Rotary cleaning device

Abstract

The utility model discloses a rotary cleaning device, and relates to the technical field of semiconductor substrate material manufacturing, and the rotary cleaning device comprises a fixing assembly and a spraying assembly; the fixing assembly is used for fixing a substrate; the spraying assembly comprises a first spraying piece, a second spraying piece and a spraying driver; the first spraying piece is provided with a plurality of first spraying holes used for conducting spraying cleaning on the first face of the substrate slice on the fixing assembly. The second spraying piece is provided with a plurality of second spraying holes used for spraying and cleaning the second surface of the substrate slice on the fixing assembly; the two faces of the substrate slice are sprayed and cleaned at the same time, and the cleaning effect is greatly improved. The spraying driver is connected with the first spraying piece and / or the second spraying piece and used for driving the first spraying piece and / or the second spraying piece to rotate; and compared with a direct flushing spraying cleaning mode, the rotary spraying cleaning device has a better cleaning effect.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor substrate material manufacturing, and particularly to a rotary cleaning device. Background Art

[0002] Radio frequency devices manufactured using indium phosphide substrates have shown excellent performance in application scenarios such as satellites and radars, and have gradually become the mainstream substrate materials for radio frequency devices.

[0003] In the manufacturing of indium phosphide substrate materials, the polished indium phosphide substrate wafers need to be cleaned. The existing cleaning methods mainly include spray or immersion cleaning. Among them, the devices used for spray cleaning are mostly single-sided cleaning. After each cleaning operation on one side of the substrate wafer, it is necessary to switch to the other side for cleaning, which not only has low cleaning efficiency but also insufficient cleaning effect. Summary of the Utility Model

[0004] In view of this, the purpose of this application is to provide a rotary cleaning device to solve the technical problems of low efficiency and insufficient cleaning effect existing in the existing single-sided spray cleaning.

[0005] To achieve the above technical purpose, this application provides a rotary cleaning device, including a fixing component and a spray component;

[0006] The fixing component is used to fix the substrate wafer;

[0007] The spray component includes a first spray member, a second spray member, and a spray driver;

[0008] The first spray member is provided with a plurality of first spray holes for spray cleaning the first side of the substrate wafer on the fixing component;

[0009] The second spray member is provided with a plurality of second spray holes for spray cleaning the second side of the substrate wafer on the fixing component;

[0010] The spray driver is connected to the first spray member and / or the second spray member, and is used to drive the first spray member and / or the second spray member to rotate.

[0011] Further, it further includes a moving plate and a plate driver;

[0012] The plate driver is connected to the moving plate and is used to drive the moving plate to move along a first horizontal straight line direction;

[0013] The fixing component is installed on the moving plate.

[0014] Further, the fixing component includes two fixtures;

[0015] The two jigs are spaced apart along a second horizontal line direction perpendicular to the first horizontal line direction, and are symmetrically arranged with respect to a preset plane perpendicular to the second horizontal line direction;

[0016] The jig is used to fixedly hold the substrate wafer in an inclined manner, such that the first surface of the substrate wafer close to the preset plane is inclined downward, and the second surface away from the preset plane is inclined upward;

[0017] The first spraying member is a pipe structure, vertically arranged above the moving plate, and its central axis coincides with the preset plane;

[0018] The first spray holes are provided on the outer peripheral wall of the first spraying member;

[0019] There are two second spraying members, and they are disk structures;

[0020] The second spraying members are arranged parallel to the substrate wafer on the jig;

[0021] The second spray holes are provided on the surface of the second spraying member facing the substrate wafer.

[0022] Further, the spraying assembly further includes a spraying support;

[0023] The spraying support is in an inverted U-shaped structure;

[0024] The first spraying member, the second spraying member, and the spraying driver are installed on the spraying support;

[0025] A first pipe joint is connected to the first spraying member;

[0026] A second pipe joint is connected to the second spraying member.

[0027] Further, the spraying driver is a hollow shaft rotary motor;

[0028] The spraying driver is connected to the second spraying member;

[0029] The second pipe joint passes through the hollow shaft of the spraying driver and is rotatably connected to the second spraying member.

[0030] Further, the plate driver is a lead screw slide;

[0031] The slider of the plate driver is connected to the moving plate.

[0032] Further, there are at least two fixing components, and they are spaced apart;

[0033] There are at least two spraying assemblies, and they correspond to the fixing components one by one.

[0034] Further, a card slot for inserting the substrate wafer is provided on the jig.

[0035] Further, there are two card slots on the jig, and they are arranged at intervals.

[0036] Further, the jig includes a connecting portion and a supporting portion;

[0037] There are two supporting portions, which are arranged at intervals on the connecting portion;

[0038] Each supporting portion is respectively provided with one of the card slots.

[0039] As can be seen from the above technical solutions, in the rotary cleaning device designed in this application, the spraying assembly is designed with a first spraying member capable of spraying and cleaning the first surface of the substrate wafer on the fixing assembly and a second spraying member capable of spraying and cleaning the second surface of the substrate wafer, so as to realize simultaneous spraying and cleaning of the two surfaces of the substrate wafer, greatly improving the cleaning effect. Moreover, the spraying assembly is also designed with a spraying driver, which can drive the first spraying member and / or the second spraying member to rotate to realize rotary spraying cleaning. Compared with the direct spraying cleaning method, it has a better cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0041] Figure 1 It is a schematic structural diagram of a rotary cleaning device provided in the present application with a moving plate and a plate driver;

[0042] Figure 2 It is a schematic structural diagram of a rotary cleaning device provided in the present application;

[0043] Figure 3 It is a schematic structural diagram of the cooperation between the jig and the substrate wafer of a rotary cleaning device provided in the present application;

[0044] In the figure: 11, the first spraying member; 111, the first spraying hole; 12, the second spraying member; 13, the spraying driver; 14, the spraying support; 15, the first pipe joint; 16, the second pipe joint; 2, the jig; 21, the card slot; 22, the connecting portion; 23, the supporting portion; 3, the substrate wafer; 4, the plate driver; 5, the moving plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0045] The technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the embodiments of the present application.

[0046] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0047] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0048] The embodiments of the present application disclose a rotary cleaning device.

[0049] Please refer to Figure 2 , an embodiment of a rotary cleaning device provided in the embodiments of the present application includes:

[0050] A fixing component and a spraying component.

[0051] The fixing component is used to fix the substrate wafer 3.

[0052] The spraying component includes a first spraying member 11, a second spraying member 12, and a spraying driver 13;

[0053] A plurality of first spray holes 111 for spraying and cleaning the first surface of the substrate wafer 3 on the fixing component are provided on the first spraying member 11; a plurality of second spray holes (not shown in the figure) for spraying and cleaning the second surface of the substrate wafer 3 on the fixing component are provided on the second spraying member 12.

[0054] The spray drive 13 is connected to the first spray member 11 and / or the second spray member 12, and is used to drive the first spray member 11 and / or the second spray member 12 to rotate.

[0055] In the rotary cleaning device designed in the present application, the spray assembly is designed with a first spray member 11 capable of spray-cleaning the first surface of the substrate film 3 on the fixed assembly and a second spray member 12 capable of spray-cleaning the second surface of the substrate film 3, so as to realize simultaneous spray-cleaning of the two surfaces of the substrate film 3, greatly improving the cleaning effect. Moreover, the spray assembly is also designed with a spray drive 13, which can drive the first spray member 11 and / or the second spray member 12 to rotate to realize rotary spray cleaning, and has a better cleaning effect compared with the direct spray cleaning method.

[0056] The above-mentioned first spray member 11, second spray member 12, and fixed assembly can be prepared from PEEK material, and there is no specific limitation.

[0057] The above is the first embodiment of a rotary cleaning device provided by the present application. The following is the second embodiment of a rotary cleaning device provided by the present application. For details, please refer to Figures 1 to 3 。

[0058] Based on the solution of the above-mentioned first embodiment:

[0059] Further, as Figure 1 shown, it further includes a moving plate 5 and a plate drive 4.

[0060] The plate drive 4 is connected to the moving plate 5 and is used to drive the moving plate 5 to move along the first horizontal straight line direction. The fixed assembly is installed on the moving plate 5. By driving the moving plate 5 to reciprocate through the plate drive 4, the substrate film 3 on the fixed assembly can be driven to reciprocate, so as to realize reciprocating dynamic cleaning operation and further improve the cleaning effect.

[0061] Further, as Figure 1 shown, the fixed assembly includes two jigs 2. Compared with the single jig 2 design, it can realize the cleaning operation of two substrate films 3 at a time, further improving the cleaning efficiency.

[0062] The two jigs 2 are spaced apart along the second horizontal straight line direction perpendicular to the first horizontal straight line direction and are symmetrically arranged with respect to a preset plane perpendicular to the second horizontal straight line direction.

[0063] The jig 2 is used to fix the substrate wafer 3 in an inclined manner, and the first surface of the substrate wafer 3 close to the preset surface is inclined downward, while the second surface away from the preset surface is inclined upward; the first spraying member 11 is a pipe structure, vertically arranged above the moving plate 5, and its central axis coincides with the preset surface; the width of the gap space between the substrate wafers 3 arranged on the two symmetrically arranged jigs 2 should be greater than the width of the first spraying member 11 to ensure that the moving plate 5 will not be interfered by the first spraying member 11 when moving. The inclination angle of the substrate wafer 3 in this application can be 45° or other angles.

[0064] The outer peripheral wall of the first spraying member 11 is provided with first spray holes 111, and the first spray holes 111 are evenly distributed.

[0065] As Figure 2 shown, taking the number of jigs 2 as two as an example, the second spraying member 12 is correspondingly designed as two and is a disk structure; the second spraying member 12 can be arranged parallel to the substrate wafer 3 on the jig 2. Correspondingly, the surface of the second spraying member 12 facing the substrate wafer 3 is provided with second spray holes, and the second spray holes are evenly distributed.

[0066] Furthermore, as Figure 1 and Figure 2 shown, for better fixed installation, the spraying assembly further includes a spraying bracket 14, and the spraying bracket 14 is in an inverted U-shaped structure.

[0067] The first spraying member 11, the second spraying member 12 and the spraying driver 13 are installed on the spraying bracket 14.

[0068] A first pipe joint 15 is connected to the first spraying member 11, and a second pipe joint 16 is connected to the second spraying member 12. The first pipe joint 15 and the second pipe joint 16 are respectively used to connect the cleaning liquid supply source.

[0069] Furthermore, in order to ensure rotational drive and at the same time avoid affecting the supply of the cleaning liquid, the spraying driver 13 is a hollow shaft rotating motor.

[0070] This application is preferably designed such that the spraying driver 13 is connected to the second spraying member 12. If there are two second spraying members 12, then there are also two corresponding spraying drivers 13 to achieve one-to-one connection. Other quantities also have one-to-one cooperation, which is not limited.

[0071] The second pipe joint 16 can pass through the hollow shaft of the spraying driver 13 and is rotationally connected to the second spraying member 12. Specifically, it can be connected through a rotary connector to ensure conduction with the second spraying member 12 without affecting the rotation of the second spraying member 12.

[0072] Furthermore, as Figure 1As shown, the plate driver 4 can be designed as a lead screw slider. Taking this as an example, the slider of the plate driver 4 is connected to the moving plate 5. Of course, it can also be an electric push rod, a telescopic cylinder linear displacement mechanism, and there is no specific limitation.

[0073] Furthermore, the fixing components are designed to be at least two and are arranged at intervals; correspondingly, the spraying components are also designed to be at least two and are in one-to-one correspondence with the fixing components, realizing at least double-station cleaning operations and further improving the cleaning efficiency.

[0074] Furthermore, as Figure 3 shown, in order to be able to fix the substrate wafer 3, the fixture 2 is provided with a card slot 21 for the substrate wafer 3 to be inserted.

[0075] Furthermore, as Figure 3 shown, there are two card slots 21 on the fixture 2 and they are arranged at intervals; the design of the spaced double card slots 21 can play a better role in fixing the substrate wafer 3.

[0076] Furthermore, as Figure 3 shown, in terms of the structural design of the fixture 2, it includes a connecting part 22 and a supporting part 23.

[0077] The connecting part 22 is fixed on the moving plate 5, and there are two supporting parts 23 which are arranged at intervals on the connecting part 22; taking the design of two card slots 21 as an example, then each supporting part 23 is respectively provided with a card slot 21.

[0078] Among them, the connecting part 22 can be a U-shaped plate structure, which saves manufacturing materials while meeting certain strength requirements.

[0079] The supporting part 23 can be a convex block structure, which is integrally formed with the connecting part 22, reducing the assembly process and making production more convenient.

[0080] Working principle (taking two fixing components and four fixtures 2 as an example):

[0081] 1. Manually install four substrate wafers 3 into the four fixtures 2 on the moving plate 5;

[0082] 2. The plate driver 4 drives the moving plate 5 to reciprocate, and then drives the fixture 2 and the substrate wafer 3 to reciprocate;

[0083] 3. Connect the first pipe joint 15 and the second pipe joint 16, and control the spraying driver 13 to drive the second spraying part 12 to rotate to realize the simultaneous cleaning of the two surfaces of the substrate wafer 3.

[0084] The above has introduced in detail a rotary cleaning device provided by the present application. For those of ordinary skill in the art, according to the idea of the embodiments of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A rotary cleaning device, characterized in that: Including fixing components and spraying components; The fixing assembly is used to fix the substrate sheet (3); The spray assembly comprises a first spray component (11), a second spray component (12) and a spray driver (13); The first spraying member (11) is provided with a plurality of first spray holes (111) for spraying and cleaning the first surface of the substrate sheet (3) on the fixed component; The second spraying member (12) is provided with a plurality of second spray holes for spraying and cleaning the second surface of the substrate sheet (3) on the fixed assembly; The spray driver (13) is connected to the first spray element (11) and / or the second spray element (12), and is used to drive the first spray element (11) and / or the second spray element (12) to rotate.

2. A rotary cleaning device according to claim 1, characterized in that: Also includes a moving plate (5) and a plate driver (4); The plate driver (4) is connected to the movable plate (5) and is used to drive the movable plate (5) to move along a first horizontal straight line direction; The fixing component is mounted on the moving plate (5).

3. A rotary cleaning device according to claim 2, characterized in that: The fixing assembly comprises two fixtures (2); The two jigs (2) are spaced apart along a second horizontal straight line direction perpendicular to the first horizontal straight line direction, and are symmetrically arranged relative to a preset plane perpendicular to the second horizontal straight line direction; The fixture (2) is used to fix the substrate sheet (3) in an inclined manner, so that a first surface of the substrate sheet (3) close to the preset surface is arranged inclined downward, and a second surface of the substrate sheet (3) away from the preset surface is arranged inclined upward; The first spraying member (11) is a tube structure, which is vertically arranged above the movable plate (5), and whose central axis coincides with the preset surface; The first spray hole (111) is provided on the outer peripheral wall of the first spraying member (11); There are two second spraying parts (12) in a disc structure; The second spraying member (12) is arranged parallel to the substrate sheet (3) on the fixture (2); The second spraying member (12) is provided with a second spray hole on a surface facing the substrate sheet (3).

4. A rotary cleaning device according to claim 1, characterized in that: The spray assembly also includes a spray bracket (14); The spray bracket (14) is an inverted U-shaped structure; The first spray component (11), the second spray component (12) and the spray driver (13) are mounted on the spray bracket (14); The first spraying element (11) is connected to a first pipe joint (15); The second spraying element (12) is connected to a second pipe joint (16).

5. A rotary cleaning device according to claim 4, characterized in that: The spray driver (13) is a hollow shaft rotary motor; The spray driver (13) is connected to the second spray element (12); The second pipe joint (16) passes through the hollow shaft of the spray drive (13) and is rotatably connected to the second spray element (12).

6. A rotary cleaning device according to claim 2, characterized in that: The plate driver (4) is a screw slide; The slider of the plate driver (4) is connected to the moving plate (5).

7. A rotary cleaning device according to claim 1, characterized in that: There are at least two fixing components, which are arranged at intervals; There are at least two spraying components, which correspond one to one with the fixing components.

8. A rotary cleaning device according to claim 3, characterized in that: The jig (2) is provided with a slot (21) for inserting the substrate sheet (3).

9. A rotary cleaning device according to claim 8, characterized in that: There are two clamping slots (21) on the fixture (2), which are arranged at intervals.

10. A rotary cleaning device according to claim 9, characterized in that: The fixture (2) comprises a connecting portion (22) and a supporting portion (23); There are two supporting parts (23), which are arranged on the connecting part (22) at intervals; A clamping slot (21) is respectively provided on each of the supporting parts (23).

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