Silicon wafer cleaning tank and tank type cleaning machine
By designing a shard mechanism in the silicon wafer cleaning tank and using rotating rods and shard parts to separate the silicon wafer, the drying difficulties and rework problems caused by bending the chips in the wet process of the silicon wafer are solved, and the efficiency and quality of the silicon wafer cleaning are improved.
Patent Information
- Application Number
- CN202422047601.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-22
AI Technical Summary
In the wet process, the silicon wafer reacts with alkali to produce hydrogen, causing bubbles to escape on the surface of the silicon wafer, the pressure between the silicon wafer becomes smaller, and thinner silicon wafers are more likely to bend the patch, resulting in difficulty in drying, liquid-loading and a large number of reworked sheets.
A silicon wafer cleaning tank is designed, including a tank body and a shard mechanism. The shard mechanism consists of a rotating rod, shard parts and a driving structure. Through the action of the robotic arm, the shard parts can pass through two adjacent silicon wafers to separate the silicon wafers, achieving effective separation between the silicon wafers.
It effectively solves the problem of silicon wafer patches, reduces the degree of silicon wafer bending, reduces the patch amplitude and liquid rework ratio, and improves the efficiency and quality of silicon wafer cleaning.
Smart Images
Figure CN222999257U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer cleaning tank and a tank-type cleaning machine. Background Art
[0002] With the increasingly fierce competition of TOPCon solar cells in the photovoltaic market, their processes and manufacturing costs have been continuously optimized by major photovoltaic companies and research institutions, and the wet process plays a crucial role among them.
[0003] Generally, the thickness of TOPCon silicon wafers is 120μm - 130μm. With the trend of wafer thinning, the thickness of silicon wafers will further decrease. In the wet process, hydrogen gas is generated when the silicon wafer reacts with alkali. After the bubbles attached to the surface of the silicon wafer escape, the pressure between the silicon wafers becomes smaller, and the thinner silicon wafers are more likely to bend and stick together, resulting in difficulties in drying and liquid carrying down, causing a large number of rework wafers. Therefore, to solve the problem of wafer sticking, there is an urgent need to provide a structure that can prevent or effectively separate wafer sticking. Summary of the Utility Model
[0004] In view of this, the utility model provides a silicon wafer cleaning tank and a tank-type cleaning machine to solve the problem of wafer sticking.
[0005] In the first aspect, the utility model provides a silicon wafer cleaning tank, including: a tank body; a wafer separating mechanism arranged in the tank body, the wafer separating mechanism includes a rotating rod, a plurality of separating pieces and a driving structure. The rotating rod is rotatably arranged in the tank body, the plurality of separating pieces are arranged on the rotating rod and arranged along the axial direction of the rotating rod, the driving structure is connected with the rotating rod, and the plurality of separating pieces have a separating state of passing through between two adjacent silicon wafers on the corresponding flower basket and a non-separating state of leaving between two adjacent silicon wafers on the corresponding flower basket.
[0006] Beneficial effects: When a handling mechanism such as a robotic arm lifts a flower basket carrying silicon wafers into the tank body, under the action of the robotic arm, the flower basket descends. As the flower basket descends, the driving structure drives the rotating rod to rotate and drives the plurality of separating pieces to swing upward. The separating pieces can pass through between two adjacent silicon wafers to separate the two adjacent silicon wafers; when the reaction in the silicon wafer cleaning tank ends, as the robotic arm lifts the flower basket upward, the separating pieces pass through between two adjacent silicon wafers again to separate the two adjacent silicon wafers again, realizing effective separation between silicon wafers, effectively solving the problem of wafer sticking. During the bubbling reaction of the cleaning machine, the bending degree of the silicon wafers can be reduced, thereby reducing the sticking amplitude and reducing the liquid-carrying rework ratio.
[0007] In an optional embodiment, the driving structure is a driven structure, the driven structure can rotate as the flower basket descends and drive the rotating rod to rotate and the separating pieces to swing upward, and the plurality of separating pieces swing downward as the flower basket ascends.
[0008] Beneficial effects: The swinging of the slicing member is achieved under the pressure of the flower basket or the gravity of the slicing member. There is no need to set up a power driving mechanism such as a motor, the structure is simpler, and the cost is saved.
[0009] In an alternative embodiment, the driven structure has a driven inclined surface for cooperating with the bottom of the flower basket.
[0010] Beneficial effects: The rotation of the driven structure is facilitated through the setting of the driven inclined surface, which is easier to achieve.
[0011] In an alternative embodiment, the driven structure is a vertically arranged driven plate, the driven plate is polygonal, and one side surface of the driven plate forms a driven inclined surface.
[0012] Beneficial effects: The driven structure is formed by a plate, the structure is simple, and it is easy to implement.
[0013] In an alternative embodiment, driven structures are provided at both ends of the rotating rod.
[0014] Beneficial effects: By applying pressure to the driven structures at both ends of the rotating rod by the flower basket, the movement of the rotating rod and the slicing member is more stable and reliable.
[0015] In an alternative embodiment, the slicing member is a slicing rod.
[0016] Beneficial effects: The structure is simple and easy to implement.
[0017] In an alternative embodiment, several slicing members on the rotating rod form at least two groups arranged at intervals along the axial direction of the rotating rod, and each group of slicing members is correspondingly arranged with a flower basket.
[0018] Beneficial effects: One slicing mechanism corresponds to at least two flower baskets, and then the silicon wafers on at least two flower baskets are separated, simplifying the structure and saving costs. The interval between adjacent two groups of slicing members is used to avoid the internal end plates in a row of flower baskets, preventing the slicing members from interfering with the internal end plates in a row of flower baskets.
[0019] In an alternative embodiment, several slicing mechanisms are provided, and the several slicing mechanisms are arranged along a preset direction, and the preset direction is perpendicular to the axial direction of the rotating rod.
[0020] Beneficial effects: The robotic arm can lift several flower baskets at one time, and several slicing mechanisms are used to separate the silicon wafers on several flower baskets, improving the slicing efficiency.
[0021] In an alternative embodiment, the silicon wafer cleaning tank further includes a flow equalizing member, the flow equalizing member is arranged in the tank body, and the slicing mechanism is arranged above the flow equalizing member.
[0022] Beneficial effects: The flow equalizing member improves the flow state of the cleaning liquid in the silicon wafer cleaning tank, thereby improving the uniformity of the liquid medicine and ensuring the consistency of the effect during the cleaning of the silicon wafer.
[0023] In a second aspect, the present utility model further provides a tank-type cleaning machine, including: the above-mentioned silicon wafer cleaning tank. Description of the drawings
[0024] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0025] Figure 1 It is a schematic structural diagram of a silicon wafer cleaning tank according to an embodiment of the present utility model;
[0026] Figure 2 For Figure 1 the three-dimensional view of the segmented structure shown in cooperation with the flower basket.
[0027] Description of the reference numerals:
[0028] 1. Tank body;
[0029] 2. Segmentation mechanism; 201. Rotating rod; 202. Segmentation member; 203. Driven structure; 2031. Driven inclined surface;
[0030] 3. Flow equalizing member;
[0031] 4. Flower basket; 401. End plate; 402. Connecting rod. Specific embodiments
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.
[0033] The following will describe the embodiments of the present utility model in conjunction with Figure 1 and Figure 2 , describing the embodiments of the present utility model.
[0034] According to an embodiment of the present utility model, on the one hand, a silicon wafer cleaning tank is provided, including: a tank body 1 and a slicing mechanism 2. The slicing mechanism 2 is arranged in the tank body 1 and includes a rotating rod 201, a plurality of slicing members 202 and a driving structure. The rotating rod 201 is rotatably arranged in the tank body 1. The plurality of slicing members 202 are arranged on the rotating rod 201 and are arranged along the axial direction of the rotating rod 201. The driving structure is connected to the rotating rod 201. The plurality of slicing members 202 have a slicing state of passing through between two adjacent silicon wafers on the corresponding carrier 4 and a non-slicing state of leaving between two adjacent silicon wafers on the corresponding carrier 4.
[0035] When a handling mechanism such as a robotic arm lifts the carrier 4 carrying silicon wafers into the tank body 1 and applies the silicon wafer cleaning tank of this embodiment, the carrier 4 descends under the action of the robotic arm. As the carrier 4 descends, the driving structure drives the rotating rod 201 to rotate and drives a plurality of slicing members 202 to swing upward. The slicing members 202 can pass through between two adjacent silicon wafers to separate the two adjacent silicon wafers. After the reaction in the silicon wafer cleaning tank ends, as the robotic arm lifts the carrier 4 upward, the slicing members 202 pass through between two adjacent silicon wafers again to separate the two adjacent silicon wafers again, realizing effective separation between silicon wafers, effectively solving the problem of silicon wafer sticking. During the bubbling reaction of the cleaning machine, the bending degree of the silicon wafers can be reduced, thereby reducing the sticking amplitude and reducing the proportion of rework due to liquid carrying.
[0036] In one embodiment, as Figure 1 shown, the driving structure is a driven structure 203. The driven structure 203 can rotate as the carrier 4 descends and drives the rotating rod 201 to rotate and the slicing members 202 to swing upward. The plurality of slicing members 202 swing downward as the carrier 4 ascends. When a handling mechanism such as a robotic arm lifts the carrier 4 carrying silicon wafers into the tank body 1, under the action of the robotic arm, the carrier 4 descends to contact the driven structure 203. As the carrier 4 continues to descend, the driven structure 203 rotates under the pressure of the carrier 4, and then drives the rotating rod 201 and a plurality of slicing members 202 to rotate synchronously. The slicing members 202 can pass through between two adjacent silicon wafers to separate the two adjacent silicon wafers. After the reaction in the silicon wafer cleaning tank ends, as the robotic arm lifts the carrier 4 upward, the pressure of the carrier 4 on the driven structure 203 decreases, and the slicing members 202 start to swing downward under their own gravity. During the downward swing of the slicing members 202, the silicon wafers are separated again. The swing of the slicing members 202 is realized under the pressure of the carrier 4 or the gravity of the slicing members 202, without setting a power driving mechanism such as a motor, the structure is simpler, and the cost is saved.
[0037] It can be understood that in another embodiment, the driving structure is a power driving mechanism such as a motor, and the rotating rod 201 is driven to rotate by the motor, and then the slicing members 202 are driven to swing up and down.
[0038] In one embodiment, as Figure 1 shown, the driven structure 203 has a driven inclined surface 2031, and the driven inclined surface 2031 is used to cooperate with the bottom of the flower basket 4. As the flower basket 4 descends, the bottom of the flower basket 4 presses down on the driven inclined surface 2031, thereby causing the driven structure 203 to rotate. The rotation of the driven structure 203 is facilitated by the setting of the driven inclined surface 2031, making it easier to implement.
[0039] Furthermore, the flower basket 4 includes two end plates 401, four connecting rods 402 and a support rod. The four connecting rods 402 are connected between the two end plates 401, and the support rod is connected between the two end plates 401. The four connecting rods 402 are divided into two groups and are located on both sides of the support rod. A number of flower basket teeth are provided on the connecting rods 402. The silicon wafers are placed in the flower basket 4. The bottom of the silicon wafers is supported by the support rod, and the two sides of the silicon wafers are limited by the flower basket teeth on the two groups of connecting rods 402. The driven inclined surface 2031 cooperates with the bottom of the end plate 401 of the flower basket 4.
[0040] In one embodiment, the driven structure 203 is a vertically arranged driven plate. The driven plate is polygonal, and one side surface of the driven plate forms the driven inclined surface 2031. The driven structure 203 is formed by a plate, with a simple structure and easy to implement.
[0041] In one embodiment, driven structures 203 are provided at both ends of the rotating rod 201. By applying pressure to the driven structures 203 at both ends of the rotating rod 201 through the flower basket 4, the movement of the rotating rod 201 and the slicing member 202 becomes more stable and reliable.
[0042] In one embodiment, the slicing member 202 is a slicing rod, with a simple structure and easy to implement.
[0043] It can be understood that in another embodiment, the slicing member 202 is a slicing plate.
[0044] In one embodiment, as Figure 1 shown, a number of slicing members 202 on the rotating rod 201 form at least two groups arranged at intervals along the axial direction of the rotating rod 201, and each group of slicing members 202 is correspondingly arranged with a flower basket 4. By one slicing mechanism 2 corresponding to at least two flower baskets 4, the silicon wafers on at least two flower baskets 4 are separated, simplifying the structure and saving costs. The interval between adjacent two groups of slicing members 202 is used to avoid the inner end plate 401 in a row of flower baskets 4, preventing the slicing members 202 from interfering with the inner end plate 401 in a row of flower baskets 4.
[0045] Furthermore, taking six flower baskets 4 as an example, two flower baskets 4 are provided in each row, and 120 silicon wafers are placed in each flower basket 4, then there are 238 slicing members 202 in each row.
[0046] It can be understood that in another embodiment, one slicing mechanism 2 corresponds to one flower basket 4.
[0047] In one embodiment, there are several slicing mechanisms 2. The several slicing mechanisms 2 are arranged along a preset direction, and the preset direction is perpendicular to the axial direction of the rotating rod 201. The robotic arm can lift several flower baskets 4 at one time, and the slicing mechanisms 2 are used to separate the silicon wafers on the several flower baskets 4, improving the slicing efficiency.
[0048] In one embodiment, the rotating rod 201 is installed on the bottom wall or side wall of the tank body 1 through a bearing seat or the like. The setting of the bearing seat facilitates the rotation of the rotating rod 201.
[0049] In one embodiment, the silicon wafer cleaning tank further includes a flow equalizing member 3. The flow equalizing member 3 is arranged in the tank body 1, and the slicing mechanism 2 is arranged above the flow equalizing member 3. The flow equalizing member 3 improves the flow state of the cleaning liquid in the silicon wafer cleaning tank, thereby improving the uniformity of the liquid medicine and ensuring the consistency of the effect during the cleaning of the silicon wafers. By installing a rotatable slicing mechanism 2 above the flow equalizing member 3, the slicing mechanism 2 is rotated by the descent of the flower basket 4 to realize the separation of the silicon wafers and improve the problem of thin silicon wafer sticking.
[0050] It should be noted that for the convenience of distinguishing each part, in Figure 1 and Figure 2 , dark gray refers to the driven structure 203, and in Figure 2 , light gray refers to the end plate 401, and the black area refers to the connecting rod 402.
[0051] According to an embodiment of the present invention, on the other hand, a tank-type cleaning machine is further provided, including: the above-mentioned silicon wafer cleaning tank.
[0052] In the related art, the problem of silicon wafer sticking during the blanking of the tank-type cleaning machine is one of the important reasons for rework wafers, and there are still few solutions to the problem of silicon wafer sticking.
[0053] In this embodiment, a rotatable slicing mechanism 2 is installed above the flow equalizing member 3 in the tank body 1. As the flower basket 4 descends, the bottom of the end plate 401 of the flower basket 4 presses the driven plate, causing the slicing member 202 to slowly rotate and pass between adjacent silicon wafers, achieving the purpose of separating the silicon wafers; when the reaction ends and the flower basket 4 is slowly pulled up by the robotic arm, the slicing member 202 also slowly rotates back to its original position under the action of gravity, separating the adjacent silicon wafers again after the reaction, realizing the effective separation of the silicon wafers, improving the problem of thin silicon wafer sticking, reducing the rework rate of water wafers. The rotatable slicing mechanism 2 can be applied to different functional tank bodies 1, has good flexibility, has a good fit for thin silicon wafers, and conforms to the development trend of subsequent battery thinning.
[0054] Although embodiments of the present utility model have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations fall within the scope defined by the appended claims.
Claims
1. A silicon wafer cleaning tank, characterized in that: include: Tank body (1); A slicing mechanism (2) is arranged in the trough body (1), the slicing mechanism (2) comprises a rotating rod (201), a plurality of slicing members (202) and a driving structure, the rotating rod (201) is rotatably arranged in the trough body (1), the plurality of slicing members (202) are arranged on the rotating rod (201) and arranged along the axial direction of the rotating rod (201), the driving structure is connected to the rotating rod (201), and the plurality of slicing members (202) have a slicing state of passing through between two corresponding adjacent silicon wafers on the flower basket and a non-slicing state of leaving between two corresponding adjacent silicon wafers.
2. The silicon wafer cleaning tank according to claim 1, characterized in that: The driving structure is a driven structure (203), and the driven structure (203) can rotate as the flower basket (4) descends and drive the rotating rod (201) to rotate and the slice members (202) to swing upwards, and a plurality of the slice members (202) swing downwards as the flower basket (4) rises.
3. The silicon wafer cleaning tank according to claim 2, characterized in that: The driven structure (203) has a driven inclined surface (2031), and the driven inclined surface (2031) is used to cooperate with the bottom of the flower basket (4).
4. The silicon wafer cleaning tank according to claim 3, characterized in that: The driven structure (203) is a vertically arranged driven plate, the driven plate is polygonal, and one side surface of the driven plate forms the driven inclined surface (2031).
5. The silicon wafer cleaning tank according to any one of claims 2 to 4, characterized in that: The driven structures (203) are provided at both ends of the rotating rod (201).
6. The silicon wafer cleaning tank according to any one of claims 1 to 4, characterized in that: The segmenting member (202) is a segmenting rod.
7. The silicon wafer cleaning tank according to any one of claims 1 to 4, characterized in that: The plurality of slice members (202) on the rotating rod (201) form at least two groups spaced apart along the axial direction of the rotating rod (201), and each group of slice members (202) is arranged corresponding to a flower basket (4).
8. The silicon wafer cleaning tank according to any one of claims 1 to 4, characterized in that: The slice mechanisms (2) are provided in plurality, and the plurality of slice mechanisms (2) are arranged along a preset direction, wherein the preset direction is perpendicular to the axial direction of the rotating rod (201).
9. The silicon wafer cleaning tank according to any one of claims 1 to 4, characterized in that: The silicon wafer cleaning tank further comprises a flow equalizer (3), wherein the flow equalizer (3) is arranged in the tank body (1), and the slice separation mechanism (2) is arranged above the flow equalizer (3).
10. A tank cleaning machine, characterized in that: include: The silicon wafer cleaning tank according to any one of claims 1 to 9.