Heating mattress

Abstract

The embodiment of the utility model provides a heating mattress. The heating mattress comprises a facing layer, a heating chip, an infrared reflecting film, an upper packaging layer and a lower packaging layer, the heating chip comprises a first packaging layer, a second packaging layer, a heating film and flow guide strips arranged on the two sides of the heating film, the heating film is a thin film formed by sputtering semiconductor metal oxide on the first packaging layer in a vacuum mode, the second packaging layer covers the heating film and the flow guide strips, and the first packaging layer and the second packaging layer are used for packaging the heating film and the flow guide strips. The diversion strips are connected with a power supply; the infrared reflecting film is arranged at the bottom of the heating chip; and the upper packaging layer and the lower packaging layer are used for clamping the heating chip and the infrared reflecting film between the upper packaging layer and the lower packaging layer and performing waterproof packaging on the heating chip and the infrared reflecting film. The heating mattress disclosed by the utility model can heat to increase the temperature and resist cold, and the heating mattress adopts the infrared reflecting film, so that the heating efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of bed heating articles, in particular to a heating mattress. Background Art

[0002] A mattress is a necessity in people's lives. The comfort level of the mattress affects people's quality of life and further affects people's physical health. With the continuous improvement of people's living standards, the pursuit of a comfortable life is becoming stronger and stronger. There are many types of mattresses, and the mattresses used by people are becoming more and more diversified. Different types of mattresses bring different feelings to users.

[0003] However, when the weather gets cold in early spring and autumn, the indoor temperature is relatively low. Ordinary mattresses have no heating function, which will make users feel cold and greatly reduce the comfort of the mattress. Summary of the Utility Model

[0004] The embodiments of the utility model provide a heating mattress to solve one or more of the above technical problems.

[0005] In a first aspect, the embodiments of the utility model provide a heating mattress, including

[0006] A decorative layer;

[0007] A heating chip, the heating chip is arranged under the decorative layer, and the heating chip is used to connect with a power supply to generate heat; the heating chip includes a first encapsulation layer and a second encapsulation layer, a heating film, and diversion bars arranged on both sides of the heating film. The heating film is a thin film formed by vacuum sputtering semiconductor metal oxide on the first encapsulation layer. The second encapsulation layer covers the heating film and the diversion bars. The first encapsulation layer and the second encapsulation layer are used to encapsulate the heating film and the diversion bars, and the diversion bars are connected with the power supply;

[0008] An infrared reflection film, the infrared reflection film is arranged at the bottom of the heating chip, and the infrared reflection film is used to reflect the infrared rays emitted by the heating chip upward;

[0009] An upper encapsulation layer and a lower encapsulation layer, the upper and lower encapsulation layers are used to sandwich the heating chip and the infrared reflection film in the middle and perform waterproof encapsulation on them.

[0010] In a preferred embodiment, the infrared reflection film is formed by extending at least one of metal simple substance, zinc oxide, aluminum oxide and titanium oxide.

[0011] In a preferred embodiment, the heating film is formed by vacuum sputtering of one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O, and ZnxAl(1-x)O.

[0012] In a preferred embodiment, the thickness range of the heating film includes 15nm to 1000nm.

[0013] In a preferred embodiment, the power density of the heating film is 50 - 200W / ㎡. When the distance between adjacent current-carrying bars is D, the sheet resistance of the heating film is 2 / D2 to 36 / D. 2 。

[0014] In a preferred embodiment, the decorative layer is adhesively bonded to the surface of the upper encapsulation layer. The decorative layer is woven from one of pure cotton, silk, linen, silk, ramie-cotton blend, pure silk, acetate fiber, and chiffon; or, the decorative layer is composed of a blend of multiple of pure cotton, silk, linen, silk, ramie-cotton, pure silk, acetate fiber, and chiffon.

[0015] One of the above technical solutions has the following advantages or beneficial effects: The heating mattress can generate heat to raise the temperature and resist cold, and the heating mattress uses an infrared reflective film, greatly improving the heating efficiency.

[0016] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, further aspects, embodiments, and features of the present invention will become readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In the drawings, unless otherwise specified, the same reference numerals throughout the several views represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in accordance with the present invention and should not be regarded as limiting the scope of the present invention.

[0018] Figure 1 A cross-sectional schematic view showing the multi-layer structure of the heating mattress according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are to be regarded as illustrative in nature and not restrictive.

[0020] Figure 1 Disclosed is a heating mattress according to an embodiment of the present utility model.

[0021] See Figure 1 As shown, the heating mattress includes a decorative layer 170, an upper encapsulation layer 150, a heating chip, an infrared reflection film 180, and a lower encapsulation layer 160 arranged in sequence.

[0022] The heating chip is arranged under the decorative layer 170 and is used to connect to a power source for heating; the heating chip includes a first encapsulation layer 110, a second encapsulation layer 120, a heating film 130, and current-carrying bars 140 arranged on both sides of the heating film 130. The heating film 130 is a thin film formed by vacuum sputtering of semiconductor metal oxide on the first encapsulation layer 110. The second encapsulation layer 120 covers the heating film 130 and the current-carrying bars 140. The first encapsulation layer 110 and the second encapsulation layer 120 are used to encapsulate the heating film 130 and the current-carrying bars 140, and the current-carrying bars 140 are connected to the power source.

[0023] The infrared reflection film 180 is arranged at the bottom of the heating chip and is used to reflect the infrared rays emitted by the heating chip upward.

[0024] The upper encapsulation layer 150 and the lower encapsulation layer 160 are used to sandwich the heating chip and the infrared reflection film 180 in the middle and perform waterproof encapsulation on them.

[0025] The heating mattress of this embodiment can heat up to raise the temperature and resist cold, and the heating mattress adopts the infrared reflection film 180, which greatly improves the heating efficiency.

[0026] In a specific embodiment, the infrared reflection film 180 is formed by extending at least one of a metal element, zinc oxide, aluminum oxide, and titanium oxide.

[0027] Further, the heating film 130 is formed by vacuum sputtering of one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O, and ZnxAl(1-x)O.

[0028] Further, the thickness range of the heating film 130 includes 15nm to 1000nm.

[0029] Further, the power density of the heating film 130 is 50 - 200W / ㎡. When the distance between adjacent current-carrying bars 140 is D, the sheet resistance of the heating film 130 is 2 / D2 to 36 / D 2 .

[0030] In a specific embodiment, the decorative layer 170 is adhesively bonded to the surface of the upper encapsulation layer 150. The decorative layer 170 is made of one of pure cotton, silk, linen, silk, ramie-cotton blend, pure silk, acetate fiber, and chiffon; or the decorative layer 170 is made of a blend of multiple ones among pure cotton, silk, linen, silk, ramie-cotton, pure silk, acetate fiber, and chiffon.

[0031] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0033] As described above, the above are only the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various changes or substitutions, and these should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A heating mattress, characterized in that: include Finishing layer; A heating chip, the heating chip is arranged under the finishing layer, and the heating chip is used to connect to a power source to generate heat; the heating chip includes a first packaging layer and a second packaging layer, a heating film, and guide bars arranged on both sides of the heating film, the heating film is a thin film formed by vacuum sputtering of a semiconductor metal oxide on the first packaging layer, the second packaging layer covers the heating film and the guide bar, the first packaging layer and the second packaging layer are used to encapsulate the heating film and the guide bar, and the guide bar is connected to a power source; An infrared reflective film, which is arranged at the bottom of the heating chip and is used to reflect the infrared rays emitted by the heating chip upwards; The upper packaging layer and the lower packaging layer are used to sandwich the heat generating chip and the infrared reflective film and perform waterproof packaging on them.

2. The heating mattress according to claim 1, characterized in that: The infrared reflective film is formed by stretching at least one of a metal element, zinc oxide, aluminum oxide and titanium oxide.

3. The heating mattress according to claim 1, characterized in that: The heating film is formed by vacuum sputtering of one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O and ZnxAl(1-x)O.

4. The heating mattress according to claim 3, characterized in that: The thickness of the heating film ranges from 15 nm to 1000 nm.

5. The heating mattress according to any one of claims 1 to 4, characterized in that: The power density of the heating film is 50-200W / ㎡. When the distance between adjacent guide strips is D, the square resistance of the heating film is 2 / D2~36 / D 2 .

6. The heating mattress according to claim 5, characterized in that: The finishing layer is bonded to the surface of the upper packaging layer, and the finishing layer is woven from one of pure cotton, silk, flax, silk, linen and cotton blended, silk, acetate fiber, and chiffon; or, the finishing layer is woven from a blend of multiple of pure cotton, silk, flax, silk, linen and cotton, silk, acetate fiber, and chiffon.

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