Wafer heating device

Abstract

The utility model relates to a wafer heating device which sequentially comprises a base plate and a carrying table upper plate from bottom to top, and an adsorption disc is installed on the carrying table upper plate. A heating pad is mounted in a pressure plate cavity at the top of the pressure plate below the adsorption disc, and the bottom of the adsorption disc is tightly attached to the heating pad below the adsorption disc; the driving end of the top of the jacking motor drives the lifting disc above the jacking motor to move in the vertical direction, a plurality of guide rods are installed on the lifting disc, and suction nozzles are installed on the tops of the guide rods. The platform can be used as an independent platform deck and can also be integrated in an automatic machine table for use; and the heating process of wafers with different sizes can be compatible by controlling different adsorption areas.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer heating device. Background Art

[0002] During the manufacturing process of chips in the semiconductor industry, wafers often need to be heated or kept warm. Heating can eliminate contamination, change material properties, etc., ensure the yield of products, and facilitate subsequent operations. Currently, the commonly used heating devices on the market have problems such as narrow application scenarios, uneven heating, and high prices.

[0003] Currently, the commonly used heating methods mainly include high-temperature furnace heating, infrared heating, laser heating, heating pad heating, etc. For wafer heating, although high-temperature furnace heating is popular, it requires a complex and large heating system to support; although infrared heating and laser heating have good heating effects, they have high technical requirements and high manufacturing costs.

[0004] In view of the above defects, the designer actively conducts research and innovation in order to create a wafer heating device that has more industrial utilization value. Summary of the Utility Model

[0005] In order to solve any one of the above technical problems, the purpose of the utility model is to provide a wafer heating device.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The wafer heating device successively includes a base plate and a carrier upper plate from bottom to top. The base plate is connected to the upper carrier plate above through a plurality of columns. An adsorption disc is installed on the carrier upper plate.

[0008] A pressure plate is arranged between the adsorption disc and the lower carrier upper plate. A heating pad is installed in the pressure plate cavity at the top of the pressure plate below the adsorption disc. The bottom of the adsorption disc is closely attached to the lower heating pad.

[0009] A jacking fixed disc is installed below the carrier upper plate through a plurality of connecting columns. A jacking motor is installed on the motor mounting plate at the middle position of the bottom of the jacking fixed disc. A lifting disc is arranged between the jacking fixed disc and the carrier upper plate. The driving end at the top of the jacking motor drives the upper lifting disc to move in the vertical direction. A plurality of guide rods are installed on the lifting disc. A suction nozzle is installed at the top of the guide rod. The guide rod can sequentially pass through the guide holes of the carrier upper plate, the pressure plate, the heating pad, and the adsorption disc from bottom to top and extend above the adsorption disc.

[0010] As a further improvement of the utility model, a sealing plate is installed between two adjacent columns.

[0011] As a further improvement of the present utility model, a first heat insulation plate is installed in the platen cavity below the heating pad, and a second heat insulation plate is installed between the platen and the upper plate of the carrier table.

[0012] As a further improvement of the present utility model, a rear vertical plate is installed at the rear end of the base plate. A cylinder support plate is installed at the top of the rear vertical plate through a reinforcing rib. A lifting cylinder is installed on the cylinder support plate. The driving end at the bottom of the lifting cylinder drives the lower heat preservation protective cover to move in the vertical direction.

[0013] As a further improvement of the present utility model, a guide bearing adapted to the guide rod is installed in the guide hole of the upper plate of the carrier table.

[0014] As a further improvement of the present utility model, a cooling fan is installed on the base plate directly below the jacking motor.

[0015] As a further improvement of the present utility model, an induction sheet is installed on the lifting disc. A lower photoelectric sensor adapted to the above-mentioned induction sheet is installed on the jacking fixed disc directly below the induction sheet. An upper photoelectric sensor adapted to the above-mentioned induction sheet is installed on the upper plate of the carrier table directly above the induction sheet.

[0016] By means of the above solution, the present utility model has at least the following advantages:

[0017] The present utility model can be used as a separate carrier table or integrated into an automated machine tool. Different heating processes for wafers of different sizes can be compatible by controlling different adsorption areas.

[0018] The lifting motor assembly with a lifting function of the present utility model facilitates manual or robotic arm to pick and place products and prevents scalding.

[0019] The present utility model has a compact structure, is convenient for operation and maintenance, is convenient for automation, improves production efficiency and saves costs.

[0020] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly and implement it according to the content of the description, the following takes the preferred embodiment of the present utility model and combines with the drawings to describe in detail as follows. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1It is a schematic structural diagram of a wafer heating device of the present utility model;

[0023] Figure 2 is Figure 1 a partial enlarged structural diagram of the upper plate of the middle carrier stage.

[0024] Among them, the meanings of the reference numerals in the figures are as follows.

[0025] Base plate 1, column 2, sealing plate 3, upper plate 4 of the carrier stage, second heat insulation plate 5, chuck 6, adsorption disc 7, heat preservation protective cover 8, cylinder support plate 9, lifting cylinder 10, rear vertical plate 11, reinforcing rib 12, suction nozzle 13, heating pad 14, first heat insulation plate 15, guide bearing 16, guide rod 17, lifting disc 18, jacking fixed disc 19, jacking motor 20, cooling fan 21, motor mounting plate 22, connecting column 23, induction sheet 24, lower photoelectric sensor 25, upper photoelectric sensor 26. Specific embodiments

[0026] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present utility model. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0027] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model to be protected, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0028] As Figures 1 to 2 shown, a wafer heating device includes a base plate 1 and an upper plate 4 of the carrier stage in sequence from bottom to top. The base plate 1 is connected to the upper plate 4 of the carrier stage above through a plurality of columns 2. A sealing plate 3 is installed between two adjacent columns 2, and an adsorption disc 7 is installed on the upper plate 4 of the carrier stage.

[0029] 1. A pressure plate 6 is provided between the adsorption disc 7 and the upper plate 4 of the lower stage. A heating pad 14 is installed in the cavity of the pressure plate at the top of the pressure plate 6 below the adsorption disc 7, and the bottom of the adsorption disc 7 is in close contact with the heating pad 14 below. A first heat insulation plate 15 is installed in the cavity of the pressure plate below the heating pad 14, and a second heat insulation plate 5 is installed between the pressure plate 6 and the upper plate 4 of the stage.

[0030] 2. A jacking fixing disc 19 is installed below the upper plate 4 of the stage through a plurality of connecting columns 23. A jacking motor 20 is installed on the middle position at the bottom of the jacking fixing disc 19 through a motor mounting plate 22. A lifting disc 18 is provided between the jacking fixing disc 19 and the upper plate 4 of the stage. The driving end at the top of the jacking motor 20 drives the upper lifting disc 18 to move in the vertical direction. A cooling fan 21 is installed on the base plate 1 directly below the jacking motor 20. A plurality of guide rods 17 are installed on the lifting disc 18, and a suction nozzle 13 is installed at the top of the guide rods 17. The guide rods 17 can sequentially pass through the guide holes of the upper plate 4 of the stage, the pressure plate 6, the heating pad 14 and the adsorption disc 7 from bottom to top and extend above the adsorption disc 7. A guide bearing 16 adapted to the guide rods 17 is installed in the guide holes of the upper plate 4 of the stage.

[0031] 3. A rear vertical plate 11 is installed at the rear end of the base plate 1. A cylinder support plate 9 is installed at the top of the rear vertical plate 11 through a reinforcing rib 12. A lifting cylinder 10 is installed on the cylinder support plate 9. The driving end at the bottom of the lifting cylinder 10 drives the lower heat preservation protective cover 8 to move in the vertical direction.

[0032] 4. An induction sheet 24 is installed on the lifting disc 18. A lower photoelectric sensor 25 adapted to the above induction sheet 24 is installed on the jacking fixing disc 19 directly below the induction sheet 24. An upper photoelectric sensor 26 adapted to the above induction sheet 24 is installed on the upper plate 4 of the stage directly above the induction sheet 24.

[0033] The first embodiment of the present utility model:

[0034] The present utility model is a device for facilitating wafer heating developed for occasions with a heating temperature of 50 - 200 °C. By reasonably arranging the number and position of the heating wires in the heating pad, the temperature difference at each part of the wafer is reduced; a partition adsorption disc is set to be compatible with wafers of different sizes, and a jacking adsorption function is set in the middle of the device to facilitate manual or automated operation.

[0035] The base plate 1 and the upper carrier plate 4 form the basic framework of the carrier through four columns 2, and are surrounded by sealing plates 3. There is a cooling fan 21 on the base plate; the back of the adsorption disc 7 is closely attached to the heating pad 14, and the heating pad is pressed tightly by the pressure plate 6. Three guide bearings 16 are embedded in the adsorption disc. A first heat insulation plate is sandwiched between the pressure plate and the heating pad to form a heating disc assembly. The heating disc assembly is connected to the upper carrier plate through a second heat insulation plate 5.

[0036] Screw motor lifting assembly: The screw lifting motor 20 is installed on the lifting fixed disc 19 through the motor mounting plate 22. The lifting disc 18 is connected to the screw motor nut. There are three guide rods 17 on the lifting disc, and high-temperature resistant suction nozzles 13 are installed at the ends of the rods. An air pipe joint is installed at the bottom of the lifting disc, and the vacuum of the three guide rods is connected in series through an air pipe. The lifting fixed disc is connected to the back of the upper carrier plate through three connecting columns 23. The guide rods can move up and down in the guide bearings.

[0037] Heat preservation protective cover assembly: The heat preservation protective cover 8 is installed at the piston rod end of the lifting cylinder 10. The lifting cylinder is installed on the cylinder support plate 9, and the cylinder support plate is installed on the rear vertical plate 11. There is also a reinforcing rib 12 connected between the two, and the rear vertical plate stands on the base plate.

[0038] The working principle and process of the present utility model:

[0039] An operator or a wafer manipulator places the product on the high-temperature resistant suction nozzle 13 at the end of the guide rod. The lifting motor 20 drives the guide rod 17 to descend, and the wafer lands on the adsorption disc 7 and is firmly adsorbed. The heat preservation protective cover 8 of the lifting cylinder 10 descends. The heating pad 14 is powered on to heat the wafer to a certain temperature and keep it warm for a period of time to meet the process requirements. The heat preservation protective cover 8 is opened, and the lifting motor 20 lifts the wafer, and then the operator or the manipulator takes away the product. The above steps are repeated.

[0040] In addition, the temperature of the above-mentioned heating pad 14 can be fed back to the temperature control controller through a temperature sensor for manual adjustment or automatic adjustment.

[0041] The present utility model can be used as an independent carrier or integrated into an automated machine tool; different heating processes for wafers of different sizes can be compatible by controlling different adsorption areas; the lifting motor assembly with a lifting function facilitates the operator or the manipulator to pick and place products and prevent scalding; the structure is compact, facilitating operation and maintenance, facilitating automation, improving production efficiency and saving costs.

[0042] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the technical features indicated. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0043] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

[0044] The above description is only the preferred embodiment of the present utility model and is not used to limit the present utility model. It should be pointed out that for those of ordinary skill in the technical field, without departing from the technical principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A wafer heating device, comprising, from bottom to top, a base plate (1) and a carrier upper plate (4), wherein the base plate (1) is connected to the carrier upper plate (4) above via a plurality of columns (2), and an adsorption disc (7) is installed on the carrier upper plate (4); characterized in that: A pressure plate (6) is arranged between the adsorption disc (7) and the upper plate (4) of the carrier below, a heating pad (14) is installed in the pressure plate cavity at the top of the pressure plate (6) below the adsorption disc (7), and the bottom of the adsorption disc (7) is in close contact with the heating pad (14) below; A lifting and fixing plate (19) is installed below the upper plate (4) of the platform through a plurality of connecting columns (23); a lifting motor (20) is installed at the middle position of the bottom of the lifting and fixing plate (19) through a motor mounting plate (22); a lifting disc (18) is arranged between the lifting and fixing plate (19) and the upper plate (4) of the platform; the driving end at the top of the lifting motor (20) drives the lifting disc (18) above to move in the vertical direction; a plurality of guide rods (17) are installed on the lifting disc (18); a suction nozzle (13) is installed at the top of the guide rod (17); the guide rod (17) can pass through the guide holes of the upper plate (4), the pressure plate (6), the heating pad (14) and the adsorption disc (7) from bottom to top in sequence and then extend to the top of the adsorption disc (7).

2. The wafer heating device according to claim 1, characterized in that: A sealing plate (3) is installed between two adjacent upright posts (2).

3. The wafer heating device according to claim 1, characterized in that: A first heat insulation board (15) is installed in the pressure plate cavity below the heating pad (14), and a second heat insulation board (5) is installed between the pressure plate (6) and the upper plate (4) of the carrier.

4. The wafer heating device according to claim 1, characterized in that: A rear vertical plate (11) is installed at the rear end of the base plate (1), a cylinder support plate (9) is installed on the top of the rear vertical plate (11) via a reinforcing rib (12), a lifting cylinder (10) is installed on the cylinder support plate (9), and a driving end at the bottom of the lifting cylinder (10) drives the thermal insulation protective cover (8) below to move in the vertical direction.

5. The wafer heating device according to claim 1, characterized in that: A guide bearing (16) matched with a guide rod (17) is installed in the guide hole of the upper plate (4) of the carrier.

6. The wafer heating device according to claim 1, characterized in that: A cooling fan (21) is installed on the base plate (1) directly below the lifting motor (20).

7. The wafer heating device according to claim 1, characterized in that: A sensing sheet (24) is mounted on the lifting disc (18), a lower photoelectric sensor (25) adapted to the sensing sheet (24) is mounted on the lifting fixed disc (19) directly below the sensing sheet (24), and an upper photoelectric sensor (26) adapted to the sensing sheet (24) is mounted on the upper plate (4) of the carrier directly above the sensing sheet (24).

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