alternative technical solution of the wafer automatic unloading device, the disassembly mechanism further includes a screw collection assembly.
[0018] As an alternative technical solution of the wafer automatic unloading device, a plurality of the wafer collection assemblies are arranged at intervals.
[0019] As an alternative technical solution of the wafer automatic unloading device, the wafer collection assembly is arranged at an inclination of 45°.
[0020] The beneficial effects of the present utility model:
[0021] The utility model provides a wafer automatic unloading device, which includes a loading mechanism, a disassembly mechanism, a blanking mechanism and a wafer unloading mechanism. The loading mechanism includes a storage component and a loading manipulator. The storage component can store a plurality of fixtures. The loading manipulator is arranged on the periphery of the storage component. The loading manipulator can move along the X-axis direction, Y-axis direction and Z-axis direction and rotate around the Z-axis direction to clamp any fixture. The disassembly mechanism includes a disassembly table and a disassembly manipulator. The disassembly manipulator is set as a four-axis industrial robot. The loading manipulator can place the fixture on the disassembly table. The disassembly manipulator can disassemble the screws on the fixture. The blanking mechanism includes a material receiving component and a blanking manipulator. The blanking manipulator can move along the X-axis direction, Y-axis direction and Z-axis direction to move the upper wafer and the lower wafer from the disassembly table to the material receiving component. The wafer unloading mechanism includes a wafer receiving component and a wafer unloading manipulator. The wafer unloading manipulator is set as a five-axis industrial robot to move the wafer from the disassembly table to the wafer receiving component. Through the above wafer automatic unloading device, manual unloading is replaced, the efficiency of wafer unloading is improved, the damage to the wafer is reduced, and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments of the present utility model. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present utility model and these drawings.
[0023] Figure 1 It is a schematic structural diagram of the wafer automatic unloading device provided by the embodiment of the present utility model.
[0024] In the figure:
[0025] 10. Loading mechanism; 11. Storage component; 12. Loading manipulator;
[0026] 20. Disassembly mechanism; 21. Disassembly table; 211. Fixed plate; 212. Fixed station; 213. Loading stage; 214. Unloading stage; 22. Disassembly manipulator; 23. Screw collection component;
[0027] 30. Blanking mechanism; 31. Material receiving component; 32. Blanking manipulator;
[0028] 40. Wafer unloading mechanism; 41. Wafer receiving component; 42. Wafer unloading manipulator;
[0029] 50. Positioning mechanism;
[0030] 60. Control mechanism. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0031] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model are shown in the drawings, rather than all the structures.
[0032] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0033] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature can include the direct contact between the first and second features, or can also include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicating that the horizontal height of the first feature is less than that of the second feature.
[0034] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.
[0035] The jig includes an upper sheet and a lower sheet, and the upper sheet and the lower sheet are connected by screws. The wafer is placed between the upper sheet and the lower sheet. The lower sheet process is one of the bottlenecks in the entire production process. Subsequent processes such as cleaning and detection can only be carried out after the wafer is unloaded from the lower sheet. However, in the traditional method, the wafer is unloaded manually, resulting in low efficiency of unloading; and manual unloading is prone to problems such as picking up the wrong wafer and scratching the surface of the wafer, affecting the quality of the wafer and increasing costs.
[0036] To solve the above problems, this embodiment provides a wafer automatic unloading device for removing the wafer from the jig. Refer to Figure 1, including a loading mechanism 10, a disassembly mechanism 20, a blanking mechanism 30 and a wafer unloading mechanism 40. The loading mechanism 10 includes a storage component 11 and a loading manipulator 12. The storage component 11 can store multiple fixtures; the loading manipulator 12 is arranged on the periphery of the storage component 11. The loading manipulator 12 can move along the X-axis, Y-axis and Z-axis directions and rotate around the Z-axis direction to pick up any fixture; the disassembly mechanism 20 includes a disassembly table 21 and a disassembly manipulator 22. The disassembly manipulator 22 is set as a four-axis industrial robot. The loading manipulator 12 can place the fixture on the disassembly table 21. The disassembly manipulator 22 can disassemble the screws on the fixture; the blanking mechanism 30 includes a material receiving component 31 and a blanking manipulator 32. The blanking manipulator 32 can move along the X-axis, Y-axis and Z-axis directions to move the upper wafer and the lower wafer from the disassembly table 21 to the material receiving component 31; the wafer unloading mechanism 40 includes a wafer receiving component 41 and a wafer unloading manipulator 42. The wafer unloading manipulator 42 is set as a five-axis industrial robot to move the wafer from the disassembly table 21 to the wafer receiving component 41. Through the above-mentioned automatic wafer unloading device, manual wafer unloading is replaced, the efficiency of wafer unloading is improved, the damage to the wafer is reduced, and the cost is reduced.
[0037] Specifically, the storage component 11 is composed of a plurality of stacked storage racks. In this embodiment, there are 10 layers of storage racks. Each layer of storage rack is provided with a fixture and a corresponding fixture presence sensor. The fixture presence sensor is used to sense whether the fixture is stored on this layer of storage rack. The fixture presence sensor can be set as a weight sensor, a photoelectric sensor or a proximity sensor, etc. The loading manipulator 12 can accurately generate actions by identifying the signal of the fixture presence sensor, improving the taking efficiency of the fixture.
[0038] Further, each layer of storage rack is provided with an anti-collision sensor to prevent the loading manipulator 12 from colliding with the storage rack when approaching the storage rack or taking out the fixture from the storage rack, thereby avoiding damage to the loading manipulator 12 or the storage rack, and also avoiding damage to the fixture when it falls during the collision. Specifically, the anti-collision sensor can be set as a proximity sensor. When the distance between the loading manipulator 12 and the storage rack is too close, the proximity sensor immediately sends a stop signal to stop the action of the loading manipulator 12. Only when both the fixture presence sensor and the anti-collision sensor are in normal signals can the loading manipulator 12 execute actions.
[0039] Further, three servo motors are arranged on the loading manipulator 12, which are respectively used to drive the loading manipulator 12 to move along the X-axis, Y-axis and Z-axis directions. Specifically, the servo motor can drive the loading manipulator 12 to move through a lead screw, a belt or a push rod. Further, the moving distance of the loading manipulator 12 is in units of pulse numbers to achieve precise movement for fixture picking and transportation.
[0040] Further, clamping petals are provided on the loading manipulator 12. The clamping petals are driven by a cylinder or a hydraulic cylinder to approach or move away from each other to clamp or release the fixture. Specifically, rubber pads can be provided on the opposite sides of the clamping petals to increase the friction force and prevent the fixture from falling. Further, a fixture position sensor is also provided on the clamping petals. When the position of the fixture clamped by the clamping petals is incorrect, the fixture position sensor will give an alarm. At this time, an operator will check to avoid the fixture falling due to insufficient clamping.
[0041] Further, the disassembly manipulator 22 is arranged on the periphery of the disassembly table 21. The disassembly table 21 includes a fixing plate 211. The fixing plate 211 can rotate around the Z-axis direction through a direct drive motor. Four fixing stations 212 are provided on the fixing plate 211. The fixing stations 212 are arranged in a hole shape for fixing the fixture. The rotation of the fixing plate 211 can drive any fixing station 212 to stay at the disassembly station to disassemble the screw. Specifically, a clamping member is provided at the fixing station 212. The clamping member can move in a direction close to or away from the fixture to fix or release the fixture. Through the clamping member, the fixture can be prevented from shifting when disassembling the screw. In this embodiment, the clamping member is arranged as a three-jaw cylinder. In other embodiments, the clamping member can also be arranged as an electric cylinder or a hydraulic cylinder, etc. Specifically, a fixture presence sensor is also provided on the fixing station 212 to achieve precise monitoring of the fixture.
[0042] Further, the fixing plate 211 can also be driven by a servo motor to move in the X-axis direction to cooperate with the loading manipulator 12.
[0043] Further, the disassembly table 21 further includes a loading carrier 213 and an unloading carrier 214. The loading carrier 213 and the unloading carrier 214 are respectively arranged on the adjacent sides of the disassembly station and are oppositely arranged with two fixing stations 212. The loading carrier 213 and the unloading carrier 214 can both rotate around the Z-axis direction to adjust the placement direction of the fixture. Specifically, the loading carrier 213 and the unloading carrier 214 are both provided with suction attachments for fixing the fixture. In this embodiment, the suction attachments are arranged as vacuum suction holes, and the fixture is fixed by means of vacuum suction.
[0044] Further, the loading carrier 213 and the unloading carrier 214 can move in the X-axis direction through a servo motor.
[0045] In this embodiment, the jig is clamped and taken out from the storage component 11 by the loading manipulator 12. Then, both the fixing plate 211 and the loading stage 213 move downward to facilitate the placement of the jig by the loading manipulator 12. After the loading manipulator 12 places the jig on the loading stage 213, both the fixing plate 211 and the loading stage 213 move upward. At this time, the loading stage 213 adsorbs the jig, and the loading stage 213 rotates to drive the jig to rotate. Then, the loading stage 213 moves upward again and is flush with the fixing station 212. The adsorbing component releases the jig, and the three-jaw cylinder clamps the jig. Then, the fixing plate 211 rotates to drive the jig to the disassembly station, and the disassembly manipulator 22 removes all the screws.
[0046] Further, the disassembly mechanism 20 further includes a screw collection component 23. After the disassembly manipulator 22 disassembles the screws, the screws are transported by the disassembly manipulator 22 to the screw collection component 23 by means of vacuum adsorption. Further, a storage type sensor is provided in the screw collection component 23, and a signal is sent when the screws are collected full.
[0047] Further, when the fixing plate 211 drives the jig after the screws are disassembled to the unloading stage 214, the three-jaw cylinder releases the jig. After the jig is placed on the unloading stage 214, it is adsorbed, and the unloading manipulator 32 first takes away the upper piece. Specifically, a suction nozzle is provided on the unloading manipulator 32.
[0048] Further, the material collection component 31 is set as a circular frame and can move along the X-axis direction by a servo motor to facilitate the unloading manipulator 32 to place the used jig. Specifically, a weight sensing device is provided on the material collection component 31, and an alarm is issued when the jig storage is full to remind the operator.
[0049] Further, a positioning mechanism 50 is provided above the disassembly station and the unloading stage 214. The positioning mechanism 50 includes a shooting component, and the shooting component can respectively collect the precise positions of the screws and the wafers. Specifically, the shooting component is set as a CCD camera. The CCD camera takes pictures of the surface of the jig at the disassembly station, and then sends the image information to a computer for analysis, so as to judge the specific position of the screws to achieve precise disassembly.
[0050] After the upper piece of the jig is taken away by the unloading manipulator 32, the CCD camera takes pictures of the wafer, and sends the image information to a computer for analysis, so that the lower piece manipulator 42 can precisely clamp the wafer and avoid scratching the wafer by mistake.
[0051] Further, after the wafer is taken away by the lower piece manipulator 42, the unloading stage 214 releases the lower piece. After the unloading manipulator 32 takes away the lower piece, it is placed in the material collection component 31.
[0052] Further, a plurality of film collecting components 41 are arranged at intervals. Specifically, the film collecting components 41 are arranged in an arc with the wafer unloading manipulator 42 as the center. The plurality of film collecting components 41 facilitate the collection of wafers of different types and different sizes. Further, the film collecting components 41 are arranged at an angle of 45°. This is conducive to the wafer unloading manipulator 42 imitating manual film collection and reducing the risk of scratching the wafers. Further, proximity sensors are provided on the film collecting components 41 to prevent the wafer unloading manipulator 42 from accidentally colliding with the film collecting components 41.
[0053] Further, the automatic wafer unloading device includes a control mechanism 60, which is communicatively connected to the loading mechanism 10, the disassembly mechanism 20, the unloading mechanism 30, the wafer unloading mechanism 40, and the positioning mechanism 50. The control mechanism 60 can optimize the film collection path and sequence and improve the wafer unloading efficiency by monitoring each link of the automatic wafer unloading device. In this embodiment, the control mechanism 60 is set as an industrial control computer. Since the structure and operation principle of the industrial control computer are prior art, they will not be elaborated here.
[0054] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limiting the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments, and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.
Claims
1. An automatic wafer unloading device, used to remove a wafer from a fixture, wherein the fixture comprises an upper plate and a lower plate, wherein the upper plate and the lower plate are connected by screws, and the wafer is placed between the upper plate and the lower plate, characterized in that: include: A feeding mechanism (10), the feeding mechanism (10) comprising a storage component (11) and a feeding robot (12), the storage component (11) being capable of storing a plurality of the jigs; the feeding robot (12) being arranged on the peripheral side of the storage component (11), the feeding robot (12) being capable of moving along the X-axis direction, the Y-axis direction and the Z-axis direction and rotating around the Z-axis direction to clamp any of the jigs; A disassembly mechanism (20), the disassembly mechanism (20) comprising a disassembly platform (21) and a disassembly manipulator (22), the disassembly manipulator (22) being configured as a four-axis industrial robot, the loading manipulator (12) being capable of placing the fixture on the disassembly platform (21), and the disassembly manipulator (22) being capable of removing the screws on the fixture; A material unloading mechanism (30), the material unloading mechanism (30) comprising a material receiving assembly (31) and a material unloading manipulator (32), the material unloading manipulator (32) being movable along the X-axis direction, the Y-axis direction and the Z-axis direction to move the upper sheet and the lower sheet from the disassembly platform (21) into the material receiving assembly (31); A wafer unloading mechanism (40) comprises a wafer collecting assembly (41) and a wafer unloading manipulator (42), wherein the wafer unloading manipulator (42) is configured as a five-axis industrial robot to move the wafer from the disassembly platform (21) to the wafer collecting assembly (41).
2. The automatic wafer unloading device according to claim 1, characterized in that: The disassembly robot (22) is arranged on the peripheral side of the disassembly platform (21), and the disassembly platform (21) includes a fixed plate (211), and the fixed plate (211) can rotate around the Z-axis direction. Four fixed stations (212) are arranged on the fixed plate (211), and the fixed stations (212) are arranged in a hole shape for fixing the fixture. The rotation of the fixed plate (211) can drive any of the fixed stations (212) to stay at the disassembly station to remove the screws.
3. The automatic wafer unloading device according to claim 2, characterized in that: The fixing station (212) is provided with a clamping member, and the clamping member can move in a direction approaching or away from the jig to fix or release the jig.
4. The automatic wafer unloading device according to claim 2, characterized in that: The disassembly platform (21) further comprises a loading platform (213) and a unloading platform (214), wherein the loading platform (213) and the unloading platform (214) are respectively arranged on two adjacent sides of the disassembly station and are arranged opposite to the two fixed stations (212), and the loading platform (213) and the unloading platform (214) are both capable of rotating around the Z-axis direction to adjust the placement direction of the fixture.
5. The automatic wafer unloading device according to claim 4, characterized in that: The loading platform (213) and the unloading platform (214) are both provided with adsorption parts for fixing the fixture.
6. The automatic wafer unloading device according to claim 4, characterized in that: A positioning mechanism (50) is arranged above the disassembly station and the unloading platform (214), and the positioning mechanism (50) includes a video camera, which can respectively capture the precise positions of the screw and the wafer.
7. The automatic wafer unloading device according to claim 6, characterized in that: The automatic wafer unloading device comprises a control mechanism (60), and the control mechanism (60) is communicatively connected with the loading mechanism (10), the disassembly mechanism (20), the unloading mechanism (30), the unloading mechanism (40) and the positioning mechanism (50).
8. The automatic wafer unloading device according to any one of claims 1 to 7, characterized in that: The disassembly mechanism (20) further comprises a screw collecting assembly (23).
9. The automatic wafer unloading device according to any one of claims 1 to 7, characterized in that: A plurality of the film collecting components (41) are arranged at intervals.
10. The automatic wafer unloading device according to any one of claims 1 to 7, characterized in that: The film collecting assembly (41) is arranged at an angle of 45°.