Light sensor and electronic equipment

Abstract

The embodiment of the utility model discloses a light sensor and electronic equipment. The light sensor comprises a substrate, a processing module and a light sensing module, the processing module and the light sensing module are arranged on the substrate, the processing module and the light sensing module are electrically connected through a lead bonding structure, and the lead bonding structure comprises one or more light sensing signal transmission channels and at least one interference noise acquisition channel. The interference of the screen on the sensor is eliminated by adding the noise reduction channel in the lead bonding structure, and compared with other shielding modes, the light sensitivity is not affected, and the cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors. More specifically, the present application relates to a light sensor and an electronic device. Background Art

[0002] In the application of under-screen light sensing, the circuit of the light sensor is a high-sensitivity circuit and is easily affected by electromagnetic interference. A large part of the electromagnetic interference of the screen will be coupled into the analog channel for transmitting the light sensor signal through wire bonding. If an additional shielding layer is not provided between the screen and the light sensor chip, the interference amplitude of the screen will be dozens or even hundreds of times that of the light sensor signal, seriously affecting the performance of the under-screen light sensor. Moreover, the additional shielding layer will bring additional costs and reduce the light sensor sensitivity. Summary of the Utility Model

[0003] In view of the deficiencies of the prior art, the present application innovatively provides a light sensor and an electronic device, which can solve at least some of the above technical problems.

[0004] To achieve the above technical objectives, a first aspect of the present application discloses a light sensor, including: a substrate, a processing module, and a light sensing module. The processing module and the light sensing module are disposed on the substrate, and the processing module and the light sensing module are electrically connected through a wire bonding structure.

[0005] The wire bonding structure includes one or more light sensor signal transmission channels and at least one interference noise acquisition channel.

[0006] Further, the processing module is configured to sample the interference noise acquisition channel and the light sensor signal transmission channel simultaneously.

[0007] Further, the interference noise acquisition channel is parallel to and has the same length as the light sensor signal transmission channel.

[0008] Further, the distance between the interference noise acquisition channel and the adjacent light sensor signal transmission channel is less than 1 mm.

[0009] Further, a plurality of light sensor signal transmission channels are provided, and one interference noise acquisition channel is provided. The interference noise acquisition channel is disposed adjacent to one light sensor signal transmission channel located in the middle of the plurality of light sensor signal transmission channels.

[0010] Further, a plurality of interference noise acquisition channels are provided, and adjacent two interference noise acquisition channels are separated by at least one light sensor signal transmission channel.

[0011] Further, a first end of the interference noise acquisition channel is electrically connected to the processing module, and a second end of the interference noise acquisition channel is electrically connected to a low-light unit of the light sensing module.

[0012] Further, a first end of the interference noise acquisition channel is electrically connected to the processing module, and a second end of the interference noise acquisition channel is not electrically connected to the light sensing module.

[0013] Further, the processing module includes an analog front-end chip, and the analog front-end chip is configured to process signals collected by the light sensing signal transmission channel and the interference noise acquisition channel, and eliminate noise in the light sensing signal transmission channel, or simultaneously eliminate noise and dark current in the light sensing signal transmission channel.

[0014] Further, it further includes: a shielding layer, and the shielding layer is disposed on a lower side of the wire bonding structure and is located on a top layer of the substrate.

[0015] A second aspect of the present application discloses an electronic device, including:

[0016] A display screen; and,

[0017] The above-mentioned light sensing sensor, and the light sensing sensor is disposed below the display screen.

[0018] The beneficial effects of the present application are as follows:

[0019] In the present application, by adding a noise reduction channel in the wire bonding structure to collect interference noise of the sensor from the screen and the like, it is convenient to process the noise. Compared with adding other shielding methods, the present application will not affect the light sensing sensitivity and has a lower cost. Description of the Drawings

[0020] Figure 1 Showing a structural schematic diagram of a light sensing sensor in the related art;

[0021] Figure 2 Showing a structural schematic diagram of a light sensing sensor according to an embodiment of the present application;

[0022] Figure 3 Showing a structural schematic diagram of a light sensing sensor according to an embodiment of the present application;

[0023] Figure 4 Showing a sampling timing schematic diagram of a light sensing signal transmission channel and an interference noise acquisition channel according to an embodiment of the present application.

[0024] In the figure,

[0025] 1. Substrate; 2. Processing module; 3. Light sensing module; 4. Wire bonding structure; 41. Light sensing signal transmission channel; 42. Interference noise acquisition channel; 5. Shielding layer. Detailed implementation manners

[0026] The following clearly and completely describes the technical solutions of the touch detection module and the electronic device provided by the present utility model in conjunction with the accompanying drawings of the specification, and gives detailed explanations and descriptions.

[0027] As Figure 1 shown, in the related art, the processing module 2 and the light sensing module 3 of the light sensor are arranged on the substrate 1 and connected through the wire bonding structure 4. Electromagnetic interference in the external environment is easily coupled into the signal transmission channel of the wire bonding structure 4, affecting the light sensing performance of the sensor.

[0028] According to the first aspect of the embodiments of the present application, a light sensor is provided. As Figure 2 shown, it includes: a substrate 1, a processing module 2 and a light sensing module 3. The processing module 2 and the light sensing module 3 are arranged on the substrate 1, and the processing module 2 and the light sensing module 3 are electrically connected through a wire bonding structure 4 (wire bonding). In this embodiment, the processing module 2 can be an Analog Front End (AFE) chip, which is used to process the signals transmitted by the wire bonding structure 4 and eliminate noise. The light sensing module 3 is used to convert light signals into electrical signals. The light sensing module 3 includes, but is not limited to, a PD (Photo-Diode). The light sensing module 3 includes a plurality of light sensing units and a low-light unit. The light sensing units include a red light filtering unit, a green light filtering unit, a blue light filtering unit, etc.

[0029] In this embodiment, the wire bonding structure 4 includes a light sensing signal transmission channel 41 and an interference noise acquisition channel 42. Both the light sensing signal transmission channel 41 and the interference noise acquisition channel 42 include bonding leads. The light sensing signal transmission channel 41 is used to transmit the photo-induced electrical signals generated by the light sensing units, and the interference noise acquisition channel 42 can collect electromagnetic interference noise. The interference noise acquisition channel 42 is at least arranged close to one light sensing transmission channel 41, so that the interference of the electromagnetic interference on the interference noise acquisition channel 42 is equal to the interference amplitude and phase on the light sensing signal transmission channel 41. Optionally, the distance between the interference noise acquisition channel 42 and its adjacent sampling signal channel is less than 1 mm.

[0030] In some embodiments, a plurality of light sensing signal transmission channels 41 are provided, and one interference noise acquisition channel 42 is provided. The interference noise acquisition channel 42 is arranged adjacent to any one of the light sensing signal transmission channels 41. Optionally, the interference noise acquisition channel 42 is arranged adjacent to one light sensing signal transmission channel located in the middle of the plurality of light sensing signal transmission channels, so that better noise acquisition can be achieved for a plurality of light sensing signal transmission channels.

[0031] In this embodiment, as Figure 2As shown, the photosensitive signal transmission channels 41 include a plurality of channels, which are sequentially arranged as follows: W channel, C channel, B channel, R channel, and G channel. Among them, the R channel is used to transmit the signal of the red light filtering unit, the G channel is used to transmit the signal of the green light filtering unit, the B channel is used to transmit the signal of the blue light filtering unit, the C channel is used to transmit the signal of the visible light filtering unit, and the W channel is used to transmit the signal of the white light unit. The photosensitive signal transmission channels 41 are formed by bonding wires. Both ends of each channel are electrically connected to the processing module 2 and the photosensitive module 3 respectively, and are used to transmit photosensitive signals. The interference noise acquisition channel 42 includes a D channel. The D channel is formed by bonding wires. In this embodiment, the D channel is arranged between the B channel and the R channel. The D channel has the same length as the B channel and the R channel and is arranged parallel to each other. The D channel is mainly used to eliminate the noise of the B channel and the R channel. Optionally, the lengths of the plurality of photosensitive transmission channels 41 are the same and are arranged parallel to each other. The extending direction of the interference noise acquisition channel 42 is parallel to the extending direction of the photosensitive signal transmission channels 41, that is, the interference noise acquisition channel 42 is arranged parallel to the plurality of photosensitive signal transmission channels 41, so that the D channel can simultaneously eliminate the noise of the R channel, G channel, B channel, C channel, and W channel. In other embodiments, the D channel can also be arranged between the R channel and the G channel, or arranged between the B channel and the C channel, and both can achieve the effect of noise elimination. Among them, the photosensitive signal transmission channel 41 adjacent to the D channel has the best noise elimination effect.

[0032] In some embodiments, the processing module 2 controls to sample simultaneously through the interference noise acquisition channel 42 and the photosensitive signal transmission channels 41 to ensure that the phases of the sampled signals are the same. Figure 4 The sampling clock signal diagram showing the photosensitive signal transmission channels 41 and the interference noise acquisition channel 42 is as Figure 4 As shown, the photosensitive signal transmission channels 41 and the interference noise acquisition channel 42 are sampled simultaneously, and then the interference noise of the photosensitive signal transmission channels 41 is removed through processing. The processing methods include: the processing module 2 samples the interference noise acquisition channel 42 and the photosensitive signal transmission channels 41, and calculates the sampled signals to eliminate the noise of the signals of the photosensitive signal transmission channels 41:

[0033] The interference noise acquisition channel 42 sampled signal D_rawdata is detrended (the median value of the signal) D_mean to obtain the interference noise D_noise, that is, D_noise = D_rawdata - D_mean, where D_mean is obtained by averaging multiple D_rawdata. Subtracting D_noise from the sampled signal (rawdata) of the light sensing signal transmission channel 41 can eliminate the interference noise coupled on the light sensing signal transmission channel 41. For example: The actual signal of the R channel is R_signal = R_rawdata - D_noise; the actual signal of the G channel is G_signal = G_rawdata - D_noise; the actual signal of the B channel is B_signal = B_rawdata - D_noise; the actual signal of the C channel is C_signal = C_rawdata - D_noise; the actual signal of the W channel is W_signal = W_rawdata - D_noise.

[0034] In some embodiments, as Figure 3 shown, multiple interference noise acquisition channels 42 are provided. Optionally, two interference noise acquisition channels 42 are provided, including a D1 channel and a D2 channel. Among them, the D1 channel is provided between the C channel and the B channel to eliminate the interference noise of the W channel, C channel, and B channel, and the D2 channel is provided between the R channel and the G channel to eliminate the noise of the R channel and the G channel. In this embodiment: The processing module 2 samples the interference noise acquisition channel 42 and the light sensing signal transmission channel 41, and calculates the sampled signal to eliminate the noise of the light sensing signal transmission channel 41 signal:

[0035] D1_noise = D1_rawdata - D1_mean,

[0036] B_signal = B_rawdata - D1_noise, C_signal = C_rawdata - D1_noise, W_signal = W_rawdata - D1_noise;

[0037] D2_noise = D2_rawdata - D2_mean,

[0038] R_signal = R_rawdata - D2_noise, G_signal = G_rawdata - D2_noise.

[0039] In other embodiments, the D1 channel can also be provided between the W channel and the C channel, and the D2 channel can be provided between the B channel and the R channel. Or, the D1 channel and the D2 channel can also be provided at other positions respectively, which can all achieve the effect of noise elimination.

[0040] In some embodiments, a plurality of interference noise acquisition channels 42 are provided. Any two adjacent optical signal transmission channels 41 are separated by an interference noise acquisition channel 42. Each optical signal transmission channel 41 can be adjacent to at least one interference noise acquisition channel 42, so that each optical signal transmission channel 41 can achieve the best noise reduction effect.

[0041] In some embodiments, such as Figure 2 , Figure 3 As shown, the first end of the optical signal transmission channel 41 is electrically connected to the processing module 2, and the second end of the optical signal transmission channel 41 is electrically connected to the optical sensing unit of the optical sensing module 3. The first end of the interference noise acquisition channel 42 is electrically connected to the processing module 2, and the second end of the interference noise acquisition channel 42 is electrically connected to the dark light unit of the optical sensing module 3, and the dark light unit of the optical sensing module 3 shields the optical induction. In this embodiment, the interference noise acquisition channel 42 can collect both electromagnetic interference signals and dark current, and the processing module 2 can eliminate both noise interference and dark current.

[0042] In some embodiments, the first end of the optical signal transmission channel 41 is electrically connected to the processing module 2, and the second end of the optical signal transmission channel 41 is electrically connected to the optical sensing unit of the optical sensing module 3. The first end of the interference noise acquisition channel 42 is electrically connected to the processing module 2, and the second end of the interference noise acquisition channel 42 is not electrically connected to the optical sensing module 3, that is, the second end of the interference noise acquisition channel 42 is fixedly connected to the optical sensing module 3 but not conductive, or the second end of the interference noise acquisition channel 42 is set to be suspended and not connected to the optical sensing module 3. At this time, the interference noise acquisition channel 42 can only collect electromagnetic interference signals, and the processing module 2 can only eliminate noise interference.

[0043] In some embodiments, a shielding layer 5 is provided on the lower side of the wire bonding structure 4. The shielding layer 5 is provided on the top layer of the substrate 1 and is located between the processing module 2 and the optical sensing module 3. The shielding layer 5 is used to shield the interference of the digital wiring of the substrate 1 to the optical signal transmission channel 41. The shielding layer 5 is preferably a copper foil.

[0044] In the embodiment of the present application, by adding an interference noise acquisition channel 42 in the wire bonding structure 4 to eliminate the interference of the screen to the sensor, compared with adding other shielding methods, the present application will not affect the optical sensing sensitivity and has a lower cost.

[0045] According to a second aspect of the embodiments of the present application, an electronic device is provided, including a display screen and the above-mentioned light sensor. The light sensor is disposed below the display screen and, optionally, can be adhered to the display screen. Through the light sensor of the present application, the influence of external environmental noises such as screen interference and power frequency on the light sensing signal can be eliminated or reduced, and the performance of the light sensing and the applicability in a complex environment of electromagnetic interference can be improved. Optionally, the electronic device includes a mobile phone, a tablet computer, a projector, a vehicle-mounted device, etc.

[0046] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and simple improvements made to the substantial content of the present application shall be included within the protection scope of the present application.

[0047] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0048] In the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the description of this specification, the descriptions referring to terms such as "this embodiment", "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any at least one embodiment or example. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0050] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0051] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and simple improvements made to the substantial content of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A light sensor, characterized in that: include: A substrate, a processing module and a photosensitive module, wherein the processing module and the photosensitive module are arranged on the substrate, and the processing module and the photosensitive module are electrically connected via a wire bonding structure. The wire bonding structure includes one or more light sensing signal transmission channels and at least one interference noise collection channel.

2. The light sensor according to claim 1, characterized in that: The processing module is used to sample the interference noise collection channel and the light sensing signal transmission channel simultaneously.

3. The light sensor according to claim 2, characterized in that: The interference noise collection channel is parallel to the light sensing signal transmission channel and has the same length as that of the light sensing signal transmission channel.

4. The light sensor according to claim 3, characterized in that: The distance between the interference noise collection channel and the adjacent light sensing signal transmission channel is less than 1 mm.

5. The light sensor according to claim 2, characterized in that: There are multiple photosensitive signal transmission channels, and one interference noise collection channel. The interference noise collection channel is arranged adjacent to a photosensitive signal transmission channel located in the middle of the multiple photosensitive signal transmission channels.

6. The light sensor according to claim 2, characterized in that: A plurality of the interference noise collection channels are provided, and two adjacent interference noise collection channels are separated by at least one of the light sensing signal transmission channels.

7. The light sensor according to claim 2, characterized in that: The first end of the interference noise collection channel is electrically connected to the processing module, and the second end of the interference noise collection channel is electrically connected to the dark light unit of the light sensing module.

8. The light sensor according to claim 2, characterized in that: The first end of the interference noise collection channel is electrically connected to the processing module, and the second end of the interference noise collection channel is not electrically connected to the photosensitive module.

9. The light sensor according to any one of claims 1 to 8, characterized in that: The processing module includes an analog front-end chip, which is used to process the signals collected by the photosensitive signal transmission channel and the interference noise collection channel, and eliminate the noise of the photosensitive signal transmission channel, or simultaneously eliminate the noise and dark current of the photosensitive signal transmission channel.

10. The light sensor according to any one of claims 1 to 8, characterized in that: Also includes: A shielding layer is arranged on the lower side of the wire bonding structure and located on the top layer of the substrate.

11. An electronic device, characterized in that: include: Display screen; and, The light sensor according to any one of claims 1 to 10, wherein the light sensor is arranged below the display screen.

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