Heat dissipation structure for precise electronic component packaging

Abstract

The utility model relates to the technical field of component packaging, in particular to a heat dissipation structure for precise electronic component packaging, which comprises a packaging box, an upper cover is mounted on the upper side of the packaging box, a supporting baffle is fixedly mounted at the lower end of the packaging box, and wire grooves are formed in the surfaces of the left side and the right side of the packaging box. Connecting holes are formed in the four corners of the upper surface of the packaging box, a plurality of heat dissipation holes are formed in the lower surface of the packaging box, a heat dissipation sheet is arranged in each heat dissipation hole, a heat dissipation plate is welded to the top ends of the heat dissipation sheets, and electrical components are placed on the heat dissipation plate. According to the utility model, air cooling is matched with the heat-conducting fins to rapidly discharge heat from the electrical components, the heat can be conveniently and rapidly dissipated, no potential safety hazard exists, the packaging box is matched with the upper cover to integrally package the electrical components, and dust accumulation is prevented from influencing the work of the electrical components.

Description

Technical Field

[0001] The utility model relates to the technical field of component packaging, in particular to a heat dissipation structure for packaging precision electronic components. Background Art

[0002] Electronic components are components of electrical components and small electrical machines and instruments. They are usually composed of several parts. Electronic component packaging is used to store electronic components. Currently, most electronic component packaging is a closed shell structure. Electrical components will generate some heat during operation. Once electronic components are damaged due to overheating and need to be repaired, they need to be removed with auxiliary tools. However, electronic components are precisely welded, and it is inconvenient to remove them with tweezers. Overheating damage to an electronic component is likely to require large-scale damage repair operations, which greatly increases the difficulty of the work.

[0003] The utility model patent with the authorization announcement number CN214155157U discloses a cooling device for electronic component packaging, which includes a cooling device body, a heat dissipation mechanism and a cooling mechanism. The cooling device body is provided with a hollow cavity with one end open, and the open end of the cooling device body is provided with a fixing block, and the fixing blocks are symmetrically arranged on both sides of the open end of the cooling device body. A support plate is provided in the middle of the cooling device body, and a heat dissipation through hole is provided in the middle of the support plate. A cooling cavity is provided on one side of the support plate, and the cooling cavity is provided on one side of the cooling device body close to the open end. The cooling cavity is provided with a hollow cavity with one end open, and a heat dissipation cavity is provided on the other side of the support plate. The utility model belongs to the technical field of cooling devices, and specifically provides a cooling device for electronic component packaging that is easy to connect with the cooling device, the heat conduction plate facilitates the heat conduction of the electronic component packaging, the heat dissipation fins facilitate the heat dissipation, and the cooling device combines air cooling and water cooling for multiple cooling and temperature reduction.

[0004] Although the above utility model can dissipate heat efficiently, the above utility model dissipates heat by combining air cooling and water cooling. When the cooling device is damaged, the solution used for water cooling will flow out and affect the circuit. In view of this, we propose a heat dissipation structure for precision electronic component packaging. Utility Model Content

[0005] The utility model provides a heat dissipation structure for packaging precision electronic components to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A heat dissipation structure for packaging precision electronic components, comprising a packaging box, an upper cover is installed on the upper side of the packaging box, and a supporting baffle is fixedly installed on the lower end of the packaging box;

[0008] Both the left and right side surfaces of the encapsulation box are provided with wire grooves, connection holes are provided at the four corners of the upper surface of the encapsulation box, a number of heat dissipation holes are provided on the lower surface of the encapsulation box, heat dissipation fins are arranged in each of the heat dissipation holes, a heat dissipation plate is welded to the top end of the heat dissipation fin, and electrical components are placed on the heat dissipation plate.

[0009] As a preferred technical solution, auxiliary pieces are arranged at the middle positions of both the left and right side surfaces of the upper cover, and connecting rods are welded at the four corners of the lower surface of the upper cover.

[0010] As a preferred technical solution, the top view of the support baffle presents a C-shaped structure, and two heat dissipation fans are installed on the left side surface of the support baffle.

[0011] As a preferred technical solution, the inside of the wire groove is filled with sponge, and a groove for the wire to pass through is provided in the middle of the sponge.

[0012] As a preferred technical solution, the lower surface of the heat dissipation fin is located below the lower surface of the heat dissipation hole, and the electrical component is placed closely against the heat dissipation plate.

[0013] As a preferred technical solution, anti-slip lines are provided on the side surface of the auxiliary piece, and the auxiliary piece is located directly above the wire groove.

[0014] As a preferred technical solution, the connecting rod is inserted into the inside of the connection hole, and the contact surfaces of the two are in mutual friction.

[0015] As a preferred technical solution, the heat dissipation fan is installed at one end of the heat dissipation fin, and the heat dissipation fin divides the air blown out by the heat dissipation fan into two parts.

[0016] Compared with the prior art, the beneficial effects of the present utility model are:

[0017] 1. By combining air cooling with heat conduction fins, the heat can be quickly discharged from the electrical components, which can conveniently and quickly dissipate the heat, and there will be no potential safety hazards.

[0018] 2. The electrical components are integrally encapsulated by the encapsulation box and the upper cover to prevent dust accumulation from affecting the operation of the electrical components. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0020] Figure 2 It is a schematic diagram of the structure of the encapsulation box in the present utility model;

[0021] Figure 3 It is a schematic diagram of the structure of the upper cover in the present utility model;

[0022] Figure 4 Structural schematic diagram of the support baffle in the present utility model;

[0023] Figure 5 Schematic diagram of the positions of the heat dissipation fan and the heat sink in the present utility model.

[0024] The meanings of the various labels in the figure are as follows:

[0025] 1. Encapsulation box; 11. Wire groove; 12. Connection hole; 13. Heat dissipation plate; 14. Heat sink; 15. Electrical component; 16. Heat dissipation hole; 2. Upper cover; 21. Auxiliary piece; 22. Connecting rod; 3. Support baffle; 31. Heat dissipation fan. Specific implementation manners

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Please refer to Figures 1 - 5 , this embodiment provides a technical solution:

[0028] A heat dissipation structure for the encapsulation of precision electronic components, including an encapsulation box 1, an upper cover 2 is installed on the upper side of the encapsulation box 1, a support baffle 3 is fixedly installed at the lower end of the encapsulation box 1, wire grooves 11 are opened on both left and right surfaces of the encapsulation box 1, connection holes 12 are opened at the four corners of the upper surface of the encapsulation box 1, a plurality of heat dissipation holes 16 are opened on the lower surface of the encapsulation box 1, a heat sink 14 is arranged in each heat dissipation hole 16, a heat dissipation plate 13 is welded to the top end of the heat sink 14, and an electrical component 15 is placed on the heat dissipation plate 13. Through the above mechanism, the heat generated during the operation of the electrical component can be transmitted through the heat dissipation plate 13 in cooperation with the heat sink 14 for heat dissipation treatment.

[0029] Furthermore, auxiliary pieces 21 are arranged at the middle positions of both left and right surfaces of the upper cover 2, and connecting rods 22 are welded at the four corners of the lower surface of the upper cover 2. The upper cover 2 can be grasped through the auxiliary pieces 21.

[0030] Furthermore, the top view of the support baffle 3 is in a C-shaped structure, and two heat dissipation fans 31 are installed on the left surface of the support baffle 3 for rapid heat dissipation through the heat dissipation fans 31.

[0031] In this embodiment, the inside of the wire groove 11 is filled with sponge, and a groove for the wire to pass through is opened in the middle of the sponge, which can support the wire while allowing the wire to pass through.

[0032] In this embodiment, the lower surface of the heat sink 14 is located below the lower surface of the heat dissipation holes 16, and the electrical component 15 is placed closely against the heat dissipation plate 13 to ensure that the heat generated by the electrical component 15 during operation can be quickly transferred away by the heat dissipation plate 13.

[0033] In this embodiment, the side surface of the auxiliary piece 21 is provided with anti-slip lines. The auxiliary piece 21 is located directly above the wire groove 11, and holding the auxiliary piece 21 can remove the upper cover 2 from the upper end of the packaging box 1.

[0034] In this embodiment, the connecting rod 22 is inserted into the connecting hole 12, and the contact surfaces of the two rub against each other. The connecting rod 22 is fixed inside the connecting hole 12 through the frictional force.

[0035] In this embodiment, the heat dissipation fan 31 is installed at one end of the heat sink 14. The heat sink 14 divides the air blown out by the heat dissipation fan 31 into two parts to ensure that the two heat dissipation fans 31 can blow all the air in the four cavities between the five heat sinks 14.

[0036] It should be noted that the structures and working principles of the heat dissipation plate 13 and the heat sink 14 involved in this embodiment are well known to those skilled in the art and will not be elaborated here.

[0037] In the specific use process of the heat dissipation structure of the precision electronic component package in this embodiment, during use, first place the electrical component 15 on the heat dissipation plate 13 in the packaging box 1, then pass the wire through the wire groove 11, and then cover the upper cover 2 to ensure that the connecting rod 22 is aligned with the connecting hole 12. After the upper cover 2 is closed, start the heat dissipation fan 31. When the electrical component 15 operates and generates heat, the heat enters the heat sink 14 through the heat dissipation plate 13 and is then cooled by the air blown out by the heat dissipation fan 31.

[0038] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for packaging precision electronic components, comprising a packaging box (1), characterized in that: An upper cover (2) is installed on the upper side of the packaging box (1), and a supporting baffle (3) is fixedly installed on the lower end of the packaging box (1); The left and right surfaces of the packaging box (1) are provided with wire grooves (11), the four corners of the upper surface of the packaging box (1) are provided with connection holes (12), the lower surface of the packaging box (1) is provided with a plurality of heat dissipation holes (16), each of the heat dissipation holes (16) is provided with a heat sink (14), a heat sink (13) is welded to the top of the heat sink (14), and an electrical component (15) is placed on the heat sink (13).

2. The heat dissipation structure for precision electronic component packaging as claimed in claim 1, characterized in that: Auxiliary plates (21) are provided in the middle of the left and right surfaces of the upper cover (2), and connecting rods (22) are welded to the four corners of the lower surface of the upper cover (2).

3. The heat dissipation structure for precision electronic component packaging as claimed in claim 2, characterized in that: The support baffle (3) has a C-shaped structure in a top view, and two cooling fans (31) are installed on the left surface of the support baffle (3).

4. The heat dissipation structure for precision electronic component packaging as claimed in claim 1, characterized in that: The wire slot (11) is filled with sponge, and a slot is provided in the middle of the sponge for the wire to pass through.

5. The heat dissipation structure for precision electronic component packaging as claimed in claim 1, characterized in that: The lower surface of the heat sink (14) is located below the lower surface of the heat dissipation hole (16), and the electrical component (15) is placed in close contact with the heat dissipation plate (13).

6. The heat dissipation structure for precision electronic component packaging as claimed in claim 2, characterized in that: The side surface of the auxiliary sheet (21) is provided with anti-slip grooves, and the auxiliary sheet (21) is located directly above the wire groove (11).

7. The heat dissipation structure for precision electronic component packaging as claimed in claim 2, characterized in that: The connecting rod (22) is inserted into the connecting hole (12), and the contact surfaces of the two are in friction with each other.

8. The heat dissipation structure for precision electronic component packaging as claimed in claim 3, characterized in that: The heat dissipation fan (31) is installed at one end of the heat dissipation fin (14), and the heat dissipation fin (14) divides the wind blown out by the heat dissipation fan (31) into two parts.

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