Rotary cleaning device

Abstract

The utility model discloses a rotary cleaning device, which relates to the technical field of semiconductor substrate material manufacturing, and comprises a turntable, a driver and a spraying assembly, the driver is connected with the turntable and used for driving the turntable to rotate; a plurality of jigs which are circumferentially distributed around the central axis of the turntable are arranged on the top surface of the turntable; the jigs are used for obliquely fixing the substrate slice, so that a first surface, close to the central axis of the turntable, of the substrate slice is obliquely downwards arranged, and a second surface, far away from the central axis of the turntable, of the substrate slice is obliquely upwards arranged; the spraying assembly comprises a first spraying pipe and a second spraying pipe; the first spraying pipe is vertically arranged above the rotating disc, and the central axis of the first spraying pipe coincides with the central axis of the rotating disc; the first spraying pipe is used for spraying and cleaning the first surface of the substrate slice; and the second spraying pipe is used for spraying and cleaning the second surface of the substrate slice. The first face and the second face of the substrate slice are synchronously cleaned, the cleaning efficiency is effectively improved, and operation is easy and convenient.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor substrate material manufacturing, and particularly to a rotary cleaning device. Background Art

[0002] Indium phosphide substrates have a wide application market in the field of radio frequency devices such as the manufacture of high-frequency and high-power devices, optical fiber communication, wireless transmission, and radio astronomy. Radio frequency devices manufactured using indium phosphide substrates have shown excellent performance in application scenarios such as satellites and radars. They have strong competitiveness in the radio frequency front-end of radar and communication systems and analog / mixed-signal broadband circuits, and are suitable for applications such as high-speed data processing and high-precision broadband A / D conversion. It can be seen that indium phosphide substrates are expected to become the mainstream substrate materials for radio frequency devices.

[0003] In the manufacture of indium phosphide substrate materials, the polished indium phosphide substrate wafers need to be cleaned. The existing cleaning methods mainly include spraying or immersion cleaning. Among them, the devices used for spraying cleaning are mostly single-sided cleaning. For each cleaning operation of one side of the substrate wafer, it is necessary to switch to the other side for cleaning, and the operation is relatively cumbersome and the cleaning efficiency is low. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a rotary cleaning device to solve the technical problems of cumbersome operation and low cleaning efficiency existing in the existing single-sided cleaning method.

[0005] To achieve the above technical purpose, this application provides a rotary cleaning device, including a turntable, a driver, and a spraying assembly;

[0006] The driver is connected to the turntable and is used to drive the turntable to rotate;

[0007] A plurality of jigs are provided on the top surface of the turntable and are circumferentially distributed around the central axis of the turntable;

[0008] The jig is used to fixedly hold the substrate wafer obliquely, and makes the first surface of the substrate wafer close to the central axis of the turntable inclined downward, while the second surface away from the central axis of the turntable is inclined upward;

[0009] The spraying assembly includes a first spraying pipe and a second spraying pipe;

[0010] The first spraying pipe is vertically arranged above the turntable, and its central axis coincides with the central axis of the turntable;

[0011] A plurality of first spray holes are provided on the first spraying pipe for spraying and cleaning the first surface of the substrate wafer located on the jig;

[0012] The second spray pipe is connected to the first spray pipe and is provided with a plurality of second spray holes for spraying and cleaning the second surface of the substrate wafer located on the fixture.

[0013] Further, the number of the fixtures is at least two, and they are evenly distributed circumferentially around the central axis of the turntable.

[0014] Further, the driver is a rotary motor;

[0015] The driver is arranged below the turntable, and its output shaft is connected to the turntable.

[0016] Further, the second spray pipe is perpendicularly connected to one end of the first spray pipe away from the turntable and is distributed in a T shape with the first spray pipe;

[0017] The first spray holes are arranged on the outer peripheral wall of the first spray pipe;

[0018] The second spray holes are arranged at the bottom of the second spray pipe.

[0019] Further, the first spray pipe is communicated with the second spray pipe;

[0020] A pipe joint is arranged on the second spray pipe.

[0021] Further, the spray assembly further includes a spray bracket;

[0022] The spray bracket is arranged on one side of the turntable;

[0023] The second spray pipe is fixedly connected to the spray bracket.

[0024] Further, the fixture is provided with a slot for inserting the substrate wafer and is inclined.

[0025] Further, there are two such slots on the fixture, and they are arranged at intervals.

[0026] Further, the fixture includes a connecting portion and a supporting portion;

[0027] The connecting portion is fixedly connected to the turntable;

[0028] There are two supporting portions, which are arranged at intervals on the connecting portion;

[0029] Each supporting portion is respectively provided with one such slot.

[0030] Further, the connecting portion is of a U-shaped plate structure;

[0031] The supporting portion is of a convex block structure and is integrally formed with the connecting portion.

[0032] As can be seen from the above technical solutions, the rotary cleaning device designed in this application uses a jig to tilt and fix the wafer, and makes the first side of the wafer close to the central axis of the turntable tilt downward, while the second side away from the central axis of the turntable tilts upward; so that both the first side and the second side of the wafer have a certain spray cleaning angle, so that the first spray pipe and the second spray pipe can be used to synchronously clean the first side and the second side of the wafer, and multiple wafers can be cleaned simultaneously at one time, effectively improving the cleaning efficiency, and there is no need for surface-changing operation, and the operation is simple and convenient; in addition, the turntable can rotate driven by the driver to achieve dynamic spray cleaning and further improve the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0034] Figure 1 is a perspective view of a rotary cleaning device provided in the present application;

[0035] Figure 2 is a perspective view of a cleaning component of a rotary cleaning device provided in the present application;

[0036] Figure 3 is a perspective view of the cooperation between the jig and the wafer of a rotary cleaning device provided in the present application;

[0037] In the figure: 1, turntable; 2, driver; 3, spray assembly; 31, first spray pipe; 311, first spray hole; 32, second spray pipe; 321, second spray hole; 33, spray bracket; 34, pipe joint; 4, jig; 40, card slot; 41, connecting part; 42, supporting part; 5, wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] The following will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the embodiments of the present application.

[0039] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0040] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0041] The embodiments of the present application disclose a rotary cleaning device.

[0042] Please refer to Figure 1 and Figure 2 , an embodiment of a rotary cleaning device provided in the embodiments of the present application includes:

[0043] A turntable 1, a driver 2, and a spray assembly 3.

[0044] The driver 2 is connected to the turntable 1 and is used to drive the turntable 1 to rotate.

[0045] A plurality of fixtures 4 are circumferentially distributed on the top surface of the turntable 1 around the central axis of the turntable 1; the fixtures 4 are used to fixedly hold the substrate film 5 obliquely, and make the first surface of the substrate film 5 close to the central axis of the turntable 1 inclined downward, and the second surface away from the central axis of the turntable 1 inclined upward; if the first surface is the back surface, then the second surface corresponds to the front surface.

[0046] The spray assembly 3 includes a first spray pipe 31 and a second spray pipe 32; the first spray pipe 31 is vertically arranged above the turntable 1, and its own central axis coincides with the central axis of the turntable 1; a plurality of first spray holes 311 for spraying and cleaning the first surface of the substrate film 5 located on the fixture 4 are provided on the first spray pipe 31; the second spray pipe 32 is connected to the first spray pipe 31, and a plurality of second spray holes 321 for spraying and cleaning the second surface of the substrate film 5 located on the fixture 4 are provided.

[0047] The inclination angle of the substrate wafer 5 of the present application can be 45° or other angles, which can enable the first surface and the second surface to have a certain spray cleaning angle, ensuring that they can be simultaneously spray cleaned by the first spray pipe 31 and the second spray pipe 32.

[0048] For the rotary cleaning device designed in the present application, the jig 4 is used to tilt and fix the substrate wafer 5, and the first surface of the substrate wafer 5 close to the central axis of the turntable 1 is tilted downward, while the second surface away from the central axis of the turntable 1 is tilted upward; this enables both the first surface and the second surface of the substrate wafer 5 to have a certain spray cleaning angle, so that the first spray pipe 31 and the second spray pipe 32 can be used to simultaneously clean the first surface and the second surface of the substrate wafer 5. It can also clean multiple substrate wafers 5 at the same time, effectively improving the cleaning efficiency, and there is no need for surface-changing operation, making the operation simple and convenient; in addition, the turntable 1 can rotate under the drive of the driver 2 to achieve dynamic spray cleaning, further improving the cleaning effect.

[0049] In the present application, the turntable 1, the jig 4, the first spray pipe 31 and the second spray pipe 32 can all be made of PEEK material, and there is no specific limitation.

[0050] The above is the first embodiment of a rotary cleaning device provided by the embodiments of the present application. The following is the second embodiment of a rotary cleaning device provided by the embodiments of the present application. For details, please refer to Figures 1 to 3 .

[0051] Based on the solution of the above first embodiment:

[0052] Furthermore, as Figure 1 shown, the number of jigs 4 is at least two and they are evenly distributed circumferentially around the central axis of the turntable 1. With the increase in the number of jigs 4, the corresponding number of substrate wafers 5 to be spray cleaned each time also increases, and those skilled in the art can design according to actual needs.

[0053] Furthermore, the driver 2 can be a rotary motor, specifically a servo motor that can rotate forward and backward; the driver 2 is arranged below the turntable 1, and its output shaft is connected to the turntable 1 to achieve direct connection drive.

[0054] Of course, the rotary motor can also be connected to the turntable 1 through a transmission component, or the driver 2 can also be a telescopic motor or a telescopic cylinder, and the telescopic motion is converted into the rotary motion of the turntable 1 through a transmission component. Those skilled in the art can design according to needs without limitation.

[0055] Furthermore, as Figure 1As shown, the second spray pipe 32 is specifically perpendicularly connected to one end of the first spray pipe 31 away from the turntable 1, and is distributed in a T shape with the first spray pipe 31; the length of the second spray pipe 32 can cover the entire turntable 1, or at least can cover two jigs 4 that are centrosymmetric, increasing the spray area and improving the spray efficiency.

[0056] As Figure 2 shown, a plurality of first spray holes 311 are provided on the outer peripheral wall of the first spray pipe 31 and are evenly distributed; a plurality of second spray holes 321 are provided at the bottom of the second spray pipe 32 and are evenly distributed.

[0057] Furthermore, the first spray pipe 31 and the second spray pipe 32 are designed to be conducted, and a pipe joint 34 is provided on the second spray pipe 32, so that the two spray pipes can share one pipe joint 34, reducing the number of joints. The pipe joint 34 is used to connect and conduct the cleaning liquid supply source; of course, the pipe joint 34 can also be provided on the first spray pipe 31 without limitation.

[0058] Furthermore, in order to fix the first spray pipe 31 and the second spray pipe 32, the spray assembly 3 further includes a spray bracket 33. The spray bracket 33 can be in a columnar rod structure and is arranged on one side of the turntable 1; the second spray pipe 32 is fixedly connected to the spray bracket 33, thereby realizing the fixed installation of the first spray pipe 31 and the second spray pipe 32.

[0059] Furthermore, as Figure 3 shown, in order to be able to fix the substrate film 5, the jig 4 is provided with a slot 40 for the substrate film 5 to be inserted and is inclined.

[0060] Furthermore, as Figure 3 shown, there are two slots 40 on the jig 4 and they are spaced apart; the design of the spaced double slots 40 can achieve a better fixing effect on the substrate film 5.

[0061] Furthermore, as Figure 3 shown, in terms of the structural design of the jig 4, it includes a connecting portion 41 and a supporting portion 42.

[0062] The connecting portion 41 is fixedly connected to the turntable 1. There are two supporting portions 42 and they are spaced apart on the connecting portion 41. Taking the design of two slots 40 as an example, then each supporting portion 42 is provided with one slot 40.

[0063] Furthermore, as Figure 3 shown, the connecting portion 41 can be in a U-shaped plate structure, saving manufacturing materials while meeting certain strength requirements.

[0064] The supporting portion 42 is in a convex block structure and is integrally formed with the connecting portion 41, reducing the assembly process and making production more convenient.

[0065] Working principle:

[0066] 1. Manually install the substrate wafer 5 onto the fixture 4 of the turntable 1;

[0067] 2. The driver 2 drives the turntable 1 to rotate, thereby driving the fixture 4 and the substrate wafer 5 to rotate;

[0068] 3. Connect the pipe joint 34 so that the first spray pipe 31 and the second spray pipe 32 spray the cleaning liquid to simultaneously clean the first side and the second side of the substrate wafer 5.

[0069] The above has introduced in detail a rotary cleaning device provided by the present application. For those of ordinary skill in the art, according to the idea of the embodiments of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A rotary cleaning device, characterized in that: It comprises a turntable (1), a driver (2) and a spray assembly (3); The driver (2) is connected to the turntable (1) and is used to drive the turntable (1) to rotate; The top surface of the turntable (1) is provided with a plurality of jigs (4) distributed circumferentially around the central axis of the turntable (1); The jig (4) is used to fix the substrate sheet (5) in an inclined manner, so that a first surface of the substrate sheet (5) close to the central axis of the turntable (1) is arranged inclined downward, and a second surface of the substrate sheet (5) away from the central axis of the turntable (1) is arranged inclined upward; The spray assembly (3) comprises a first spray pipe (31) and a second spray pipe (32); The first spray pipe (31) is vertically arranged above the turntable (1), and its central axis coincides with the central axis of the turntable (1); The first spray pipe (31) is provided with a plurality of first spray holes (311) for spraying and cleaning the first surface of the substrate sheet (5) located on the fixture (4); The second spray pipe (32) is connected to the first spray pipe (31) and is provided with a plurality of second spray holes (321) for spraying and cleaning the second surface of the substrate sheet (5) located on the fixture (4).

2. A rotary cleaning device according to claim 1, characterized in that: The number of the jigs (4) is at least two, and they are evenly distributed around the circumference of the central axis of the turntable (1).

3. A rotary cleaning device according to claim 1, characterized in that: The driver (2) is a rotating motor; The driver (2) is arranged below the turntable (1), and its output shaft is connected to the turntable (1).

4. A rotary cleaning device according to claim 1, characterized in that: The second spray pipe (32) is vertically connected to an end of the first spray pipe (31) away from the rotating disk (1), and is arranged in a T-shape with the first spray pipe (31); The first spray hole (311) is arranged on the outer peripheral wall of the first spray pipe (31); The second spray hole (321) is arranged at the bottom of the second spray pipe (32).

5. A rotary cleaning device according to claim 4, characterized in that: The first spray pipe (31) is connected to the second spray pipe (32); The second spray pipe (32) is provided with a pipe joint (34).

6. A rotary cleaning device according to claim 4, characterized in that: The spray assembly (3) further comprises a spray bracket (33); The spray bracket (33) is arranged on one side of the turntable (1); The second spray pipe (32) is fixedly connected to the spray bracket (33).

7. A rotary cleaning device according to claim 1, characterized in that: The jig (4) is provided with an inclined slot (40) for inserting the substrate sheet (5).

8. A rotary cleaning device according to claim 7, characterized in that: There are two clamping slots (40) on the fixture (4), which are arranged at intervals.

9. A rotary cleaning device according to claim 8, characterized in that: The fixture (4) comprises a connecting portion (41) and a supporting portion (42); The connecting portion (41) is fixedly connected to the rotating disk (1); There are two supporting parts (42), which are arranged on the connecting part (41) at intervals; A clamping slot (40) is respectively provided on each of the supporting portions (42).

10. A rotary cleaning device according to claim 9, characterized in that: The connecting portion (41) is a U-shaped plate structure; The supporting portion (42) is a convex block structure, and is integrally formed with the connecting portion (41).

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