Circuit board assembly and image acquisition equipment

Abstract

The utility model provides a circuit board assembly and image acquisition equipment, and relates to the technical field of image acquisition. The circuit board assembly comprises a connecting support and at least two circuit board modules, the at least two circuit board modules are arranged in a spaced and stacked mode in the first direction, and a containing space is formed between every two adjacent circuit board modules; the connecting support is arranged in the containing space and welded to the circuit board modules on the two sides, the connecting support comprises a first connecting section and two second connecting sections, the two second connecting sections are connected to the two ends of the first connecting section respectively, containing areas are formed on the two opposite sides of the first connecting section respectively, and the containing areas are communicated with the outside of the containing space. The structural strength of the stacked circuit board assembly and the reliability of signal transmission between the circuit board modules are improved, and components between the circuit board modules are convenient to maintain and overhaul.

Description

Technical Field

[0001] The present application relates to the technical field of image acquisition, and particularly relates to a circuit board assembly and an image acquisition device. Background Art

[0002] With the development of technology, image data has become important data information, and image acquisition devices such as cameras and industrial cameras for collecting image data are also widely used in different fields such as industrial logistics, autonomous driving, and intelligent robots.

[0003] In related technologies, the functions of image acquisition devices are increasing, and the number of electronic control boards arranged inside them is also increasing. Among them, an image acquisition device usually includes a housing and multiple circuit boards arranged inside the housing. The multiple circuit boards are stacked to make full use of the internal space of the housing, and adjacent circuit boards are connected by means of board-to-board connectors or pins.

[0004] However, the connection method of the stacked circuit boards in the current image acquisition device is prone to looseness and poor contact, resulting in signal transmission interruption between the circuit boards. Summary of the Utility Model

[0005] The present application provides a circuit board assembly and an image acquisition device to solve the technical problem that the connection method of the stacked circuit boards in the current image acquisition device is prone to looseness and poor contact, resulting in signal transmission interruption between the circuit boards.

[0006] In a first aspect, the present application provides a circuit board assembly, which includes a connection bracket and at least two circuit board modules. The at least two circuit board modules are stacked at intervals along a first direction, and there is an accommodation space between adjacent circuit board modules; the connection bracket is arranged in the accommodation space and is welded to the circuit board modules on both sides to transmit signals between adjacent circuit board modules.

[0007] Among them, the connection bracket includes a first connection section and two second connection sections. The two second connection sections are respectively connected to both ends of the first connection section, and accommodation areas are respectively formed on opposite sides of the first connection section. The accommodation areas communicate with the outside of the accommodation space.

[0008] The circuit board assembly provided by the present application is welded and connected by arranging a circuit board connection bracket between adjacent circuit board modules. While playing a role in signal transfer, it can support the upper and lower circuit board modules, improving the structural strength of the stacked circuit board assembly and the reliability of signal transmission between circuit board modules. In addition, the accommodation areas formed on both sides of the middle of the connection bracket are open relative to the outside of the circuit board assembly, facilitating the maintenance and repair of the components between the circuit board modules.

[0009] As an alternative implementation, the circuit board module may include a circuit board main body and components connected to the circuit board main body. The circuit board main body is welded to the connection bracket, and the components on the side of the circuit board main body facing the accommodation space are arranged within the accommodation area.

[0010] With such an arrangement, the space between adjacent circuit board modules can be fully utilized, reducing the waste of space between circuit board main bodies, which is beneficial for the miniaturization and high integration design of the image acquisition device.

[0011] As an alternative implementation, the connection bracket may include a bracket main body and welding points provided on the opposite two side surfaces of the bracket main body. The welding points on the opposite two side surfaces of the bracket main body are electrically connected; the welding points on the opposite two side surfaces of the bracket main body are respectively welded to the circuit board modules on both sides.

[0012] With such an arrangement, the connection bracket itself serves as a circuit board structure, which can transmit signals between boards while playing a supporting role, facilitating the reduction of the inter-board height between circuit board modules.

[0013] As an alternative implementation, there may be multiple welding points, and the multiple welding points are distributed on the surface of at least one of the first connection section and the second connection section.

[0014] With such an arrangement, the welding points in each area of the connection bracket can be fully utilized to form signal transfer terminals, and the distribution of the welding points can be adjusted according to the specific selection of the circuit board module, improving the design flexibility.

[0015] As an alternative implementation, the welding points on the opposite two side surfaces of the bracket main body may be connected by a conductor; the conductor is printed within the bracket main body.

[0016] With such an arrangement, the conductor and the bracket main body can be welded to the upper and lower circuit board modules as a whole, reducing the process difficulty and cost.

[0017] As an alternative implementation, any one of the two second connection sections is provided with an anti-fooling part, and the anti-fooling part is located at the end of the second connection section.

[0018] With such an arrangement, the accuracy of the welding position between the connection bracket and the circuit board module can be ensured.

[0019] As an alternative implementation, the opposite two sides of the first connection section have positioning parts, and the positioning parts protrude towards the accommodation area.

[0020] With such an arrangement, when the connection bracket and the circuit board module are welded and assembled, it is convenient for external tooling to grasp the connection bracket, improving the convenience of process implementation.

[0021] As an alternative embodiment, at least one circuit board module is provided with positioning holes, which are located at the circumferential edge of the circuit board module.

[0022] With such a setting, it is convenient to install the circuit board assembly as a whole into the image acquisition device, improving the assembly convenience.

[0023] As an alternative embodiment, there can be multiple circuit board modules and multiple connection brackets. The multiple circuit board modules and the multiple connection brackets are alternately stacked in sequence along the first direction.

[0024] With such a setting, a multi-layer circuit board stacking structure can be formed, and the overall circuit board assembly has good structural strength and signal transmission stability.

[0025] In a second aspect, the present application provides an image acquisition device, which includes the circuit board assembly in the above technical solution.

[0026] The present application provides a circuit board assembly and an image acquisition device. The circuit board assembly includes a connection bracket and at least two circuit board modules. The at least two circuit board modules are stacked at intervals along the first direction, and there is an accommodation space between adjacent circuit board modules. The connection bracket is arranged in the accommodation space and is welded to the circuit board modules on both sides. The connection bracket includes a first connection section and two second connection sections. The two second connection sections are respectively connected to both ends of the first connection section. Accommodation areas are respectively formed on the opposite sides of the first connection section, and the accommodation areas communicate with the outside of the accommodation space, improving the structural strength of the stacked circuit board assembly and the reliability of signal transmission between the circuit board modules, and facilitating the maintenance and repair of the components between the circuit board modules.

[0027] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by these technical features of the technical solutions, the other technical problems that the circuit board assembly and the image acquisition device provided by the present application can solve, the other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic structural diagram of the circuit board assembly provided by the embodiment of the present application;

[0030] Figure 2 Exploded view of the circuit board assembly provided by the embodiment of the present application;

[0031] Figure 3 Top view of the circuit board assembly provided by the embodiment of the present application;

[0032] Figure 4 Side view of the circuit board assembly provided by the embodiment of the present application;

[0033] Figure 5 Schematic diagram of the connection between the connection bracket and the circuit board module in the circuit board assembly provided by the embodiment of the present application;

[0034] Figure 6 Top view of the connection bracket on the circuit board module in the circuit board assembly provided by the embodiment of the present application;

[0035] Figure 7 Schematic diagram of the distribution of welding points on the connection bracket in the circuit board assembly provided by the embodiment of the present application;

[0036] Figure 8 Schematic diagram of the structure of the circuit board assembly with a multi-layer circuit board module and a connection bracket provided by the embodiment of the present application.

[0037] Explanation of reference numerals:

[0038] 10 - Circuit board assembly; 11 - Accommodating space;

[0039] 100 - Connection bracket; 101 - Accommodating area; 110 - Bracket main body; 111 - First connection section; 112 - Second connection section; 113 - Anti-fooling part; 114 - Positioning part; 120 - Welding point; 130 - Positioning hole;

[0040] 200 - Circuit board module; 200a - First circuit board module; 200b - Second circuit board module; 210 - Circuit board main body; 220 - Components. Detailed implementation manners

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0042] First of all, those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application. Those skilled in the art can make adjustments according to needs to adapt to specific application scenarios.

[0043] Secondly, it should be noted that in the description of the present application, the terms indicating directions or positional relationships such as "upper", "lower", "left", "right", "front", "back", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0044] In addition, it should also be noted that in the description of the present application, unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be the communication inside two components. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0045] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0046] Image acquisition devices have more and more functions, and there are more and more electronic control boards arranged inside them. Among them, an image acquisition device generally includes a housing and multiple circuit boards arranged inside the housing. The multiple circuit boards are stacked to make full use of the internal space of the housing, and adjacent circuit boards are connected by means of board-to-board connectors or pins. However, the circuit boards connected by means of board-to-board connectors or pins are independent modules respectively. In the vibration scenario of the image acquisition device, for example, when the image acquisition device is applied to a vehicle or a mobile robot, the connectors or pins are prone to looseness and poor contact. When transmitting high-frequency signals between the circuit boards, the signal transmission is prone to interruption, and the integrity of the signal cannot be guaranteed.

[0047] In view of the above problems, the embodiments of the present application provide a circuit board assembly and an image acquisition device. By designing the connection between circuit board modules, a connection bracket is used to connect upper and lower different circuit board modules into a whole, combining the line transfer and support structure between circuit board modules into a whole, improving the reliability of the overall structure of the circuit board assembly and the stability of signal transmission, and ensuring the integrity of signal transmission. In addition, the connection bracket plays the role of both transferring signals and providing support, which can reduce the occupation of the inter-board space between circuit board modules, facilitating the miniaturization and integrated design of the image acquisition device and reducing production costs.

[0048] For ease of understanding, the application scenarios applicable to the circuit board assembly and the image acquisition device provided by the embodiments of the present application will be described first below.

[0049] The circuit board assembly provided by the embodiments of the present application is applied in an image acquisition device. The image acquisition device can be applied in the automation equipment of a manufacturing factory, or in a handling robot or an automated sorting device in logistics warehousing. In addition, it can be applied to vehicles and other means of transportation for identifying the surrounding environment or objects. Exemplarily, the image acquisition device can be an industrial camera, a barcode reader, etc. The embodiments of the present application do not make specific limitations in this regard.

[0050] Figure 1 is a schematic structural diagram of the circuit board assembly provided by the embodiments of the present application. Figure 2 is an exploded view of the circuit board assembly provided by the embodiments of the present application. Figure 3 is a top view of the circuit board assembly provided by the embodiments of the present application. Figure 4 is a side view of the circuit board assembly provided by the embodiments of the present application.

[0051] Please refer to Figures 1 to 4 , the present application provides a circuit board assembly 10. The circuit board assembly 10 includes a connection bracket 100 and at least two circuit board modules 200. The at least two circuit board modules 200 are stacked at intervals along a first direction. There is an accommodation space 11 between adjacent circuit board modules 200. The connection bracket 100 is disposed in the accommodation space 11 and is welded to the circuit board modules 200 on both sides.

[0052] It can be understood that one of the adjacent two circuit board modules 200 is located above the connection bracket 100 along the first direction, and the other of the adjacent two circuit board modules 200 is located below the connection bracket 100 along the first direction.

[0053] Define the first direction as the X direction, and the circuit board modules 200 are stacked along the X direction.

[0054] In some embodiments, the connection bracket 100 includes a first connection segment 111 and two second connection segments 112. The two second connection segments 112 are respectively connected to both ends of the first connection segment 111. Accommodating regions 101 are respectively formed on opposite sides of the first connection segment 111, and the accommodating regions 101 communicate with the outside of the accommodating space 11.

[0055] Among them, the first connection segment 111 and the second connection segments 112 can form an integral body to jointly support the circuit board modules 200 on both sides, improving the structural strength of the circuit board assembly 10. The first connection segment 111 divides the accommodating space 11 to form two accommodating regions 101, and the two accommodating regions 101 are open with respect to the side space of the circuit board assembly 10. In this way, after the circuit board modules 200 on both sides of the connection bracket 100 are welded to the connection bracket 100 to form an integral body, the components 220 on the circuit board modules 200 in the accommodating space 11 can still be seen and accessed from the side of the circuit board assembly 10, thereby facilitating the maintenance and repair of the components 220 between the circuit board modules 200.

[0056] It can be understood that in the circuit board assembly 10 provided by the embodiments of the present application, the connection brackets 100 welded between adjacent circuit board modules 200 not only play a role in connection and support, but also play a role in signal transmission. When the circuit board assembly 10 is applied to a scenario where vibrations may exist, the circuit board assembly 10 has high structural strength and reliability as a whole, and there will be no relative displacement between adjacent circuit board modules 200. Through the connection bracket 100, stable signal transmission can be ensured between the two circuit board modules 200, avoiding the loss of high-frequency signals. Therefore, the signal quality in the image acquisition device is improved.

[0057] Exemplarily, the circuit board module 200 can be a printed circuit board (PCB) connected with components 220, and the connection bracket 100 can be a printed circuit board (PCB). The connection bracket 100 is electrically connected to the circuit board modules 200 by welding to the circuit board modules 200 on both sides thereof, and the connection bracket 100 can simultaneously play a role in support and signal transmission between two adjacent circuit board modules 200.

[0058] It should be noted that since the connection bracket 100 itself is a PCB board structure and is fixed and electrically connected to the circuit board module 200 by welding, the thickness of the connection bracket 100 is relatively thin. Compared with the board-to-board connectors and pins in the prior art, there is no need to reserve space for the installation and insertion of connectors between the circuit board modules 200 in the embodiments of the present application, reducing the distance between adjacent circuit board modules 200 and shrinking the overall height of the circuit board assembly 10. Furthermore, when applied to an image acquisition device, the product volume of the image acquisition device can be reduced, realizing the miniaturization, high integration, and portability design of the image acquisition device.

[0059] In addition, compared with the board-to-board connectors and pins in the prior art that need to be welded to the circuit board first and then assembled and inserted into the circuit board, the connection bracket 100 in the circuit board assembly 10 in the embodiments of the present application can be directly welded to the circuit board modules 200 on both sides, simplifying the assembly and production processes and reducing the process difficulty and production cost.

[0060] Figure 5 It is a schematic diagram of the connection between the connection bracket and the circuit board module in the circuit board assembly provided by the embodiments of the present application. Figure 6 It is a top view of the connection bracket on the circuit board module in the circuit board assembly provided by the embodiments of the present application.

[0061] Please refer to Figure 5 and Figure 6 and in combination with Figures 1 to 4 , in a possible implementation manner, the circuit board module 200 may include a circuit board main body 210 and components 220 connected to the circuit board main body 210. The circuit board main body 210 is welded to the connection bracket 100, and the components 220 on the side of the circuit board main body 210 facing the accommodation space 11 are arranged in the accommodation area 101.

[0062] It can be understood that components 220 may be connected to both surfaces of the circuit board main body 210, and the height of the components 220 on the side of the circuit board main body 210 facing the accommodation space 11 on the surface of the circuit board main body 210 is less than the height of the accommodation space 11 to avoid interference between the components 220 on adjacent two circuit board modules 200.

[0063] Exemplarily, the components 220 may include resistor-capacitor components such as capacitors and resistors, as well as controller components such as control units. The embodiments of the present application do not limit the specific types and functions of the components 220.

[0064] It should be noted that in the embodiments of the present application, the connection bracket 100 is welded to the circuit board main bodies 210 on its upper and lower sides. The board spacing between the two circuit board main bodies 210 can be approximately equal to the thickness of the connection bracket 100, so as to make full use of the space between adjacent circuit board modules 200, reduce the waste of space between the circuit board main bodies 210, and facilitate the miniaturization and high integration design of the image acquisition device.

[0065] Figure 7 It is a schematic diagram of the distribution of welding points on the connection bracket in the circuit board assembly provided by the embodiments of the present application.

[0066] Please refer to Figure 7 and in combination with Figures 1 to 6 , in some embodiments, the connection bracket 100 may include a bracket main body 110 and welding points 120 provided on opposite side surfaces of the bracket main body 110. The welding points 120 on opposite side surfaces of the bracket main body 110 are electrically connected. The welding points 120 on opposite side surfaces of the bracket main body 110 are respectively welded to the circuit board modules 200 on both sides.

[0067] It can be understood that the connection bracket 100 can be a PCB bracket. As a circuit board structure itself, the connection bracket 100 can transmit signals between boards while playing a supporting role, which is beneficial to reducing the board-to-board height between the circuit board modules 200.

[0068] Exemplarily, when the connection bracket 100 is welded to the circuit board main body 210, after the welding points 120 on the circuit board main body 210 are melted, the connection bracket 100 can be docked with the circuit board module 200, so that the connection bracket 100 is connected and fixed to the preset corresponding position on the circuit board main body 210, and the two are electrically connected. For example, the connection bracket 100 can be first welded to the circuit board module 200 on the lower side, and then the circuit board module 200 on the upper side is welded to the connection bracket 100.

[0069] In some embodiments, there may be multiple welding points 120, and the multiple welding points 120 are distributed on the surface of at least one of the first connection section 111 and the second connection section 112, so as to make full use of the welding points 120 in each area of the connection bracket 100 to form signal transfer terminals, and adjust the distribution of the welding points 120 according to the specific selection of the circuit board module 200 to improve the design flexibility.

[0070] It can be understood that most of the welding points 120 can be distributed on the second connection section 112, and a small number of welding points 120 can be provided on the first connection section 111 located in the middle area relative to the circuit board main body 210, so that the welding points 120 are distributed as close as possible to the edge of the circuit board module 200. In this way, the layout of the components 220 on the circuit board module 200 is avoided.

[0071] Exemplarily, both the first connection segment 111 and the second connection segment 112 can extend in a straight line direction. The first connection segment 111 and the second connection segment 112 are perpendicular to each other, and the two second connection segments 112 are parallel to each other. The first connection segment 111 is connected to the middle position of the second connection segment 112, so that the connection bracket 100 forms a "work" shaped structure, improving the support reliability of the connection bracket 100 for the circuit board module 200.

[0072] In some embodiments, the solder joints 120 on the opposite side surfaces of the bracket body 110 can be connected by a conductor, and the conductor is printed in the bracket body 110. In this way, the conductor and the bracket body 110 can be welded to the upper and lower circuit board modules 200 as a whole, reducing the process difficulty and cost.

[0073] It should be noted that signal transmission lines are formed between the solder joints on both sides of the bracket body 110 for the two circuit board modules 200. According to the specific signal transmission requirements between the circuit board modules 200, a 3D wiring layout can be carried out on the bracket body 110. Without increasing the height between the boards, the requirements of different wiring layouts can be met, improving the space utilization rate and the signal transmission rate between the circuit board modules 200.

[0074] In some embodiments, any one of the two second connection segments 112 is provided with an anti-fooling portion 113, and the anti-fooling portion 113 is located at the end of the second connection segment 112, so as to ensure the accuracy of the welding position between the connection bracket 100 and the circuit board module 200.

[0075] It can be understood that the connection bracket 100 and the circuit board module 200 have a preset specific welding position. One of the two second connection segments 112 is provided with an anti-fooling portion 113, and the other second connection segment 112 is not provided with an anti-fooling portion 113, so that the structures of the two second connection segments 112 are different. Furthermore, it can be ensured that when the circuit board assembly 10 is mass-produced, the connection bracket 100 can be accurately welded to the specific welding position on the circuit board module 200.

[0076] Exemplarily, the anti-fooling portion 113 can be an inclined surface at the end of one of the second connection segments 112, and this inclined surface is inclined with respect to the end of the other second connection segment 112. In addition, the anti-fooling portion 113 can also be other structural forms such as a protrusion or a groove. The anti-fooling portion 113 can be provided with one, two or more. The specific structure and the number of settings of the anti-fooling portion 113 in the embodiments of the present application are not limited.

[0077] As an alternative embodiment, positioning portions 114 are provided on opposite sides of the first connecting section 111, and the positioning portions 114 protrude towards the accommodating area 101. The positioning portions 114 can cooperate with an external assembly tool during the assembly process of the connecting bracket 100 and the circuit board module 200. Thus, when the connecting bracket 100 and the circuit board module 200 are assembled by welding, the assembly tool can grasp the connecting bracket 100, improving the convenience of process implementation.

[0078] It can be understood that the width of the area of the first connecting section 111 where the positioning portions 114 are provided is greater than the width of other areas of the first connecting section 111. Exemplarily, the positioning portions 114 can be located in the middle area of the first connecting section 111 so that the positioning portions 114 avoid the area where the welding points 120 on the connecting bracket 100 are distributed, enabling the external tool to avoid the welding points 120 when cooperating with the connecting bracket 100.

[0079] In a possible implementation manner, at least one circuit board module 200 is provided with a positioning hole 130, and the positioning hole 130 is located at the circumferential edge of the circuit board module 200, thereby facilitating the installation of the circuit board assembly 10 as a whole into the image acquisition device and improving the assembly convenience.

[0080] It can be understood that the contour dimensions of two adjacent circuit board modules 200 can be the same, or the contour dimension of one of the circuit board modules 200 can be greater than that of the other. When the contour dimensions of two adjacent circuit board modules 200 are the same, positioning holes 130 can be provided on both circuit board modules 200, and the positioning holes 130 on the two circuit board modules 200 are coaxially arranged. When the contour dimensions of two adjacent circuit board modules 200 are different, the positioning hole 130 can be provided on the circuit board module 200 with a larger size, such that the positioning hole 130 of this circuit board module 200 can avoid the other circuit board module 200 with a smaller contour dimension.

[0081] Exemplarily, the circuit board module 200 in the embodiment of the present application can include a first circuit board module 200a and a second circuit board module 200b. The contour dimension of the first circuit board module 200a is greater than the dimension of the second circuit board module 200b. The projection of the first circuit board module 200a in the first direction covers the second circuit board module 200b, and the positioning hole 130 is provided at the edge of the first circuit board module 200a. The projection of the connecting bracket 100 in the first direction is located within the projection orientation of the second circuit board module 200b. For example, the side wall of the second connecting section 112 of the connecting bracket 100 is flush with the edge side wall of the second circuit board module 200b.

[0082] It should be noted that at least one circuit board module 200 in the circuit board assembly 10 may be provided with mounting bosses, and threaded holes may be provided on the mounting bosses, so that the circuit board assembly 10 can be fixedly mounted to the image acquisition device through threaded fasteners.

[0083] Figure 8 FIG. is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application, which has a multi-layer circuit board module and a connection bracket.

[0084] Please refer to Figure 8 , in some embodiments, there may be multiple circuit board modules 200 and multiple connection brackets 100. The multiple circuit board modules 200 and the multiple connection brackets 100 are alternately stacked in sequence along a first direction, so as to form a multi-layer circuit board stacking structure. The overall circuit board assembly 10 has good structural strength and signal transmission stability.

[0085] It should be noted that the number of circuit board modules 200 provided may be two, three, four or more. When there are two circuit board modules 200, there is one connection bracket 100; when there are three circuit board modules 200, there are two connection brackets 100; when there are four circuit board modules 200, there are three connection brackets 100, and so on. The specific number of circuit board modules 200 and connection brackets 100 in the embodiments of the present application is not limited.

[0086] The present application provides an image acquisition device, which includes the circuit board assembly 10 in the above technical solution.

[0087] It can be understood that the circuit board module 200 in the embodiments of the present application may be any one of a sensor board, a main control board, and an interface board in the image acquisition device. Among them, the sensor board is used to connect an image sensor to collect image signals; the main control board is used to control the image acquisition device and process the collected information; the interface board is used to connect an interface component to other components inside the image acquisition device or components outside the image acquisition device, for example, a heat dissipation module in the image acquisition device, etc.

[0088] It should be noted that the image acquisition device provided by the embodiments of the present application may include all the technical solutions and technical effects of the foregoing circuit board assembly 10, which will not be elaborated herein.

[0089] The present application provides a circuit board assembly and an image acquisition device. The circuit board assembly includes a connection bracket and at least two circuit board modules. The at least two circuit board modules are arranged in a stacked manner at intervals along a first direction, and there is an accommodation space between adjacent circuit board modules. The connection bracket is arranged in the accommodation space and welded to the circuit board modules on both sides. The connection bracket includes a first connection section and two second connection sections. The two second connection sections are respectively connected to both ends of the first connection section. Accommodation areas are respectively formed on opposite sides of the first connection section, and the accommodation areas communicate with the outside of the accommodation space, improving the structural strength of the stacked circuit board assembly and the reliability of signal transmission between circuit board modules, and facilitating the maintenance and repair of components between circuit board modules.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly (10) comprises a connection bracket (100) and at least two circuit board modules (200); the at least two circuit board modules (200) are stacked and arranged at intervals along a first direction, and an accommodation space (11) is provided between adjacent circuit board modules (200); the connection bracket (100) is arranged in the accommodation space (11) and is welded to the circuit board modules (200) on both sides so as to transmit signals between adjacent circuit board modules (200); The connecting bracket (100) comprises a first connecting section (111) and two second connecting sections (112), wherein the two second connecting sections (112) are respectively connected to two ends of the first connecting section (111), and opposite sides of the first connecting section (111) respectively form accommodating areas (101), wherein the accommodating areas (101) are connected to the outside of the accommodating space (11).

2. The circuit board assembly according to claim 1, characterized in that: The circuit board module (200) comprises a circuit board body (210) and components (220) connected to the circuit board body (210); the circuit board body (210) is welded to the connecting bracket (100); and the components (220) on the side of the circuit board body (210) facing the accommodating space (11) are arranged in the accommodating area (101).

3. The circuit board assembly according to claim 1, characterized in that: The connecting bracket (100) comprises a bracket body (110) and welding points (120) arranged on two opposite side surfaces of the bracket body (110), wherein the welding points (120) on the two opposite side surfaces of the bracket body (110) are electrically connected to each other; and the welding points (120) on the two opposite side surfaces of the bracket body (110) are respectively welded to the circuit board modules (200) on both sides.

4. The circuit board assembly according to claim 3, characterized in that: There are a plurality of welding points (120), and the plurality of welding points (120) are distributed on the surface of at least one of the first connecting section (111) and the second connecting section (112).

5. The circuit board assembly according to claim 3, characterized in that: The welding points (120) on the two opposite surfaces of the bracket body (110) are connected via a conductor; the conductor is printed on the bracket body (110).

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: Any one of the two second connecting sections (112) is provided with an anti-foolproofing portion (113), and the anti-foolproofing portion (113) is located at the end of the second connecting section (112).

7. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The first connecting section (111) has positioning portions (114) on two opposite sides, and the positioning portions (114) protrude toward the accommodating area (101).

8. The circuit board assembly according to any one of claims 1 to 5, characterized in that: At least one of the circuit board modules (200) is provided with a positioning hole (130), and the positioning hole (130) is located at the circumferential edge of the circuit board module (200).

9. The circuit board assembly according to any one of claims 1 to 5, characterized in that: There are a plurality of circuit board modules (200), there are a plurality of connection brackets (100), and the plurality of circuit board modules (200) and the plurality of connection brackets (100) are alternately stacked in sequence along the first direction.

10. An image acquisition device, characterized in that: The circuit board assembly (10) comprises any one of claims 1 to 9.

Images